TW530428B - Semiconductor manufacturing apparatus and method for managing the operating condition parameter - Google Patents

Semiconductor manufacturing apparatus and method for managing the operating condition parameter Download PDF

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Publication number
TW530428B
TW530428B TW089117213A TW89117213A TW530428B TW 530428 B TW530428 B TW 530428B TW 089117213 A TW089117213 A TW 089117213A TW 89117213 A TW89117213 A TW 89117213A TW 530428 B TW530428 B TW 530428B
Authority
TW
Taiwan
Prior art keywords
memory
operating condition
semiconductor manufacturing
parameters
parameter
Prior art date
Application number
TW089117213A
Other languages
English (en)
Chinese (zh)
Inventor
Masaya Nagata
Masahiro Sugawara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW530428B publication Critical patent/TW530428B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41835—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by programme execution
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41845—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by system universality, reconfigurability, modularity
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36088—Machining parameters, overide
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36089—Machining parameters, modification during operation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36271—Enter, edit workpiece data
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Factory Administration (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Process Working Machines And Systems (AREA)
TW089117213A 1999-09-01 2000-08-25 Semiconductor manufacturing apparatus and method for managing the operating condition parameter TW530428B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24746499A JP4545252B2 (ja) 1999-09-01 1999-09-01 半導体製造装置

Publications (1)

Publication Number Publication Date
TW530428B true TW530428B (en) 2003-05-01

Family

ID=17163847

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089117213A TW530428B (en) 1999-09-01 2000-08-25 Semiconductor manufacturing apparatus and method for managing the operating condition parameter

Country Status (6)

Country Link
US (1) US6514345B1 (enExample)
EP (1) EP1148402A4 (enExample)
JP (1) JP4545252B2 (enExample)
KR (1) KR100453777B1 (enExample)
TW (1) TW530428B (enExample)
WO (1) WO2001016659A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252161A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
KR100395697B1 (ko) * 2001-04-07 2003-08-25 (주)지우텍 반도체 공정 파라미터를 이용한 반도체 공정 장비 제어 방법
JP4126189B2 (ja) * 2002-04-10 2008-07-30 株式会社日立ハイテクノロジーズ 検査条件設定プログラム、検査装置および検査システム
JP4277100B2 (ja) * 2002-11-14 2009-06-10 東京エレクトロン株式会社 搬送機構の基準位置補正装置及び基準位置補正方法
CN101283360B (zh) * 2005-02-25 2011-07-06 朗姆研究公司 用于群集工具的安全通用配置方法
US7353379B2 (en) * 2005-02-25 2008-04-01 Lam Research Corporation Methods for configuring a plasma cluster tool
US7162317B2 (en) * 2005-02-25 2007-01-09 Lam Research Corporation Methods and apparatus for configuring plasma cluster tools
US7536538B1 (en) 2005-03-31 2009-05-19 Lam Research Corporation Cluster tools for processing substrates using at least a key file
JP4841183B2 (ja) * 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
TWI342058B (en) * 2005-12-20 2011-05-11 Applied Materials Inc Extended mainframe designs for semiconductor device manufacturing equipment
JP5091413B2 (ja) * 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP4697896B2 (ja) * 2007-03-24 2011-06-08 東京エレクトロン株式会社 半導体製造装置、装置動作パラメータの管理方法、およびプログラム
US20120016506A1 (en) * 2009-04-15 2012-01-19 Masahiro Yokogawa Manufacturing method and manufacturing system for product
JP6111980B2 (ja) 2013-10-29 2017-04-12 株式会社安川電機 産業機器管理システム、産業機器管理サーバ、産業機器管理方法、プログラム、及び情報記憶媒体
JP6806601B2 (ja) * 2017-03-17 2021-01-06 アズビル株式会社 機器情報管理システム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844784A (ja) * 1981-09-11 1983-03-15 Nippon Sekigaisen Kogyo Kk レ−ザ装置
US4967381A (en) * 1985-04-30 1990-10-30 Prometrix Corporation Process control interface system for managing measurement data
US4951190A (en) * 1985-04-30 1990-08-21 Prometrix Corporation Multilevel menu and hierarchy for selecting items and performing tasks thereon in a computer system
US5469361A (en) * 1991-08-08 1995-11-21 The Board Of Regents Acting For And On Behalf Of The University Of Michigan Generic cell controlling method and apparatus for computer integrated manufacturing system
JPH06222819A (ja) * 1993-01-26 1994-08-12 Fanuc Ltd Ｎｃ装置の加工プログラム実行方法
JPH08129407A (ja) * 1994-10-28 1996-05-21 Tokyo Electron Ltd 制御装置、制御装置のプログラムのロード方法および処理装置
JPH08161013A (ja) * 1994-12-09 1996-06-21 Canon Inc デバイス製造装置および方法
JPH0962323A (ja) * 1995-08-24 1997-03-07 Mitsubishi Electric Corp 数値制御装置のシステムパラメータ設定方法および数値制御装置
JP3393035B2 (ja) * 1997-05-06 2003-04-07 東京エレクトロン株式会社 制御装置及び半導体製造装置
US5838565A (en) 1997-05-15 1998-11-17 Vanguard International Semiconductor Corporation Manufacturing control method for IC plant batch sequential machine
JPH113117A (ja) * 1997-06-10 1999-01-06 Dainippon Screen Mfg Co Ltd 処理システムにおけるアラーム装置

Also Published As

Publication number Publication date
KR20010080917A (ko) 2001-08-25
KR100453777B1 (ko) 2004-10-20
EP1148402A4 (en) 2002-08-14
EP1148402A1 (en) 2001-10-24
US6514345B1 (en) 2003-02-04
JP2001075628A (ja) 2001-03-23
WO2001016659A1 (en) 2001-03-08
JP4545252B2 (ja) 2010-09-15

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