KR100453777B1 - 반도체 제조 장치 및 그 동작 조건 파라미터의 관리 방법과, 컴퓨터 판독 가능한 기록 매체 - Google Patents

반도체 제조 장치 및 그 동작 조건 파라미터의 관리 방법과, 컴퓨터 판독 가능한 기록 매체 Download PDF

Info

Publication number
KR100453777B1
KR100453777B1 KR10-2001-7005297A KR20017005297A KR100453777B1 KR 100453777 B1 KR100453777 B1 KR 100453777B1 KR 20017005297 A KR20017005297 A KR 20017005297A KR 100453777 B1 KR100453777 B1 KR 100453777B1
Authority
KR
South Korea
Prior art keywords
operating condition
semiconductor manufacturing
condition parameters
memory
device operating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2001-7005297A
Other languages
English (en)
Korean (ko)
Other versions
KR20010080917A (ko
Inventor
나가타마사야
스가와라마사히로
Original Assignee
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20010080917A publication Critical patent/KR20010080917A/ko
Application granted granted Critical
Publication of KR100453777B1 publication Critical patent/KR100453777B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41835—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by programme execution
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41845—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by system universality, reconfigurability, modularity
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36088—Machining parameters, overide
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36089—Machining parameters, modification during operation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36271—Enter, edit workpiece data
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Factory Administration (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Process Working Machines And Systems (AREA)
KR10-2001-7005297A 1999-09-01 2000-08-22 반도체 제조 장치 및 그 동작 조건 파라미터의 관리 방법과, 컴퓨터 판독 가능한 기록 매체 Expired - Fee Related KR100453777B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP99-247464 1999-09-01
JP24746499A JP4545252B2 (ja) 1999-09-01 1999-09-01 半導体製造装置

Publications (2)

Publication Number Publication Date
KR20010080917A KR20010080917A (ko) 2001-08-25
KR100453777B1 true KR100453777B1 (ko) 2004-10-20

Family

ID=17163847

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-7005297A Expired - Fee Related KR100453777B1 (ko) 1999-09-01 2000-08-22 반도체 제조 장치 및 그 동작 조건 파라미터의 관리 방법과, 컴퓨터 판독 가능한 기록 매체

Country Status (6)

Country Link
US (1) US6514345B1 (enExample)
EP (1) EP1148402A4 (enExample)
JP (1) JP4545252B2 (enExample)
KR (1) KR100453777B1 (enExample)
TW (1) TW530428B (enExample)
WO (1) WO2001016659A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252161A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
KR100395697B1 (ko) * 2001-04-07 2003-08-25 (주)지우텍 반도체 공정 파라미터를 이용한 반도체 공정 장비 제어 방법
JP4126189B2 (ja) * 2002-04-10 2008-07-30 株式会社日立ハイテクノロジーズ 検査条件設定プログラム、検査装置および検査システム
JP4277100B2 (ja) * 2002-11-14 2009-06-10 東京エレクトロン株式会社 搬送機構の基準位置補正装置及び基準位置補正方法
CN101283360B (zh) * 2005-02-25 2011-07-06 朗姆研究公司 用于群集工具的安全通用配置方法
US7353379B2 (en) * 2005-02-25 2008-04-01 Lam Research Corporation Methods for configuring a plasma cluster tool
US7162317B2 (en) * 2005-02-25 2007-01-09 Lam Research Corporation Methods and apparatus for configuring plasma cluster tools
US7536538B1 (en) 2005-03-31 2009-05-19 Lam Research Corporation Cluster tools for processing substrates using at least a key file
JP4841183B2 (ja) * 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
TWI342058B (en) * 2005-12-20 2011-05-11 Applied Materials Inc Extended mainframe designs for semiconductor device manufacturing equipment
JP5091413B2 (ja) * 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP4697896B2 (ja) * 2007-03-24 2011-06-08 東京エレクトロン株式会社 半導体製造装置、装置動作パラメータの管理方法、およびプログラム
US20120016506A1 (en) * 2009-04-15 2012-01-19 Masahiro Yokogawa Manufacturing method and manufacturing system for product
JP6111980B2 (ja) 2013-10-29 2017-04-12 株式会社安川電機 産業機器管理システム、産業機器管理サーバ、産業機器管理方法、プログラム、及び情報記憶媒体
JP6806601B2 (ja) * 2017-03-17 2021-01-06 アズビル株式会社 機器情報管理システム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844784A (ja) * 1981-09-11 1983-03-15 Nippon Sekigaisen Kogyo Kk レ−ザ装置
US4967381A (en) * 1985-04-30 1990-10-30 Prometrix Corporation Process control interface system for managing measurement data
US4951190A (en) * 1985-04-30 1990-08-21 Prometrix Corporation Multilevel menu and hierarchy for selecting items and performing tasks thereon in a computer system
US5469361A (en) * 1991-08-08 1995-11-21 The Board Of Regents Acting For And On Behalf Of The University Of Michigan Generic cell controlling method and apparatus for computer integrated manufacturing system
JPH06222819A (ja) * 1993-01-26 1994-08-12 Fanuc Ltd Ｎｃ装置の加工プログラム実行方法
JPH08129407A (ja) * 1994-10-28 1996-05-21 Tokyo Electron Ltd 制御装置、制御装置のプログラムのロード方法および処理装置
JPH08161013A (ja) * 1994-12-09 1996-06-21 Canon Inc デバイス製造装置および方法
JPH0962323A (ja) * 1995-08-24 1997-03-07 Mitsubishi Electric Corp 数値制御装置のシステムパラメータ設定方法および数値制御装置
JP3393035B2 (ja) * 1997-05-06 2003-04-07 東京エレクトロン株式会社 制御装置及び半導体製造装置
US5838565A (en) 1997-05-15 1998-11-17 Vanguard International Semiconductor Corporation Manufacturing control method for IC plant batch sequential machine
JPH113117A (ja) * 1997-06-10 1999-01-06 Dainippon Screen Mfg Co Ltd 処理システムにおけるアラーム装置

Also Published As

Publication number Publication date
KR20010080917A (ko) 2001-08-25
EP1148402A4 (en) 2002-08-14
EP1148402A1 (en) 2001-10-24
US6514345B1 (en) 2003-02-04
JP2001075628A (ja) 2001-03-23
WO2001016659A1 (en) 2001-03-08
TW530428B (en) 2003-05-01
JP4545252B2 (ja) 2010-09-15

Similar Documents

Publication Publication Date Title
KR100453777B1 (ko) 반도체 제조 장치 및 그 동작 조건 파라미터의 관리 방법과, 컴퓨터 판독 가능한 기록 매체
US7930569B2 (en) Firmware controlled dynamic voltage adjustment
US20040093597A1 (en) Firmware update system for facilitating firmware update in mobile handset related applications
US20020065958A1 (en) System and method for implementing a self-activating embedded application
WO2007117514A1 (en) Mobile device capable of multiple updates
WO2017052528A1 (en) Selecting and loading firmware volumes
US5233510A (en) Continuously self configuring distributed control system
CN113741926B (zh) 内核驱动程序的升级方法、装置、服务器及存储介质
KR20030009528A (ko) 제어기 간의 접속 상태를 검출하는 반도체 제조 장치
US6401201B2 (en) Arrangements offering firmware support for different input/output (I/O) types
JPH1021060A (ja) プログラム自動更新処理機能を有する通信システムおよびプログラム更新処理を実行するプログラムを備えた記録媒体
JPH05197559A (ja) リモートソフトウェアダウンロード方式
JP4697896B2 (ja) 半導体製造装置、装置動作パラメータの管理方法、およびプログラム
JP3201368B2 (ja) 半導体集積回路及びそのテスト方法
US7788454B2 (en) Controller including electrically rewritable nonvolatile memory
CN113778474A (zh) 升级方法、装置、设备及存储介质
JP2735972B2 (ja) プログラムローディング制御システム
US20250251718A1 (en) Checking system and related method for checking a production process and/or characteristics of a workpiece
JPH10289077A (ja) 印刷装置
JPH10260820A (ja) ソフトウェアツールのインストーラ、インストール方法及びインストール媒体
JP2000207180A (ja) 情報処理装置及びプログラム書換方法
JP2002278768A (ja) モジュールアップグレードに伴う設定処理方法及びこれを用いた情報処理システム
US20050117143A1 (en) Supply control system and method, program, and information storage medium
JP2000010784A (ja) ファ−ムウェアのダウンロ−ド装置
KR20230107953A (ko) 논리연산제어장치에 신규 모듈을 추가하는 방법

Legal Events

Date Code Title Description
A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20120924

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20130924

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20141001

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20151013

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20151013