TW501197B - Polishing compound for chemical mechanical polishing and method for polishing substrate - Google Patents

Polishing compound for chemical mechanical polishing and method for polishing substrate Download PDF

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Publication number
TW501197B
TW501197B TW089116550A TW89116550A TW501197B TW 501197 B TW501197 B TW 501197B TW 089116550 A TW089116550 A TW 089116550A TW 89116550 A TW89116550 A TW 89116550A TW 501197 B TW501197 B TW 501197B
Authority
TW
Taiwan
Prior art keywords
polishing
compound
chemical mechanical
substrate
less
Prior art date
Application number
TW089116550A
Other languages
English (en)
Chinese (zh)
Inventor
Akiko Igarashi
Yasuo Kamigata
Yasushi Kurata
Hiroki Terasaki
Takeshi Uchida
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TW501197B publication Critical patent/TW501197B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW089116550A 1999-08-17 2000-08-16 Polishing compound for chemical mechanical polishing and method for polishing substrate TW501197B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23093099 1999-08-17
JP30866599 1999-10-29

Publications (1)

Publication Number Publication Date
TW501197B true TW501197B (en) 2002-09-01

Family

ID=26529617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089116550A TW501197B (en) 1999-08-17 2000-08-16 Polishing compound for chemical mechanical polishing and method for polishing substrate

Country Status (8)

Country Link
US (2) US7744666B2 (cg-RX-API-DMAC7.html)
EP (1) EP1211717B1 (cg-RX-API-DMAC7.html)
JP (3) JP3954383B2 (cg-RX-API-DMAC7.html)
KR (1) KR100510977B1 (cg-RX-API-DMAC7.html)
CN (1) CN101792655B (cg-RX-API-DMAC7.html)
AU (1) AU6594200A (cg-RX-API-DMAC7.html)
TW (1) TW501197B (cg-RX-API-DMAC7.html)
WO (1) WO2001013417A1 (cg-RX-API-DMAC7.html)

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Also Published As

Publication number Publication date
KR100510977B1 (ko) 2005-08-31
EP1211717A1 (en) 2002-06-05
JP5472049B2 (ja) 2014-04-16
CN101792655A (zh) 2010-08-04
AU6594200A (en) 2001-03-13
US7319072B2 (en) 2008-01-15
JP3954383B2 (ja) 2007-08-08
KR20020021408A (ko) 2002-03-20
WO2001013417A1 (fr) 2001-02-22
CN101792655B (zh) 2013-05-01
EP1211717A4 (en) 2007-03-28
US7744666B2 (en) 2010-06-29
JP2011082537A (ja) 2011-04-21
US20060037251A1 (en) 2006-02-23
US20060124597A1 (en) 2006-06-15
EP1211717B1 (en) 2016-04-13
JP2012182473A (ja) 2012-09-20

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