TW475229B - Offset measurement method, tool position detection method and bonding device - Google Patents

Offset measurement method, tool position detection method and bonding device Download PDF

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Publication number
TW475229B
TW475229B TW089126701A TW89126701A TW475229B TW 475229 B TW475229 B TW 475229B TW 089126701 A TW089126701 A TW 089126701A TW 89126701 A TW89126701 A TW 89126701A TW 475229 B TW475229 B TW 475229B
Authority
TW
Taiwan
Prior art keywords
tool
position detection
camera
aforementioned
reference member
Prior art date
Application number
TW089126701A
Other languages
English (en)
Chinese (zh)
Inventor
Shigeru Hayata
Ryuichi Kyomasu
Satoshi Enokido
Toshiaki Sasano
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Application granted granted Critical
Publication of TW475229B publication Critical patent/TW475229B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
TW089126701A 2000-03-06 2000-12-14 Offset measurement method, tool position detection method and bonding device TW475229B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000059843A JP3967518B2 (ja) 2000-03-06 2000-03-06 オフセット測定方法、ツール位置検出方法およびボンディング装置

Publications (1)

Publication Number Publication Date
TW475229B true TW475229B (en) 2002-02-01

Family

ID=18580243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089126701A TW475229B (en) 2000-03-06 2000-12-14 Offset measurement method, tool position detection method and bonding device

Country Status (4)

Country Link
US (2) US6762848B2 (https=)
JP (1) JP3967518B2 (https=)
KR (1) KR100420272B1 (https=)
TW (1) TW475229B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380872B (zh) * 2009-03-31 2013-01-01 Toshiba Machine Co Ltd Tool nose position detection method and tool nose position detection device
TWI498179B (zh) * 2012-12-19 2015-09-01 Genesis Photonics Inc 工作機台及晶圓的處理方法

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置
JP4620262B2 (ja) * 2001-01-16 2011-01-26 富士機械製造株式会社 電子部品装着装置
DE10119018A1 (de) * 2001-04-18 2002-10-24 Emhart Llc Newark Positionier- und/oder Montagehilfe sowie dementsprechendes Verfahren
KR101086097B1 (ko) * 2002-04-04 2011-11-25 토레이 엔지니어링 컴퍼니, 리미티드 얼라이먼트 방법 및 그 방법을 이용한 실장 방법
JP4105926B2 (ja) * 2002-09-30 2008-06-25 株式会社新川 ボンディング装置におけるオフセット測定機構及びボンディング装置におけるオフセット測定方法
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
DE10338809B4 (de) * 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム
US20070260420A1 (en) * 2006-05-03 2007-11-08 Data I/O Corporation Automated calibration system
JP5301329B2 (ja) * 2008-03-31 2013-09-25 Ｊｕｋｉ株式会社 電子部品の実装方法
JP4247299B1 (ja) * 2008-03-31 2009-04-02 株式会社新川 ボンディング装置及びボンディング方法
US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
KR101360289B1 (ko) 2012-02-28 2014-02-12 국립대학법인 울산과학기술대학교 산학협력단 공구의 깊이 방향의 이동 위치 측정 방법
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
JP5389995B1 (ja) * 2012-08-21 2014-01-15 安田工業株式会社 計測システム及びその計測システムを備えた工作機械
CN104690424B (zh) * 2013-12-05 2016-08-24 大族激光科技产业集团股份有限公司 丝端面熔球激光焊接装置及方法
TWI580511B (zh) * 2014-06-10 2017-05-01 新川股份有限公司 A bonding device, and a method of estimating the placement position of the engagement tool
WO2016158588A1 (ja) * 2015-03-31 2016-10-06 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
CN104741297B (zh) * 2015-04-08 2018-01-16 常州铭赛机器人科技股份有限公司 易损件顶点坐标校正装置及校正方法
US11031367B2 (en) 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
DE102017204657A1 (de) 2017-03-21 2018-09-27 Schunk Sonosystems Gmbh Verfahren und Vorrichtung zur Herstellung einer Schweißbaugruppe
US11047795B2 (en) * 2019-06-03 2021-06-29 Formfactor, Inc. Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems
CN113136721B (zh) * 2020-01-17 2024-06-18 青岛海尔洗衣机有限公司 一种叠衣机的自动纠偏方法
US11540399B1 (en) * 2020-04-09 2022-12-27 Hrl Laboratories, Llc System and method for bonding a cable to a substrate using a die bonder
CN115649799A (zh) * 2022-11-16 2023-01-31 河南中烟工业有限责任公司 一种烟箱的输送姿态检测系统及方法
CN117324271B (zh) * 2023-11-26 2024-05-10 广州奥图弹簧有限公司 一种高精密ccd全检打二维码一体设备
CN119870975B (zh) * 2025-03-28 2025-06-06 江苏筑一智能装备科技有限公司 一种压板、导向平键组装与合膛组合加工设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969939A (ja) 1982-10-15 1984-04-20 Toshiba Corp ワイヤボンデイング方法およびその装置
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
KR100301139B1 (ko) * 1993-07-01 2001-11-30 오노 시게오 투영노광장치및방법
JPH07115296A (ja) * 1993-10-15 1995-05-02 Sanyo Electric Co Ltd 部品実装機の制御装置
JP3255807B2 (ja) * 1994-10-21 2002-02-12 松下電器産業株式会社 Ｔｃｐ実装方法
US5702049A (en) * 1995-06-07 1997-12-30 West Bond Inc. Angled wire bonding tool and alignment method
KR100246853B1 (ko) * 1997-11-25 2000-03-15 윤종용 다이 본딩 설비 및 이를 이용한 접착부재 잔량 검출 방법
JP2982000B1 (ja) * 1998-07-03 1999-11-22 株式会社新川 ボンディング方法及びその装置
JP3757254B2 (ja) * 1999-12-28 2006-03-22 株式会社新川 ボンディング装置およびボンディング方法
JP3416091B2 (ja) * 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
JP3566166B2 (ja) * 2000-02-10 2004-09-15 株式会社新川 ツール位置測定方法、オフセット測定方法、基準部材およびボンディング装置
JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380872B (zh) * 2009-03-31 2013-01-01 Toshiba Machine Co Ltd Tool nose position detection method and tool nose position detection device
TWI498179B (zh) * 2012-12-19 2015-09-01 Genesis Photonics Inc 工作機台及晶圓的處理方法

Also Published As

Publication number Publication date
KR20010087325A (ko) 2001-09-15
US6814121B2 (en) 2004-11-09
JP3967518B2 (ja) 2007-08-29
JP2001249007A (ja) 2001-09-14
US20030030821A1 (en) 2003-02-13
US20010042770A1 (en) 2001-11-22
KR100420272B1 (ko) 2004-03-02
US6762848B2 (en) 2004-07-13

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