JP3967518B2 - オフセット測定方法、ツール位置検出方法およびボンディング装置 - Google Patents

オフセット測定方法、ツール位置検出方法およびボンディング装置 Download PDF

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Publication number
JP3967518B2
JP3967518B2 JP2000059843A JP2000059843A JP3967518B2 JP 3967518 B2 JP3967518 B2 JP 3967518B2 JP 2000059843 A JP2000059843 A JP 2000059843A JP 2000059843 A JP2000059843 A JP 2000059843A JP 3967518 B2 JP3967518 B2 JP 3967518B2
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JP
Japan
Prior art keywords
tool
position detection
plane
reference member
pickup device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000059843A
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English (en)
Japanese (ja)
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JP2001249007A (ja
JP2001249007A5 (https=
Inventor
滋 早田
隆一 京増
聡 榎戸
利明 笹野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2000059843A priority Critical patent/JP3967518B2/ja
Priority to TW089126701A priority patent/TW475229B/zh
Priority to KR10-2001-0011101A priority patent/KR100420272B1/ko
Priority to US09/800,323 priority patent/US6762848B2/en
Publication of JP2001249007A publication Critical patent/JP2001249007A/ja
Priority to US10/267,154 priority patent/US6814121B2/en
Publication of JP2001249007A5 publication Critical patent/JP2001249007A5/ja
Application granted granted Critical
Publication of JP3967518B2 publication Critical patent/JP3967518B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
JP2000059843A 2000-03-06 2000-03-06 オフセット測定方法、ツール位置検出方法およびボンディング装置 Expired - Fee Related JP3967518B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000059843A JP3967518B2 (ja) 2000-03-06 2000-03-06 オフセット測定方法、ツール位置検出方法およびボンディング装置
TW089126701A TW475229B (en) 2000-03-06 2000-12-14 Offset measurement method, tool position detection method and bonding device
KR10-2001-0011101A KR100420272B1 (ko) 2000-03-06 2001-03-05 오프셋 측정방법, 툴위치 검출방법 및 본딩장치
US09/800,323 US6762848B2 (en) 2000-03-06 2001-03-06 Offset measurement method, tool position detection method and bonding apparatus
US10/267,154 US6814121B2 (en) 2000-03-06 2002-10-09 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000059843A JP3967518B2 (ja) 2000-03-06 2000-03-06 オフセット測定方法、ツール位置検出方法およびボンディング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007117590A Division JP4467599B2 (ja) 2007-04-26 2007-04-26 ボンディング装置

Publications (3)

Publication Number Publication Date
JP2001249007A JP2001249007A (ja) 2001-09-14
JP2001249007A5 JP2001249007A5 (https=) 2005-08-11
JP3967518B2 true JP3967518B2 (ja) 2007-08-29

Family

ID=18580243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000059843A Expired - Fee Related JP3967518B2 (ja) 2000-03-06 2000-03-06 オフセット測定方法、ツール位置検出方法およびボンディング装置

Country Status (4)

Country Link
US (2) US6762848B2 (https=)
JP (1) JP3967518B2 (https=)
KR (1) KR100420272B1 (https=)
TW (1) TW475229B (https=)

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JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置
JP4620262B2 (ja) * 2001-01-16 2011-01-26 富士機械製造株式会社 電子部品装着装置
DE10119018A1 (de) * 2001-04-18 2002-10-24 Emhart Llc Newark Positionier- und/oder Montagehilfe sowie dementsprechendes Verfahren
KR101086097B1 (ko) * 2002-04-04 2011-11-25 토레이 엔지니어링 컴퍼니, 리미티드 얼라이먼트 방법 및 그 방법을 이용한 실장 방법
JP4105926B2 (ja) * 2002-09-30 2008-06-25 株式会社新川 ボンディング装置におけるオフセット測定機構及びボンディング装置におけるオフセット測定方法
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
DE10338809B4 (de) * 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム
US20070260420A1 (en) * 2006-05-03 2007-11-08 Data I/O Corporation Automated calibration system
JP5301329B2 (ja) * 2008-03-31 2013-09-25 Ｊｕｋｉ株式会社 電子部品の実装方法
JP4247299B1 (ja) * 2008-03-31 2009-04-02 株式会社新川 ボンディング装置及びボンディング方法
US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
JP2010256341A (ja) * 2009-03-31 2010-11-11 Toshiba Mach Co Ltd 刃先位置検出方法および刃先位置検出装置
KR101360289B1 (ko) 2012-02-28 2014-02-12 국립대학법인 울산과학기술대학교 산학협력단 공구의 깊이 방향의 이동 위치 측정 방법
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
JP5389995B1 (ja) * 2012-08-21 2014-01-15 安田工業株式会社 計測システム及びその計測システムを備えた工作機械
TWI498179B (zh) * 2012-12-19 2015-09-01 Genesis Photonics Inc 工作機台及晶圓的處理方法
CN104690424B (zh) * 2013-12-05 2016-08-24 大族激光科技产业集团股份有限公司 丝端面熔球激光焊接装置及方法
TWI580511B (zh) * 2014-06-10 2017-05-01 新川股份有限公司 A bonding device, and a method of estimating the placement position of the engagement tool
WO2016158588A1 (ja) * 2015-03-31 2016-10-06 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
CN104741297B (zh) * 2015-04-08 2018-01-16 常州铭赛机器人科技股份有限公司 易损件顶点坐标校正装置及校正方法
US11031367B2 (en) 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
DE102017204657A1 (de) 2017-03-21 2018-09-27 Schunk Sonosystems Gmbh Verfahren und Vorrichtung zur Herstellung einer Schweißbaugruppe
US11047795B2 (en) * 2019-06-03 2021-06-29 Formfactor, Inc. Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems
CN113136721B (zh) * 2020-01-17 2024-06-18 青岛海尔洗衣机有限公司 一种叠衣机的自动纠偏方法
US11540399B1 (en) * 2020-04-09 2022-12-27 Hrl Laboratories, Llc System and method for bonding a cable to a substrate using a die bonder
CN115649799A (zh) * 2022-11-16 2023-01-31 河南中烟工业有限责任公司 一种烟箱的输送姿态检测系统及方法
CN117324271B (zh) * 2023-11-26 2024-05-10 广州奥图弹簧有限公司 一种高精密ccd全检打二维码一体设备
CN119870975B (zh) * 2025-03-28 2025-06-06 江苏筑一智能装备科技有限公司 一种压板、导向平键组装与合膛组合加工设备

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JPH07115296A (ja) * 1993-10-15 1995-05-02 Sanyo Electric Co Ltd 部品実装機の制御装置
JP3255807B2 (ja) * 1994-10-21 2002-02-12 松下電器産業株式会社 Ｔｃｐ実装方法
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JP2982000B1 (ja) * 1998-07-03 1999-11-22 株式会社新川 ボンディング方法及びその装置
JP3757254B2 (ja) * 1999-12-28 2006-03-22 株式会社新川 ボンディング装置およびボンディング方法
JP3416091B2 (ja) * 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
JP3566166B2 (ja) * 2000-02-10 2004-09-15 株式会社新川 ツール位置測定方法、オフセット測定方法、基準部材およびボンディング装置
JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置

Also Published As

Publication number Publication date
KR20010087325A (ko) 2001-09-15
US6814121B2 (en) 2004-11-09
JP2001249007A (ja) 2001-09-14
US20030030821A1 (en) 2003-02-13
US20010042770A1 (en) 2001-11-22
KR100420272B1 (ko) 2004-03-02
US6762848B2 (en) 2004-07-13
TW475229B (en) 2002-02-01

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