TW472317B - Process and apparatus for treating a workpiece such as a semiconductor wafer - Google Patents

Process and apparatus for treating a workpiece such as a semiconductor wafer Download PDF

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Publication number
TW472317B
TW472317B TW089114615A TW89114615A TW472317B TW 472317 B TW472317 B TW 472317B TW 089114615 A TW089114615 A TW 089114615A TW 89114615 A TW89114615 A TW 89114615A TW 472317 B TW472317 B TW 472317B
Authority
TW
Taiwan
Prior art keywords
patent application
liquid
scope
item
ozone
Prior art date
Application number
TW089114615A
Other languages
English (en)
Chinese (zh)
Inventor
Eric J Bergman
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of TW472317B publication Critical patent/TW472317B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H10P50/283—
    • H10P50/287—
    • H10P70/15—
    • H10P72/0414—
    • H10P72/0424—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/007—Heating the liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2230/00—Other cleaning aspects applicable to all B08B range
    • B08B2230/01—Cleaning with steam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW089114615A 1999-07-23 2000-07-21 Process and apparatus for treating a workpiece such as a semiconductor wafer TW472317B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14535099P 1999-07-23 1999-07-23

Publications (1)

Publication Number Publication Date
TW472317B true TW472317B (en) 2002-01-11

Family

ID=22512696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089114615A TW472317B (en) 1999-07-23 2000-07-21 Process and apparatus for treating a workpiece such as a semiconductor wafer

Country Status (6)

Country Link
EP (2) EP1212151A4 (enExample)
JP (3) JP2004500701A (enExample)
AT (1) ATE485115T1 (enExample)
DE (1) DE60045134D1 (enExample)
TW (1) TW472317B (enExample)
WO (1) WO2001007177A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7163588B2 (en) 1997-05-09 2007-01-16 Semitool, Inc. Processing a workpiece using water, a base, and ozone
US7416611B2 (en) 1997-05-09 2008-08-26 Semitool, Inc. Process and apparatus for treating a workpiece with gases
JP4917651B2 (ja) * 1999-08-12 2012-04-18 アクアサイエンス株式会社 レジスト膜除去装置及びレジスト膜除去方法
US6982006B1 (en) 1999-10-19 2006-01-03 Boyers David G Method and apparatus for treating a substrate with an ozone-solvent solution
JP4000247B2 (ja) 2001-04-18 2007-10-31 株式会社ルネサステクノロジ フォトマスクの洗浄方法
EP1347496A3 (en) 2002-03-12 2006-05-03 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus and substrate treating method
JP4232383B2 (ja) * 2002-05-13 2009-03-04 信越半導体株式会社 半導体ウエーハの表面処理方法
KR100467016B1 (ko) * 2002-05-30 2005-01-24 삼성전자주식회사 반도체기판의 세정방법
JP2006093473A (ja) * 2004-09-24 2006-04-06 M Fsi Kk 基板の洗浄方法及び基板の洗浄装置
JP4919388B2 (ja) * 2006-03-09 2012-04-18 国立大学法人広島大学 食品製造設備の被洗浄物を洗浄する洗浄装置、および洗浄方法
DE102007027112B4 (de) * 2007-06-13 2011-06-22 Siltronic AG, 81737 Verfahren zur Reinigung, Trocknung und Hydrophilierung einer Halbleiterscheibe
JP2008311591A (ja) * 2007-06-18 2008-12-25 Sharp Corp 基板処理装置および基板処理方法
KR101106582B1 (ko) * 2007-12-07 2012-01-19 가부시키가이샤 사무코 실리콘 웨이퍼 세정 방법 및 그 장치
CN101945608B (zh) * 2008-02-21 2013-04-03 荷兰联合利华有限公司 清洁基底的方法和装置
IT1395090B1 (it) * 2009-04-08 2012-09-05 Lasa Impianti Srl Apparecchiatura a basso impatto ambientale per il lavaggio di particolari metallici e non metallici che necessitano di un altro grado di pulizia
JP5682290B2 (ja) * 2010-12-20 2015-03-11 東京エレクトロン株式会社 炭素含有薄膜のスリミング方法及び酸化装置
JP5520991B2 (ja) * 2012-03-29 2014-06-11 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
WO2013158937A1 (en) * 2012-04-18 2013-10-24 Advanced Wet Technologies Gmbh Hyperbaric methods and systems for rinsing and drying granular materials
US11358172B2 (en) * 2015-09-24 2022-06-14 Suss Microtec Photomask Equipment Gmbh & Co. Kg Method for treating substrates with an aqueous liquid medium exposed to UV-radiation
CN107820638A (zh) * 2016-10-25 2018-03-20 深圳市柔宇科技有限公司 液体控温系统及膜层剥离设备
JP7353212B2 (ja) * 2020-02-28 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7645114B2 (ja) * 2021-03-25 2025-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法
JP7718916B2 (ja) 2021-08-31 2025-08-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置
JP7720209B2 (ja) * 2021-09-24 2025-08-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232511A (en) * 1990-05-15 1993-08-03 Semitool, Inc. Dynamic semiconductor wafer processing using homogeneous mixed acid vapors
US5261966A (en) * 1991-01-28 1993-11-16 Kabushiki Kaisha Toshiba Method of cleaning semiconductor wafers using mixer containing a bundle of gas permeable hollow yarns
JPH05152203A (ja) * 1991-11-29 1993-06-18 Chlorine Eng Corp Ltd 基板処理方法および処理装置
KR940012061A (ko) * 1992-11-27 1994-06-22 가나이 쯔또무 유기물제거방법 및 그 방법을 이용하기 위한 유기물제거장치
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
JP2760418B2 (ja) * 1994-07-29 1998-05-28 住友シチックス株式会社 半導体ウエーハの洗浄液及びこれを用いた半導体ウエーハの洗浄方法
JP3923097B2 (ja) * 1995-03-06 2007-05-30 忠弘 大見 洗浄装置
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
US5803982A (en) * 1996-10-15 1998-09-08 Ez Environmental Solutions Corporation Pressure washing apparatus with ozone generator
ATE522926T1 (de) * 1997-02-14 2011-09-15 Imec Verfahren zur entfernung organischer kontamination von einer halbleiteroberfläche
JPH10340876A (ja) * 1997-06-10 1998-12-22 Shibaura Eng Works Co Ltd 洗浄処理方法および洗浄処理装置
JP4477704B2 (ja) * 1997-11-20 2010-06-09 アイメック 半導体基板表面からの有機汚染物の除去方法

Also Published As

Publication number Publication date
EP1481741B1 (en) 2010-10-20
JP2007049176A (ja) 2007-02-22
JP2006261685A (ja) 2006-09-28
EP1212151A4 (en) 2005-08-17
EP1212151A1 (en) 2002-06-12
ATE485115T1 (de) 2010-11-15
JP2004500701A (ja) 2004-01-08
EP1481741A2 (en) 2004-12-01
DE60045134D1 (de) 2010-12-02
WO2001007177A1 (en) 2001-02-01
EP1481741A3 (en) 2005-08-17

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MK4A Expiration of patent term of an invention patent