TW457163B - A method for bonding ceramic and metal and a ceramic-metal bonding article prepared by the method - Google Patents

A method for bonding ceramic and metal and a ceramic-metal bonding article prepared by the method Download PDF

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TW457163B
TW457163B TW089112144A TW89112144A TW457163B TW 457163 B TW457163 B TW 457163B TW 089112144 A TW089112144 A TW 089112144A TW 89112144 A TW89112144 A TW 89112144A TW 457163 B TW457163 B TW 457163B
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metal
ceramic
joint surface
ceramics
joining
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Seiichi Miyamoto
Toshimasa Maruyama
Toshifumi Sato
Takayuki Itotani
Minoru Kobayashi
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Mitsubishi Electric Corp
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    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
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Description

經 濟 部 智 慧 財 產 局 員 工 消 費 合 η 社
Α7 _______Β7___ 五、發明說明(1 ) [技術領域] 本發明係有關於一種焊接陶瓷與金屬之接合方法以 及依此方法接合之陶瓷與金屬之接合體。係有關例如於電 氣切換之開關器’在為開關接觸點之電性絕緣操作桿令絕 緣物(陶瓷)與金屬之接合者。 [背景技術] 第7圖示為以往之方法及接合體,其說明如下。 第7圊為特開平1 -299790公報中揭示之接合體,介於 陶究之氧化链1和金屬之鎳榛2之間,有鎳板4或鎢极5 等之中間材。圖中之3為焊材。 金屬之熱膨脹率比氧化銘大·而焊材在溶化凝固降溫 時會比氧化鋁縮小’故於金屬接觸之中央部會發生塵縮應 力’其外圍部會發生拉伸應力而在常溫時殘留。氧化銘因 對壓縮較強而對拉伸脆弱,故較不適於大拉伸殘留應力之 發生。 中間材乃是吸收該殘留應力之部材,使用於為 合體之強度安定性。 ’件接 尚有,其他之中間材如1990年曰刊工業新聞社發〜 之陶瓷接合工學(岸本信也、須贺唯和同著) 仃 r m u、 載之起 Q Nb )、鉬()、鋁(a])、銅(cu )、鐵•錄· / p 銘^合金1 e-Ni-Cr )、鋼•碳(Cu-C )、鋁·碳化矽(:、、 泡金屬、多孔質材料等。 發 依據以往之方法及由該方法所形成之接合體必須 ^之中間材,為此.於接合作業中會有零: 探 TFT—~~- ----------------------訂.-------- (請先閱讀背面之注意事項再填寫本頁) A7 457163 B7_____ _ 五、發明說明(2 ) 多、組裝費時、造價昂貴等問題。 此外’一旦介於其間之中間材’其表面狀態變差時就 不能得到充分之接合強度而必須進行充分之管理β 為解決上述課題’本發明之目的乃提供一種接合強度 可靠性高之接合方法及接合體。 [發明之揭示] 申請專利範圍第1項之發明,為焊接陶竞與金屬之接 合方法’其特徵為金屬側之接合面面積為不超過陶竟侧接 合面積之90%者。 申請專利範圍第2項之發明,係焊接陶曼與金屬之接 合方法’其特徵為由殘留之熱應力不損傷陶瓷而金屬側之 接合面面積為不超過之陶瓷側接合面積之9〇%者。 申請專利範圍第3項之發明,其特徵為於申請專利範 圍第2項之陶瓷與金屬之接合方法中,接合面為平面者。 申請專利範圍第4項之發明,係於申請專利範圍第2 項之陶曼與金屬之接合方法中,該陶瓷為氧化鋁,金屬為 銅、鎮、鐵之任一種者》 申請專利範圍第5項之發明’係於申請專利範圍第2 項之陶瓷與金屬之接合方法中,該陶瓷為氧化鋁,金屬為 銅、鎳、鐵之任一者為主成分之合金者。 申請專利範圍第6項之發明’係於申請專利範圍第2 項之陶竟與金屬之接合方法中’該陶瓷之接合面不施以金 屬化時,係使用含活性金屬之焊材者β 申請專利範圍第7項之發明,係於申請專利範 6 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公笼) 311554 {請先閱讀背面之注意事項再填寫本頁) 裝·----— II訂·!麵*竣 經濟部智慧財產局員工消費合作社印製 2 經濟部智慧財產局員工消費合作社印製 I _,_丨"丨丨_丨_ _ | 恭紙張.<度瑀用國家螵進(CNOAi規格 五、發明說明( 項之陶兗與金屬之接合方法中,使用之活性金屬為鈦(Ti: 或錯(乙〇者。 t請專利範圍第8項之陶瓷與金屬之接合體之發明, 其特徵為於谭接陶瓷與金屬之接合方法中,由殘留之熱應 力不損傷陶£而與陶磁接合之金屬側接合面面積不超過陶 曼側接合面積之90%接合者。 本發明之特徵如第1圖所示為陶瓷10與金屬20接合 體之剖視圖’於陶瓷10與金屬2〇接合體之焊接接合面(以 下單純指接合面)使金屬2〇之接合面面積比陶瓷1〇之接 合面面積小,例如不超過陶瓷10接合面面積之90%,此 時更好之陶瓷10與金屬2〇雙方之接合面為平面。依此接 合方法,即使不用t間材亦可抑止陶瓷〗〇側之拉伸殘留應 力發生,而能獲得具有充分焊接強度之接合體。 尚且,於本說明書中,金屬2〇之接合面如文字般意 指與陶瓷10側實質上接觸之全部接合面而言。另—方面’ 陶瓷10之接合面為由於與金屬20之熱膨脹係數差異而拉 伸殘留應力所須之程度輕微為止之範圍而t,係指與金屬 2〇側實質上接觸之接合面及該面之延伸面,亦包含與金屬 20側無接觸面部分。上述之拉伸殘留應力所須之程度輕微 意指對接合體強度安定性無不利影響之程度輕微而士。 以上述之陶竞為例1氧化罐化紹陶竟則關器 之絕緣桿為宜。 又以上述之金屬為例’以鋼起始為主成分的有:銅· 辞(Cu-Zn)、銅♦錫(Cu-Sn)、銅,絡(cu,cr)、钢•錯⑴ i-—— 〇 3Π554 裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 457163
五、發明說明(4 )
Zr) '銅•鈹(Cu_Be)、銅•鈦(Cu_Ti)等合金;又,以鎳起 始為主成分的有鎳•銅(Zi-Cu)、蒙鎳合金(Monel)、英高鎳 (Inconel)鎳鉻鐵等之合金;再者,以鐵起始為主成分的有 鐵•鎳(Fe-Ni)、科伐(Kovar)鐵鎳鈷、英高合金(Inc〇i〇力 鎳路鐵等之合金為宜》而’蒙鎳合金(M〇nel)、英高鍊 (Inconel)、科伐(Kovar)、英高合金(inc〇i〇y)為商品之名 稱。 依據實驗’金屬20之接合面面積一旦超過90%時, 於陶瓷殘留熱應力變大而僅成為低焊接強度,在焊接完成 當時陶瓷即已產生破壞。 此外’如使用鈦(Ti)或錘(Zr)等含有適當活性之金屬焊 材時’於接合面省略施以金屬化又鍍錄之程序也能得到具 有充分之接合強度。 因此,依據本發明,於接合面無須施以金屬化也不須 鍍鎳之程序》 [圖示之簡單說明] 第1圖示本發明形態模式垂直剖視圖。 第2圖示實施形態1之開關器操作桿模式垂直剖視 圖。 第3圖示實施形態2模式垂直剖視圖(a)至(e)為其變形 例0 第4圖示實施形態3模式水平剖視圖(a)至⑴為其變形 例。 第5圖示實施形態4模式水平剖視圖(a)至(b)為其變形 (請先閱讀背面之注意事項再填寫本頁) '裝--------訂i 丨成 經濟部智慧財產局具工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4 311554 A7 A7 經濟部智慧財產局員工消费合作社印製 B7 五、發明說明(5 ) 例。 第6圖示本發明之實驗結果表。 第7圖示以往技術之模式垂直剖視圖。 [實施本發明之最佳形態] 本發明之實施形態乃以開關器之陶瓷與金屬之接合 體為例說明之。 且,該接合體以作為絕緣物之陶瓷置於中央,其上下 乃接合同種金屬,而接合部分有2處,因2處接合部分皆 相同故以下就一方之接合部分說明之。 實施形態1 於第2圖所示之形態中’該實施形態1,於焊接面施 以金屬化和鍍鎳之02 Ox L20·之氣化鋁陶瓷η與可變外 徑為03〇、2〇、19、18、15、1〇唧1之[5〇皿1之鋼棒(€11)2 1 之間夹著厚度0.1 nun之焊材(BAg-8)31,直立在真空度1χ 10'5Torr於800°C加熱5分鐘進行焊接。 焊接後’將在陶瓷11兩端焊接之銅棒(CU)21以拉伸 試驗機測量拉伸焊接強度,結果如第6圖所示。 由表可知,銅棒(CU)21之直徑小時銅棒(Cu)23會破 斷’而銅棒(Cu)21直徑大時連帶著陶瓷丨丨也破斷^銅棒 (Cu)21之直徑大於陶磁n之直徑時,在焊接完成當時, 陶变Π即有裂縫(crack)產生成為無法進行拉伸試驗之樣 品。 I---— —— — —----— — — — ——II ----- - {猜先閱讀背面之注意事項再填寫本頁)
^11554 457163 A7
五、發明說明(6 ) 面面積之90%開始,陶瓷n之破壞即開始而接合強度明顯 地降低。 由此可知,為確保接合體之安定強度,鋼棒(Cu)21之 接合面面積必須約為陶瓷Η之接合面面積之9〇%以下β 實施形態2 於第2圖所示之形態令,於焊接面未施以金屬化之分 20x L20咖之氧化鋁陶瓷Η與可變外徑0 2〇、19、18腿之 L50im銅棒(Cu)21之間夾著厚度o.iuujj之含鈦(τ〖)活性焊材 如銀.銅•鈦(Ag-Cu-Ti)之市售烊材31,在真空度lx if Torr於900°C加熱5分鐘進行焊接。 將焊接完成品與上述實施形態1同樣地以拉伸試驗機 測量拉伸焊接強度,其結果如第6圖之表所示。 由表可知’施以金屬化之焊接強度與以市售之焊材 (BAg-8)焊接時並無太大差異。 實施形態3 於第2圖所示之形態中,於焊接面施以金屬化和鍍鎳 之必20x L20咖之氧化鋁陶瓷11與可變外徑必19、18腦之 L50 mm 之蒙鎳合金(Monel)、鎳(Ni)、鐵(Fe)、鐵(Fe)-42 鎳 (Ni)棒21之間夹著厚度〇.1麵之市售焊材(BAg-8)31,直立 於真空度lx 10‘5 Torr於80(TC加熱5分鐘進行焊接》 焊接完成後與上述實施形態1、2同樣地以拉伸試驗 機測量拉伸焊接強度,其結果如第6圖之表所示。 由表可知,於破斷強度有差異者,在金屬棒21之接 合面面積超過陶瓷11接合面面積之90%開始,陶瓷之破壞 (諳先閱讀背面之泫意事項再填寫本頁)
裝-------—訂·------J*M 經濟部智慧財產局員工消費合作社印制衣 本紙張尺度適用中國國家標準(CNS>A4規格(210 X 297公釐) 6 311554 經濟邡智慧財產局員工消費合作杜印製 3]1554 -_____B7_______ 五、發明說明(7 ) 即開始,超過以上之直徑時接合強度明顯地降低。 此傾向與鋼之情況時相同,為確保安定強度,接合面 面積必須為氡化鋁陶瓷接合面面積之90°/〇以下。 實施形態4 上述之實施形態1至3係以圓柱狀之氧化鋁陶瓷11 與圓柱狀之金屬棒21說明之,但不限於此,若為使接合體 之安定強度無不利影響之範圍,則陶瓷u與金屬21之焊 接接合部,如第3圖之(a)至(e)分別示縱斷面之形態或者如 第4圖之(a)至⑴所示之橫斷面之形態亦可。 且’如第3圖所示之(c)或(d),陶瓷u側之接合面並 不須要全面性之平面,至少與金屬21侧之接合面之實質接 觸面若平坦即已足夠,無接觸之接合面區域可不為平面而 可有適當之切割面。 t施形輳5 如第5圖所示之實施形態,金屬21並非實心狀焊 接接合面之橫斷面如第5圖(a)所示為中空,另外,如第5 圖(b)所示有狹縫(Sllt)者亦可。 [產業上之可利用性] 依申請專利範圍第1項至第7項之各項發明乃提供 一種無須任何中間材、零件數目少、組裝容易、造價低廉、 接合強度具高信賴度之陶瓷與金屬之接合方法。 依申請專利範圍第8項之發明,可提供一種不需要如 以往之中間材,陶吏與金屬間即具有充分焊接強度之接 合' 不僅製作容易且價格低廉之接合體 .各纸張人U國家標a (CNSM4賴⑵G---—--- — — — — — — — 1 -1111111 ·11!1111· <請先閱讀背面之注意事項再填寫本頁)

Claims (1)

  1. 457 163 六、申請專利範圍 1. 一種陶瓷與金屬之接合方法’其特徵為於焊接陶曼與金 屬之接合方法中’金屬側之接合面面積為不超過陶瓷側 接合面面積之90%者。 2. 一種陶瓷與金屬之接合方法,其特徵為於焊接陶瓷與金 屬之接合方法中,以殘留熱應力不損傷陶瓷而金屬側之 接合面面積為不超過陶瓷側接合面面積之9〇%者。 3. 如申請專利範圍第2項之陶瓷與金屬之接合方法,其中 接合面為平面者。 - 4·如申請專利範圍第2項之陶瓷與金屬之接合方法,其中 陶瓷為氧化鋁,金屬每銅、鎳、鐵之任一種者。 5. 如申請專利範圍第2項之陶竞與金屬之接合方法,其_ 陶竟為氧化銘,金屬為銅、錄、鐵之任_者為主成分之 合金者& 6. 如申請專利範圍第2項之陶曼與金屬之接合方法,其甲 陶竟之接合面不施以金屬化時,係使用含活性金之 材者。 7. 如申請專利範圍帛6項之陶竞與金屬之接合方法,其令 使用之活性金屬為鈦或锆者。 8· 一種陶瓷與金屬之接合體,其特徵 微马於焊接陶瓷與金屬 之接合方法巾,以殘留熱應力不損傷陶^金相之接 合面面積為不超過陶究側接合面面積之9q%而接人 者。 〇 本紙張尺度適用中囷國家標準(CNS)A4規格(210 X 297公釐) ·- '裝--------訂---------線 <請先閱讀背面之注意事項再填寫本Ϊ ) 311554
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TWI619207B (zh) * 2014-03-20 2018-03-21 三菱綜合材料股份有限公司 接合體、電源模組用基板、電源模組及接合體之製造方法

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CN105384457B (zh) * 2015-12-15 2018-09-07 深圳市日联科技有限公司 一种氧化铝陶瓷与金属钼的焊接方法

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