CN1327438A - 陶瓷与金属的接合方法及用该方法接合的陶瓷与金属的接合体 - Google Patents
陶瓷与金属的接合方法及用该方法接合的陶瓷与金属的接合体 Download PDFInfo
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Abstract
本发明的目的是提供一种无需中间材料的将陶瓷与金属接合的方法和使用该方法的陶瓷与金属的接合体。在本发明中,金属侧的接合面面积不超过陶瓷侧接合面面积的90%。
Description
技术领域
本发明涉及通过钎焊将陶瓷与金属接合的方法及用该方法接合的陶瓷与金属的接合体，例如，涉及将电源开关中为了使接点通断而电绝缘的操作杆中的绝缘物(陶瓷)与金属接合。
背景技术
下面通过图7对现有的方法和接合体进行说明。
图7是日本特许公开公报1989年第299790号中公开的接合体，在作为陶瓷的氧化铝1与作为金属的镍棒2之间插入了作为中间材料的镍板4和钨板5等。图中的3是钎料。
金属的热膨胀系数比氧化铝的大，在熔融的钎料降温而固化的时候，其收缩率大于氧化铝，因此，在氧化铝与金属接合的中心部分会出现压缩应力，在其周边部分会出现拉伸应力，并在常温下保留。氧化铝对压缩的承受能力大，但对拉伸则较脆弱，因此，出现大的拉伸残留应力是不适宜的。
中间材料是吸收上述残留应力的构件，用于提高接合体的强度稳定性。
其他的中间材料如1990年日刊工业新闻社出版的“陶瓷接合工学”(岸本信也须贺唯和合著)中所述，有铌(Nb)、钼(Mo)、铝(Al)、铜(Cu)、铁-镍-铬合金(Fe-Ni-Cr)、铜-碳(Cu-C)、铝-碳化硅(Al-SiC)、发泡金属、多孔材料等。
现有的接合方法和使用该方法的接合体必须有上述中间材料。因此存在接合操作中构件数增加、组装时花费功夫、制作成本高等问题。
此外，若中间材料的表面状态差，则不能得到足够的接合强度，因此，其管理必须十分注意。
为了解决上述问题，本发明的目的是，提供一种能使接合强度具有高可靠性的接合方法和接合体。
发明的公开
权利要求1的发明是一种通过钎焊将陶瓷与金属接合的方法，其特征在于，金属侧的接合面面积不超过陶瓷侧接合面面积的90％。
权利要求2的发明也是一种通过钎焊将陶瓷与金属接合的方法，其特征在于，金属侧的接合面面积不超过陶瓷侧接合面面积的90％，以不使陶瓷因残留热应力而损伤。
权利要求3的发明的特征在于，在权利要求2所述的陶瓷与金属的接合方法中，所述接合面为平面。
权利要求4的发明的特征在于，在权利要求2所述的陶瓷与金属的接合方法中，所述陶瓷是氧化铝，所述金属是铜、镍、铁中的任一种。
权利要求5的发明的特征在于，在权利要求2所述的陶瓷与金属的接合方法中，所述陶瓷是氧化铝，所述金属是以铜、镍、铁中的任一种为主要成分的合金。
权利要求6的发明的特征在于，在权利要求2所述的陶瓷与金属的接合方法中，在未对陶瓷接合面进行过金属化处理时，使用含有活泼金属的钎料。
权利要求7的发明的特征在于，在权利要求6的陶瓷与金属的接合方法中，所述活泼金属是钛(Ti)或锆(Zr)。
权利要求8的陶瓷与金属的接合体的发明的特征在于，用通过钎料将陶瓷与金属接合的方法进行接合，在所述方法中，金属侧的接合面面积不超过陶瓷侧接合面面积的90％，以不使陶瓷因残留热应力而损伤。
本发明的特征在于，如图1的陶瓷10与金属20的接合体的截面图所示，在陶瓷10与金属20的钎焊接合面(以下简称接合面)中，使金属20的接合面面积小于陶瓷10的接合面面积，例如，不超过陶瓷10的接合面面积的90％。此时，使陶瓷10和金属20两者的接合面为平面则更佳。使用该接合方法，即使不使用中间材料，也能抑制在陶瓷10侧产生拉伸残留应力，并能得到具有足够钎焊强度的接合体。
在本说明书中，金属20的接合面按字面含义，是指与陶瓷10侧实质性接触并接合的整个表面。而陶瓷10的接合面是指这样一个范围：在该范围之外，由与金属20的热膨胀吸收之差而引起的拉伸残留应力可忽略地轻微，具体地说，是指与金属20侧实质性接触并接合的表面和该表面的延伸部分，包括与金属20侧不接触的表面部分。所述拉伸残留应力可忽略地轻微是指轻微得不会对接合体所需强度的稳定性产生不良影响。
作为上述陶瓷，例如氧化铝(氧化铝陶瓷)适合用作开关的绝缘杆。
上述金属例如以铜和以铜为主要成分的铜-锌(Cu-Zn)、铜-锡(Cu-Sn)、铜-铬(Cu-Cr)、铜-锆(Cu-Zr)、铜-铍(Cu-Be)、铜-钛(Cu-Ti)等合金，或镍和以镍为主要成分的镍-铜(Ni-Cu)合金、蒙乃尔合金(Monel)、因科镍合金(Inconel)等，铁和以铁为主要成分的铁-镍(Fe-Ni)合金、科伐合金(Kovar)、因科镍铬不锈铜(Incoloy)等合金为佳。其中，蒙乃尔合金(Monel)、因科镍合金(Inconel)、科伐合金(Kovar)、因科镍铬不锈钢(Incoloy)均是商品名。
根据实验，若金属20的接合面面积超过90％，则陶瓷中残留的热应力增大，不仅会使钎焊强度下降，而且，钎焊完成时陶瓷会出现开裂。
此外，使用适当含有例如钛、锆等的活泼金属钎料时，即使省略了在接合面上进行金属化处理或镀镍的工序，也能得到具有足够接合强度的接合体。
因此，根据本发明，无需在接合体的接合面上实施金属化处理或镀镍的工序。
图面的简单说明
图1是本发明一实施方式的垂直截面示意图。
图2是实施方式1的开关的操作杆主要部分的垂直截面示意图。
图3是实施方式2的垂直截面示意图，图3(a)～(e)是其变例。
图4是实施方式3的水平截面示意图，图4(a)～(e)是其变例。
图5是实施方式4的水平截面示意图，图5(a)～(e)是其变例。
图6是显示本发明的实验结果的表。
图7是现有技术的垂直截面示意图。
本发明的最佳实施方式
以用作开关的陶瓷与金属的接合体作为本发明实施方式的例子进行说明。
该例所示的接合体以作为绝缘物的陶瓷为中心，在其上下接合了同种金属。虽然有两个接合部分，但由于该两个接合部分的接合方法是相同的，因此，下面仅就其中的一个接合部分进行说明。
实施方式1
如图2所示，在本实施方式中，将厚0.1mm的钎料(BAg-8)31夹入对钎焊面进行过金属化处理并镀过镍的φ20×长20mm的氧化铝陶瓷11与外径φ为30或20、19、18、15、10mm、长50mm的铜棒(Cu)21之间，将它们直立，并在1×10-5Torr的真空于800℃加热5分钟，进行钎焊。
钎焊后，用拉伸试验机测定钎焊在陶瓷11两端的铜棒21的拉伸钎焊强度，结果见图6的表。
根据表，当铜棒21直径小时，会在铜棒(Cu)21处断裂，而随着铜棒21的直径增大，断裂处移向陶瓷11，若铜棒21的直径比陶瓷11的大，则钎焊完成时陶瓷11会出现开裂，无法对试样进行拉伸试验。
该陶瓷11的断裂由残留的热应力(尤其是拉伸残留应力)而引起的，从铜棒21的接合面面积超过陶瓷11的接合面面积的约90％时起，陶瓷11出现断裂，强度显著下降。
由上述结果可知，为了确保作为接合体的稳定的强度，铜棒21的接合面面积必须在陶瓷11的接合面面积的约90％以下。
实施方式2
在图2所示方式中，将厚0.1mm的含钛(Ti)的活性钎料(如市售的银铜钛(Ag-Cu-Ti)钎料)31夹入未对钎焊面进行过金属化处理的φ20×长20mm的氧化铝陶瓷11与外径φ为20或19、18mm、长50mm的铜棒(Cu)21之间，将它们直立，并在1×10-5Torr的真空于900℃加热5分钟，进行钎焊。
钎焊后，与上述实施方式1相同，用拉伸试验机测定钎焊强度，结果见图6的表。
根据表，钎焊强度与进行过金属化处理(例如，用市售的钎料(Bag-8)钎焊过)时的钎焊强度没有明显不同。
实施方式3
在图2所示方式中，将厚0.1mm的市售钎料(BAg-8)31夹入对钎焊面进行过金属化处理并镀过镍的φ20×长20mm的氧化铝陶瓷11与外径φ为19或18mm、长50mm的蒙乃尔合金、Ni、Fe、Fe-42Ni棒21之间，将它们直立，并在1×10-5Torr的真空于800℃加热5分钟，进行钎焊。
钎焊后，与上述实施方式1和2相同，用拉伸试验机测定钎焊强度，结果见图6的表。
根据表，虽然断裂强度存在差异，但从金属棒21的接合面面积超过陶瓷11的接合面面积的约90％时起，陶瓷11开始出现断裂，强度显著下降。
该倾向与铜的情况相同，为了确保稳定的强度，接合面面积必须在氧化铝陶瓷接合面面积的90％以下。
实施方式4
在上述实施方式1至3中是就氧化铝陶瓷12和金属棒21为圆柱形的情况进行了说明，但本发明不限于这些实例，只要不会对接合体所需强度的稳定性产生不良影响，陶瓷11与金属21的钎焊接合部分例如可以是图3(a)～(e)所示各纵截面的形态，也可以是图4(a)～(i)所示各横截面图的形态。
如图3(c)和图3(d)所示，陶瓷11侧的接合面并非其整个面一定要是平面，至少与金属21侧的接合面实质性接触的接合面平坦即可，不接触的接合面部分不一定非是平面，可以是适当切削过的面。
实施方式5
在图5所示实施方式5中，金属21不是实心形状，钎焊接合面的横截面如图5(a)所示，是中空的，也可如图5(b)所示，有细缝。
产业上利用的可能性
根据权利要求1-7要求保护的各发明，均可提供无需中间材料、零件数少、组装容易、制作成本低、接合强度高、具有可靠性的陶瓷与金属的接合方法。根据权利要求8要求保护的发明，可提供与以往不同、无需中间材料、陶瓷与金属以足够的钎焊强度接合的、制作容易、制作成本低的价格低廉的接合体。
Claims (8)
1.通过钎焊将陶瓷与金属接合的方法，其特征在于，金属侧的接合面面积不超过陶瓷侧接合面面积的90％。
2.通过钎焊将陶瓷与金属接合的方法，其特征在于，金属侧的接合面面积不超过陶瓷侧接合面面积的90％，以不使陶瓷因残留热应力而损伤。
3.如权利要求2所述的方法，特征在于，所述接合面为平面。
4.如权利要求2所述的方法，其特征在于，所述陶瓷是氧化铝，所述金属是铜、镍、铁中的任一种。
5.如权利要求2所述的方法，其特征在于，所述陶瓷是氧化铝，所述金属是以铜、镍、铁中的任一种为主要成分的合金。
6.如权利要求2所述的方法，其特征在于，在未对陶瓷接合面进行过金属化处理时，使用含有活泼金属的钎料。
7.如权利要求6所述的方法，其特征在于，所述活泼金属是钛或锆。
8.陶瓷与金属的接合体，其特征在于，用通过钎料将陶瓷与金属接合的方法接合，在所述方法中，金属侧的接合面面积不超过陶瓷侧接合面面积的90％，以不使陶瓷因残留热应力而损伤。
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| JP31093199A JP2001130976A (ja) | 1999-11-01 | 1999-11-01 | セラミックスと金属の接合方法及びその方法により接合されたセラミックスと金属の接合体 |
| JP310931/1999 | 1999-11-01 |
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| CN1327438A true CN1327438A (zh) | 2001-12-19 |
| CN1174934C CN1174934C (zh) | 2004-11-10 |
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| EP (1) | EP1146026B1 (zh) |
| JP (1) | JP2001130976A (zh) |
| KR (1) | KR100435623B1 (zh) |
| CN (1) | CN1174934C (zh) |
| HK (1) | HK1040234B (zh) |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672357A (zh) * | 2011-02-22 | 2012-09-19 | 通用电气公司 | 受约束的金属凸缘及其制造方法 |
| CN101723699B (zh) * | 2008-10-24 | 2013-11-20 | 日本特殊陶业株式会社 | 陶瓷接合体、陶瓷加热器以及气体传感器 |
| CN105384457A (zh) * | 2015-12-15 | 2016-03-09 | 无锡日联科技股份有限公司 | 一种氧化铝陶瓷与金属钼的焊接方法 |
| CN106255674A (zh) * | 2014-04-30 | 2016-12-21 | 日本碍子株式会社 | 陶瓷部件与金属部件的接合体及其制法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI572582B (zh) * | 2013-09-30 | 2017-03-01 | 三菱綜合材料股份有限公司 | 銅／陶瓷接合體，銅／陶瓷接合體之製造方法及電力模組用基板 |
| US9735085B2 (en) * | 2014-03-20 | 2017-08-15 | Mitsubishi Materials Corporation | Bonded body, power module substrate, power module and method for producing bonded body |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| GB844171A (en) * | 1957-06-27 | 1960-08-10 | Eitel Mccullough Inc | Ceramic structures for electron tubes and method of making the same |
| FR1217865A (fr) * | 1958-12-11 | 1960-05-06 | Applic De La Ceramique Aux Tub | Perfectionnements aux méthodes de scellement céramique-métal |
| JPS61117169A (ja) * | 1984-11-09 | 1986-06-04 | 株式会社小松製作所 | セラミツクスと金属との接合構造 |
| JPS6256381A (ja) * | 1985-09-05 | 1987-03-12 | トヨタ自動車株式会社 | セラミツク部材への金属部材の接合方法 |
| JPS63139077A (ja) * | 1986-12-02 | 1988-06-10 | 工業技術院長 | 熱膨張係数の異なる異種材料の接合法 |
| DE3888380T2 (de) * | 1987-04-02 | 1994-10-13 | Toshiba Kawasaki Kk | Luftdichter Keramikbehälter. |
| JPH02196075A (ja) * | 1989-01-25 | 1990-08-02 | Sumitomo Cement Co Ltd | 接合構造体 |
| JPH03261670A (ja) * | 1990-03-12 | 1991-11-21 | Eagle Ind Co Ltd | 金属・セラミックスの接合体およびその接合方法 |
| JPH04198068A (ja) * | 1990-11-29 | 1992-07-17 | Shinko Electric Ind Co Ltd | セラミックと金属体の接合体 |
| JPH05319946A (ja) * | 1992-05-22 | 1993-12-03 | Ibiden Co Ltd | 金属板接合セラミック基板 |
| JP3522295B2 (ja) * | 1992-09-01 | 2004-04-26 | イビデン株式会社 | 金属板接合セラミック基板とその製造方法 |
| JP3866320B2 (ja) * | 1995-02-09 | 2007-01-10 | 日本碍子株式会社 | 接合体、および接合体の製造方法 |
| JP3892965B2 (ja) * | 1998-03-27 | 2007-03-14 | 日本碍子株式会社 | 接合体の製造方法および接合体 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101723699B (zh) * | 2008-10-24 | 2013-11-20 | 日本特殊陶业株式会社 | 陶瓷接合体、陶瓷加热器以及气体传感器 |
| CN102672357A (zh) * | 2011-02-22 | 2012-09-19 | 通用电气公司 | 受约束的金属凸缘及其制造方法 |
| CN102672357B (zh) * | 2011-02-22 | 2016-04-20 | 通用电气公司 | 受约束的金属凸缘及其制造方法 |
| CN106255674A (zh) * | 2014-04-30 | 2016-12-21 | 日本碍子株式会社 | 陶瓷部件与金属部件的接合体及其制法 |
| CN105384457A (zh) * | 2015-12-15 | 2016-03-09 | 无锡日联科技股份有限公司 | 一种氧化铝陶瓷与金属钼的焊接方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1146026A1 (en) | 2001-10-17 |
| HK1040234A1 (en) | 2002-05-31 |
| JP2001130976A (ja) | 2001-05-15 |
| HK1040234B (zh) | 2005-04-22 |
| CN1174934C (zh) | 2004-11-10 |
| EP1146026A4 (en) | 2005-06-01 |
| WO2001032584A1 (fr) | 2001-05-10 |
| KR100435623B1 (ko) | 2004-06-12 |
| KR20010089748A (ko) | 2001-10-08 |
| TW457163B (en) | 2001-10-01 |
| EP1146026B1 (en) | 2013-01-23 |
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