DE3888380T2 - Luftdichter Keramikbehälter. - Google Patents

Luftdichter Keramikbehälter.

Info

Publication number
DE3888380T2
DE3888380T2 DE3888380T DE3888380T DE3888380T2 DE 3888380 T2 DE3888380 T2 DE 3888380T2 DE 3888380 T DE3888380 T DE 3888380T DE 3888380 T DE3888380 T DE 3888380T DE 3888380 T2 DE3888380 T2 DE 3888380T2
Authority
DE
Germany
Prior art keywords
ceramic container
airtight ceramic
airtight
container
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3888380T
Other languages
English (en)
Other versions
DE3888380D1 (de
Inventor
Masako C O Patent Di Nakahashi
Makoto C O Patent Di Shirokane
Hiromitsu C O Patent Di Takeda
Tatsuo C O Patent Div Yamazaki
Tsutomu C O Patent Div Okutomi
Shozi C O Patent Division Niwa
Mikio C O Patent Divisio Okawa
Mitsutaka C O Patent Div Homma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27462407&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3888380(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP63049758A external-priority patent/JP2752079B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE3888380D1 publication Critical patent/DE3888380D1/de
Application granted granted Critical
Publication of DE3888380T2 publication Critical patent/DE3888380T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/60—Switches wherein the means for extinguishing or preventing the arc do not include separate means for obtaining or increasing flow of arc-extinguishing fluid
    • H01H33/66—Vacuum switches
    • H01H33/662—Housings or protective screens
    • H01H33/66207—Specific housing details, e.g. sealing, soldering or brazing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80—Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/84—Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/60—Switches wherein the means for extinguishing or preventing the arc do not include separate means for obtaining or increasing flow of arc-extinguishing fluid
    • H01H33/66—Vacuum switches
    • H01H33/662—Housings or protective screens
    • H01H33/66207—Specific housing details, e.g. sealing, soldering or brazing
    • H01H2033/66215—Details relating to the soldering or brazing of vacuum switch housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/60—Switches wherein the means for extinguishing or preventing the arc do not include separate means for obtaining or increasing flow of arc-extinguishing fluid
    • H01H33/66—Vacuum switches
    • H01H33/662—Housings or protective screens
    • H01H33/66261—Specific screen details, e.g. mounting, materials, multiple screens or specific electrical field considerations
    • H01H2033/66276—Details relating to the mounting of screens in vacuum switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
DE3888380T 1987-04-02 1988-03-31 Luftdichter Keramikbehälter. Expired - Fee Related DE3888380T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7961887 1987-04-02
JP17284587 1987-07-13
JP17284387 1987-07-13
JP63049758A JP2752079B2 (ja) 1987-04-02 1988-03-04 気密性セラミック容器の製造方法

Publications (2)

Publication Number Publication Date
DE3888380D1 DE3888380D1 (de) 1994-04-21
DE3888380T2 true DE3888380T2 (de) 1994-10-13

Family

ID=27462407

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3888380T Expired - Fee Related DE3888380T2 (de) 1987-04-02 1988-03-31 Luftdichter Keramikbehälter.

Country Status (3)

Country Link
US (2) US4917642A (de)
EP (1) EP0286335B2 (de)
DE (1) DE3888380T2 (de)

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DE3888380T2 (de) * 1987-04-02 1994-10-13 Toshiba Kawasaki Kk Luftdichter Keramikbehälter.
DE3914333A1 (de) * 1989-04-29 1990-10-31 Hoechst Ceram Tec Ag Pumpenkolben fuer axialkolbenpumpen
NL8901748A (nl) * 1989-07-07 1991-02-01 Holec Syst & Componenten Werkwijze voor het bevestigen van een metalen scherm in het huis van een vacuuemschakelaar, scherm daarvoor alsmede van een dergelijk scherm voorziene vacuuemschakelaar.
DE3931774A1 (de) * 1989-09-23 1991-04-04 Calor Emag Elektrizitaets Ag Verfahren zur herstellung einer vakuumschaltkammer
US5364010A (en) * 1990-07-05 1994-11-15 The Morgan Crucible Company, Plc Joining of metal to ceramic bodies by brazing
US5152449A (en) * 1990-07-05 1992-10-06 Morgan Crucible Company Plc Edge braze of metal end cap to ceramic cylinder
US5186380A (en) * 1991-08-15 1993-02-16 Handy & Harman Titanium hydride coated brazing product
US5565838A (en) * 1992-05-28 1996-10-15 Avx Corporation Varistors with sputtered terminations
EP0572151A3 (de) * 1992-05-28 1995-01-18 Avx Corp Varistoren mit gesputterten Anschlüssen und Methode zur Aufbringung von gesputterten Anschlüssen auf Varistoren.
TW264530B (de) * 1993-12-24 1995-12-01 Hitachi Seisakusyo Kk
US5569958A (en) * 1994-05-26 1996-10-29 Cts Corporation Electrically conductive, hermetic vias and their use in high temperature chip packages
US5665654A (en) * 1995-02-10 1997-09-09 Micron Display Technology, Inc. Method for forming an electrical connection to a semiconductor die using loose lead wire bonding
US5612256A (en) * 1995-02-10 1997-03-18 Micron Display Technology, Inc. Multi-layer electrical interconnection structures and fabrication methods
EP0743131A1 (de) * 1995-05-17 1996-11-20 Kabushiki Kaisha Toshiba Metallkeramik Verbindung
JP3512940B2 (ja) * 1996-03-12 2004-03-31 株式会社東芝 真空気密容器用封着ろう材および真空気密容器の製造方法
JP2001130976A (ja) * 1999-11-01 2001-05-15 Mitsubishi Electric Corp セラミックスと金属の接合方法及びその方法により接合されたセラミックスと金属の接合体
US6315188B1 (en) 2000-06-28 2001-11-13 Sandia Corporation Surface preparation for high purity alumina ceramics enabling direct brazing in hydrogen atmospheres
US6528123B1 (en) * 2000-06-28 2003-03-04 Sandia Corporation Coating system to permit direct brazing of ceramics
KR100817376B1 (ko) * 2000-10-31 2008-03-27 니혼도꾸슈도교 가부시키가이샤 진공 스위치용 용기, 진공 스위치, 진공 스위치용 용기의제조방법 및 진공 스위치의 제조방법
JP3690979B2 (ja) * 2000-11-30 2005-08-31 日本特殊陶業株式会社 金属−セラミック接合体及びそれを用いた真空スイッチユニット
US6840429B2 (en) * 2001-09-25 2005-01-11 Lucas-Milhaupt, Inc. Method of and composition for treating a non-metallic refractory material for brazing
US20050181199A1 (en) * 2001-09-25 2005-08-18 Handy & Harman (Ny Corporation) Composition for treating refractory materials for brazing
DE10251658B4 (de) * 2002-11-01 2005-08-25 Atotech Deutschland Gmbh Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil
JP4576335B2 (ja) * 2003-08-02 2010-11-04 株式会社ブレイジング ろう付用活性バインダー及び、該バインダーを用いたろう付製品の製造方法
US7569933B2 (en) 2004-08-27 2009-08-04 Electro Ceramic Industries Housing for accommodating microwave devices having an insulating cup member
CN102047413B (zh) * 2008-06-06 2015-04-15 三菱综合材料株式会社 功率模块用基板、功率模块以及功率模块用基板的制造方法
WO2010100432A2 (en) * 2009-03-06 2010-09-10 Institute Of Metal Research, Chinese Academy Of Sciences Sealing technology
JP4775461B2 (ja) * 2009-03-10 2011-09-21 ウシオ電機株式会社 エキシマランプ及びエキシマランプの製造方法
US8358003B2 (en) * 2009-06-01 2013-01-22 Electro Ceramic Industries Surface mount electronic device packaging assembly
KR101132064B1 (ko) * 2010-01-29 2012-04-02 삼성에스디아이 주식회사 고체산화물 연료전지 및 연료전지의 셀과 캡간 브레이징방법
JP5537303B2 (ja) * 2010-07-12 2014-07-02 株式会社東芝 真空バルブ
DE102010043119A1 (de) * 2010-10-29 2012-05-03 Endress + Hauser Gmbh + Co. Kg Verfahren zum Herstellen einer Verbindung zwischen zwei Keramikteilen, insbesondere von Teilen eines Drucksensors, und ein keramisches Produkt, insbesondere einen keramischen Drucksensor
DE102013204775A1 (de) * 2013-03-19 2014-09-25 Siemens Aktiengesellschaft Verfahren zum Erzeugen eines Bauteils einer Vakuumschaltröhre
JP6146707B2 (ja) * 2013-03-27 2017-06-14 パナソニックＩｐマネジメント株式会社 セラミックス−金属の接合体およびその製造方法
DE102019126954A1 (de) * 2019-10-08 2021-04-08 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats, Lötsystem und Metall-Keramik-Substrat, hergestellt mit einem solchen Verfahren
CN113600951B (zh) * 2021-08-03 2022-05-03 苏州楚翰真空科技有限公司 一种基于真空钎焊炉生成保温杯的方法和系统

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US4729504A (en) * 1985-06-01 1988-03-08 Mizuo Edamura Method of bonding ceramics and metal, or bonding similar ceramics among themselves; or bonding dissimilar ceramics
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DE3888380T2 (de) * 1987-04-02 1994-10-13 Toshiba Kawasaki Kk Luftdichter Keramikbehälter.

Also Published As

Publication number Publication date
EP0286335B2 (de) 2001-10-17
DE3888380D1 (de) 1994-04-21
US5056702A (en) 1991-10-15
EP0286335A1 (de) 1988-10-12
US4917642A (en) 1990-04-17
EP0286335B1 (de) 1994-03-16

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