TW436329B - Method and apparatus for gluing two substrates together - Google Patents

Method and apparatus for gluing two substrates together Download PDF

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Publication number
TW436329B
TW436329B TW087105543A TW87105543A TW436329B TW 436329 B TW436329 B TW 436329B TW 087105543 A TW087105543 A TW 087105543A TW 87105543 A TW87105543 A TW 87105543A TW 436329 B TW436329 B TW 436329B
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TW
Taiwan
Prior art keywords
substrate
adhesive
item
patent application
scope
Prior art date
Application number
TW087105543A
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English (en)
Inventor
Klaus Weber
Ulrich Speer
Original Assignee
Steag Hamatech Ag
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Publication of TW436329B publication Critical patent/TW436329B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841Holding or clamping means for handling purposes
    • B29C65/7847Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7879Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path
    • B29C65/7882Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path said parts to be joined moving in a circular path
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/342Preventing air-inclusions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/345Progressively making the joint, e.g. starting from the middle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D17/00Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
    • B29D17/005Producing optically read record carriers, e.g. optical discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B39/00Layout of apparatus or plants, e.g. modular laminating systems
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26Apparatus or processes specially adapted for the manufacture of record carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406Ultraviolet [UV] radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845Radiation curing adhesives, e.g. UV light curing adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00Carriers for sound or information
    • B32B2429/02Records or discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/16Drying; Softening; Cleaning
    • B32B38/162Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Saccharide Compounds (AREA)
  • Coating Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Nozzles (AREA)

Description

經濟部中央標準局負工消费合作社印聚 A7 ________B7 五、發明説明(ι·) 一" ~~~~~~ 本發明係關於-種將二基板黏合成_基板片之方法及 裝置,其中黏劑被塗在第一基板要黏合之面上,然後將第 二基板以其要黏合之面置於第一基板上,而且基板會繞其 中心軸轉動,以使黏劑離心塗佈。 此類之方法及裝置見於DE 40 41 199 Α1德條摘要(
Derwent-Abstract) 94-246139/30 及 ΕΡ 0 744 739 Α1 中,例 如為了製造所謂的數位影音光碟(簡稱DVD) ^數位影音 光碟係由二基板或是部份基板所組成,且在二基板或是部 份基板各一表面上存有數位影音資訊,其不存有資訊之面 則是相互黏合在一起。為要將此二基板黏合成一基板片, 例如黏合成一數位影音光碟,需要非常準確之操作裝置, 因為此二基板不僅必須非常準確地上下疊置,而且在黏合 過程中,黏劑必須均勻地、無空氣夾雜物,且黏劑層厚度 亦須相同的被塗抹在整個板面上,以得到無瑕疵之基板片 。除此之外,用於黏貼二基板之傳統裝置設計極為昂貴, 且所佔空間極大》 本發明之任務是’創造一種用於黏貼二基板之方法及 裝置,此方法或是裝置提供可靠、均勻之基板黏合,可形 成具較小廢品率之優良基板片,然而容易實施或構造簡單 ,可達一高度之生產力。 根據本發明,此提出之任務可藉前文所述之方法加以 解決,在此方法中,將至少一個要黏合之基板面,最好是 在要塗以黏劑黏合之基板面,先施以預塗層。以此方法可 以改善主黏劑或是主漆之潤滑特性,以使黏劑在整個表面 X297公釐} -4- Γ - —^ϋ ^^^1 — - - ^^1 ^tnr (諳先閱讀背面之注項再填寫本頁) 訂 經濟部中央揉隼局員工消費合作社印製 Α7 Β7 五、發明説明(2·) 之分佈既快速又均勻。此預塗層可使在要黏合之基板上之 黏劑以簡單之方式極為均勻地分佈在整個要黏合之面上, 且可預防夾雜物,如氣泡或類似之物的出現。基板因而能 在整個基板面上相互黏合得極為堅固,特別是此基板片在 整個面上均有相同的厚度。 此黏劑最好是所謂的紫外線一塑膠漆,其可藉紫外光 之照射而快速硬化,並在二基板間有良好之黏合作用。黏 劑最好以環狀黏著方式塗在基板要黏合之面上,如此,黏 劑可藉離心過程分佈到整個基板面上。 置於第一基板上之第二基板,在疊置後最好施加一可 調之、準確之壓力,如此可改善基板間黏劑之均勻分佈。 置於上方之基板最好是藉一具精密驅動裝置之單臂機械手 ,以精密運動,定心置於第一基板上,並施以一壓力。 根據本發明,此提出之任務可藉下述方法加以解決: 至少一個基板置於另一基板上時,其在邊緣範圍與另一基 板彎曲分離,以使氣泡或是其他在黏劑層或是在黏劑内之 夾雜物可以確實、可靠地被排除。因為置於上方之基板在 經過彎曲後首先被置於此基板之中央,然後在完全放開時 才從内向外滚壓而出,黏劑環也從内向外滾壓至基板邊緣 ,因而可以排除空氣夾雜物及氣泡。 此提出之任務之另一個解決方法是:在黏劑離心塗佈 後,將黏合之基板邊緣加以清潔。由於此清潔過程可額外 獲得可靠的基板片邊緣密封,其有助於成品品質之提升。 為了清潔基板片邊緣,最好是設有一可彈性壓在基板片邊 本紙張尺度逍用中國國家揉率《CNS Μ4規格(210X297公釐) --ΪΙ ^—^1 -二 II I -· I 1 {請先閱讀背面之注意事項再填寫本頁}
-、1T 經濟部中央梯準局員工消費合作社印簟 43 632 g A7 I---__ 丨五、發明説明(3. ) 緣上之黏劑吸取裝置。為了要提高生產力,此基板邊緣之 清潔,在黏劑離心塗佈過程後立即進行,使邊緣之清潔並 不需要額外改變基板片之位置,或是設立一個清潔工作站 〇 此黏合之基板片最好在黏劑乾燥機中脫乾,在使用紫 外線漆時則在紫外線乾燥機中脫乾,因此製造過程會縮短 。此類之黏劑乾燥機可依一裝置加以設計’例如在同一申 請人未公佈之DE-A 195 45 843中所描述者,為避免重覆, 將之用為此申請書之内容。而且基板片可以例如以轉動運 動通過紫外線燈之下。 :¾在脫乾過程中將石英板或是玻璃板置於基板片上, 則對達成此任務極為有利,如此,在脫乾時,石英板或是 玻璃板以自身重量壓在基板片上,使基板片保持平面。在 脫乾過程中,石英板或玻璃板被加熱,但在置於下一個基 板片上之前須先冷卻。根據一實施例,此石英板或是玻璃 板之冷卻是藉一離子化空氣來完成,其中玻璃板是以一交 換系統在冷卻過程及置於基板片上進行交換。在惰性氣體 環境中進行脫乾亦是有利的,其有助於基板片較快速且完 全地脫乾》 在黏合過程及脫乾過程束後,基板片會被送至檢驗站 ’例如以掃描器檢查缺陷,再依所得之測量結果將其分類 為通過或是不及格廢品。 根據本發明之方法具一資料處理程式,其例如在個人 電腦上執行,控制及/或加以圖像顯示。 本紙張尺度適用中國國家標準(CNS } A4規择< 210X297公釐) -6 - 「裝— (請先閲請背面之注意事項再填湾本頁) 、1T. 超濟部中央標準局員工消費合作社印" 436321 A7 H~ -------- B7 五、發明説明(4. ) "一'~~' 此提出之任務另外亦可藉一前述類別之裝置加以解決 ,此裝置具一預塗層裝置或是預分散器裝置,預塗層裝置 或是預分散器裝置在整個製造方法之流程中被安排在黏合 站或是黏劑塗佈裝置之前。藉此預塗層裝置’至少一個要 黏合之基板面’最好是在要置放於另一基板上之面,被塗 上預漆,其能改善黏劑或是主漆之潤滑效果,因此在離心 塗佈過程時主漆能較均勻且快速地分佈。藉由相應之、特 別是具有精密驅動裝置之基板處理機械手,基板可被準確 的定心置於另一基板上,而且還可以一準確、可調之壓力 施加在要黏合之基板上,因而也施力在二基板間之黏劑上 ’此舉也可改善或是提高在黏合過程時黏劑之分佈及速度 。前面所述之、根據本發明之方法所獲致之優點,亦可藉 本發明之裝置加以實現,也就是黏劑可快速、可靠及均勻 地分佈在要黏合之基板面上,而且在基板間不會存有夾雜 物’例如空氣夾雜物,此夾雜物會造成不同厚度之基板片 ,因而造成較低品質之基板片或是高廢品率。 根據另一解決此任務之發明想法為,設置一彎曲裝置 ’用以彎曲至少一個要黏合之基板之邊緣,使此基板之邊 緣與另一基板分離。以此方法,更可以避免黏合層中出現 氣泡或其他夾雜物,因為二個要加以黏合之基板,首先從 中心向外逐漸疊合,並在此壓滾過程中將氣泡或是空氣夾 雜物向外壓擠並且排除掉。 此弩曲裝置最好具有一作用在要弩曲基板内部範固之 内爪’及一作用在要弩曲基板外部範圍之外爪,其在基板 { CNS ) ( 2X0X291^·^ ) ·7· H ί -1 m I— I- -I I ......I I {請先閱讀背面之注意事項再填疼本頁}
、1T 43 63 2 9 經濟部中央樣準局貝工消費合作社印製 A7 B7 五、發明説明(5·) 之軸向可作相對運動,因而造成下或上基板相對另一基板 之彎曲。為内爪及/或外爪之作動最好設有吸嘴或是吸嘴組 ,其在外爪上可能分伟在整個圓周上。 此提出之任務之另一解決方法是一設有一清潔基板片 邊緣之清潔裝置裝置。此清潔過程同時造成基板片邊緣之 密封’因此也改善了產品的品質。此清潔裝置最好設有一 黏劑吸取裝置,其在另一發明實施形式中係彈性地壓在基 板片邊緣上。此清潔裝置最好是黏劑離心塗佈裝置之一部 份,使基板片不必為了清潔過程被搬運到另一相應之工作 站去’而是直接在離心塗佈過程後進入預定之位置,以清 潔其邊緣。 在黏劑離心塗佈裝置或是基板片邊緣清潔裝置之後最 好設置一乾燥站,其在使用以紫外光乾燥及硬化之黏劑或 是漆時,即是一紫外線乾燥機。 為要改善黏合基板片之品質及生產力’此乾燥站最好 設置有石英板或是玻璃板置放單元。此石英板或是玻璃板 可藉一推送系統或是交換系統,在基板片範園及冷卻範圍 間來回移動。 乾燥站最好設有紫外線燈,較有利的是在基板邊緣之 範圍設有燈照射用之反射面。因此,在基板片邊緣範園及 邊角範園黏劑之乾燥及硬化也可快速及可靠地進行。根據 本發明裝置之另一實施形式,緊接在乾燥站之後設有一檢 驗站,依檢測過程之測量結果,將製造之基板片放行或是 當作廢品丢棄。 本紙張尺度適用中國國家榡準(CMS ) A4規格(210X 297公嫠) -8 - —;------)裝-----—訂----:—〆 (請先閱讀背面之注意事項再填寫本頁) 43632g Α7 Β7 五、發明説明(6·) 根據本發明之裝置成本特別低廉,因其精簡之設計結 構’可以較小之尺寸加以製造,而且最好設有具門及窗之 保護艙,在其中裝有所謂的氣流盒(Flow-Box),藉僅可 能的層流達到製造基板片所需之類似潔淨室之環境。根據 本發明之裝置,其不僅可單機使用,也可與生產線整合為 一體。 在和本發明相關的基板片中,不僅包括數位影音光碟 ,也包括了一般黏合至少二部分薄片之基板片。 以下藉較偏好之實施例,配合圖式更進一步說明本發 明。圖式為: 圖一根據本發明之裝置之上視示意圖。 圖二用於彎曲裝置之實施形式之示意圖。 經濟部中央標準局員工消费合作社印装 由圖一所示之,用於根據本發明裝置之實施例中,可 知操作步驟中之操作順序是由右向左。在第一分配站i之 分配轉盤2上已準備好第一基板3。以同樣之方式,在第二 分配站4之分配轉盤5上已準備好第二基板6,其不具資訊 之面要與第一基板3相應之面黏合^藉頂架機械手7將第 一基板3從分配站1中取出,轉動18〇度使要黏合之,不 存有資訊之面向上’且置於入口轉動平台8之預定位置上 。分配機械手9將要黏合之面向下之第二基板6,也就是不 轉動基板6 ’搬運至入口轉動平台8之相應範圍上。入口轉 動平台8具有特殊之分隔,也就是雙位置分隔,藉之,即 使電力中斷,要黏合之二基板3及6也不會混淆。 入口轉動平台8為黏合站1〇準備好第一及第二基板3 ( CNS J A4im ( 210X297^ 厂--一--— -O .

Claims (1)

  1. 436a2g 日修 4 L 捕〜 六、申請專利範圍 JLj710SS43號專利案申諸專利签[善n: t 一種將二基板(3、6)黏合成一基板片(23)之方法, 黏劑被塗在第一基板(3)姜黏合之面上,然後將第二 基板(6)以其要黏合之面置於第一基板上,而且基板 (3、6)會繞其中心軸轉動’以使黏劑離心塗侔,其特 徵為’第一基板(3)要黏合之面’在黏劑塗佈之前會 先施以預塗層。 2. 根據申請專利範園第1項所述之方法,其特徵為,黏劑 係為一種紫外線一塑膠漆。 3. 根據申請專利範圍中第1項所述之方法,其特徵為,黏 劑是以環形式塗在第一基板(3)要黏合之面上。 4. 根據申請專利範圍中第1項所述之方法,其特徵為,第 二基板(6)在置於黏劑上後,會被施以一可調之壓力 5· —種將二基板(3、6)黏合成一基板片(23)之方法, 黏劑被塗在第一基板(3)要黏合之面上,然後將第二 基板(6)以其要黏合之面置於第一基板上,而且基板 (3、6)會繞其中心軸轉動,以使黏劑離心塗佈,其特 徵為,至少有一基板(3、6),在置於另一基板(6、3 )上時’其從另一基板(6、3)之邊緣範圍彎曲分離。 6. —種將二基板(3、6)黏合成一基板片(23)之方法, 黏劑被塗在第一基板(3)要黏合之面上,然後將第二 基板(6)以其要黏合之面置於第一基板上,而且基板 本紙張尺度逋用中B國家#準(CNS ) A4洗格(210X297公釐) (請先Μ讀背面之注意事項再填寫本頁} iT. Γ! 經濟部智慧財產局員工消费合作杜印製 -13- 六 A8 B8 C8
    經 部 智 慧 財 ▲ 局 貝 工 消 f 合 作 社 印 製 申請專利範圍 (3、6)會繞其中心軸轉動,以使黏劑離心塗佈,其特 歡為,黏合之基板片(23)之邊緣,在黏劑離心塗佈後 須加以清潔。 7. 根據申請專利範圍第6項所述之方法,其特徵為,邊緣 之清潔工作係在基板(3、6)之黏合站(1〇)中進行。 8. 根據申請專利範園第6項所述之方法,其特徵為,一黏 劑吸取裝置係彈性地壓在黏合之基板片(23)邊緣。 9· 一種將二基板(3、6)黏合成一基板片(23)之方法, 黏劑被塗在第一基板(3)要黏合之面上,然後將第二 基板(6)以其要黏合之面置於第一基板上,而且基板 (3、6)會繞其中心軸轉動,以使黏劑離心塗佈,其特 徵為,在脫乾時,在基板片(23)上置有一石英板或是 玻璃板(29)。 10. 根據申請專利範圍第9項所述之方法,其特徵為,在乾 燥過程後’石英板或是玻璃板(29)在置於下一個基板 片(23)上之前,先加以冷卻。 11. 根據申請專利範圍第9項所述之方法,其特徵為,石英 板或是玻璃板(29)是以離子化空氣加以冷卻。 12·根據申請專利範圍第9項所述之方法,其特徵為,脫乾 是在惰性氣體環境中進行。 13. 根據申請專利範圍中第1項所述之方法,其特徵為,對 黏合及脫乾之基板片(23)加以瑕疵檢測。 14. 根據申請專利範園中第1項所述之方法,其特徵為,此 方法以一資料處理程式加以控制及/或圖像顯示。 本紙張尺度逍用中國爾家標率(CNS ) A4规格(210X297公釐 -14- ;--U-------Γ 策-- {請先閲讀背面之注意事項再填寫本頁) 订 經濟部智慧財產局員工消費合作社印製 Λ8 g D8 了、申料祕® 15. —種將二基板(3、6)黏合成一基板片(23)之裝置, 其具至少一黏合站(10),至少一黏劑塗佈裝置(13、 14),及至少一黏劑離心塗佈裝置(11、I2),其特徵 為,有一預塗層裝置(17)。 16·根據申請專利範圍第15項所述之裝置,其特徵為,有 一施壓裝置,其在黏合過程中,以一可調之壓力,施於 至少一個基板(3、6)上。 17. —種將二基板(3、6)黏合成一基板片(23)之裝置, 其具至少一黏合站(10),至少一黏劑塗佈裝置(i3、 14) ’及至少一黏劑離心塗佈裝置(11、12),其特徵 為,有一彎曲裝置(40),用以彎曲至少一要加以黏合 之基板(3、6)之邊緣範圍,使其輿另一基板(6、3) 分離β 18·根據申請專利範圍第Π項所述之裝置,其特徵為,彎 曲裝置(40)有一作用在要加以彆曲之基板(3、6)内 部範圍之内爪(41),及一作用在要加以彎曲之基板( 3、6)外部範圍之外爪(42)。 19.根據申請專利範圍第18項所述之裝置,其特徵為,内 爪(41)及/或外爪(42)可在基板(3、6)之轴向上 作相對運動》 20·根據申請專利▲圍第18項所述之裝置,其特徵為,内 爪(41)及/或外爪(42)上設有吸嘴(43或46) » 21. —種將二基板(3、6)黏合成一基板片(23)之裝置, 其具至少一黏合站(10),至少一黏劑塗佈裝置(13、 本紙張尺度適用中«國家梯準(CNS ) A4规格(210Χ297公釐) -15- L-丨L----------TW! f請先閲讀背面之注$項再填缚本頁} -訂 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 14),及至少一黏劑離心塗佈裝置(11、12),其特徵 為,有一基板片邊緣清潔裝置(15、16)。 22·根據申請專利範圍第21項所述之裝置,其特徵為,基 板片邊緣清潔裝置(15、16)設有一黏劑吸取裝置。 23. 根據申請專利範圍第21項所述之裝置,其特徵為,基 板片邊緣清潔裝置(15、16)係彈性地壓在基板片邊緣 〇 24. 根據申請專利範圍第21項所述之裝置,其特徵為,基 板片邊緣清潔裝置(15、16)是黏劑離心塗佈裝置(11 、12)之一部份。 25· —種將二基板(3、6)黏合成一基板片(23)之裝置, 其具至少一黏合站(10),至少一黏劑塗佈裝置(13、 14),及至少一黏劑離心塗佈裝置(11、12),其特徵 為,有一具石英板或是玻璃板置放單元(28)之乾燥站 (26)。 26. 根據申請專利範圍第25項所述之裝置,其特徵為,乾 燥站(26)設有一石英板或是玻璃板冷卻裝置。 27. 根據申請專利範圍第26項所述之裝置,其特徵為,冷 卻劑是離子化空氣。 28. 根據申請專利範圍第25項所述之裝置,其特徵為,乾 燥站(26)設有紫外線燈,且在基板邊緣範圍設有燈光 照射用之反射面。 29. 根據申請專利範圍第25項所述之裝置,其特徵為,在 乾燥站(26)之後設有檢驗站(34)。 本紙張尺度逋用中國國家#準(CNS ) A4规格(210X297公釐) -16- (請先聞讀背面之注f項再填寫本頁)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101027138B (zh) * 2004-06-03 2010-08-25 芝浦机械电子装置股份有限公司 树脂层形成方法及树脂层形成装置、盘及盘的制造方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19718471A1 (de) * 1997-04-30 1998-11-05 Steag Hamatech Gmbh Machines Verfahren und Vorrichtung zum Verkleben von zwei Substraten
DE19721689C2 (de) 1997-05-23 1999-06-10 Steag Hama Tech Gmbh Machines Vorrichtung zum Trocknen von Substraten
DE19818478A1 (de) 1998-04-24 1999-11-04 Steag Hama Tech Ag Vorrichtung zum Fixieren von Substraten
DE19818479C1 (de) * 1998-04-24 1999-11-11 Steag Hama Tech Ag Vorrichtung und Verfahren zum Handhaben von Substraten
JP4498502B2 (ja) * 1999-10-22 2010-07-07 大日本印刷株式会社 薄板で被覆された基板の製造方法、及びその製造装置
DE10063666C1 (de) * 2000-12-20 2002-04-11 Steag Hamatech Ag Verfahren und Vorrichtung zum Zusammenfügen von Substraten
DE10108383B4 (de) * 2001-02-21 2006-06-14 Steag Hamatech Ag Vorrichtung zum Aufnehmen von Substraten
DE10122668C1 (de) * 2001-05-10 2002-10-10 Steag Hamatech Ag Vorrichtung zum Verkleben von Substraten
EP1256948A3 (en) * 2001-05-11 2006-05-24 Dainippon Ink And Chemicals, Inc. Method for maintaining flatness, flatness maintaining unit and device, and disc manufacturing method and device
TW587825U (en) * 2003-03-11 2004-05-11 Automation Design & Manufactur Compact disk manufacturing machine
KR101288758B1 (ko) 2004-12-30 2013-07-23 포세온 테크날러지 인코퍼레이티드 산업 공정에서 광원을 사용하는 시스템 및 방법
DE102005011383B3 (de) * 2005-03-11 2006-06-01 Steag Hamatech Ag Vorrichtung und Verfahren zum Verteilen eines Klebers zwischen zwei ein Innenloch aufweisenden Substratscheiben eines optischen Datenträgers
KR101052373B1 (ko) 2006-09-28 2011-07-28 시바우라 메카트로닉스 가부시끼가이샤 접합 방법 및 접합 장치
CN101522400A (zh) * 2006-09-28 2009-09-02 芝浦机械电子装置股份有限公司 贴合方法以及贴合装置
WO2008038414A1 (en) * 2006-09-28 2008-04-03 Shibaura Mechatronics Corporation Bonding method and bonding apparatus
CN100583259C (zh) * 2008-06-23 2010-01-20 东莞宏威数码机械有限公司 用于修饰光盘盘片边缘的装置和修饰光盘盘片边缘的方法
CN102166877B (zh) * 2010-12-10 2013-07-24 林英志 Uv胶贴合方法
CN102896874B (zh) * 2012-10-30 2015-03-18 昆山希盟自动化科技有限公司 一种双工位触摸屏液态胶贴合方法
DE102013103837A1 (de) 2013-04-16 2014-10-16 Teamtechnik Maschinen Und Anlagen Gmbh Aufbringen von Leitkleber auf Solarzellen
CN108855776B (zh) * 2017-05-08 2020-08-14 致伸科技股份有限公司 离心注胶系统及其方法
CN111715470B (zh) * 2020-05-26 2021-07-06 江苏益通流体科技有限公司 一种方便清洗的机械密封件涂装设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707944A (en) * 1970-10-23 1973-01-02 Ibm Automatic photoresist apply and dry apparatus
JPS60120666A (ja) * 1983-12-02 1985-06-28 Kanzaki Paper Mfg Co Ltd 高電圧高周波パルス発生装置
JPH0712638B2 (ja) * 1986-08-20 1995-02-15 ソニー株式会社 デイスクの貼り合わせ方法
NL8702493A (nl) * 1986-10-31 1988-05-16 Seiko Epson Corp Optisch opnamemedium en werkwijze voor het vervaardigen daarvan.
JPH0688459B2 (ja) * 1988-03-09 1994-11-09 株式会社日立製作所 光学的情報記録媒体およびその製法
DE4041199A1 (de) * 1990-12-21 1992-07-09 Hamatech Halbleiter Maschinenb Verfahren und vorrichtung zum verkleben von zwei miteinander zu verbindenden, informationen tragenden scheiben oder dergleichen
JP3388789B2 (ja) * 1992-12-04 2003-03-24 株式会社リコー 紫外線硬化型樹脂膜の硬化装置
KR100284556B1 (ko) * 1993-03-25 2001-04-02 다카시마 히로시 도포막 형성방법 및 그를 위한 장치
JP3498816B2 (ja) * 1995-04-20 2004-02-23 日本政策投資銀行 光ディスクの製造方法
DE69618275T2 (de) * 1995-05-20 2002-06-13 Kitano Engineering Co., Ltd. Verfahren zur Herstellung einer optischen Platte und dazu verwendete Plattform
US5779855A (en) * 1995-08-30 1998-07-14 Kitano Engineering Co., Ltd. Apparatus for curing an optical disc
JP3096242B2 (ja) * 1995-08-30 2000-10-10 日本政策投資銀行 光ディスクの硬化装置
DE19545843C1 (de) * 1995-12-08 1997-03-13 Schott Glaswerke Verfahren zum nachträglichen Beschichten von Stoffaustauschpackungen aus Borosilicatglas
SE506451C2 (sv) * 1996-04-01 1997-12-15 Toolex Alpha Ab Förfarande och anordning för sammanlimning av substrat till dataskivor
SE506617C2 (sv) * 1996-05-13 1998-01-19 Toolex Alpha Ab Anordning för böjning av ett plant, runt skivelement
DE19718471A1 (de) * 1997-04-30 1998-11-05 Steag Hamatech Gmbh Machines Verfahren und Vorrichtung zum Verkleben von zwei Substraten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101027138B (zh) * 2004-06-03 2010-08-25 芝浦机械电子装置股份有限公司 树脂层形成方法及树脂层形成装置、盘及盘的制造方法

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