WO2008038414A1 - Bonding method and bonding apparatus - Google Patents

Bonding method and bonding apparatus Download PDF

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Publication number
WO2008038414A1
WO2008038414A1 PCT/JP2007/001025 JP2007001025W WO2008038414A1 WO 2008038414 A1 WO2008038414 A1 WO 2008038414A1 JP 2007001025 W JP2007001025 W JP 2007001025W WO 2008038414 A1 WO2008038414 A1 WO 2008038414A1
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WO
WIPO (PCT)
Prior art keywords
substrate
adhesive
bonding
irradiation
electromagnetic waves
Prior art date
Application number
PCT/JP2007/001025
Other languages
French (fr)
Japanese (ja)
Inventor
Haruka Narita
Hisashi Nishigaki
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Publication of WO2008038414A1 publication Critical patent/WO2008038414A1/en

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/266—Sputtering or spin-coating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1448—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
    • B29C65/7811—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7879—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path
    • B29C65/7882—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path said parts to be joined moving in a circular path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00145—Vacuum, e.g. partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/342—Preventing air-inclusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
    • B29C66/91643—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
    • B29C66/91645—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1412—Infrared [IR] radiation
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1606—Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00141—Protective gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

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Abstract

Provided are a bonding method and a bonding apparatus, by which bubbles in an adhesive layer can be suppressed while ensuring uniformity of the adhesive layer at the time of application, and furthermore, fluctuation of the adhesive layer during manufacture can be suppressed. The bonding apparatus is provided with a first spin-coating apparatus (1) for coating one surface of a first substrate (P1) with an adhesive (B1); a second spin-coating apparatus for coating one surface of a second substrate (P2) with an adhesive (B2) of the first substrate; a pre-irradiation section (4) for irradiating the adhesive applied on the first substrate (P1) with ultraviolet in the atmosphere; a bonding section (5) for bonding the surface of the first substrate (P1) whereupon the adhesive (B1) is applied, with the surface of the second substrate (P2) whereupon the adhesive (B2) is applied; and a post-irradiation section (6) for irradiating the adhesives (B1, B2) between the first substrate (P1) and the second substrate (P2) with ultraviolet.

Description

明 細 書  Specification
貼合方法及び貼合装置  Bonding method and bonding device
技術分野  Technical field
[0001 ] 本発明は、 例えば、 一対の基板を接着剤を介して貼り合せた記録媒体を製 造するために、 貼り合せ前の接着剤の基板への塗布に改良を施した貼合方法 及び貼合装置に関する。  [0001] The present invention relates to, for example, a bonding method in which application of an adhesive before bonding to a substrate is improved in order to produce a recording medium in which a pair of substrates are bonded via an adhesive. It relates to the bonding device.
背景技術  Background art
[0002] 現在、 光ディスクや光磁気ディスク等の光学読み取り式の記録媒体は、 再 生専用のものや、 記録された情報の書き換えが可能なものなど、 多種多様な 規格のものが普及している。 例えば、 D V D等の光ディスクは、 基本的には 、 2つの基板の片方若しくは両方に情報の記録領域が設けられ、 接着剤を介 して貼り合せることで製造されている。 そして、 貼り合せるための接着剤の 層は、 レーザ光線による読み書きを正確に行うため、 その厚みに非常に高い 精度が要求される。  [0002] Currently, optically readable recording media such as optical discs and magneto-optical discs are widely used in various standards such as playback-only recording media and rewritable recorded information. . For example, an optical disc such as a DVD is basically manufactured by providing an information recording area on one or both of two substrates and bonding them with an adhesive. The adhesive layer for bonding is required to have very high accuracy in thickness in order to accurately read and write with a laser beam.
[0003] このような貼り合せ型のディスクの製造手順の一例を、 図 7を参照して説 明する。 まず、 あらかじめ 2枚のポリカーボネート製の基板 Pを射出成型し 、 スパッタ室においてスパッタリングによってレーザ反射用の金属膜 （記録 膜） を形成する。 そして、 図 7 ( A ) に示すように、 2枚の基板 Pの接合面 に、 紫外線硬化型の接着剤を塗布し、 スピンコートによって接着剤を展延す る。 スピンコートとは、 基板 Pの中心の周囲に、 塗布装置 Kによって接着剤 を滴下塗布した後、 基板 Pを高速スピンさせることにより、 基板 P上に接着 剤による薄い膜 （接着層 R ) を形成し、 余分な接着剤を飛散させるものであ る。  [0003] An example of a manufacturing procedure for such a bonded disk will be described with reference to FIG. First, two polycarbonate substrates P are injection molded in advance, and a metal film (recording film) for laser reflection is formed by sputtering in a sputtering chamber. Then, as shown in FIG. 7 (A), an ultraviolet curable adhesive is applied to the bonding surface of the two substrates P, and the adhesive is spread by spin coating. With spin coating, a thin film (adhesive layer R) is formed on the substrate P by applying an adhesive agent around the center of the substrate P using the coating device K and then spinning the substrate P at a high speed. However, it will disperse excess adhesive.
[0004] このように接着層 Rを形成した一対の基板 Pは、 図 7 ( B ) に示すように 、 互いの接着層 Rが平行に向かい合った状態となるように、 一方がセンター ピン Gのチャック Eで保持され、 他方がターンテーブルゃサセプタなどの載 置面 Fに載置された状態で、 真空チャンバ Cの下部に導入される。 そして、 図 7 ( C ) に示すように、 真空チャンバ Cが下降して密閉することにより減 圧室 Sが形成され、 この減圧室 Sから排気装置によって排気することにより 、 基板 Pの周囲の圧力が、 大気圧から真空となる。 [0004] As shown in Fig. 7 (B), the pair of substrates P on which the adhesive layer R is formed in this way is such that one of the center pins G is in a state where the adhesive layers R face each other in parallel. It is held by the chuck E and introduced into the lower part of the vacuum chamber C while the other is placed on a mounting surface F such as a turntable. And As shown in FIG. 7 (C), the vacuum chamber C is lowered and sealed to form a pressure reducing chamber S. By exhausting from the pressure reducing chamber S by the exhaust device, the pressure around the substrate P is changed. From atmospheric pressure to vacuum.
[0005] この減圧された空間において、 一方の基板 Pを保持したチャック Eが閉じ て基板 Pが落下すると同時に、 押圧部丁が、 シリンダ等の駆動源によって下 降して押圧することによって、 他方の基板 Pに貼り合わされる。 貼り合せ時 に真空とするのは、 接着される面の間の気体分子を可能な限り排除するため である。 [0005] In this decompressed space, the chuck E holding one substrate P closes and the substrate P falls, and at the same time, the pressing part is lowered and pressed by a driving source such as a cylinder, so that the other Affixed to the substrate P. The reason for applying a vacuum at the time of bonding is to eliminate as much as possible gas molecules between the bonded surfaces.
[0006] その後、 貼り合わされた基板 Pの周囲は、 図 7 ( D ) に示すように、 大気 を導入して大気圧に戻すか、 大気圧以上に加圧後、 大気圧に戻す。 このよう に大気圧に解放されることで、 接着層 Rに残存した気泡が、 真空との差圧に よって徐々に圧縮される。 気泡が十分圧縮するまで、 数秒〜数十秒大気に放 置された基板 Pに対して、 図 7 ( E ) に示すように、 光源 Uによって、 全体 に紫外線を照射することにより、 接着層 Rが硬化する。 これにより、 2枚の 基板 Pは強固に接着され、 ディスクが完成する。  [0006] Thereafter, as shown in Fig. 7 (D), the atmosphere around the bonded substrate P is returned to atmospheric pressure by introducing air, or after returning to atmospheric pressure, the atmospheric pressure is restored. By being released to atmospheric pressure in this way, the bubbles remaining in the adhesive layer R are gradually compressed by the differential pressure from the vacuum. Until the bubbles are sufficiently compressed, the substrate P that has been left in the atmosphere for several seconds to several tens of seconds is irradiated with ultraviolet light by the light source U as shown in FIG. Is cured. As a result, the two substrates P are firmly bonded to complete the disc.
[0007] 以上のように、 接着剤を塗布した基板を貼り合せて製造されるディスクに ついては、 情報の読み書きに用いられるレーザがディスクに照射されたとき に、 安定してスポットが形成されるように、 反りや歪みのない平坦なものと する必要がある。 従って、 かかるディスクにおいては、 貼り合せる際の接着 層の膜厚が、 できるだけ均一となっていることが望ましい。  [0007] As described above, with respect to a disc manufactured by bonding substrates coated with an adhesive, spots are stably formed when the disc is irradiated with a laser used for reading and writing information. In addition, it should be flat without warping or distortion. Therefore, in such a disk, it is desirable that the thickness of the adhesive layer when bonded is as uniform as possible.
[0008] しかし、 上述のようなスピンコートによって接着剤を塗布する場合、 回転 する基板上の接着剤は、 遠心力によって展延していく。 このため、 基板の内 周部に対して外周部の膜厚が厚くなつてしまい （例えば、 程度） 、 基板全体で膜厚を均一化させることは困難である。  However, when the adhesive is applied by spin coating as described above, the adhesive on the rotating substrate spreads by centrifugal force. For this reason, the film thickness of the outer peripheral part becomes thicker (for example, about) with respect to the inner peripheral part of the substrate, and it is difficult to make the film thickness uniform over the entire substrate.
[0009] これに対処するため、 スピンコートによって樹脂を均一に塗布する技術と して、 スピンコート中、 ディスクの回転を止める前に、 ディスク上の樹脂に 紫外線を照射して全体の粘度を変えることにより、 外周部への樹脂の流動を 制限する手法が提案されている（特許文献 1参照） 。 また、 複数回のスピンコ ートを行う場合に、 その間に樹脂の一部を硬化させることで、 流動を抑制す る手法も提案されている （特許文献 2参照） 。 [0009] In order to cope with this, as a technique for uniformly applying the resin by spin coating, before stopping the rotation of the disk during spin coating, the resin on the disk is irradiated with ultraviolet rays to change the overall viscosity. Thus, a method for restricting the flow of resin to the outer periphery has been proposed (see Patent Document 1). Also, multiple spins A method of suppressing flow by curing a part of the resin during the process is also proposed (see Patent Document 2).
[0010] 特許文献 1 ：特開 2002 _ 31 91 92号公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2002_31 91 92
特許文献 2： 国際公開第 2005/1 1 81 59号  Patent Document 2: International Publication No. 2005/1 1 81 59
特許文献 3：特開 2006 _ 48855号公報  Patent Document 3: Japanese Patent Application Laid-Open No. 2006_48855
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0011] ところで、 接着層の膜厚の周内変動 （ばらつき） は、 ディスクの内周から 外周に向かうほど大きくなることが分かっている。 し力、し、 近年の HD (Hig h Definition DVD) 、 B D (Blu-ray Disc) に見られるような記録密度の向 上に伴い、 最終的なディスクに求められる接着層の均一性は、 非常に厳しく なっている。 例えば、 従来の DVDでは、 ばらつきレンジ 3 O m程度であ つたものが、 H Dや BDでは 1 O m程度へと、 より高い精度が求められる 。 したがって、 周内ばらつきを抑える必要性は、 より一層高まってきている  [0011] By the way, it has been found that the variation (variation) in the circumference of the thickness of the adhesive layer increases from the inner circumference to the outer circumference of the disc. With the improvement in recording density as seen in HD (High Definition DVD) and BD (Blu-ray Disc) in recent years, the uniformity of the adhesive layer required for the final disc is extremely high. It has become severe. For example, conventional DVDs have a variation range of about 3 Om, but HD and BD require about 1 Om with higher accuracy. Therefore, the need to suppress intra-circumference variation is increasing further.
[0012] また、 かかる記録密度の向上に伴い、 読み取りエラ一を防ぐために、 付着 するゴミゃ発生する気泡のサイズ、 量についても、 より一層低減することが 求められている。 気泡の低減については、 従来から、 真空中での貼り合せや 貼り合せ後の加圧により対処してきた。 そのような加圧の手段として、 大気 圧を利用して、 大気中に一定時間曝しておくこと （大気放置） が行われてい る （特許文献 3参照） 。 [0012] Further, with the improvement of the recording density, in order to prevent reading error, it is required to further reduce the size and amount of bubbles generated by adhering dust. Conventionally, the reduction of bubbles has been dealt with by bonding in a vacuum or pressurization after bonding. As a means for such pressurization, exposure to the atmosphere for a certain period of time (atmosphere leaving) is performed using atmospheric pressure (see Patent Document 3).
[0013] しかしながら、 このような大気放置を行うと、 その一方で接着層の周内変 動が拡大してしまうことがわかった。 これは、 接着剤の塗布後から硬化まで の時間が長くなり、 硬化途中の接着剤が流動する機会が増加するためと考え られる。 例えば、 貼り合せ後に放置を行わなかった場合と、 放置 （20 s) を行った場合とで、 それぞれの一例と平均の周内変動率を測定した結果を、 図 8に示す。 この図 8によると、 放置した場合には、 周内変動が全体的に悪 化することと、 外周部の変動が大きいことがわかる。 [0014] さらに、 スピンコートによる塗布を行う際には、 上記のように、 余分な接 着剤が飛散する。 このように飛散した接着剤は、 回収して再利用される。 し かし、 特許文献 1のように、 回転中に全面に紫外線照射を行うと、 飛散する 接着剤には、 紫外線が照射されて硬化が始まったものが含まれてしまう。 す ると、 再利用のためには、 硬化が始まった接着剤と未硬化の接着剤とを分離 する必要が生じるが、 これは非常に困難である。 [0013] However, it has been found that when the air is left in the atmosphere, the variation in the circumference of the adhesive layer is enlarged. This is thought to be because the time from application of the adhesive to curing becomes longer and the opportunity for the adhesive to flow during curing increases. For example, Fig. 8 shows the results of measuring the average rate of change in the circumference of each case when the sample was not left after bonding and when it was left (20 s). According to Fig. 8, it can be seen that if left unattended, the fluctuation in the circumference deteriorates overall and the fluctuation in the outer circumference is large. [0014] Furthermore, when applying by spin coating, as described above, excess adhesive is scattered. The scattered adhesive is collected and reused. However, as disclosed in Patent Document 1, when the entire surface is irradiated with ultraviolet rays during rotation, the scattered adhesive includes an adhesive that has been cured by being irradiated with ultraviolet rays. Thus, for reuse, it is necessary to separate the cured adhesive from the uncured adhesive, which is very difficult.
[0015] 本発明は、 上記のような従来技術の問題点を解決するために提案されたも のであり、 その目的は、 塗布時の接着層の均一性を確保しつつ気泡を抑制で き、 さらに製造中の接着層の変動を抑えることが可能な貼合方法及び貼合装 置を提供することにある。  [0015] The present invention has been proposed to solve the above-described problems of the prior art, and its purpose is to suppress bubbles while ensuring the uniformity of the adhesive layer during coating. Furthermore, it is providing the bonding method and the bonding apparatus which can suppress the fluctuation | variation of the contact bonding layer in manufacture.
課題を解決するための手段  Means for solving the problem
[0016] 上記のような目的を達成するため、 本発明は、 第 1の基板と第 2の基板と を、 電磁波の照射により硬化が引き起こされる接着剤を介して貼り合せる貼 合方法において、 前記第 1の基板及び前記第 2の基板の少なくとも一方の面 に接着剤を塗布し、 塗布後の接着剤に、 大気中で電磁波を照射し、 前記第 1 の基板と前記第 2の基板とを貼り合せ、 前記第 1の基板と前記第 2の基板と の間の接着剤に、 電磁波を照射することを特徴とする。  In order to achieve the above object, the present invention provides a bonding method in which the first substrate and the second substrate are bonded to each other via an adhesive that is cured by irradiation of electromagnetic waves. An adhesive is applied to at least one surface of the first substrate and the second substrate, the applied adhesive is irradiated with electromagnetic waves in the atmosphere, and the first substrate and the second substrate are bonded to each other. Bonding and irradiating the adhesive between the first substrate and the second substrate with electromagnetic waves.
[0017] 他の態様は、 第 1の基板と第 2の基板とを、 電磁波の照射により硬化が引 き起こされる接着剤を介して貼り合せる貼合装置において、 前記第 1の基板 及び前記第 2の基板の少なくとも一方の面に接着剤を塗布する塗布部と、 塗 布後の接着剤に、 大気中で電磁波を照射する前照射部と、 前記第 1の基板と 前記第 2の基板とを貼り合せる貼合部と、 前記第 1の基板と前記第 2の基板 との間の接着剤に、 電磁波を照射する後照射部と、 を有することを特徴とす る。  [0017] In another aspect, in the bonding apparatus for bonding the first substrate and the second substrate via an adhesive that is cured by irradiation of electromagnetic waves, the first substrate and the second substrate An application part that applies an adhesive to at least one surface of the substrate of 2; a pre-irradiation part that irradiates electromagnetic waves in the atmosphere to the adhesive after application; the first substrate; and the second substrate; And a post-irradiation unit that irradiates an electromagnetic wave to the adhesive between the first substrate and the second substrate.
[0018] 以上のような発明では、 第 1の基板と第 2の基板の貼り合せ前に、 大気中 で接着剤に電磁波を照射するので、 接着剤が仮硬化し、 接着力を維持しつつ 流動が防止され、 周内変動を抑制できる。 また、 仮硬化によりアウトガスの 発生が抑制され、 気泡の残留を低減できる。 [0019] 他の態様は、 第 1の基板と第 2の基板とを、 電磁波の照射により硬化が引 き起こされる接着剤を介して貼り合せる貼合方法において、 前記第 1の基板 及び前記第 2の基板の少なくとも一方の面に接着剤を塗布し、 塗布後の接着 剤の一部に電磁波を照射し、 塗布後の接着剤の上に、 さらに一回以上接着剤 を重ねて塗布し、 重ねて塗布した後の接着剤に電磁波を照射し、 前記第 1の 基板と前記第 2の基板とを貼り合せ、 前記第 1の基板と前記第 2の基板との 間の接着剤に、 電磁波を照射することを特徴とする。 In the invention as described above, before the first substrate and the second substrate are bonded together, the adhesive is irradiated with electromagnetic waves in the air, so that the adhesive is temporarily cured and the adhesive force is maintained. Flow is prevented and fluctuations in the circumference can be suppressed. In addition, the temporary curing suppresses the generation of outgas and reduces the residual bubbles. [0019] Another aspect is the bonding method in which the first substrate and the second substrate are bonded via an adhesive that is cured by irradiation of electromagnetic waves. The first substrate and the second substrate Apply an adhesive to at least one side of the substrate in 2 and irradiate part of the adhesive after application with electromagnetic waves, and apply the adhesive once more on the adhesive after application, Irradiate an electromagnetic wave to the adhesive after being applied in layers, bond the first substrate and the second substrate, and apply an electromagnetic wave to the adhesive between the first substrate and the second substrate. It is characterized by irradiating.
[0020] 他の態様は、 第 1の基板と第 2の基板とを、 電磁波の照射により硬化が引 き起こされる接着剤を介して貼り合せる貼合装置において、 前記第 1の基板 及び前記第 2の基板の少なくとも一方の面に、 接着剤を複数回塗布する塗布 部と、 前記塗布部による複数回の塗布の間のいずれかにおいて、 接着剤の一 部に電磁波を照射する第 1の照射部と、 前記塗布部により複数回塗布した後 の接着剤に電磁波を照射する第 2の照射部と、 前記第 1の基板と前記第 2の 基板とを貼り合せる貼合部と、 前記第 1の基板と前記第 2の基板との間の接 着剤に、 電磁波を照射する第 3の照射部と、 を有することを特徴とする。 [0020] Another aspect is a bonding apparatus that bonds the first substrate and the second substrate via an adhesive that is cured by irradiation of electromagnetic waves, wherein the first substrate and the first substrate 1st irradiation which irradiates an electromagnetic wave to a part of adhesive agent in any one of the application part which applies an adhesive multiple times to at least one side of 2 substrates, and multiple times of application by the application part A second irradiation unit that irradiates an electromagnetic wave to the adhesive after being applied a plurality of times by the application unit, a bonding unit that bonds the first substrate and the second substrate, and the first The adhesive between the substrate and the second substrate has a third irradiating part for irradiating electromagnetic waves.
[0021 ] 以上のような態様では、 接着剤を比較的厚く塗布する必要がある場合であ つても、 一部に電磁波を照射した上に重ね塗りすることにより、 接着剤の流 動を抑えて、 均一に塗布することができる。 また、 貼り合せ前の電磁波の照 射により、 周内変動を抑制できる。  [0021] In the embodiment as described above, even when it is necessary to apply the adhesive relatively thickly, by applying an electromagnetic wave to a part of the adhesive and applying it again, the flow of the adhesive can be suppressed. Can be applied uniformly. In addition, fluctuations in the circumference can be suppressed by irradiation of electromagnetic waves before bonding.
[0022] 他の態様は、 前記塗布部は、 スピンコート装置であり、 前記第 1の照射部 は、 接着剤に対して、 回転中心の周囲にスポットで電磁波を照射する照射装 置であることを特徴とする。  [0022] In another aspect, the application unit is a spin coater, and the first irradiation unit is an irradiation device that irradiates an adhesive with electromagnetic waves in spots around a rotation center. It is characterized by.
[0023] 以上のような態様では、 重ね塗りにスピンコート装置を用いることにより 、 厚みの調整が容易となるとともに、 回転中心の周囲に電磁波を照射するこ とにより、 外周側への接着剤の流動を抑えて、 均一な重ね塗りが可能となる  [0023] In the embodiment as described above, by using a spin coat apparatus for overcoating, the thickness can be easily adjusted, and by irradiating an electromagnetic wave around the rotation center, the adhesive on the outer peripheral side can be obtained. Reduces flow and enables uniform overcoating
発明の効果 The invention's effect
[0024] 以上、 説明したように、 本発明によれば、 塗布時の接着層の均一性を確保 しつつ気泡を抑制でき、 さらに製造中の接着層の変動を抑えることが可能な 貼合方法及び貼合装置を提供することができる。 [0024] As described above, according to the present invention, the uniformity of the adhesive layer at the time of application is ensured. In addition, it is possible to provide a bonding method and a bonding apparatus that can suppress bubbles while suppressing variations in the adhesive layer during manufacture.
図面の簡単な説明  Brief Description of Drawings
[0025] [図 1 ]本発明の貼合装置の第 1の実施形態の構成を示す説明図である。  [0025] FIG. 1 is an explanatory view showing the configuration of the first embodiment of the bonding apparatus of the present invention.
[図 2]図 1の実施形態の処理の手順を示すフローチヤ一トである。  2 is a flowchart showing a processing procedure of the embodiment of FIG.
[図 3]本発明の貼合装置の第 2の実施形態におけるスピンコート装置を示す簡 略縦断面図である。  FIG. 3 is a simplified longitudinal sectional view showing a spin coater in a second embodiment of the bonding apparatus of the present invention.
[図 4]図 3の実施形態の処理の手順を示すフローチヤ一トである。  4 is a flowchart showing a processing procedure of the embodiment of FIG.
[図 5]本発明の実施形態によって製造した実施例と従来例の接着層厚の周内分 布を示す説明図である。  FIG. 5 is an explanatory view showing an inner circumference distribution of an adhesive layer thickness of an example and a conventional example manufactured according to the embodiment of the present invention.
[図 6]本発明の貼合装置において、 前照射部を 2つ設置した場合の一実施形態 を示す説明図である。  FIG. 6 is an explanatory view showing an embodiment when two pre-irradiation units are installed in the bonding apparatus of the present invention.
[図 7]従来の基板貼り合せ手順を示す説明図であり、 （A ) は接着剤の展延、 ( B ) は真空チャンバへの導入、 （C ) は貼り合せ、 （D ) は大気開放、 （ E ) は接着剤硬化の工程をそれぞれ示す。  [Fig. 7] An explanatory diagram showing the conventional procedure for bonding substrates, (A) spreads adhesive, (B) introduces into vacuum chamber, (C) bonds, (D) opens to atmosphere , (E) indicate the adhesive curing process.
[図 8]従来技術によって製造したディスクの接着層厚の周内分布を示す説明図 である。  FIG. 8 is an explanatory diagram showing the distribution in the circumference of the adhesive layer thickness of a disc manufactured by the conventional technology.
符号の説明  Explanation of symbols
[0026] 1…第 1のスピンコート装置  [0026] 1 ... First spin coater
3 , 1 1 , 2 1…ターンテーブル  3, 1 1, 2 1… Turntable
2…第 2のスピンコ一ト装置  2… Second spin coat device
4…前照射部  4… Pre-irradiation part
4 a…第 1の前照射部  4 a ... 1st front irradiation part
4 b…第 2の前照射部  4 b… Second front irradiation unit
5…貼合部  5 ... Pasting part
6…後照射部  6… Post-irradiation part
1 2 , 2 2…駆動源  1 2, 2 2… Drive source
1 3…照射装置 1 4…加熱装置 1 3… Irradiation device 1 4… Heating device
3 1…第 1の投入ポジション  3 1… First input position
3 2…第 2の投入ポジション  3 2… Second input position
3 4…紫外線照射ポジション  3 4… UV irradiation position
3 5…搬出ポジション  3 5 ... Unloading position
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0027] 次に、 本発明を実施するための最良の形態 （以下、 実施形態と呼ぶ） につ いて、 図面を参照して具体的に説明する。 本実施形態は、 一対の基板に接着 剤を塗布し、 接着剤を仮硬化させた後、 貼り合せることで、 接着剤の周内変 動を抑制するものである。 Next, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be specifically described with reference to the drawings. In the present embodiment, the adhesive is applied to a pair of substrates, the adhesive is temporarily cured, and then bonded, thereby suppressing the variation in the circumference of the adhesive.
[0028] [第 1の実施形態] [0028] [First embodiment]
[構成]  [Constitution]
まず、 本実施形態の貼合装置 （以下、 本装置と呼ぶ） の構成を、 図 1を参 照して説明する。 なお、 本装置は、 ディスクの製造装置の一部を構成するも のであり、 本装置の上流工程に配設される基板の成型装置及び金属膜の形成 装置、 各装置間で基板を受け渡す機構等については、 公知のあらゆる技術を 適用可能であるため、 説明を省略する。  First, the structure of the bonding apparatus of this embodiment (henceforth this apparatus) is demonstrated with reference to FIG. This device constitutes a part of the disk manufacturing device. The substrate forming device and the metal film forming device disposed in the upstream process of this device, and the mechanism for transferring the substrate between the devices. Since any known technology can be applied, etc., the explanation is omitted.
[0029] 本装置は、 第 1のスピンコート装置 1、 第 2のスピンコート装置 2、 タ一 ンテーブル 3に構成された前照射部 4、 貼合部 5、 後照射部 6等を有してい る。 第 1のスピンコート装置 1は、 貼り合せる一方の基板 P 1に対して、 ス ピンコートにより、 紫外線硬化型の接着剤 B 1を塗布する装置である。 この 第 1のスピンコ一ト装置 1は、 基板 P 1を載置するターンテーブル 1 1 と、 ターンテーブル 1 1を回転させる駆動源 1 2を備え、 接着剤供給部 （図示せ ず） から滴下された接着剤 B 1を、 基板 P 1を回転させることにより展延さ せる装置である。 [0029] This apparatus has a first irradiation unit 4, a pasting unit 5, a rear irradiation unit 6 and the like configured in a first spin coating apparatus 1, a second spin coating apparatus 2, and a turntable 3. ing. The first spin coating apparatus 1 is an apparatus that applies an ultraviolet curable adhesive B 1 to one substrate P 1 to be bonded by spin coating. The first spin coat apparatus 1 includes a turntable 1 1 for placing a substrate P 1 and a drive source 1 2 for rotating the turntable 1 1, and is dropped from an adhesive supply unit (not shown). This is a device that spreads the adhesive B 1 by rotating the substrate P 1.
[0030] 第 2のスピンコート装置 2は、 図 1に示すように、 貼り合せる他方の基板 P 2に対して、 スピンコートにより、 紫外線硬化型の接着剤を塗布する装置 である。 この第 2のスピンコート装置 2は、 基板 P 2を載置するターンテ一 ブル 2 1 とターンテーブル 2 1を回転させる駆動源 2 2を備え、 接着剤供給 部 （図示せず） から滴下された接着剤 B 2を、 基板 P 2を回転させることに より展延させる装置である。 As shown in FIG. 1, the second spin coater 2 is a device that applies an ultraviolet curable adhesive to the other substrate P 2 to be bonded by spin coating. The second spin coater 2 is a turntable on which the substrate P 2 is placed. A device that includes a drive source 2 2 that rotates the bull 2 1 and the turntable 2 1, and spreads the adhesive B 2 dropped from an adhesive supply section (not shown) by rotating the substrate P 2. It is.
[0031 ] ターンテーブル 3には、 前照射部 4に対応し、 基板 P 1が投入される第 1 の投入ポジション 3 1、 反転装置 （図示せず） により、 接着面が対向するよ うに反転させた基板 P 2を投入する第 2の投入ポジシヨン 3 2、 貼合部 5に 対応する貼り合せポジション 3 3、 後照射部 6に対応する紫外線照射ポジシ ヨン 3 4、 完成ディスク Dを次工程に搬出する搬出ポジション 3 5を有して いる。 このターンテーブル 3は、 図示しない駆動機構によって、 上記のよう な各ポジションに合わせて、 間欠回転するように構成されている。  [0031] The turntable 3 is turned upside down so that the bonding surface faces the turntable 3 by a first turning position 31 corresponding to the front irradiation unit 4 and a turning device (not shown) where the substrate P1 is put. 2nd loading position 3 2 for loading the substrate P 2, bonding position 3 3 corresponding to the bonding section 5, UV irradiation position 3 4 corresponding to the post-irradiation section 6, and the completed disk D are carried out to the next process It has an unloading position 35. The turntable 3 is configured to rotate intermittently according to each position as described above by a drive mechanism (not shown).
[0032] 前照射部 4は、 U V照射装置によって、 基板 P 1に塗布された接着剤 B 1 に大気中で紫外線を照射して、 仮硬化させる装置である。 なお、 請求項及び 実施形態でいう 「大気中」 とは、 硬化阻害環境、 例えば、 酸素含有ガス雰囲 気中を意味する。 一般的には、 大気中とするのが簡易であるが、 酸素が含ま れる、 あるいはその他の硬化を阻害する環境であればよい。  [0032] The pre-irradiation unit 4 is a device that irradiates the adhesive B 1 applied to the substrate P 1 with ultraviolet rays in the atmosphere and temporarily cures it with a UV irradiation device. The term “in the atmosphere” as used in the claims and embodiments means a curing-inhibiting environment such as an oxygen-containing gas atmosphere. In general, it is easy to be in the atmosphere, but it may be any environment that contains oxygen or inhibits other curing.
[0033] 貼合部 5は、 真空中で基板 P 1 , P 2を貼り合せる装置である。 なお、 貼 合部 5は、 昇降機構により作動する真空チャンバ、 真空チャンバ内を減圧す る真空源、 昇降機構により作動して基板 P 1 , P 2を押圧する押圧部等を有 しているが、 周知の技術であるため、 説明を省略する。  The bonding unit 5 is a device that bonds the substrates P 1 and P 2 in a vacuum. Note that the bonding unit 5 has a vacuum chamber that is operated by an elevating mechanism, a vacuum source that depressurizes the inside of the vacuum chamber, a pressing unit that is operated by the elevating mechanism and presses the substrates P 1 and P 2, and the like. Since it is a well-known technique, the description is omitted.
[0034] 後照射部 6は、 U V照射装置によって、 貼り合わされた基板 P 1 , P 2に 真空中で紫外線を照射して、 基板 p 1 P 2の間の接着剤 B 1 , B 2を完全 硬化させる装置である。 後照射部 6も、 昇降機構により作動する真空チャン バ、 真空チャンバ内を減圧する真空源等を有しているが、 周知の技術である ため、 説明を省略する。  [0034] The post-irradiation unit 6 irradiates the bonded substrates P 1 and P 2 with ultraviolet rays in a vacuum using a UV irradiation device to completely remove the adhesives B 1 and B 2 between the substrates p 1 and P 2. It is a device for curing. The post-irradiation unit 6 also has a vacuum chamber that is operated by an elevating mechanism, a vacuum source that depressurizes the inside of the vacuum chamber, and the like.
[0035] なお、 真空中で照射するのは、 酸素等の硬化阻害の要因を排除するためで あるが、 必ずしも酸素のない環境とする必要はない。 貼り合せ後の基板 P 1 , P 2の接着接触面はほぼ一体化しており、 雰囲気に左右されず、 硬化する からである。 大気中での貼り合せとした場合には、 外周端面は大気に接触す ることになるが、 この部分については、 製造ライン上の保管時間 （数日） で 完全硬化に至る。 上記のような真空中での照射を行えば、 この外周端面につ いても、 より確実に硬化させることができる利点がある。 不活性ガス （N 2 ) で酸素を排除 （パージ） することによつても、 同様の効果が得られる。 [0035] Note that the irradiation in vacuum is performed to eliminate the cause of curing inhibition such as oxygen, but it is not always necessary to have an oxygen-free environment. This is because the bonded contact surfaces of the substrates P 1 and P 2 after bonding are almost integrated, and are cured regardless of the atmosphere. When pasting in the atmosphere, the outer peripheral edge is in contact with the atmosphere. However, this part will be fully cured in storage time (several days) on the production line. If irradiation is performed in a vacuum as described above, there is an advantage that even the outer peripheral end face can be cured more reliably. The same effect can be obtained by eliminating (purging) oxygen with an inert gas (N 2 ).
[0036] 上記の接着剤供給部からの接着剤の供給量、 ターンテーブルの回転及びそ の速度、 照射装置の発光、 加熱装置、 昇降機構及び真空源の作動等は、 制御 装置によって制御される。 この制御装置は、 例えば、 専用の電子回路若しく は所定のプログラムで動作するコンピュータ等によって実現できる。 従って 、 以下に説明する手順で本装置の動作を制御するためのコンピュータプログ ラム及びこれを記録した記録媒体も、 本発明の一態様である。  [0036] The amount of adhesive supplied from the adhesive supply unit, the rotation and speed of the turntable, the light emission of the irradiation device, the operation of the heating device, the elevating mechanism, and the vacuum source are controlled by the control device. . This control device can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. Therefore, a computer program for controlling the operation of the apparatus according to the procedure described below and a recording medium on which the computer program is recorded are also an embodiment of the present invention.
[0037] [作用]  [0037] [Action]
以上のような本装置による基板の貼り合せ手順を、 図 1及び図 2のフロー チャートを参照して説明する。 なお、 前工程において、 一方の基板 P 1には 、 半透明の反射膜がスパッタリングにより形成され、 他方の基板 P 2には、 全反射の金属膜がスパッタリングされているものとする。  The procedure for bonding substrates by the apparatus as described above will be described with reference to the flow charts of FIGS. In the previous step, it is assumed that a translucent reflective film is formed on one substrate P 1 by sputtering and a totally reflective metal film is sputtered on the other substrate P 2.
[0038] 基板 P 1には、 図 1に示すように、 第 1のスピンコート装置 1において、 中心穴の周囲に紫外線硬化型の接着剤を滴下塗布し、 ターンテーブル 1 1を 高速回転させることにより、 接着剤を展延させる （ステップ 2 0 1 ) 。 例え ば、 塗布圧は 0 . 2 M P a、 塗布時間は 0 . 6 s e cとする。 これを、 例え ば、 1 0 0 0 0 r p mの高速スピンによって、 1 s e c間で振り切る。  [0038] As shown in FIG. 1, in the first spin coater 1, a UV curable adhesive is dropped around the center hole on the substrate P1, and the turntable 11 is rotated at a high speed. To spread the adhesive (step 2 0 1). For example, the application pressure is 0.2 MPa and the application time is 0.6 sec. For example, this is swung between 1 s e c by high-speed spin of 1 0 0 0 0 r pm.
[0039] 次に、 図 1に示すように、 基板 P 1は、 上記のように塗布された接着剤 B  [0039] Next, as shown in FIG. 1, the substrate P 1 is made of the adhesive B applied as described above.
1の面が上になるように、 ターンテーブル 3に投入される （ステップ 2 0 2 ) 。 そして、 前照射部 4において、 U V照射装置によって大気中で紫外線が 全面に照射され、 接着剤 B 1の塗布形状が崩れない程度に仮硬化させる （ス テツプ 2 0 3 ) 。  It is thrown into the turntable 3 so that the 1 side faces up (step 2 0 2). Then, in the pre-irradiation unit 4, the entire surface is irradiated with ultraviolet rays in the atmosphere by a UV irradiation device, and is temporarily cured to such an extent that the applied shape of the adhesive B 1 is not broken (step 20 3).
[0040] なお、 一般的な紫外線硬化型の樹脂 （接着剤） は、 大気中の場合、 全面に 紫外線を照射しても、 通常の照射強度では、 完全硬化はしない。 これは、 樹 脂の表面付近で、 空気中の酸素により硬化が阻害されるからである。 つまり 、 大気中で紫外線照射を行うと、 表面の接着性を維持したまま、 仮硬化させ ることができる。 例えば、 1 00 OmWx 1〜2 sでも全部硬化しないこと が実証されている。 この仮硬化の際の照射条件については、 特定のものには 限定されない。 [0040] It should be noted that a general ultraviolet curable resin (adhesive) does not completely cure at normal irradiation intensity even in the atmosphere even if it is irradiated with ultraviolet rays. This is because curing is inhibited by oxygen in the air near the surface of the resin. That is When UV irradiation is performed in the atmosphere, it can be temporarily cured while maintaining the adhesion of the surface. For example, it has been demonstrated that even 100 OmWx 1-2 s does not cure completely. Irradiation conditions for this temporary curing are not limited to specific ones.
[0041] また、 図 1に示すように、 他方の基板 P 2には、 第 2のスピンコート装置 2において、 通常のスピンコートによる接着剤 B 2の塗布が行われる （ステ ップ 204) 。 例えば、 塗布圧は、 0. 2MP aで塗布時間を 0. 6 s e c とし、 高速スピン 4600 r pmで 1 s e c間振り切る。 そして、 基板 P 2 は反転装置によって反転されて （ステップ 205) 、 接着剤 B2の塗布面が 下になるように、 基板 P 1の上方に投入される （ステップ 206) 。  Further, as shown in FIG. 1, the other substrate P 2 is coated with the adhesive B 2 by normal spin coating in the second spin coater 2 (step 204). For example, the coating pressure is 0.2 MPa, the coating time is 0.6 sec, and it is shaken off for 1 sec with a high speed spin of 4600 rpm. Then, the substrate P 2 is reversed by the reversing device (step 205), and is placed above the substrate P 1 so that the application surface of the adhesive B2 is down (step 206).
[0042] その後、 2枚の基板 P 1 , P 2は、 貼合部 5に搬送され、 従来技術と同様 に、 真空中での貼り合せが行われる （ステップ 207) 。 貼り合わされた基 板 P 1 , P 2は、 後照射部 6に送られ、 真空中で紫外線が全面に照射され、 接着剤 B 1 , B 2が完全に硬化する （ステップ 208) 。 このとき、 反透過 の金属膜がスパッタリングされている基板 P 1側から、 紫外線を照射するよ うにする。 接着剤硬化により完成されたディスク Dは、 搬出ポジション 35 から搬出される （ステップ 209) 。  [0042] Thereafter, the two substrates P 1 and P 2 are transported to the bonding unit 5 and bonded in a vacuum as in the prior art (step 207). The bonded substrates P 1 and P 2 are sent to the post-irradiation unit 6, where the entire surface is irradiated with ultraviolet rays in a vacuum, and the adhesives B 1 and B 2 are completely cured (step 208). At this time, ultraviolet rays are irradiated from the substrate P 1 side on which the anti-transmissive metal film is sputtered. The disk D completed by the adhesive curing is unloaded from the unloading position 35 (step 209).
[0043] [効果]  [0043] [Effect]
以上のような本実施形態によれば、 貼り合わされる基板 P 1に塗布する接 着剤 B 1を仮硬化させてから、 基板 P 2と貼り合せるので、 接着力を維持し つつ、 接着剤 B 1の流動が抑制され、 貼り合せた後の接着層厚の周内変動を 抑制できる。  According to the present embodiment as described above, since the adhesive B 1 applied to the substrate P 1 to be bonded is temporarily cured and then bonded to the substrate P 2, the adhesive B is maintained while maintaining the adhesive force. The flow of 1 can be suppressed, and fluctuations in the thickness of the adhesive layer after bonding can be suppressed.
[0044] また、 接着剤 B 1を仮硬化させた場合には、 あらかじめ一部の領域が硬化 しているため、 基板 P 1 , P 2を真空中で貼り合せた時にアウトガスの発生 が抑制され、 気泡の残留を低減できる。 そして、 仮硬化がなされているため に周内変動を抑制できるので、 例えば、 貼り合せ後に放置時間を確保するこ ともでき、 これにより気泡の発生も抑制できる。  [0044] In addition, when the adhesive B 1 is temporarily cured, since a part of the region is cured in advance, generation of outgas is suppressed when the substrates P 1 and P 2 are bonded together in a vacuum. , Residual air bubbles can be reduced. Since the temporary curing is performed, fluctuations in the circumference can be suppressed, and for example, it is possible to secure a standing time after bonding, thereby suppressing the generation of bubbles.
[0045] さらに、 仮硬化のための紫外線の照射は、 スピンコートが終了して接着剤 B 1の飛び散りが無くなった後に行うので、 スピンコ一ト時に飛散する接着 剤の硬化が始まっているということがなく、 回収した接着剤の再利用に問題 はない。 なお、 スピンコートとは別の場所において照射することも、 同様の 効果に繋がる。 [0045] Further, the ultraviolet irradiation for temporary curing is performed after the spin coating is completed. Since it is performed after the B 1 scatters, the adhesive that scatters during spin coating does not start to cure, and there is no problem in reusing the recovered adhesive. Irradiation at a place different from the spin coat leads to the same effect.
[0046] [第 2の実施形態] [Second Embodiment]
[構成]  [Constitution]
本実施形態は、 基本的には、 上記の第 1の実施形態と同様の構成である。 但し、 図 3に示すように、 第 1のスピンコート装置 1力 基板 P 1上の接着 剤 B 1に対して、 紫外線 （UV) を照射する照射装置 1 3 (第 1の照射部） 、 加熱する加熱装置 1 4を備えている。 照射装置 1 3は、 基板 P 1の中心穴 の周囲にスポット的に紫外線を照射する装置であり、 光源からの紫外線が光 ファイバ一によって導かれるように構成されている。 光源に紫外線 L EDを 用いて、 照射強度を調整できるように構成してもよい。 加熱装置 1 4は、 基 板 P 1の外周近傍を加熱する装置である。 この加熱装置 1 4としては、 例え ば、 赤外線 （ I R) 照射ユニット又はヒータを用いることができる。 なお、 本実施形態における前照射部 4は、 請求項の第 2の照射部、 後照射部 6は第 3の照射部に対応する。  This embodiment basically has the same configuration as that of the first embodiment. However, as shown in FIG. 3, the first spin coater 1 force Irradiation device 1 3 (first irradiation unit) that irradiates the adhesive B 1 on the substrate P 1 with ultraviolet (UV), heating It has a heating device 1 to 4. The irradiation device 13 is a device that irradiates ultraviolet rays in a spot manner around the central hole of the substrate P 1, and is configured such that the ultraviolet rays from the light source are guided by an optical fiber. An ultraviolet LED may be used as the light source so that the irradiation intensity can be adjusted. The heating device 14 is a device that heats the vicinity of the outer periphery of the substrate P 1. As the heating device 14, for example, an infrared (IR) irradiation unit or a heater can be used. The pre-irradiation unit 4 in this embodiment corresponds to the second irradiation unit in the claims, and the post-irradiation unit 6 corresponds to the third irradiation unit.
[0047] [作用] [0047] [Action]
以上のような本装置による基板の貼り合せ手順を、 図 1及び図 3、 さらに 図 4のフローチャートを参照して説明する。 なお、 前工程において、 一方の 基板 P 1には、 半透明の反射膜がスパッタリングにより形成され、 他方の基 板 P 2には、 全反射の金属膜がスパッタリングされているものとする。  The procedure for bonding substrates by the apparatus as described above will be described with reference to FIGS. 1 and 3 and the flowchart of FIG. In the previous step, it is assumed that a translucent reflective film is formed on one substrate P 1 by sputtering and a totally reflective metal film is sputtered on the other substrate P 2.
[0048] 基板 P 1には、 図 1に示すように、 第 1のスピンコート装置 1において、 中心穴の周囲に紫外線硬化型の接着剤を滴下塗布し、 ターンテーブル 1 1を 高速回転させることにより、 接着剤を展延させる （ステップ 401 ) 。 例え ば、 接着剤の粘度としては 43 OmP a sのものを用い、 塗布圧は 0. 2M P a、 塗布時間は 0. 1 5 s e cとする。 これを、 例えば、 l O O O O r p mの高速スピンによって、 8 s e c間で振り切る。 [0049] 次に、 図 3に示すように、 基板 P 1を接着剤が流動しない程度に回転させ (例えば、 1 20 r pm〜300 r pm) 、 中心穴の周囲に、 照射装置 1 3 によってスポット的に紫外線を照射する。 これにより、 展延した接着剤に、 環状に硬化させた部分 （硬化部） が形成される （ステップ 402) 。 このと き、 UV光強度が強い部分では完全に硬化するが、 外周に行くにしたがって 、 接着剤の酸素阻害の影響を受け、 表面が固まらず、 内部が固まり、 外周に 向かって内部もだんだん硬化しなくなる。 As shown in FIG. 1, on the substrate P 1, in the first spin coater 1, an ultraviolet curable adhesive is dropped around the center hole, and the turntable 11 is rotated at a high speed. To spread the adhesive (step 401). For example, the viscosity of the adhesive is 43 OmPas, the application pressure is 0.2 MPa, and the application time is 0.15 sec. This is shaken off for 8 seconds by, for example, lOOO rpm high-speed spin. Next, as shown in FIG. 3, the substrate P 1 is rotated to such an extent that the adhesive does not flow (for example, 120 rpm to 300 rpm), and around the center hole by the irradiation device 1 3 Irradiate ultraviolet rays in spots. As a result, an annularly cured portion (cured portion) is formed in the spread adhesive (step 402). At this time, the part where the UV light intensity is strong is completely cured, but as it goes to the outer periphery, it is affected by the oxygen inhibition of the adhesive, the surface does not solidify, the inside solidifies, and the inside gradually hardens toward the outer circumference. No longer.
[0050] 次に、 このように展延され、 硬化部が形成された基板 P 1の接着剤の上に 、 再度、 紫外線硬化型の接着剤が滴下塗布され、 ターンテーブル 1 1を高速 回転せることにより、 接着剤を展延させる （ステップ 403) 。 例えば、 1 回目と同様の接着剤を用いて、 塗布圧を 0. 2MP a、 塗布時間を 0. 6 s e cとし、 1 0000 r p mの高速スピンによって、 1 s e cで振り切る。 このとき、 加熱装置 1 4を用いて、 部分的に加熱することにより、 展延する 。 例えば、 熱源としてスポットヒータを用い、 波長を 700〜3000 n m 、 設定出力は 35 OW、 加熱範囲は、 基板 P 1の径方向 4 1 mm〜53 mm で、 加熱時間は 1 s e cとする。  [0050] Next, the UV curable adhesive is applied again on the adhesive of the substrate P 1 which has been spread in this way and the cured portion is formed, and the turntable 11 is rotated at high speed. As a result, the adhesive is spread (step 403). For example, using the same adhesive as the first time, setting the application pressure to 0.2 MPa, the application time to 0.6 sec, and shaking off at 1 sec with a high speed spin of 1 0000 rpm. At this time, it spreads by partially heating using the heating apparatus 14. For example, a spot heater is used as the heat source, the wavelength is 700 to 3000 nm, the set output is 35 OW, the heating range is 41 to 53 mm in the radial direction of the substrate P1, and the heating time is 1 sec.
[0051] 以上のように基板 P 1に接着剤を塗布することによって、 暖められ、 粘度 が低下した接着剤は、 基板を回転させることで生じる遠心力により、 振り切 られ、 外周へはじき出され易くなる。 または、 熱エネルギーを得て、 揮発量 が増大する。 このため、 外周に残る接着剤は薄くなり、 その厚みが増大する ことを抑制できるので、 全体として厚みを均一化できる。 なお、 同時に外周 に熱風をあて、 接着剤の加熱の補助を行ってもよい。  [0051] As described above, by applying the adhesive to the substrate P1, the adhesive that has been warmed and whose viscosity has been reduced is easily shaken off by the centrifugal force generated by rotating the substrate and is easily ejected to the outer periphery. Become. Or, by obtaining thermal energy, the volatilization amount increases. For this reason, the adhesive remaining on the outer periphery is thinned, and it is possible to suppress an increase in the thickness, so that the thickness can be made uniform as a whole. At the same time, hot air may be applied to the outer periphery to assist heating of the adhesive.
[0052] その後、 図 1に示すように、 基板 P 1は、 上記のように塗布された接着剤 B 1の面が上になるように、 ターンテーブル 3に投入される （ステップ 40 4) 。 そして、 前照射部 4において、 UV照射装置によって大気中で紫外線 が全面に照射され、 接着剤 B 1の塗布形状が崩れない程度に仮硬化させる （ ステップ 405) 。 例えば、 通常の本硬化の場合の条件 （50mW/cm2 x 5 s) と比較して、 同様の強度で約半分の照射時間 （2 s) の照射を行う。 [0053] また、 図 1に示すように、 他方の基板 P 2には、 第 2のスピンコート装置 2において、 通常のスピンコートによる接着剤 B 2の塗布が行われる （ステ ップ 406) 。 例えば、 塗布圧は、 0. 2MP aで塗布時間を 0. 6 s e c とし、 高速スピン 6000 r pmで 1 s e c間振り切る。 そして、 基板 P 2 は反転装置によって反転されて （ステップ 407) 、 接着剤 B 2の塗布面が 下になるように、 基板 P 1の上方に投入される （ステップ 408) 。 Thereafter, as shown in FIG. 1, the substrate P 1 is put into the turntable 3 so that the surface of the adhesive B 1 applied as described above is on (step 40 4). Then, in the pre-irradiation unit 4, the entire surface is irradiated with ultraviolet rays in the atmosphere by the UV irradiation device, and is temporarily cured to such an extent that the applied shape of the adhesive B 1 is not broken (step 405). For example, compared to the conditions for normal main curing (50 mW / cm 2 x 5 s), irradiation is performed for about half the irradiation time (2 s) at the same intensity. Further, as shown in FIG. 1, the other substrate P 2 is coated with the adhesive B 2 by normal spin coating in the second spin coater 2 (step 406). For example, the coating pressure is 0.2 MPa, the coating time is 0.6 sec, and the high speed spin is 6000 rpm for 1 sec. Then, the substrate P 2 is reversed by the reversing device (step 407), and is placed above the substrate P 1 so that the application surface of the adhesive B 2 is down (step 408).
[0054] その後、 2枚の基板 P 1 , P 2は、 貼合部 5に搬送され、 従来技術と同様 に、 真空中での貼り合せが行われる （ステップ 409) 。 貼り合わされた基 板 P 1 , P 2は、 後照射部 6に送られ、 真空中で紫外線が全面に照射され、 接着剤 B 1 , B2が完全に硬化する （ステップ 41 0) 。 このとき、 反透過 の金属膜がスパッタリングされている基板 P 1側から、 紫外線を照射するよ うにする。 接着剤硬化により完成されたディスク Dは、 搬出ポジション 35 から搬出される （ステップ 41 1 ) 。  [0054] After that, the two substrates P 1 and P 2 are conveyed to the bonding unit 5 and bonded in a vacuum as in the conventional technique (step 409). The bonded substrates P 1 and P 2 are sent to the post-irradiation unit 6 where the entire surface is irradiated with ultraviolet rays in a vacuum, and the adhesives B 1 and B 2 are completely cured (step 410). At this time, ultraviolet rays are irradiated from the substrate P 1 side on which the anti-transmissive metal film is sputtered. The disk D completed by the adhesive curing is unloaded from the unloading position 35 (step 41 1).
[0055] [効果]  [0055] [Effect]
以上のような本実施形態によれば、 貼り合わされる基板 P 1に塗布する接 着剤 B 1を厚くする場合にも、 接着剤 B 1を仮硬化させることにより、 接着 剤 B 1の流動が抑制され、 基板 P 1 , P 2を貼り合せた後の接着層厚の周内 変動を抑制できる。 このような貼り合せ後の基板の接着層の周内分布を、 図 5に示す。 これによると、 上記の実施形態に沿って作製した実施例と、 仮硬 化なく貼り合せた従来例 （他の条件は実施例と同様） について、 その一例と 平均の周内変動率を比較すると、 実施例の周内変動が、 従来例よりも小さく なることがわかる。  According to the present embodiment as described above, even when the adhesive B 1 applied to the substrate P 1 to be bonded is thickened, the adhesive B 1 can be flowed by temporarily curing the adhesive B 1. It is possible to suppress fluctuations in the adhesive layer thickness after bonding the substrates P 1 and P 2. Figure 5 shows the distribution of the adhesive layer on the substrate after such bonding. According to this, when comparing the average circumference variation rate with an example of an example manufactured according to the above-mentioned embodiment and a conventional example (other conditions are the same as the example) pasted together without pre-curing. It can be seen that the variation in the circumference of the example is smaller than that of the conventional example.
[0056] また、 塗布厚は、 接着剤の塗布量、 回転条件、 展延回数を変えることによ り、 容易に調節できる。 特に、 塗布厚を厚くしたい場合には、 上記のように 、 硬化部を形成し、 加熱しながら重ね塗りを行うことにより、 均一な厚みを 確保できるので、 周内変動の抑制効果を高めることができる。 基板 P 2に厚 く塗布したり、 基板 P 1 , P 2の双方に厚く塗布することも可能である。 こ のとき、 第 2のスピンコート装置 2にも、 照射装置 1 3を設けることにより 、 基板 P 2の接着剤にも硬化部を形成するようにしてもよく、 加熱装置 1 4 を設けることにより、 厚みの増大を抑えてもよい。 [0056] Further, the coating thickness can be easily adjusted by changing the coating amount of the adhesive, the rotation conditions, and the number of spreads. In particular, when it is desired to increase the coating thickness, a uniform thickness can be secured by forming the cured portion and applying the coating while heating, as described above, so that the effect of suppressing fluctuations in the circumference can be enhanced. it can. It is also possible to apply a thick coating on the substrate P 2 or a thick coating on both the substrates P 1 and P 2. At this time, the second spin coater 2 is also provided with an irradiation device 13. Further, a hardened portion may be formed in the adhesive of the substrate P 2, and an increase in thickness may be suppressed by providing the heating device 14.
[0057] そして、 仮硬化のためにアウトガスの発生が抑制され、 気泡の残留を低減 できるとともに、 放置時間を確保すれば、 より一層の気泡の抑制が可能であ ることは、 上記の第 1の実施形態と同様である。 さらに、 仮硬化のための紫 外線の照射は、 スピンコート終了後、 スピンコートとは別の場所において行 われ、 基板 P 1を回転させながらのスポット照射についても、 限定された一 部の領域を照射するに過ぎないため、 接着剤の回収には問題がない。  [0057] Then, the occurrence of outgassing due to temporary curing can be suppressed, the remaining of bubbles can be reduced, and if the standing time is secured, it is possible to further suppress bubbles. This is the same as the embodiment. In addition, ultraviolet irradiation for pre-curing is performed at a place different from spin coating after the spin coating is completed, and spot irradiation while rotating the substrate P 1 is also performed in a limited part of the area. There is no problem in collecting the adhesive because it is only irradiated.
[0058] [他の実施形態]  [0058] [Other Embodiments]
本発明は、 上記のような実施形態に限定されるものではない。 上記の実施 形態においては、 双方の基板に接着剤を塗布し、 一方の接着剤に対してのみ 紫外線照射 （仮硬化、 スポット） を行った。 しかし、 請求項における接着剤 の塗布及び電磁波の照射は、 少なくとも一方の基板に対して行えばよい。 し たがって、 接着剤の塗布を、 一方の基板に対してのみ行ってもよい。  The present invention is not limited to the embodiment as described above. In the above embodiment, an adhesive is applied to both substrates, and ultraviolet irradiation (temporary curing, spot) is performed only on one of the adhesives. However, the application of the adhesive and the electromagnetic wave irradiation in the claims may be performed on at least one of the substrates. Therefore, the adhesive may be applied only to one substrate.
[0059] また、 双方の基板に接着剤を塗布した場合、 双方の接着剤に対して紫外線 照射を行ってもよい。 例えば、 図 6に示すように、 基板 P 1に対して紫外線 の照射を行う第 1の前照射部 4 aと、 基板 P 2に対して紫外線の照射を行う 第 2の前照射部 4 bを設けることにより、 接着剤 B 1 , B 2の双方について 仮硬化を行ってから、 貼り合せを行うことも可能である。 これにより、 周内 変動のより一層の抑制効果が得られるとともに、 気泡低減効果も得られる。  [0059] Further, when an adhesive is applied to both the substrates, both the adhesives may be irradiated with ultraviolet rays. For example, as shown in FIG. 6, a first pre-irradiation unit 4a that irradiates the substrate P 1 with ultraviolet rays and a second pre-irradiation unit 4b that irradiates the substrate P 2 with ultraviolet rays are provided. By providing it, it is also possible to perform bonding after both the adhesives B 1 and B 2 are pre-cured. As a result, it is possible to obtain a further suppression effect of fluctuations in the circumference and a bubble reduction effect.
[0060] また、 使用する接着剤については、 紫外線硬化型の樹脂には限定されず、 その他の電磁波 （レーザ光も含む） により硬化する樹脂、 熱硬化型の樹脂等 、 種々のものが使用可能である。 したがって、 樹脂の種類に応じて、 照射す る電磁波の種類も、 紫外線、 赤外線 （熱線を含む） 、 所定の波長のレーザ光 等、 種々のものが適用可能である。 上記の実施形態では、 接着剤を厚く塗布 するために、 硬化部を形成して重ね塗りをしたが、 単なる重ね塗りでも、 接 着剤の滴下量を多くした一回塗りでもよい。 展延時の加熱を省略してもよい 。 また、 貼り合せは、 必ずしも真空中で行わなくてもよい。 [0061 ] 接着剤を塗布するための塗布部は、 単数であっても複数であってもよい。 例えば、 第 1の基板と第 2の基板とで共通のスピンコ一ト装置を用いてもよ し、。 重ね塗りを複数台のスピンコート装置で行っても良い。 塗布部は、 スピ ンコート装置には限定されず、 接着剤を塗布可能な装置であれば、 現在又は 将来において利用可能なあらゆる装置を含む。 [0060] The adhesive to be used is not limited to the ultraviolet curable resin, and various other materials such as a resin curable by other electromagnetic waves (including laser light), a thermosetting resin, and the like can be used. It is. Therefore, depending on the type of resin, various types of electromagnetic waves can be applied such as ultraviolet rays, infrared rays (including heat rays), laser light with a predetermined wavelength, and the like. In the above embodiment, in order to apply the adhesive thickly, the hardened portion is formed and overcoated. However, it may be a simple overcoating or a single coating with a large amount of adhesive dropped. Heating during spreading may be omitted. Further, the bonding is not necessarily performed in a vacuum. [0061] The application portion for applying the adhesive may be single or plural. For example, a common spin coat device may be used for the first substrate and the second substrate. Overcoating may be performed with a plurality of spin coaters. The application unit is not limited to a spin coater, and includes any device that can be used at present or in the future as long as it can apply an adhesive.
[0062] また、 前照射部は、 スピン塗布の後、 貼り合せまでの間であれば、 どこに 設置されていてもよい。 例えば、 スピンコート装置に設置されていても、 ス ビンコ一ト装置からターンテ一ブルまでの搬送途中に設置されていてもよい 。 上述のように、 ターンテーブル上の基板 P 1 , P 2のいずれか一方に設置 されていても、 双方に設置されていてもよい。  [0062] In addition, the pre-irradiation unit may be installed anywhere as long as it is between spin coating and bonding. For example, even if it is installed in a spin coater, it may be installed in the middle of conveyance from the spin coater to the turntable. As described above, it may be installed on either one of the substrates P 1 and P 2 on the turntable or on both.
[0063] 基板についても、 その大きさ、 形状、 材質等は自由であり、 将来において 採用されるあらゆるものに適用可能である。 従って、 あらゆる規格の記録媒 体用のディスクに適用可能であり、 当然、 追記型の記録媒体、 書き込み型の 記録媒体のいずれにも適用できる。 また、 記録媒体であるディスクばかりで なく、 接着剤により貼り合わされるあらゆる基板に適用することができる。 つまり、 請求項に記載の 「基板」 は、 円盤状等には限定されず、 平面状の製 品を広く含む概念である。  [0063] The size, shape, material, and the like of the substrate are also free, and can be applied to everything that will be used in the future. Therefore, the present invention can be applied to discs for recording media of any standard, and of course, can be applied to both write-once recording media and writable recording media. Moreover, it can be applied not only to a disk as a recording medium but also to any substrate bonded with an adhesive. In other words, the “substrate” described in the claims is not limited to a disk shape or the like, but is a concept including a wide range of flat products.

Claims

請求の範囲 The scope of the claims
[1 ] 第 1の基板と第 2の基板とを、 電磁波の照射により硬化が引き起こされる 接着剤を介して貼り合せる貼合方法において、  [1] In a bonding method in which the first substrate and the second substrate are bonded through an adhesive that is cured by irradiation with electromagnetic waves.
前記第 1の基板及び前記第 2の基板の少なくとも一方の面に接着剤を塗布 し、  Applying an adhesive to at least one surface of the first substrate and the second substrate;
塗布後の接着剤に、 大気中で電磁波を照射し、  Irradiate the applied adhesive with electromagnetic waves in the atmosphere,
前記第 1の基板と前記第 2の基板とを貼り合せ、  Bonding the first substrate and the second substrate,
前記第 1の基板と前記第 2の基板との間の接着剤に、 電磁波を照射するこ とを特徴とする貼合方法。  A bonding method comprising irradiating an electromagnetic wave to an adhesive between the first substrate and the second substrate.
[2] 第 1の基板と第 2の基板とを、 電磁波の照射により硬化が引き起こされる 接着剤を介して貼り合せる貼合方法において、 [2] In a bonding method in which the first substrate and the second substrate are bonded via an adhesive that is cured by irradiation of electromagnetic waves.
前記第 1の基板及び前記第 2の基板の少なくとも一方の面に接着剤を塗布 し、  Applying an adhesive to at least one surface of the first substrate and the second substrate;
塗布後の接着剤の一部に電磁波を照射し、  Irradiate part of the adhesive after application with electromagnetic waves,
塗布後の接着剤の上に、 さらに一回以上接着剤を重ねて塗布し、 重ねて塗布した後の接着剤に電磁波を照射し、  On top of the adhesive after application, apply the adhesive one more time, apply the electromagnetic waves to the adhesive after it has been applied,
前記第 1の基板と前記第 2の基板とを貼り合せ、  Bonding the first substrate and the second substrate,
前記第 1の基板と前記第 2の基板との間の接着剤に、 電磁波を照射するこ とを特徴とする貼合方法。  A bonding method comprising irradiating an electromagnetic wave to an adhesive between the first substrate and the second substrate.
[3] 第 1の基板と第 2の基板とを、 電磁波の照射により硬化が引き起こされる 接着剤を介して貼り合せる貼合装置において、 [3] In a laminating apparatus for laminating the first substrate and the second substrate through an adhesive that is cured by irradiation of electromagnetic waves,
前記第 1の基板及び前記第 2の基板の少なくとも一方の面に接着剤を塗布 する塗布部と、  An application unit for applying an adhesive to at least one surface of the first substrate and the second substrate;
塗布後の接着剤に、 大気中で電磁波を照射する前照射部と、  A pre-irradiation part that irradiates the applied adhesive with electromagnetic waves in the atmosphere;
前記第 1の基板と前記第 2の基板とを貼り合せる貼合部と、  A bonding portion for bonding the first substrate and the second substrate;
前記第 1の基板と前記第 2の基板との間の接着剤に、 電磁波を照射する後 照射部と、  An irradiation unit that irradiates the adhesive between the first substrate and the second substrate with electromagnetic waves; and
を有することを特徴とする貼合装置。 It has a bonding apparatus characterized by having.
[4] 第 1の基板と第 2の基板とを、 電磁波の照射により硬化が引き起こされる 接着剤を介して貼り合せる貼合装置において、 [4] In a laminating apparatus for laminating the first substrate and the second substrate through an adhesive that is cured by irradiation of electromagnetic waves.
前記第 1の基板及び前記第 2の基板の少なくとも一方の面に、 接着剤を複 数回塗布する塗布部と、  An application section for applying an adhesive multiple times to at least one surface of the first substrate and the second substrate;
前記塗布部による複数回の塗布の間のいずれかにおいて、 接着剤の一部に 電磁波を照射する第 1の照射部と、  In any of a plurality of times of application by the application unit, a first irradiation unit that irradiates a part of the adhesive with electromagnetic waves;
前記塗布部により複数回塗布した後の接着剤に、 電磁波を照射する第 2の 照射部と、  A second irradiating unit that irradiates electromagnetic waves to the adhesive after being applied a plurality of times by the applying unit;
前記第 1の基板と前記第 2の基板とを貼り合せる貼合部と、  A bonding portion for bonding the first substrate and the second substrate;
前記第 1の基板と前記第 2の基板との間の接着剤に、 電磁波を照射する第 3の照射部と、  A third irradiating unit that irradiates an electromagnetic wave to the adhesive between the first substrate and the second substrate;
を有することを特徴とする貼合装置。  It has a bonding apparatus characterized by having.
[5] 前記塗布部は、 スピンコート装置であり、 [5] The application unit is a spin coater,
前記第 1の照射部は、 接着剤に対して、 回転中心の周囲にスポットで電磁 波を照射する照射装置であることを特徴とする請求項 4記載の貼合装置。  5. The bonding apparatus according to claim 4, wherein the first irradiation unit is an irradiation apparatus that irradiates the adhesive with electromagnetic waves with spots around the rotation center.
PCT/JP2007/001025 2006-09-28 2007-09-20 Bonding method and bonding apparatus WO2008038414A1 (en)

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JP2012071281A (en) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Apparatus and method for supplying adhesive
JP5186556B2 (en) * 2008-04-14 2013-04-17 昭和電工株式会社 Cured film and method for producing the same
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EP2793275A3 (en) * 2013-04-16 2015-08-12 teamtechnik Maschinen und Anlagen GmbH Application of conductive adhesive on solar cells

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JP6100570B2 (en) * 2013-03-22 2017-03-22 株式会社東芝 Display device manufacturing apparatus and display device manufacturing method

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JP5186556B2 (en) * 2008-04-14 2013-04-17 昭和電工株式会社 Cured film and method for producing the same
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