JP2002067169A - Device and method for pasting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pasting device by which flatness of the surfaces of members to be pasted is ensured. SOLUTION: By this pasting device, two or more members 22 and 23 to be pasted are bonded with an adhesive 28 by pressing the members 22 and 23 between a supporting body 13 and a pressing body 16. In such a pasting device, porous layers 14 and 18 are provided on one side of the supporting body 13 or the pressing body 16 which faces to at least one of the members 22 and 23 to be pasted. Then, the porous layers 14 and 18 are impregnated and crosslinked with a resin, and a crosslinked resin film 21 is formed on the surfaces of the porous layers 14 and 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for bonding members to be bonded such as an optical disk substrate, a composite optical lens and a composite glass plate.

[0002]

2. Description of the Related Art Japanese Patent Publication No. Hei 4-53012 and Patent No. 2
As disclosed in U.S. Pat. No. 7,425,524, an ultraviolet curable adhesive is applied concentrically on the signal surface of an optical disk substrate, the other optical disk substrate or dummy substrate is placed thereon, and the two substrates are rotated at high speed. A method is known in which an adhesive is filled between the substrates while the adhesive is being cured, and the adhesive is cured by irradiating ultraviolet rays, and is generally used for DVD video disks.

Separately from this method, a relatively high-viscosity ultraviolet-curable adhesive is applied to an optical disk substrate, and is rotated at high speed to stabilize the applied thickness. Curing the adhesive by the method described in JP-A-8-203125 or JP-A-8-30
As disclosed in Japanese Patent No. 6077, a method of applying pressure and bonding using an adhesive sheet having a constant thickness is also used.

[0004] In the step of bonding the disk substrates by pressing as described above, since the surface in contact with the disk substrate is flat, the disk substrate moves in the direction in which the warpage is corrected during bonding, and the pressing body or the support body is pressed. The disk substrate is scratched by the sliding with the disk. Therefore, as disclosed in JP-A-1-303649, a pressing body,
A low-rigidity buffer layer is provided on the side of the support facing the disk substrate.

On the other hand, in order to narrow the recording / reproducing light spot with the increase in the recording capacity, the thickness of the substrate is set to DVD.
(Digital Versatile Disc) has been proposed to be thinner than 0.6 mm and the numerical aperture NA of the objective lens to be larger than 0.6.

When the thickness of the substrate is smaller than 0.3 mm, the rigidity of the substrate itself is reduced, and it becomes difficult to support the disk substrate only by the inner and outer peripheries of the substrate as disclosed in Japanese Patent No. 21221870. Unless at least the entire surface opposite to the surface on which the signal is recorded is supported, the disk substrate warps due to its own weight.

[0007]

Problems to be Solved by the Invention
As disclosed in Japanese Unexamined Patent Publication No. 649, a material provided with a low-rigidity buffer layer such as a rubber-based sheet or a nonwoven fabric and receiving and bonding a disk substrate has excellent flexibility because of its flexibility. As described above, when the thickness of the substrate is reduced, the unevenness of the buffer layer affects the unevenness of the bonded disk surface, and the focus margin is reduced.

[0008] Further, the evaporation component of the adhesive applied for bonding permeates into the adhesive layer on the back surface of the sheet or the nonwoven fabric,
It begins to peel off from the edges of the sheet or nonwoven. Due to the peeling, there are disadvantages such as an increase in the warpage of the disk substrate, a decrease in yield, and a decrease in the operation rate of the bonding apparatus for exchanging the sheet or nonwoven fabric.

SUMMARY OF THE INVENTION An object of the present invention is to solve the conventional disadvantages described above, to ensure a flatness of the surface of a member to be bonded and a buffering property for the member to be bonded, and to provide a bonding device having excellent durability. It is to provide a bonding method.

[0010]

In order to achieve the above object, the present invention provides a method for supporting two or more members to be bonded, such as a disk substrate, via an adhesive such as an ultraviolet curing adhesive. In a bonding apparatus for bonding the member to be bonded by pressing between a pressing member and a pressing member, for example, a porous layer of metal or ceramic is formed on at least one of the support and the pressing member on the side facing the bonding member. And a resin such as a polyfunctional acrylate is impregnated in the porous layer and crosslinked, and the crosslinked resin film is formed on the surface of the porous layer.

In the present invention, at least one of the support and the pressing body has a porous layer on the side facing the member to be bonded, and the porous layer is impregnated with a resin and crosslinked to form a porous layer. Because a crosslinked resin film is formed, flatness,
It is excellent in cushioning property and durability, and can suppress warping of a member to be bonded and prevent a decrease in yield due to a scratch or the like.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram of a bonding device according to an embodiment, and FIG. 2 is a cross-sectional view of a bonding portion in a first specific example of the bonding device.

As shown in FIG. 1, the bonding apparatus includes a disk substrate supply unit 1, an adhesive application unit 2, a spinner unit 3, an inversion unit 4, a bonding unit 5, an inspection unit 6, and a bonded disk integration unit 7. It is mainly composed.

The laminating unit 5 has a station for a disk supply section 8, a laminating section 9, an ultraviolet irradiation section 10, and a disk take-out section 11, which are arranged from the center of rotation of the rotary table 12 as shown in FIG. They are provided at equidistant positions.

On the rotary table 12, six disk supports 13 are mounted at equal intervals in the circumferential direction at the same intervals as the disk supply unit 8 and the bonding unit 9 (ultraviolet irradiation unit 10 and disk extraction unit 11). I have. Disk support 13
Has an outer diameter of 118 mm and an inner diameter of 40 m, as shown in FIG.
It has a porous plate 14 having a thickness of 5 mm and a thickness of 5 mm, and a positioning pin 15 having an outer diameter of 15.0 mm and an eccentricity of 15 μm or less.

As shown in FIG. 2, a disc pressing member 16 is connected to the air cylinder 17 at the bonding portion 9, and is supported to be vertically movable. A porous plate 18 having an outer diameter of 118 mm, an inner diameter of 40 mm, and a thickness of 5 mm is attached to a lower portion of the pressing body 16, and an upper end of the positioning pin 15 is fitted to a center of the pressing body 16 and the porous plate 18. Fitting hole 1
9 are provided.

The porous plates 14 and 18 are obtained by sintering a powder having a predetermined particle size distribution of a metal such as aluminum or stainless steel or a ceramic such as alumina to obtain a porous body, and lapping both sides and chamfering the end faces. Do. Next, wash and dry, apply a thermosetting or photocuring resin or a resin with both properties to the disk contact surface by gas displacement method, etc., fully impregnate the resin, rotate at high speed and shake off excess resin Cured (crosslinked) by heat or light,
The cross-linked resin film 21 having a thickness of about 1 to 50 μm is formed on the surface.

As the resin used here, for example, urethane-modified, epoxy-modified or silicon-modified polyfunctional acrylate (diacrylate, triacrylate)
And the like.

FIG. 3 is a partially enlarged cross-sectional view of the porous plates 14 and 18, in which a resin 20 is impregnated at a predetermined depth and crosslinked, and the surface of the porous plates 14 and 18 is crosslinked. Membrane 2
1 is formed, and the impregnated and crosslinked resin 20 and the crosslinked resin film 21 are integrally connected via a three-dimensional porous structure.

FIG. 4 is a diagram showing a manufacturing flow of the optical disc according to the first specific example. Track pitch 0.34μ
m, a stamper on which read-only information is recorded in a pit row in a spiral at a channel pit pitch of 0.063 μm is attached to a substrate molding die, and the pit row is transferred to the surface by an injection molding method. Then, a disk substrate having a thickness of 1.1 mm is injection-molded (S1).
Examples of the resin for the substrate include polycarbonate and amorphous polyolefin.

A reflective film of aluminum is formed on the surface of the substrate on which the pit row has been transferred by sputtering (S2).
Next, the substrate is transferred to the disk substrate supply unit 1 of the bonding apparatus shown in FIG. 1 by a disk transport unit (not shown), and the substrate with the reflective film is not provided with a reflective film on the adhesive coating unit 2 by the transport arm. With its side facing down and a ring of viscosity 400 around the inner circumference 30 mm of the substrate surface.
An ultraviolet curable adhesive of mPa to 650 mPa is applied and moved to the spinner unit 3.

In the spinner unit 3, the spinner table is rotated from 3000 rpm to 4500 rpm,
Forming a 15 μm-thick UV-curable adhesive layer (S
3). Examples of the ultraviolet curable adhesive include SD-661 manufactured by Dainippon Ink and Chemicals, Z841 manufactured by JSR Corporation.
2. XNR5526AP manufactured by Nagase Chiba Co., Ltd. and the like.

The other substrate supply unit 1 is provided with a transparent cover substrate 22 having an outer diameter of 120 mm, an inner diameter of 15 mm, and a thickness of 0.09 mm (S4). The cover substrate 22 is made of a molded body of the same material as the above-mentioned substrate with a reflective film 23.

The cover substrate 22 is moved onto the disk support 13 waiting in the disk supply section 8 and the positioning pins 1 are moved.
5, the center hole of the cover substrate 22 is fitted so that the position of the cover substrate 22 on the disk support 13 is determined. Next, the turntable 12 is rotated to move the cover substrate 22 to the bonding section 9.

The substrate 23 on which the adhesive layer is formed is turned upside down by the reversing unit 4 so that the adhesive layer is turned down, and is placed on the conveyed cover substrate 22. And the center of the cover substrate 22.

The inside of the bonding portion 9 is surrounded by a casing 24, and the inside of the casing 24 is decompressed by a vacuum pump (not shown) connected via an exhaust pipe 25. The inside of the casing 24 is maintained at a reduced pressure of 1/100 or less of the atmospheric pressure by a vacuum pump, and a pressure of 100 KPa to 150 KPa is applied to the disc pressing body 17 by the air cylinder 17, and the disc pressing body 17 is lowered to position the positioning pin. 15 is inserted into the fitting hole 19, so that the disc support 13 and the disc pressing
Is maintained, the cover substrate 22 and the substrate 23 are pressed against the disk support 13 by the disk pressing member 17, and the cover substrate 22 and the substrate 23 are uniformly pressed and bonded (S5). In this specific example, the pressure is reduced during the bonding, but the bonding may be performed in the air without reducing the pressure.

The optical disk 26 bonded by the next ultraviolet irradiation unit 10 is turned over, and the integrated illuminance of 6 J
The adhesive is cured by irradiating ultraviolet rays of from 12 / m ² to 12 J / m ² (S6).

The disk 26 that has been bonded and cured is
Is transported from the disk removal unit 11 to the cover layer thickness / tilt / flaw inspection unit 6 for inspection (S7). As an inspection device, Dr. Those manufactured by Schenk, Basler and Tohyo at are used. The inspection yield was 95%, and the thickness variation of the cover layer including the cover substrate and the adhesive layer was ± 2 μm or less. Also, 10,0
Even after the continuous operation of 00 sheets, the flatness and parallelism of the disk support 13 and the disk pressing body 16 remained unchanged at 10 μm or less. The inspected disk 26 is integrated by the integration unit 7 (S8) and sent to the next step.

The bonding apparatus shown in FIG. 1 has two adhesive application units 2 and two spinner units 3 arranged side by side. In the case of the first specific example, a cover substrate 22 to which no adhesive is applied and an adhesive are used. To bond the substrate 23 with the reflective film to be applied, only one of the adhesive application unit 2 and the spinner unit 3 is used. In the second specific example, since the adhesive is applied to both substrates as described later, both the adhesive applying units 2 and 2a and the spinner unit 3 are used.
3a is used.

Next, a case where the present invention is applied to a DVD substrate according to the second specific example will be described. The schematic configuration of the bonding device is the same as that of FIG. A stamper having a track pitch of 0.74 μm and a channel pit pitch of 0.144 μm on which read-only information is pitlessly recorded in a spiral shape is mounted on a substrate molding die, and the outer diameter of the pit array is transferred to the surface by injection molding to 120 mm. Then, a disk substrate made of polycarbonate having an inner diameter of 15 mm and a thickness of 0.6 mm is formed.

An aluminum reflective film is formed on the surface of one of the disk substrates by a sputtering method.
3 is formed, and a gold translucent film is formed on the surface of the other disk substrate by a sputtering method, thereby producing a substrate 30 with a translucent film. Next, these disk substrates 23 and 30 are transported separately by a disk transport unit (not shown) to the disk substrate supply units 1 and 1a of the bonding apparatus, and the substrate 23 with the reflective film is turned upward by the transport arm. And placed on the adhesive application unit 2 and the substrate 3 with a translucent film.
No. 0 is placed on the adhesive application unit 2a with the translucent film side facing up.

Next, the inner circumference 3 of the reflective film surface and the translucent film surface
Viscosity from 1000 mPa to 1500 in an annular shape around 0 mm
An ultraviolet curable adhesive of mPa is applied and moved to the spinner units 3 and 3a. 60 spinner tables
Rotate from 00rpm to 7500rpm, thickness 28μ
m of an ultraviolet-curable adhesive layer. As the ultraviolet curable adhesive, for example, LC-2101 made by Sumitomo 3M Ltd., which is a urethane acrylate resin, is used.

The substrate 23 with the reflection film is bonded to the bonding portion 9
Is placed on the disk support 13 which is waiting at step (1), and is positioned by the positioning pins 15. Next, the substrate 30 with a translucent film is turned over by the reversing unit 4 and held on the disk pressing body 16 with the adhesive applied surface facing down, and is opposed directly above the substrate 23 with the reflection film. This state is slightly different from the state shown in FIG. Then, the inside of the casing 24 of the bonding section 9 is evacuated to a pressure of 1/100 or less of the atmospheric pressure by a vacuum pump, and a pressure of 100 KPa to 150 KPa is applied to the disc pressing body 16 by the air cylinder 17 to form The substrate 30 with a translucent film is attached.

The laminated optical disk 26 is irradiated with an integrated illuminance of 2
The adhesive is cured by irradiating ultraviolet rays of J / m ² to 3 J / m ² . After the lamination and curing are completed, the optical disk 26 is covered with the cover layer thickness, tilt,
It is transferred to the flaw inspection unit 6 and inspected.

As a result of the inspection, the yield was 95% and the variation in the thickness of the adhesive layer was ± 5 μm or less. Also, 10,
Even after the continuous operation of 000 sheets, the flatness and parallelism of the disk support 13 and the disk pressing body 17 remained unchanged at 10 μm or less.

FIG. 5 is a partially enlarged sectional view of the optical disk obtained by the first specific example. As shown in the figure, a substrate 23 having an aluminum reflective film 27 and a transparent cover substrate 22 are bonded together with an ultraviolet-curable adhesive layer 28, and the cover substrate 22 is on the light incident side.

FIG. 6 is a partially enlarged sectional view of the optical disk obtained by the second embodiment. As shown in the figure, a substrate 23 having an aluminum reflective film 27 and a substrate 30 having a gold translucent film 29 are bonded together by an ultraviolet-curable adhesive layer 28, and a substrate 30 having a translucent film is provided.
Is the light incident side.

In the above embodiment, the example in which the substrates of the optical disks are bonded to each other has been described. However, the present invention is not limited to this. For example, the present invention is applicable to bonding other members and components such as a composite lens and a composite glass plate. Is also applicable.

In the above-described embodiment, the case where two (two) members to be bonded are bonded is described. However, the present invention is not limited to this, and three (three) or more members to be bonded are bonded. The present invention is also applicable to a case where members are bonded.

[0040]

As described above, according to the present invention, at least one of a support member and a pressing member which opposes two or more members to be bonded to each other with an adhesive therebetween. Since the porous layer has a porous layer, and the resin is impregnated and crosslinked in the porous layer, and the crosslinked resin film is formed on the surface of the porous layer, the pressing force can be evenly transmitted to the member to be bonded. And a cushioning function for preventing damage to the members to be bonded and durability as a buffer layer, thereby enabling bonding with high uniformity.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a bonding portion in a first specific example of the bonding device.

FIG. 3 is an enlarged sectional view of a main part of a disk support and a disk pressing body used in the bonding apparatus.

FIG. 4 is a diagram showing a manufacturing flow of the optical disc according to the first specific example.

FIG. 5 is a partially enlarged cross-sectional view of the optical disc manufactured in the first specific example.

FIG. 6 is a partially enlarged cross-sectional view of the optical disc manufactured in the second specific example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 disk substrate supply unit 2 adhesive application unit 3 spinner unit 4 reversing unit 5 bonding unit 8 disk supply unit 9 bonding unit 10 ultraviolet irradiation unit 12 turntable 13 disk support 14, 18 porous plate 15 positioning pin 16 disk Pressing body 17 Air cylinder 20 Resin 21 Cross-linked resin film 22 Cover substrate 23 Substrate with reflective film 24 Casing 25 Exhaust pipe 26 Optical disk 27 Reflective film 28 Adhesive layer 29 Translucent film 30 Substrate with translucent film

 ──────────────────────────────────────────────────続 き Continued on front page F-term (reference) 4F211 AA03 AA28 AD08 AH73 AH74 AH79 AJ01 AJ02 AJ03 AJ06 AJ10 AM28 TA03 TC02 TD11 TH01 TJ13 TJ14 TJ23 TN45 TN60 TN67 TQ04 TQ07 4J040 PA33 PA35 PB09 PB FF11A01A

Claims (6)

[Claims] 1. A bonding apparatus for bonding two or more members to be bonded by pressing two or more members to be bonded between a support and a pressing body via an adhesive, wherein A porous layer is provided on at least one of the sides facing the member to be bonded, wherein the porous layer is impregnated with a resin and crosslinked, and a crosslinked resin film is formed on the surface of the porous layer. Bonding device. 2. The bonding apparatus according to claim 1, wherein said porous layer is made of metal or ceramic. 3. The bonding apparatus according to claim 1, wherein the resin film impregnated in the porous layer and formed on the surface of the porous layer is an acrylate-based resin. 4. The bonding apparatus according to claim 1, further comprising a pressure reducing means for maintaining an atmosphere for bonding the members to be bonded with an adhesive under reduced pressure. 5. A porous layer on a side of at least one of a support and a pressing body facing a member to be bonded,
The porous layer is impregnated with a resin and cross-linked to form a cross-linked resin film on the surface of the porous layer. Using the support and the pressing body, two or more bonded members are bonded via an adhesive. A bonding method, wherein a member to be bonded is bonded by pressing between a support and a pressing body. 6. The bonding method according to claim 5, wherein when the members to be bonded are bonded by pressing with the pressing body, the bonding is performed under reduced pressure.