JP2004220725A - Device for laminating and method for laminating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminating device in which flatness for a surface of a laminated material is ensured. <P>SOLUTION: In the laminating device, which glues laminated materials 1, 2 together by pressing two or more laminated materials 1, 2 between a holding unit 113 and a pressing unit 116 via adhesive 16, a gluing method with excellence in the flatness is realized in which porous plates 9, 10 on the side facing the laminated materials 1, 2 at least on either of the holding unit 113 or the pressing 116 are arranged, the laminated materials are sucked on the porous plates 9, 10 in a negative-pressure state generated by a decompressing means, and laminated with a warp corrected. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus and a method for bonding members to be bonded such as an optical information recording disk substrate, a large-capacity hologram memory substrate, a composite optical lens, and a composite glass plate.
[0002]
[Prior art]
As disclosed in Japanese Patent Publication No. Hei 4-53012 and Japanese Patent No. 2742524, an ultraviolet curable adhesive is applied concentrically on the signal surface of an optical disk substrate, and the other optical disk substrate or dummy substrate is placed thereon. A method of filling an adhesive between the substrates while rotating the two substrates at a high speed and curing the adhesive by irradiating ultraviolet rays is known, and is generally used for DVD video disks.
[0003]
Separately from this method, a relatively high-viscosity UV-curable adhesive is applied to an optical disk substrate, and the applied thickness is stabilized by high-speed rotation. As described in JP-A-8-203125 and JP-A-8-306077, and a method of pressing and bonding using a pressure-sensitive adhesive sheet having a constant thickness is also used. .
[0004]
In the step of bonding the disk substrates by pressing as described above, since the surface in contact with the disk substrate is flat, the disk substrate moves in the direction in which the warpage is corrected during bonding, and slides with the pressing body or the support. The movement causes scratches on the disk substrate. For this reason, as disclosed in JP-A-1-303649, a buffer layer having low rigidity is provided on the side of the pressing body or the support which faces the disk substrate.
[0005]
Apart from the conventional optical disk, a large-capacity hologram memory has been proposed in which recording is performed at an interference point in a thickness direction of a recording layer by using interference between a recording light and a reference light, and information recorded at the interference point is read by the reference light. ing.
[0006]
In the case of a large-capacity hologram memory, if the disk substrate is supported only by the inner and outer peripheries of the substrate as disclosed in Japanese Patent No. 21221870, the rigidity of the substrate is insufficient and the flatness required for the hologram memory can be obtained. However, even when only the inner and outer peripheries are adsorbed and held on a flat support member, stress is generated in the adsorbed portion, flatness is deteriorated in the vicinity thereof, and data information recorded as a hologram memory cannot be read. On the other hand, if the substrate is not held, unevenness in thickness due to curing shrinkage of the adhesive layer occurs, resulting in insufficient parallelism between the substrates.
[Patent Document 1]
JP-A-8-203125 [Patent Document 2]
JP-A-8-306077 [Patent Document 3]
JP-A-1-303649
[Problems to be solved by the invention]
If the hologram memory substrate is held by a flat hard support such as metal or ceramic, the substrate surface is likely to be scratched due to displacement due to slippage of the substrate when the substrate is pressed, and it is sufficient to hold the substrate with a soft support such as plastic. Flatness cannot be obtained.
[0008]
In addition, as disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 1-303649, when a low-rigidity buffer layer support material such as a rubber-based sheet or a nonwoven fabric is provided and a substrate is received and bonded, there is flexibility. Although it has excellent buffering properties, the large-capacity hologram memory has the disadvantage that the unevenness of the buffer layer affects the unevenness of the bonded substrate surface as described above, making it impossible to read data information recorded as a hologram memory. I have.
[0009]
SUMMARY OF THE INVENTION An object of the present invention is to solve the conventional drawbacks described above, to ensure the flatness of the surface of the substrate as the member to be bonded and the buffering property for the member to be bonded, and to provide a bonding device and a bonding device having excellent durability. It is to provide a matching method.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the present invention relates to a method in which a member to be bonded, such as two hologram recording substrates, is bonded to a support via an adhesive constituting a polymer matrix containing a refractive index modulation type hologram recording material. In a bonding apparatus that adsorbs and holds each of the pressing members and presses between them to bond the member to be bonded, at least one of the support or the pressing member is provided with a metal on a side facing the member to be bonded. And a porous layer made of ceramics and ceramics, and uniformly holding the substrate by a pressure reducing means connected to the porous body, thereby preventing scratches due to slippage of the members to be bonded and providing flatness even after bonding. A hologram memory is provided.
[0011]
In the present invention, at least one of the support and the pressing body has a porous body on the side facing the member to be bonded, and the member to be bonded is suctioned and held by the support and the pressing body, respectively. It is possible to suppress scratches caused by the member to be bonded moving on the surface of the support or the pressing body and to ensure excellent flatness. Further, a resin buffer film is formed on the surface of the porous body by resin coating, plasma polymerization, sputtering of a fluorine-containing resin, or a diamond-like carbon (DLC) protective film is formed by CVD (chemical vapor deposition) of a hydrocarbon gas. After that, by forming the fine holes penetrating the porous body, the buffering property is improved, the warpage of the members to be bonded can be suppressed, and the decrease in the yield due to scratches can be prevented. Also, by adsorbing and holding the optical disk substrate or the hologram memory substrate on the surface of the support or the pressing body, the undulation of the members to be bonded is corrected, and the substrate surface flatness after bonding and the two The parallelism between the substrates is also good.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram of a bonding device according to an embodiment, and FIG. 2 is a cross-sectional view of a bonding portion in a first specific example of the bonding device.
[0013]
As shown in FIG. 1, the bonding apparatus includes a supply unit 101 for a member to be bonded (substrate 1), a coating unit 102 for an adhesive 16, a low-speed rotation unit 103, a reversing unit 104, a bonding unit 105, an inspection unit 106, It is mainly composed of a bonded disk integrated unit 107.
[0014]
The bonding unit 105 includes a substrate supply unit 108, a bonding unit 109, an ultraviolet irradiation unit 110, and a bonding disk extracting unit 111. These stations are arranged from the center of rotation of a rotary table 112 as shown in FIG. It is provided at each distance position.
[0015]
On the rotary table 112, six substrate supports 113 are attached at equal intervals in the circumferential direction at the same intervals as the substrate supply unit 108 and the bonding unit 109 (the ultraviolet irradiation unit 110 and the bonding disk removal unit 11). . As shown in FIG. 2, the substrate supporting portion 113 is attached to a porous plate 10 having an outer diameter of 128 mm, an inner diameter of 18 mm, and a thickness of 20 mm, and an outer diameter divided into three portions of 15.0 mm and an eccentricity of 15 μm or less. The positioning pin 8 is provided.
[0016]
In the bonding section 109 shown in FIG. 1, a substrate pressing body 116 is connected to an air cylinder 117 so as to face the substrate supporting section 113 and is supported so as to be able to move up and down. A porous plate 9 having an outer diameter of 128 mm, an inner diameter of 18 mm, and a thickness of 20 mm is attached to the lower part of the pressing body 116, and the upper part of the positioning pin 7 is fitted to the center of the pressing body 116 and the porous plate 118. A fitting hole is provided.
[0017]
The porous plates 9 and 10 are formed by vacuum sintering a powder having a predetermined particle size distribution of a metal such as aluminum or stainless steel or a ceramic such as alumina to obtain a porous body, lapping both sides and chamfering end faces, Washed and dried. Alternatively, a resin 120 having thermosetting or photocuring properties or both properties is applied to the disk contact surface by a gas replacement method, a spin coating method, or the like, and the porous body surface layer is impregnated with the resin. Excess resin may be shaken off, cured (crosslinked) by heat or light, and a crosslinked resin thin film 121 having a thickness of about 1 to 50 μm may be formed as a buffer layer on the surface.
[0018]
Examples of the resin used here include urethane-modified, epoxy-modified or silicon-modified polyfunctional acrylates (diacrylate, triacrylate). Instead of coating with a cross-linkable acrylate resin, coating using vacuum thin film technology such as sputtering of fluorine-containing resin or an organic thin film such as a plasma polymerized film or a diamond-like carbon thin film by a chemical vapor deposition method may be used.
[0019]
In the case of a porous plate having a buffer layer formed on the surface, a resin is impregnated into the porous plate at a predetermined depth and crosslinked, and a crosslinked resin film 121 is formed on the surface of the porous plates 9 and 10 and impregnated. The crosslinked resin 120 and the crosslinked resin film 121 are integrally connected via a three-dimensional porous structure. After the resin is cured, the surface of the porous plates 9 and 10 is irradiated with a high-power laser to form a plurality of fine through-holes, and the back surfaces of the porous plates 9 and 10 are connected via connecting portions 11 and 12 to a vacuum pump or the like. Connected to decompression means.
[0020]
Hereinafter, a manufacturing flow of the hologram memory according to the first specific example will be described.
A stamper having servo patterns recorded concentrically provided at intervals of about 2 mm was attached to a substrate molding die, and the servo patterns were transferred to the surface by an injection molding method. The outer diameter was 130 mm, the inner diameter was 15 mm, and the thickness was 1.0 mm. Is injection molded (step 1). Examples of the substrate resin include norbornene-based amorphous polyolefin.
[0021]
An anti-reflection film is formed by sputtering on the surface of the substrate (member 2 to be bonded) onto which the servo pattern has been transferred (Step 2). Next, the substrate 2 is transferred by a substrate transfer unit (not shown) to the disk substrate supply unit 1 of the bonding apparatus shown in FIG. Placed with the attached side down, containing UV curable resin used for a refractive index modulation hologram memory with a viscosity of 10,000 mPa · s to 20,000 mPa · s from the inner circumference of about 20 mm to the outside of the substrate surface, An adhesive obtained by mixing a two-component curable adhesive that becomes a polymer matrix of the mold resin is applied, and the mixture is moved to the low-speed rotation unit 103.
[0022]
In the low-speed rotation unit 103, the rotary table is rotated at a low speed of 10 rpm to 300 rpm to spread evenly on the entire back surface of the substrate 2 with the anti-reflection film (step 3), and the substrate support 113 (FIG. (Lower block), and placed so that the center hole of the anti-reflection servo substrate 2 is fitted to the positioning pin 8.
[0023]
In the other substrate supply unit 1, a transparent cover substrate 1 (member to be bonded) having an outer diameter of 130 mm, an inner diameter of 15 mm, and a thickness of 1.0 mm is arranged (Step 4). The cover substrate 1 is made of a molded body of the same material as the above-mentioned substrate 2 having an antireflection film.
[0024]
The cover substrate 1 that has been subjected to the anti-reflection treatment in the same manner as the servo substrate 2 is inverted by the reversing unit 104 and transferred to the disc pressing body 116 (upper block in FIG. ·Hold.
[0025]
The cover substrate 1 is disposed on the servo substrate 2 on which the adhesive layer has been moved to the bonding section 109, and the center of the servo substrate 2 and the cover substrate 1 are aligned via the positioning pins 7.
[0026]
A cylinder electrically controlled by the bonding unit 109 applies a pressure of 100 KPa to 150 KPa to the substrate disk pressing body 116 to lower the substrate disk pressing body 116, and a positioning pin provided for alignment with the substrate disk support 113. By fitting the upper end into the fitting hole, the relative positional relationship between the substrate disk support 113 and the substrate disk pressing body 116 is maintained, and the substrate is gradually lowered in accordance with the curing shrinkage of the adhesive. The servo substrate 2 and the cover substrate 1 are pressed against the substrate disk support 113 by the substrate disk pressing body 116, and the servo substrate 2 and the cover substrate 1 are uniformly pressed and bonded (step 5). Here, the reference plane provided on the substrate disk pressing body 116 is measured with a laser length measuring device, and the position of each point is fed back to keep the distance between the two substrates 1 and 2 constant, so that the distance is 5 μm or less. Is obtained. The distance from the substrate disk support 113 is based on a state in which the pressure detected by a pressure sensor of a motor-controlled cylinder is the same, using optically polished reference glass having a thickness of 3 mm with parallelism and flatness of 5 μm or less. Adjust as a point.
In this specific example, the bonding is performed in the air, but the bonding may be performed by placing the adhesive layer 16 surrounded by the two substrates 1 and 2 under reduced pressure. (Fig. 3)
[0027]
The disk 126 that has been bonded and cured is transferred from the bonded disk take-out unit 111 to the inspection unit 106 and inspected for flatness, parallelism, surface flaws, and the like of the substrate (Step 7).
[0028]
The inspected disks 126 are accumulated in a disk magazine by the accumulation unit 107 (step 8), sent to the next step, and mounted on a cartridge.
[0029]
The bonding apparatus shown in FIG. 1 has two adhesive application units 102 and two low-speed rotation units 103 arranged side by side. In the case of the first specific example, a cover substrate 1 on which no adhesive is applied and an adhesive are applied. To bond the servo substrate 2, only one adhesive application unit 102 and the low-speed rotation unit 103 are used. However, since the adhesive is applied to both substrates, both the adhesive application units 102 and 102 a are used. Spinner units 103 and 103a may be used.
Alternatively, the servo substrate 2 and the cover substrate 1 may be reversed, and an adhesive may be applied to the cover substrate.
[0030]
Next, a case where the present invention is applied to a DVD substrate according to the second specific example will be described. The schematic configuration of the bonding apparatus is almost the same as that of FIG. A stamper having a track pitch of 0.74 μm and a channel pit pitch of 0.144 μm in which read-only information is recorded in a pit row in a spiral manner is mounted on a substrate molding die, and the outer diameter of the pit row transferred to the surface by injection molding. A disc substrate made of polycarbonate having a size of 120 mm, an inner diameter of 15 mm, and a thickness of 0.6 mm is formed.
[0031]
An aluminum reflective film is formed on the surface of one disk substrate by a sputtering method to produce a substrate 130 with a reflective film, and a gold translucent film is formed on the surface of the other disk substrate by a sputtering method. 131 is manufactured. Next, these disk substrates 130 and 131 are separated and transported to disk substrate supply units 101 and 101a of a bonding apparatus by a disk transport unit (not shown), and the reflective film-attached substrate 123 is turned upward by the transport arm. And put on the adhesive application unit 102.
[0032]
Next, an ultraviolet curable adhesive having a viscosity of 500 mPa · s to 700 mPa · s is applied in an annular shape around the inner circumference 30 mm of the reflective film surface of the reflective film-coated substrate 130, and moved to the spinner unit 103. The substrate 131 with the translucent film is turned over on the substrate 130 with the reflective film via an adhesive so that the translucent films are opposed to each other, and the spinner table is rotated at 2,000 to 3,000 rpm to obtain a thickness of 45 μm. An ultraviolet curable adhesive layer 128 having a thickness of about 55 μm is formed. As the ultraviolet curable adhesive, for example, SD-698 manufactured by Dainippon Ink Industries, DVD-0893 manufactured by Nippon Kayaku, Z8412H manufactured by JSR, or the like is used.
[0033]
The disc 126 on which the reflective film-attached substrate 130 and the translucent film-attached substrate 131 are stacked is placed on the disk support 113 waiting at the bonding section 109 with an adhesive, and the positioning pins 115 are used. After positioning, suck and hold. Next, the disk 126 is lightly pressed by the disk pressing body 116 to correct the disk warpage.
[0034]
The optical disc 126 by bonding the accumulated illuminance 2J / ^{m 2} from a translucent film-coated substrate 131 side in the ultraviolet irradiation unit 110 is irradiated with ultraviolet light of 3J / ^{m 2,} curing the adhesive 128. The optical disk 126 that has been bonded and cured is transferred from the disk take-out unit 111 to the cover layer thickness / tilt / flaw inspection unit 106 for inspection.
[0035]
As a result of the inspection, the yield was 95%, and the variation in the thickness of the adhesive layer was ± 5 μm or less. Further, even after the continuous operation of 10,000 sheets, the flatness of the disk support 113 was not changed at 5 μm or less.
[0036]
FIG. 4 is a partially enlarged sectional view of the large-capacity hologram memory obtained by the first specific example. As shown in the figure, a substrate 2 having a servo pattern and a cover substrate 1 are bonded together by an adhesive layer 16 serving as a recording layer of a refractive index modulation type hologram memory, and the cover substrate 1 is on the light incident side. .
[0037]
Although the embodiment has been described with respect to an example in which optical information recording substrates are bonded together, the present invention is not limited to this. For example, other members such as a composite lens or a composite glass plate may be bonded to components. Applicable.
[0038]
In the above embodiment, the case where two (two) members to be bonded are bonded is described, but the present invention is not limited to this, and three (three) or more members to be bonded are bonded. It is also applicable when matching.
[0039]
【The invention's effect】
As described above, the present invention provides a porous body on at least one of a support body and a pressing body, which opposes the member to be bonded, of two or more members to be bonded to each other with an adhesive interposed therebetween. And the flatness and rigidity for transmitting the pressing force evenly to the bonded member because the bonded member is in close contact with the porous body that has been under negative pressure in a reduced pressure state. It has a buffer function for preventing damage to the bonding member, and enables bonding with high uniformity. Further, by forming a thin buffer layer on the surface of the porous body and providing fine holes penetrating the multi-hard body connected to the decompression means, the surface in contact with the bonding member is flat, and the bonding member By adsorbing and holding, the bonding members can be bonded in a state where the warpage of the bonding members has been corrected, and a bonding method having a flat substrate surface with excellent buffering properties can be provided.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a bonding device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a bonding portion in a first specific example of the bonding device.
FIG. 3 is an enlarged cross-sectional view of a main part of a disk support and a disk pressing body in the case of vacuum bonding.
FIG. 4 is a partially enlarged cross-sectional view of the disk manufactured in the first specific example.
[Explanation of symbols]
1, 2 bonded members (substrate)
3, 4 Porous plate holding block 5, 6 Suction housing 7, 8 Positioning pin 9, 10 Porous plate 11, 12 Connection part to pressure reducing means (for negative pressure suction of substrate)
13, 14 Connecting part to decompression means (for decompression of adhesive layer)
15 Vacuum chamber partition 16 Adhesive containing hologram recording material 101 Disk substrate supply unit 102 Adhesive application unit 103 Spinner unit 104 Inversion unit 105 Bonding unit 108 Disk supply unit 109 Bonding unit 110 Ultraviolet irradiation unit 112 Rotary table 113 Disk support 116 Disc pressing body 117 Cylinder 120 Resin 121 Crosslinked resin film 126 Optical disc 127 Reflective film 128 Adhesive layer 129 Translucent film 130 Substrate with translucent film

Claims (6)

In a bonding apparatus that presses two or more members to be bonded between a support and a pressing member via an adhesive to bond the members to be bonded, the bonding device may be configured to include at least one of the support and the pressing member. A flat porous body is provided on the side facing the member to be bonded, and the back surface of the porous body includes a decompression unit for adsorbing the entire member to be bonded by negative pressure, or is connected to the decompression unit, And a means for controlling a distance between the support and the pressing body, and performing bonding by moving at least one of the support and the pressing body while holding the members to be bonded in parallel. A bonding device characterized by the above-mentioned. The bonding apparatus according to claim 1, wherein the porous body is made of metal or ceramic. 3. The bonding apparatus according to claim 2, wherein the porous body is impregnated and a crosslinked resin film is formed on the surface of the porous body, or the surface of the porous body is subjected to plasma polymerization or sputtering. A bonding layer, wherein a buffer layer is formed on the porous body, and fine holes are formed through the porous body. A method for bonding two bonded members with an adhesive using the bonding device according to claim 1, further comprising: a unit configured to measure a distance between the support and the pressing body at a plurality of points. A bonding apparatus characterized in that the pressing body spacing control means is controlled in such a manner that the spacing between the support and the pressing body is kept constant in conjunction with the measurement result. 5. A bonding method using the bonding apparatus according to claim 4, wherein the parallelism between the surfaces of the members to be bonded when the members to be bonded to each other by pressing are bonded is maintained at 5 μm or less. A bonding method characterized in that: A method for bonding two bonded members with an adhesive using the bonding device according to claim 1, wherein the bonded member is held in a state where the porous member is negatively attracted to the porous body, A cylindrical member is provided between the support and the pressing body for reducing the pressure of the member to be bonded and the adhesive, and the bonding is performed after the member to be bonded and the adhesive therebetween are maintained in a reduced pressure state. Bonding method characterized by performing.

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