WO2008038414A1 - Procédé et appareil de liaison - Google Patents

Procédé et appareil de liaison Download PDF

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Publication number
WO2008038414A1
WO2008038414A1 PCT/JP2007/001025 JP2007001025W WO2008038414A1 WO 2008038414 A1 WO2008038414 A1 WO 2008038414A1 JP 2007001025 W JP2007001025 W JP 2007001025W WO 2008038414 A1 WO2008038414 A1 WO 2008038414A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
adhesive
bonding
irradiation
electromagnetic waves
Prior art date
Application number
PCT/JP2007/001025
Other languages
English (en)
Japanese (ja)
Inventor
Haruka Narita
Hisashi Nishigaki
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Publication of WO2008038414A1 publication Critical patent/WO2008038414A1/fr

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/266—Sputtering or spin-coating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1448—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
    • B29C65/7811—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7879—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path
    • B29C65/7882—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path said parts to be joined moving in a circular path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00145—Vacuum, e.g. partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/342—Preventing air-inclusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
    • B29C66/91643—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
    • B29C66/91645—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1412—Infrared [IR] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1606—Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00141—Protective gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

Definitions

  • the present invention relates to, for example, a bonding method in which application of an adhesive before bonding to a substrate is improved in order to produce a recording medium in which a pair of substrates are bonded via an adhesive. It relates to the bonding device.
  • optically readable recording media such as optical discs and magneto-optical discs are widely used in various standards such as playback-only recording media and rewritable recorded information.
  • an optical disc such as a DVD is basically manufactured by providing an information recording area on one or both of two substrates and bonding them with an adhesive.
  • the adhesive layer for bonding is required to have very high accuracy in thickness in order to accurately read and write with a laser beam.
  • FIG. 7 (A) An example of a manufacturing procedure for such a bonded disk will be described with reference to FIG.
  • two polycarbonate substrates P are injection molded in advance, and a metal film (recording film) for laser reflection is formed by sputtering in a sputtering chamber.
  • an ultraviolet curable adhesive is applied to the bonding surface of the two substrates P, and the adhesive is spread by spin coating.
  • a thin film is formed on the substrate P by applying an adhesive agent around the center of the substrate P using the coating device K and then spinning the substrate P at a high speed. However, it will disperse excess adhesive.
  • the pair of substrates P on which the adhesive layer R is formed in this way is such that one of the center pins G is in a state where the adhesive layers R face each other in parallel. It is held by the chuck E and introduced into the lower part of the vacuum chamber C while the other is placed on a mounting surface F such as a turntable. And As shown in FIG. 7 (C), the vacuum chamber C is lowered and sealed to form a pressure reducing chamber S. By exhausting from the pressure reducing chamber S by the exhaust device, the pressure around the substrate P is changed. From atmospheric pressure to vacuum.
  • the chuck E holding one substrate P closes and the substrate P falls, and at the same time, the pressing part is lowered and pressed by a driving source such as a cylinder, so that the other Affixed to the substrate P.
  • a driving source such as a cylinder
  • the atmosphere around the bonded substrate P is returned to atmospheric pressure by introducing air, or after returning to atmospheric pressure, the atmospheric pressure is restored.
  • the bubbles remaining in the adhesive layer R are gradually compressed by the differential pressure from the vacuum.
  • the substrate P that has been left in the atmosphere for several seconds to several tens of seconds is irradiated with ultraviolet light by the light source U as shown in FIG. Is cured. As a result, the two substrates P are firmly bonded to complete the disc.
  • the adhesive when the adhesive is applied by spin coating as described above, the adhesive on the rotating substrate spreads by centrifugal force. For this reason, the film thickness of the outer peripheral part becomes thicker (for example, about) with respect to the inner peripheral part of the substrate, and it is difficult to make the film thickness uniform over the entire substrate.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2002_31 91 92
  • Patent Document 2 International Publication No. 2005/1 1 81 59
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2006_48855
  • Fig. 8 shows the results of measuring the average rate of change in the circumference of each case when the sample was not left after bonding and when it was left (20 s). According to Fig. 8, it can be seen that if left unattended, the fluctuation in the circumference deteriorates overall and the fluctuation in the outer circumference is large. [0014] Furthermore, when applying by spin coating, as described above, excess adhesive is scattered. The scattered adhesive is collected and reused.
  • the scattered adhesive when the entire surface is irradiated with ultraviolet rays during rotation, the scattered adhesive includes an adhesive that has been cured by being irradiated with ultraviolet rays. Thus, for reuse, it is necessary to separate the cured adhesive from the uncured adhesive, which is very difficult.
  • the present invention has been proposed to solve the above-described problems of the prior art, and its purpose is to suppress bubbles while ensuring the uniformity of the adhesive layer during coating. Furthermore, it is providing the bonding method and the bonding apparatus which can suppress the fluctuation
  • the present invention provides a bonding method in which the first substrate and the second substrate are bonded to each other via an adhesive that is cured by irradiation of electromagnetic waves.
  • An adhesive is applied to at least one surface of the first substrate and the second substrate, the applied adhesive is irradiated with electromagnetic waves in the atmosphere, and the first substrate and the second substrate are bonded to each other. Bonding and irradiating the adhesive between the first substrate and the second substrate with electromagnetic waves.
  • the first substrate and the second substrate An application part that applies an adhesive to at least one surface of the substrate of 2; a pre-irradiation part that irradiates electromagnetic waves in the atmosphere to the adhesive after application; the first substrate; and the second substrate; And a post-irradiation unit that irradiates an electromagnetic wave to the adhesive between the first substrate and the second substrate.
  • the adhesive is irradiated with electromagnetic waves in the air, so that the adhesive is temporarily cured and the adhesive force is maintained. Flow is prevented and fluctuations in the circumference can be suppressed. In addition, the temporary curing suppresses the generation of outgas and reduces the residual bubbles. [0019] Another aspect is the bonding method in which the first substrate and the second substrate are bonded via an adhesive that is cured by irradiation of electromagnetic waves.
  • the first substrate and the second substrate Apply an adhesive to at least one side of the substrate in 2 and irradiate part of the adhesive after application with electromagnetic waves, and apply the adhesive once more on the adhesive after application, Irradiate an electromagnetic wave to the adhesive after being applied in layers, bond the first substrate and the second substrate, and apply an electromagnetic wave to the adhesive between the first substrate and the second substrate. It is characterized by irradiating.
  • Another aspect is a bonding apparatus that bonds the first substrate and the second substrate via an adhesive that is cured by irradiation of electromagnetic waves, wherein the first substrate and the first substrate 1st irradiation which irradiates an electromagnetic wave to a part of adhesive agent in any one of the application part which applies an adhesive multiple times to at least one side of 2 substrates, and multiple times of application by the application part
  • a second irradiation unit that irradiates an electromagnetic wave to the adhesive after being applied a plurality of times by the application unit, a bonding unit that bonds the first substrate and the second substrate, and the first
  • the adhesive between the substrate and the second substrate has a third irradiating part for irradiating electromagnetic waves.
  • the application unit is a spin coater
  • the first irradiation unit is an irradiation device that irradiates an adhesive with electromagnetic waves in spots around a rotation center. It is characterized by.
  • the thickness can be easily adjusted, and by irradiating an electromagnetic wave around the rotation center, the adhesive on the outer peripheral side can be obtained. Reduces flow and enables uniform overcoating
  • the uniformity of the adhesive layer at the time of application is ensured.
  • FIG. 1 is an explanatory view showing the configuration of the first embodiment of the bonding apparatus of the present invention.
  • FIG. 2 is a flowchart showing a processing procedure of the embodiment of FIG.
  • FIG. 3 is a simplified longitudinal sectional view showing a spin coater in a second embodiment of the bonding apparatus of the present invention.
  • FIG. 4 is a flowchart showing a processing procedure of the embodiment of FIG.
  • FIG. 5 is an explanatory view showing an inner circumference distribution of an adhesive layer thickness of an example and a conventional example manufactured according to the embodiment of the present invention.
  • FIG. 6 is an explanatory view showing an embodiment when two pre-irradiation units are installed in the bonding apparatus of the present invention.
  • FIG. 7 An explanatory diagram showing the conventional procedure for bonding substrates, (A) spreads adhesive, (B) introduces into vacuum chamber, (C) bonds, (D) opens to atmosphere , (E) indicate the adhesive curing process.
  • FIG. 8 is an explanatory diagram showing the distribution in the circumference of the adhesive layer thickness of a disc manufactured by the conventional technology.
  • the adhesive is applied to a pair of substrates, the adhesive is temporarily cured, and then bonded, thereby suppressing the variation in the circumference of the adhesive.
  • This device constitutes a part of the disk manufacturing device.
  • the substrate forming device and the metal film forming device disposed in the upstream process of this device, and the mechanism for transferring the substrate between the devices. Since any known technology can be applied, etc., the explanation is omitted.
  • This apparatus has a first irradiation unit 4, a pasting unit 5, a rear irradiation unit 6 and the like configured in a first spin coating apparatus 1, a second spin coating apparatus 2, and a turntable 3. ing.
  • the first spin coating apparatus 1 is an apparatus that applies an ultraviolet curable adhesive B 1 to one substrate P 1 to be bonded by spin coating.
  • the first spin coat apparatus 1 includes a turntable 1 1 for placing a substrate P 1 and a drive source 1 2 for rotating the turntable 1 1, and is dropped from an adhesive supply unit (not shown). This is a device that spreads the adhesive B 1 by rotating the substrate P 1.
  • the second spin coater 2 is a device that applies an ultraviolet curable adhesive to the other substrate P 2 to be bonded by spin coating.
  • the second spin coater 2 is a turntable on which the substrate P 2 is placed.
  • the turntable 3 is turned upside down so that the bonding surface faces the turntable 3 by a first turning position 31 corresponding to the front irradiation unit 4 and a turning device (not shown) where the substrate P1 is put.
  • 2nd loading position 3 2 for loading the substrate P 2 bonding position 3 3 corresponding to the bonding section 5, UV irradiation position 3 4 corresponding to the post-irradiation section 6, and the completed disk D are carried out to the next process It has an unloading position 35.
  • the turntable 3 is configured to rotate intermittently according to each position as described above by a drive mechanism (not shown).
  • the pre-irradiation unit 4 is a device that irradiates the adhesive B 1 applied to the substrate P 1 with ultraviolet rays in the atmosphere and temporarily cures it with a UV irradiation device.
  • the term “in the atmosphere” as used in the claims and embodiments means a curing-inhibiting environment such as an oxygen-containing gas atmosphere. In general, it is easy to be in the atmosphere, but it may be any environment that contains oxygen or inhibits other curing.
  • the bonding unit 5 is a device that bonds the substrates P 1 and P 2 in a vacuum.
  • the bonding unit 5 has a vacuum chamber that is operated by an elevating mechanism, a vacuum source that depressurizes the inside of the vacuum chamber, a pressing unit that is operated by the elevating mechanism and presses the substrates P 1 and P 2, and the like. Since it is a well-known technique, the description is omitted.
  • the post-irradiation unit 6 irradiates the bonded substrates P 1 and P 2 with ultraviolet rays in a vacuum using a UV irradiation device to completely remove the adhesives B 1 and B 2 between the substrates p 1 and P 2. It is a device for curing.
  • the post-irradiation unit 6 also has a vacuum chamber that is operated by an elevating mechanism, a vacuum source that depressurizes the inside of the vacuum chamber, and the like.
  • the irradiation in vacuum is performed to eliminate the cause of curing inhibition such as oxygen, but it is not always necessary to have an oxygen-free environment. This is because the bonded contact surfaces of the substrates P 1 and P 2 after bonding are almost integrated, and are cured regardless of the atmosphere. When pasting in the atmosphere, the outer peripheral edge is in contact with the atmosphere. However, this part will be fully cured in storage time (several days) on the production line. If irradiation is performed in a vacuum as described above, there is an advantage that even the outer peripheral end face can be cured more reliably. The same effect can be obtained by eliminating (purging) oxygen with an inert gas (N 2 ).
  • the amount of adhesive supplied from the adhesive supply unit, the rotation and speed of the turntable, the light emission of the irradiation device, the operation of the heating device, the elevating mechanism, and the vacuum source are controlled by the control device.
  • This control device can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. Therefore, a computer program for controlling the operation of the apparatus according to the procedure described below and a recording medium on which the computer program is recorded are also an embodiment of the present invention.
  • a UV curable adhesive is dropped around the center hole on the substrate P1, and the turntable 11 is rotated at a high speed.
  • the application pressure is 0.2 MPa and the application time is 0.6 sec. For example, this is swung between 1 s e c by high-speed spin of 1 0 0 0 0 r pm.
  • the substrate P 1 is made of the adhesive B applied as described above.
  • step 20 3 It is thrown into the turntable 3 so that the 1 side faces up (step 2 0 2). Then, in the pre-irradiation unit 4, the entire surface is irradiated with ultraviolet rays in the atmosphere by a UV irradiation device, and is temporarily cured to such an extent that the applied shape of the adhesive B 1 is not broken (step 20 3).
  • a general ultraviolet curable resin does not completely cure at normal irradiation intensity even in the atmosphere even if it is irradiated with ultraviolet rays. This is because curing is inhibited by oxygen in the air near the surface of the resin. That is When UV irradiation is performed in the atmosphere, it can be temporarily cured while maintaining the adhesion of the surface. For example, it has been demonstrated that even 100 OmWx 1-2 s does not cure completely. Irradiation conditions for this temporary curing are not limited to specific ones.
  • the other substrate P 2 is coated with the adhesive B 2 by normal spin coating in the second spin coater 2 (step 204).
  • the coating pressure is 0.2 MPa
  • the coating time is 0.6 sec
  • the substrate P 2 is reversed by the reversing device (step 205), and is placed above the substrate P 1 so that the application surface of the adhesive B2 is down (step 206).
  • the two substrates P 1 and P 2 are transported to the bonding unit 5 and bonded in a vacuum as in the prior art (step 207).
  • the bonded substrates P 1 and P 2 are sent to the post-irradiation unit 6, where the entire surface is irradiated with ultraviolet rays in a vacuum, and the adhesives B 1 and B 2 are completely cured (step 208).
  • ultraviolet rays are irradiated from the substrate P 1 side on which the anti-transmissive metal film is sputtered.
  • the disk D completed by the adhesive curing is unloaded from the unloading position 35 (step 209).
  • the adhesive B 1 applied to the substrate P 1 to be bonded is temporarily cured and then bonded to the substrate P 2, the adhesive B is maintained while maintaining the adhesive force.
  • the flow of 1 can be suppressed, and fluctuations in the thickness of the adhesive layer after bonding can be suppressed.
  • the ultraviolet irradiation for temporary curing is performed after the spin coating is completed. Since it is performed after the B 1 scatters, the adhesive that scatters during spin coating does not start to cure, and there is no problem in reusing the recovered adhesive. Irradiation at a place different from the spin coat leads to the same effect.
  • the first spin coater 1 force Irradiation device 1 3 (first irradiation unit) that irradiates the adhesive B 1 on the substrate P 1 with ultraviolet (UV), heating It has a heating device 1 to 4.
  • the irradiation device 13 is a device that irradiates ultraviolet rays in a spot manner around the central hole of the substrate P 1, and is configured such that the ultraviolet rays from the light source are guided by an optical fiber. An ultraviolet LED may be used as the light source so that the irradiation intensity can be adjusted.
  • the heating device 14 is a device that heats the vicinity of the outer periphery of the substrate P 1.
  • the heating device 14 for example, an infrared (IR) irradiation unit or a heater can be used.
  • IR infrared
  • the pre-irradiation unit 4 in this embodiment corresponds to the second irradiation unit in the claims, and the post-irradiation unit 6 corresponds to the third irradiation unit.
  • an ultraviolet curable adhesive is dropped around the center hole, and the turntable 11 is rotated at a high speed.
  • the viscosity of the adhesive is 43 OmPas
  • the application pressure is 0.2 MPa
  • the application time is 0.15 sec. This is shaken off for 8 seconds by, for example, lOOO rpm high-speed spin.
  • the substrate P 1 is rotated to such an extent that the adhesive does not flow (for example, 120 rpm to 300 rpm), and around the center hole by the irradiation device 1 3 Irradiate ultraviolet rays in spots.
  • an annularly cured portion (cured portion) is formed in the spread adhesive (step 402).
  • the part where the UV light intensity is strong is completely cured, but as it goes to the outer periphery, it is affected by the oxygen inhibition of the adhesive, the surface does not solidify, the inside solidifies, and the inside gradually hardens toward the outer circumference. No longer.
  • the UV curable adhesive is applied again on the adhesive of the substrate P 1 which has been spread in this way and the cured portion is formed, and the turntable 11 is rotated at high speed.
  • the adhesive is spread (step 403). For example, using the same adhesive as the first time, setting the application pressure to 0.2 MPa, the application time to 0.6 sec, and shaking off at 1 sec with a high speed spin of 1 0000 rpm. At this time, it spreads by partially heating using the heating apparatus 14.
  • a spot heater is used as the heat source, the wavelength is 700 to 3000 nm, the set output is 35 OW, the heating range is 41 to 53 mm in the radial direction of the substrate P1, and the heating time is 1 sec.
  • the adhesive that has been warmed and whose viscosity has been reduced is easily shaken off by the centrifugal force generated by rotating the substrate and is easily ejected to the outer periphery. Become. Or, by obtaining thermal energy, the volatilization amount increases. For this reason, the adhesive remaining on the outer periphery is thinned, and it is possible to suppress an increase in the thickness, so that the thickness can be made uniform as a whole.
  • hot air may be applied to the outer periphery to assist heating of the adhesive.
  • the substrate P 1 is put into the turntable 3 so that the surface of the adhesive B 1 applied as described above is on (step 40 4).
  • the entire surface is irradiated with ultraviolet rays in the atmosphere by the UV irradiation device, and is temporarily cured to such an extent that the applied shape of the adhesive B 1 is not broken (step 405).
  • irradiation is performed for about half the irradiation time (2 s) at the same intensity. Further, as shown in FIG.
  • the other substrate P 2 is coated with the adhesive B 2 by normal spin coating in the second spin coater 2 (step 406).
  • the coating pressure is 0.2 MPa
  • the coating time is 0.6 sec
  • the high speed spin is 6000 rpm for 1 sec.
  • the substrate P 2 is reversed by the reversing device (step 407), and is placed above the substrate P 1 so that the application surface of the adhesive B 2 is down (step 408).
  • the two substrates P 1 and P 2 are conveyed to the bonding unit 5 and bonded in a vacuum as in the conventional technique (step 409).
  • the bonded substrates P 1 and P 2 are sent to the post-irradiation unit 6 where the entire surface is irradiated with ultraviolet rays in a vacuum, and the adhesives B 1 and B 2 are completely cured (step 410).
  • ultraviolet rays are irradiated from the substrate P 1 side on which the anti-transmissive metal film is sputtered.
  • the disk D completed by the adhesive curing is unloaded from the unloading position 35 (step 41 1).
  • Figure 5 shows the distribution of the adhesive layer on the substrate after such bonding. According to this, when comparing the average circumference variation rate with an example of an example manufactured according to the above-mentioned embodiment and a conventional example (other conditions are the same as the example) pasted together without pre-curing. It can be seen that the variation in the circumference of the example is smaller than that of the conventional example.
  • the coating thickness can be easily adjusted by changing the coating amount of the adhesive, the rotation conditions, and the number of spreads.
  • a uniform thickness can be secured by forming the cured portion and applying the coating while heating, as described above, so that the effect of suppressing fluctuations in the circumference can be enhanced. it can.
  • the second spin coater 2 is also provided with an irradiation device 13. Further, a hardened portion may be formed in the adhesive of the substrate P 2, and an increase in thickness may be suppressed by providing the heating device 14.
  • an adhesive is applied to both substrates, and ultraviolet irradiation (temporary curing, spot) is performed only on one of the adhesives.
  • ultraviolet irradiation temporary curing, spot
  • the application of the adhesive and the electromagnetic wave irradiation in the claims may be performed on at least one of the substrates. Therefore, the adhesive may be applied only to one substrate.
  • both the adhesives may be irradiated with ultraviolet rays.
  • a first pre-irradiation unit 4a that irradiates the substrate P 1 with ultraviolet rays and a second pre-irradiation unit 4b that irradiates the substrate P 2 with ultraviolet rays are provided.
  • the adhesive to be used is not limited to the ultraviolet curable resin, and various other materials such as a resin curable by other electromagnetic waves (including laser light), a thermosetting resin, and the like can be used. It is. Therefore, depending on the type of resin, various types of electromagnetic waves can be applied such as ultraviolet rays, infrared rays (including heat rays), laser light with a predetermined wavelength, and the like.
  • various types of electromagnetic waves can be applied such as ultraviolet rays, infrared rays (including heat rays), laser light with a predetermined wavelength, and the like.
  • the hardened portion is formed and overcoated. However, it may be a simple overcoating or a single coating with a large amount of adhesive dropped. Heating during spreading may be omitted. Further, the bonding is not necessarily performed in a vacuum.
  • the application portion for applying the adhesive may be single or plural.
  • a common spin coat device may be used for the first substrate and the second substrate. Overcoating may be performed with a plurality of spin coaters.
  • the application unit is not limited to a spin coater, and includes any device that can be used at present or in the future as long as it can apply an adhesive.
  • the pre-irradiation unit may be installed anywhere as long as it is between spin coating and bonding. For example, even if it is installed in a spin coater, it may be installed in the middle of conveyance from the spin coater to the turntable. As described above, it may be installed on either one of the substrates P 1 and P 2 on the turntable or on both.
  • the size, shape, material, and the like of the substrate are also free, and can be applied to everything that will be used in the future. Therefore, the present invention can be applied to discs for recording media of any standard, and of course, can be applied to both write-once recording media and writable recording media. Moreover, it can be applied not only to a disk as a recording medium but also to any substrate bonded with an adhesive.
  • the “substrate” described in the claims is not limited to a disk shape or the like, but is a concept including a wide range of flat products.

Abstract

L'invention concerne un procédé et un appareil de liaison permettant de supprimer les bulles dans une couche adhésive tout en assurant l'uniformité de cette couche au moment de son application et la suppression des variations de la couche adhésive pendant sa fabrication. L'appareil de liaison comprend un premier appareil de revêtement par centrifugation (1) permettant de recouvrir une surface d'un premier substrat (P1) avec un adhésif (B1); un second appareil de revêtement par centrifugation permettant de recouvrir une surface d'un second substrat (P2) avec un adhésif (B2) du premier substrat; une partie d'irradiation préalable (4) pour irradier l'adhésif (B1) appliqué sur le premier substrat (P1) au moyen d'un rayonnement ultraviolet de l'atmosphère; une partie de liaison (5) pour assembler la surface du premier substrat (P1) sur laquelle l'adhésif (B1) est appliqué, avec la surface du second substrat (P2) sur laquelle l'adhésif (B2) est appliqué; et une partie d'irradiation postérieure (6) pour irradier les adhésifs (B1, B2) placés entre le premier substrat (P1) et le second substrat (P2) au moyen d'un rayonnement ultraviolet.
PCT/JP2007/001025 2006-09-28 2007-09-20 Procédé et appareil de liaison WO2008038414A1 (fr)

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JP2006-263947 2006-09-28

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JP2012071281A (ja) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp 接着剤供給装置及び接着剤供給方法
JP5186556B2 (ja) * 2008-04-14 2013-04-17 昭和電工株式会社 硬化フィルム及びその製造方法
JP2014199457A (ja) * 2014-05-30 2014-10-23 芝浦メカトロニクス株式会社 貼合ワークの製造装置及び貼合ワークの製造方法
EP2793275A3 (fr) * 2013-04-16 2015-08-12 teamtechnik Maschinen und Anlagen GmbH Application d'adhésif conducteur sur des cellules solaires

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TWI490049B (zh) * 2012-03-12 2015-07-01 Shibaura Mechatronics Corp 接著劑供給裝置以及接著劑供給方法
JP6100570B2 (ja) 2013-03-22 2017-03-22 株式会社東芝 表示装置の製造装置、および表示装置の製造方法

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JPH05456A (ja) * 1991-06-24 1993-01-08 Three Bond Co Ltd 被着体の接合方法
JP2000513654A (ja) * 1997-04-30 2000-10-17 ステアーグ ハマテヒ アクチエンゲゼルシャフト ２つの基板を接着するための方法及び装置
JP2002067169A (ja) * 2000-08-28 2002-03-05 Hitachi Maxell Ltd 貼り合わせ装置及び貼り合わせ方法
WO2005118159A1 (fr) * 2004-06-03 2005-12-15 Shibaura Mechatronics Corporation Procédé de formation d’une couche de résine, dispositif de formation d’une couche de résine, disque et son procédé de fabrication
JP2006048855A (ja) * 2004-08-06 2006-02-16 Shibaura Mechatronics Corp 貼合装置及び貼合方法並びに貼合装置制御用プログラム

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JPH05456A (ja) * 1991-06-24 1993-01-08 Three Bond Co Ltd 被着体の接合方法
JP2000513654A (ja) * 1997-04-30 2000-10-17 ステアーグ ハマテヒ アクチエンゲゼルシャフト ２つの基板を接着するための方法及び装置
JP2002067169A (ja) * 2000-08-28 2002-03-05 Hitachi Maxell Ltd 貼り合わせ装置及び貼り合わせ方法
WO2005118159A1 (fr) * 2004-06-03 2005-12-15 Shibaura Mechatronics Corporation Procédé de formation d’une couche de résine, dispositif de formation d’une couche de résine, disque et son procédé de fabrication
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JP5186556B2 (ja) * 2008-04-14 2013-04-17 昭和電工株式会社 硬化フィルム及びその製造方法
JP2012071281A (ja) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp 接着剤供給装置及び接着剤供給方法
EP2793275A3 (fr) * 2013-04-16 2015-08-12 teamtechnik Maschinen und Anlagen GmbH Application d'adhésif conducteur sur des cellules solaires
EP2793275B1 (fr) 2013-04-16 2020-04-08 teamtechnik Maschinen und Anlagen GmbH Application d'adhésif conducteur sur des cellules solaires
JP2014199457A (ja) * 2014-05-30 2014-10-23 芝浦メカトロニクス株式会社 貼合ワークの製造装置及び貼合ワークの製造方法

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