CN101522400A - 贴合方法以及贴合装置 - Google Patents

贴合方法以及贴合装置 Download PDF

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Publication number
CN101522400A
CN101522400A CNA2007800361756A CN200780036175A CN101522400A CN 101522400 A CN101522400 A CN 101522400A CN A2007800361756 A CNA2007800361756 A CN A2007800361756A CN 200780036175 A CN200780036175 A CN 200780036175A CN 101522400 A CN101522400 A CN 101522400A
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China
Prior art keywords
substrate
bonding agent
coating
irradiation
face
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Pending
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CNA2007800361756A
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English (en)
Inventor
成田悠
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Shibaura Mechatronics Corp
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Shibaura Engineering Works Co Ltd
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Publication date
Application filed by Shibaura Engineering Works Co Ltd filed Critical Shibaura Engineering Works Co Ltd
Publication of CN101522400A publication Critical patent/CN101522400A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7879—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path
    • B29C65/7882—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined said parts to be joined moving in a closed path, e.g. a rectangular path said parts to be joined moving in a circular path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00145—Vacuum, e.g. partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
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    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
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    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract

本发明提供一种既可确保涂敷时的粘接层的均匀性、抑制制造中的粘接层的变化，又可减少气泡的贴合方法和贴合装置。具有向第一基板(P1)的一方的面涂敷粘接剂(B1)的第一旋转涂敷装置(1)、向第二基板(P2)的一方的面比第一基板的粘接剂(B1)薄地涂敷粘接剂(B2)的第二旋转涂敷装置、使第一基板(P1)的粘接剂(B1)临时硬化的前照射部(4)、贴合第一基板(P1)的涂敷了粘接剂(B1)的面和第二基板(P2)的涂敷了粘接剂(B2)的面的贴合部(5)以及使第一基板(P1)和第二基板(P2)之间的粘接剂(B1、B2)硬化的后照射部(6)。

Description

贴合方法以及贴合装置
技术领域
本发明涉及一种贴合装置以及贴合方法，该贴合装置和贴合方法例如为了制造通过粘接剂贴合一对基板而形成的记录介质，对在贴合前向基板涂敷粘接剂进行改良。
背景技术
目前，对于光盘或光磁盘等的光学读取式的记录介质，再生专用的记录介质或可重写记录的信息的记录介质等各种各样规格的介质正在普及。例如，DVD等的光盘基本上是通过在两个基板的一方或双方上设置信息记录区域，并且经由粘接剂贴合而制造的。而且，为了正确地通过激光进行读写，要求用于贴合的粘接剂层的厚度具有非常高的精度。
参照图6对这样的贴合型盘片的制造顺序的一个例子进行说明。首先，预先注射模塑成形两张聚碳酸酯制的基板P，在喷溅室通过喷溅形成激光反射用的金属膜(记录膜)。然后，如图6(A)所示，将紫外线硬化型的粘接剂涂敷在两张基板P的接合面上，通过旋转涂敷来延展粘接剂。旋转涂敷是指，在利用涂敷装置K将粘接剂滴下涂敷到基板P的中心的周围之后，通过使基板P高速旋转，从而在基板P上形成粘接剂的薄膜(粘接层R)，使多余的粘接剂飞散。
如图6(B)所示，这样形成粘接层R的一对基板P以彼此的粘接层R形成平行相对的状态的方式，由中心销G的卡盘E保持一方，并且另一方载置在转台或基座等的载置面F上，在该状态下，导入到真空室C的下部。然后，如图6(C)所示，通过真空室C下降并密封，形成减压室S，通过排气装置从该减压室S排气，由此，基板P周围的压力从大气压变成真空。
在该减压后的空间中，在保持一方的基板P的卡盘E闭合并且基板P落下的同时，推压部T通过汽缸等驱动源而下降并推压，由此，贴合于另一方的基板P。贴合时形成真空是为了尽可能地排除粘接的面之间的气体分子。
之后，如图6(D)所示，贴合后的基板P的周围导入大气而恢复到大气压，或者在加压到大气压以上之后恢复到大气压。通过这样被释放到大气压，残留在粘接层R的气泡通过与真空的压差而逐渐压缩。如图6(E)所示，通过光源U向放置在大气中几秒至几十秒的基板P整体照射紫外线，直到气泡被充分压缩为止，由此，粘接层R硬化。这样，两张基板P被牢固地粘接，制成盘片。
如上所述，对于贴合涂敷了粘接剂的基板而制造的盘片，在用于读写信息的激光照射到盘片上时，为了稳定地形成光点，希望尽量降低附着的脏物或产生的气泡。作为对策，目前，在真空中进行贴合或贴合后进行加压。这样的加压方法是利用大气压并在大气中暴露规定的时间(大气放置)(参照专利文献1)。
专利文献1：日本特开2006-48855号公报
但是，为了形成由激光形成的稳定的光点，所述盘片必须是没有弯曲或变形的平坦的盘片。因此，在该盘片中，希望贴合时的粘接层的膜厚尽量均匀。已知，例如通过旋转涂敷而涂敷的粘接层的膜厚的周内变化(标准离差)是从盘片的内周越向外周越大。
并且，随着如近年来的HD(高清晰度DVD)、BD(蓝光光盘)中所出现的记录密度的提高，最终的盘片所要求的粘接层的均匀性非常严格。例如，目前的DVD的标准离差范围为30μm左右，但HD或BD要求10μm左右的更高的精度。并且，随着该记录密度的提高，为了防止读取错误，也要求进一步减小附着的脏物或产生的气泡的尺寸和数量。
但是，如所述专利文献1所述，若为了减少气泡而在贴合后放置到大气中，则粘接层的周内变化扩大。这想必是由于从涂敷粘接剂后开始到硬化为止的时间变长，在硬化中途粘接剂流动的机会增加所致。例如，图7表示在贴合后不进行放置的情况和进行放置(20s)的情况下的各自的一个例子和测定平均的周内变化率的结果。根据图7可知，在放置的情况下，周内变化整体变差，外周部的变化大。
发明内容
本发明是为了解决所述现有技术的问题点而提出的，其目的是提供一种贴合方法和贴合装置，该贴合方法和贴合装置既能确保涂敷时的粘接层的均匀性，抑制制造中的粘接层的变化，又能够减少气泡。
为了达成所述目的，本发明是一种贴合方法，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂，向涂敷到所述第一基板上的粘接剂和涂敷到所述第二基板上的粘接剂中的厚的一方照射电磁波，贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面，向所述第一基板和所述第二基板之间的粘接剂照射电磁波。
其它的形式是一种贴合装置，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，具有：以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂的至少一个涂敷部，向涂敷到所述第一基板上的粘接剂和涂敷到所述第二基板上的粘接剂中的厚的一方照射电磁波的前照射部，贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面的贴合部，以及，向所述第一基板和所述第二基板之间的粘接剂照射电磁波的后照射部。
在以上的发明中，由于在贴合第一基板和第二基板之前向厚的一方的粘接剂照射电磁波，因此，厚的区域发生临时硬化，在抑制周内变化的同时，能够抑制贴合后产生气泡。
其它的形式是一种贴合方法，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂，向涂敷到所述第一基板上的粘接剂和涂敷到所述第二基板上的粘接剂双方照射电磁波，贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面，向所述第一基板和所述第二基板之间的粘接剂照射电磁波。
其它的形式是一种贴合装置，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，具有：以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂的至少一个涂敷部，向涂敷到所述第一基板的粘接剂和涂敷到所述第二基板的粘接剂双方照射电磁波的前照射部，贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面的贴合部，以及，向所述第一基板和所述第二基板之间的粘接剂照射电磁波的后照射部。
在以上的形式中，由于在贴合第一基板和第二基板之前向双方的粘接剂照射电磁波，因此，能够在抑制双方的粘接剂流动的状态下进行贴合，能够抑制粘接层的周内变化，同时，能够减少贴合后气泡的产生。
其它形式的特征是，所述涂敷部具有至少一个旋转涂敷装置，该旋转涂敷装置通过使所述第一基板和所述第二基板旋转而延展粘接剂，具有控制装置，该控制装置以在所述第一基板和所述第二基板上各自的旋转条件不同的方式控制所述旋转涂敷装置。
在所述的形式中，通过使转速等旋转条件不同，能够控制粘接剂的涂敷厚度。
其他形式的特征是，所述涂敷部具有至少一个旋转涂敷装置，该旋转涂敷装置通过使所述第一基板和所述第二基板旋转而延展粘接剂，具有控制装置，该控制装置以在所述第一基板和所述第二基板上各自的延展次数不同的方式控制所述旋转涂敷装置。
在所述的形式中，由于通过改变延展次数，根据重叠涂敷的次数控制粘接剂的涂敷厚度，因此，即使具有厚度也容易确保均匀性。
如上所述，根据本发明，能够提供既确保涂敷时的粘接层的均匀性、抑制制造中的粘接层的变化，又能够减少气泡的贴合方法和贴合装置。
附图说明
图1是表示本发明的贴合装置的一个实施方式的结构的说明图。
图2是表示图1的实施方式的第一旋转涂敷装置的简略纵剖视图。
图3是表示图1的实施方式的处理顺序的流程图。
图4是表示利用本发明的实施方式制造的膜厚比不同的盘片的气泡产生程度的说明图。
图5是表示在本发明的贴合装置中，在设置两个前照射部的情况下的一个实施方式的说明图。
图6是表示现有的基板贴合顺序的说明图，(A)是粘接剂的延展，(B)是向真空室的导入，(C)是贴合，(D)是大气开放，(E)是粘接剂的硬化工序。
图7是表示通过现有技术制造的盘片的粘接层厚的周内分布的说明图。
具体实施方式
以下参照附图，就实施本发明的最佳方式(以下，称为实施方式)进行具体说明。在本实施方式中，以不同厚度向一对基板涂敷粘接剂，使粘结剂临时硬化，然后进行贴合，从而抑制粘结剂的周内变化。
[实施方式的结构]
首先，参照图1和图2说明本实施方式的贴合装置(以下称为“本装置”)的结构。另外，本装置构成盘片的制造装置的一部分，关于设置在本装置的上游工序中的基板的成形装置、金属膜的形成装置以及在各装置之间交接基板的机构等，可使用众所周知的所有技术，因此省略说明。
本装置具有第一旋转涂敷装置1、第二旋转涂敷装置2、构成于转台3上的前照射部4、贴合部5、后照射部6等。第一旋转涂敷装置1是通过旋转涂敷而对贴合的一方的基板P1涂敷紫外线硬化型粘接剂B1的装置。该第一旋转涂敷装置1具有载置基板P1的转台11和使转台11旋转的驱动源12，是通过使基板P1旋转从而使从粘接剂供给部(无图示)滴下的粘接剂B1延展的装置。
并且，如图2所示，第一旋转涂敷装置1具有向基板P1上的粘接剂B1照射紫外线(UV)的照射装置13、和进行加热的加热装置14。照射装置13是向基板P1的中心孔周围点状地照射紫外线的装置，以来自光源的紫外线被光纤引导的方式构成。也可以将紫外线LED用于光源、以能够调整照射强度的方式构成。加热装置14是对基板P1的外周附近进行加热的装置。作为该加热装置14，可以使用例如红外线(IR)照射单元或加热器。
如图1所示，第二旋转涂敷装置2是通过旋转涂敷而对贴合的另一方的基板P2涂敷紫外线硬化型粘接剂的装置。该第二旋转涂敷装置2具有载置基板P2的转台21和使转台21旋转的驱动源22，是通过使基板P2旋转而将从粘接剂供给部(无图示)滴下的粘接剂B2延展的装置。
在转台3上具有：对应于前照射部4而放入基板P1的第一放入位置31；放入基板P2的第二放入位置32，该基板P2通过翻转装置(无图示)以粘接面相对的方式翻转；与贴合部5对应的贴合位置33；与后照射部6对应的紫外线照射位置34；以及将完成的盘片D搬出到下一个工序的搬出位置35。该转台3通过无图示的驱动机构而与所述的各位置配合并间歇旋转。
前照射部4通过UV照射装置在大气中向涂敷在基板P1上的粘接剂B1照射紫外线、使其临时硬化。“大气中”是指妨碍硬化环境，例如，指含有氧的气体氛围。一般来说，处在大气中比较容易，但是，包含氧或其它的妨碍硬化的环境也可以。
贴合部5是在真空中贴合基板P1、P2的装置。另外，贴合部5具有通过升降机构而工作的真空室、对真空室内进行减压的真空源、通过升降机构而工作并且推压基板P1、P2的推压部等，因为是众所周知的技术，因此省略说明。
后照射部6是如下的装置，即，通过UV照射装置在真空中向贴合后的基板P1、P2照射紫外线，使基板P1、P2之间的粘接剂B1、B2完全硬化的装置。另外，后照射部6也具有通过升降机构而工作的真空室、对真空室内进行减压的真空源等，因为是众所周知的技术，因此省略说明。
另外，在真空中照射是为了排除氧等妨碍硬化的主要原因，但并不是必须要形成无氧环境。这是由于贴合后的基板P1、P2的粘接接触面几乎一体化而不受环境气体左右地进行硬化的缘故。在大气中进行贴合的情况下，虽然外周端面与大气接触，但对于这部分，在生产线上的保管时间内(几天)达到完全硬化。如果在所述的真空中进行照射，则对于该外周端面也具有可进一步可靠地硬化的优点。利用惰性气体(N2)排除氧(净化)也可得到同样的效果。
通过控制装置控制来自所述粘接剂供给部的粘接剂的供给量、转台的旋转及其速度、照射装置的发光、加热装置、升降机构以及真空源的工作等。该控制装置可通过例如以专用的电子电路或规定的程序进行动作的计算机等实现。因此，以以下说明的顺序控制本装置的动作的计算机程序以及对其进行记录的记录介质也是本发明的一个形式。
[实施方式的作用]
参照图1、图2以及图3的流程图就通过以上的本装置进行的基板贴合的顺序进行说明。另外，在前工序中，利用喷溅在一方的基板P1上形成半透明的反射膜，在另一方的基板P2上喷溅全反射的金属膜。
如图1所示，在第一旋转涂敷装置1中，将紫外线硬化型粘接剂滴下涂敷在基板P1的中心孔的周围，通过使转台11高速旋转，从而延展粘接剂(步骤301)。例如，使用粘度为430mPas的粘接剂，涂敷压为0.2MPa，涂敷时间为0.15sec。例如，通过10000rpm的高速旋转将其甩动(振り切ゐ)1sec。
然后，如图2所示，使基板P1旋转到粘接剂不流动的程度(例如120rpm～300rpm)，通过照射装置13向中心孔的周围点状地照射紫外线。由此，环形硬化的部分(硬化部)形成于延展后的粘接剂上(步骤302)。此时，在UV光的强度强的部分完全硬化，但是，随着向外周移动，受到粘接剂的氧妨碍的影响，表面不凝固而内部凝固，朝向外周内部也逐渐不发生硬化。
然后，在这样延展并形成硬化部的基板P1的粘接剂上，再次滴下涂敷紫外线硬化型的粘接剂，通过高速旋转转台11而使粘接剂延展(步骤303)。例如，使用与第一次相同的粘接剂，涂敷压为0.2MPa，涂敷时间为0.6sec，通过4000rpm的高速旋转甩动1sec。此时，通过使用加热装置14进行部分地加热，进行延展。例如，使用点加热器作为热源，波长为700～3000nm，设定输出为350W，加热范围是基板P1的径方向40mm～60mm，加热时间为1sec。
通过如上所述地向基板P1涂敷粘接剂，被加热而粘度降低了的粘接剂，通过基板旋转所产生的离心力而被甩动，容易向外周弹出。或者，得到热能而挥发量增大。因此，残留在外周的粘接剂变薄，可抑制其厚度的增大，因此，可使整体厚度均匀化。另外，也可同时向外周喷吹热风，对粘接剂的加热进行辅助。
之后，如图1所示，以如上所述地涂敷了粘接剂B1的面朝上的方式将基板P1放入转台3(步骤304)。然后，在前照射部4中，通过UV照射装置在大气中全面地照射紫外线，使粘接剂B1的涂敷形状临时硬化至不变形的程度(步骤305)。例如，与通常的真硬化的情况下的条件(50mW/cm2×5s)相比较，用同样的强度照射大约一半的照射时间(2s)。
另外，如果在大气中，一般的紫外线硬化型树脂(粘接剂)即使全面照射紫外线，在通常的照射强度下也不会完全硬化。这是因为，在树脂的表面附近，空气中的氧将阻碍硬化。即，如果在大气中进行紫外线照射，则能够在保持表面的粘接性的状态下进行临时硬化。例如，事实证明即使是1000mW×1～2s也不会全部硬化。因此，该临时硬化时的照射条件不局限于所述条件。
并且，如图1所示，在另一方的基板P2上，在第二旋转涂敷装置2中，进行基于通常的旋转涂敷的粘接剂B2的涂敷(步骤306)。例如，涂敷压为0.2MPa，涂敷时间为0.6sec，通过6000rpm的高速旋转甩动1sec。如上所述，通过设定旋转涂敷的旋转条件和涂敷次数，基板P1的粘接剂B1变厚，基板P2的粘接剂B2变薄。然后，利用翻转装置翻转基板P2(步骤307)，并将其以粘接剂B2的涂敷面朝下的方式放在基板P1的上方(步骤308)。
之后，将两张基板P1、P2搬运到贴合部5，与现有技术相同地在真空中进行贴合(步骤309)。将贴合后的基板P1、P2输送到后照射部6，在真空中全面地照射紫外线，粘接剂B1、B2完全硬化(步骤310)。此时，从喷溅了不透光(反透過)的金属膜的基板P1侧照射紫外线。从搬出位置35搬出通过粘接剂硬化而制成的盘片D(步骤311)。
[实施方式的效果]
根据以上的本实施方式，由于使涂敷在贴合的基板P1上的粘接剂B1比涂敷在基板P2上的粘接剂B2厚，并且使粘接剂B1临时硬化，因此，一部分区域预先硬化，能够在真空中贴合基板P1、P2时抑制排气的产生，减少残留的气泡。图4表示这样的减少气泡的效果。这样，在所述的实施方式中，在改变了粘接剂B1、B2的膜压比(B2/B1)的情况下的气泡程度是，临时硬化侧的粘接剂B1的膜厚越厚，气泡减少效果越大。
可以想到这是由于如下的原因，即，虽然厚的一方产生气泡的材料多，但是通过进行临时硬化，抑制来自粘接剂内部的产生气体的分量增多。另外，在贴合并完全硬化后，目视检测气泡程度，程度0.0表示没有气泡，程度1.0表示有气泡，程度2.0表示气泡为中等程度，程度3.0表示气泡多。在向两个基板涂敷相同厚度的粘接剂而不进行临时硬化就贴合的现有例中，是程度3.0。
并且，由于一方的粘接剂B1进行临时硬化，因此，能够得到抑制流动的效果，能够抑制贴合基板P1、P2后的粘接层厚的周内变化。另外，由于用于临时硬化的紫外线照射是在旋转涂敷结束并且粘接剂B1的飞散消失后进行的，因此，在旋转涂敷时飞散的粘接剂不会开始硬化。因此，无需将回收后的粘接剂分离成未硬化的和硬化的，可进行循环使用。另外，在与旋转涂敷不同的位置进行照射，也可得到相同的效果。对于在旋转基板P1的同时进行点照射，由于只不过照射限定了的一部分区域，因此，可回收粘接剂。
并且，通过改变粘接剂的涂敷量、旋转条件以及延展次数，可容易地调节涂敷厚度。尤其是在想增加涂敷厚度的情况下，如上所述，通过形成硬化部，一面加热一面重叠涂敷，可确保均匀的厚度，因此，可提高抑制周内变化的效果。
[其他实施方式]
本发明并不局限于所述的实施方式。对贴合前的一方的粘接剂的硬化程度没有特别的限制。因此，通过在真空中进行照射、利用惰性气体进行净化并照射、提高照射强度、延长照射时间等各种方法，即使不使涂敷在一方的基板上的厚的一方的粘接剂临时硬化而是使其完全硬化，也能够得到抑制贴合后的周内变化的效果。在这种情况下，在贴合时，通过另一方的未硬化的粘接剂确保粘接性。
并且，如图5所示，也可通过设置向基板P1照射紫外线的第一前照射部4a和向基板P2照射紫外线的第二前照射部4b，从而对粘接剂B1、B2双方进行临时硬化，然后进行贴合。由此，在能够得到进一步抑制周内变化的效果的同时，也可得到降低气泡的效果。
另外，对于涂敷薄的一方的粘接剂，根据其厚度的程度而不容易流动。例如，如果将粘接剂涂敷得非常薄(几微米左右、通过点照射形成的硬化部的程度)，则可得到抑制流动并且抑制贴合后的周内变化的效果。因此，在非常薄地涂敷不临时硬化的粘接剂的情况下，也存在可提高抑制周内变化的效果的情况。即使使这样薄地涂敷的粘接剂临时硬化，也可得到抑制周内变化的效果。
并且，对于所使用的粘接剂，并不局限于紫外线硬化型的树脂，也可使用其他通过电磁波(也包括激光)而硬化的树脂、热硬化型树脂等各种树脂。因此，根据树脂的种类，进行照射的电磁波的种类也可使用紫外线、红外线(包括热线)以及规定波长的激光等各种电磁波。在所述的实施方式中，为了涂厚粘接剂而形成硬化部并重叠涂敷，但是，也可以只进行重叠涂敷，也可增加粘接剂的滴下量而进行一次涂敷。也可省略延展时的加热。并且，贴合也可不在真空中进行。
用于涂敷粘接剂的涂敷部可以是单数也可以是复数。例如，第一基板和第二基板也可使用共同的旋转涂敷装置。也可用多台旋转涂敷装置进行重叠涂敷。涂敷部并不局限于旋转涂敷装置，只要是可涂敷粘接剂的装置即可，包括现在或将来可利用的所有装置。
并且，前照射部可以设置在旋转涂敷之后到贴合为止之间的任何位置。例如，可设置于旋转涂敷装置，也可设置于从旋转涂敷装置到转台为止的搬运中途。如上所述，可设置在转台上的基板P1、P2中的任何一方上，也可设置于双方。
基板的大小、形状、材质等是任意的，可适用于将来采用的所有基板。因此，可适用于任何规格的记录介质用的盘片，当然也能够适用于补写型的记录介质、写入型的记录介质中的任何一种。并且，不仅适用于作为记录介质的盘片，还可适用于通过粘接剂贴合的所有基板。即，权利要求中所述的“基板”的概念不局限于圆盘形等，还广泛地包括平面状的产品。

Claims (6)

1.一种贴合方法，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，
以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂，
向涂敷到所述第一基板上的粘接剂和涂敷到所述第二基板上的粘接剂中的厚的一方照射电磁波，
贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面，
向所述第一基板和所述第二基板之间的粘接剂照射电磁波。
2.一种贴合方法，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，
以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂，
向涂敷到所述第一基板上的粘接剂和涂敷到所述第二基板上的粘接剂双方照射电磁波，
贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面，
向所述第一基板和所述第二基板之间的粘接剂照射电磁波。
3.一种贴合装置，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，具有：
以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂的至少一个涂敷部，
向涂敷到所述第一基板上的粘接剂和涂敷到所述第二基板上的粘接剂中的厚的一方照射电磁波的前照射部，
贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面的贴合部，以及，
向所述第一基板和所述第二基板之间的粘接剂照射电磁波的后照射部。
4.一种贴合装置，经由通过照射电磁波而发生硬化的粘接剂贴合第一基板和第二基板，其特征在于，具有：
以分别不同的厚度向所述第一基板的一方的面和所述第二基板的一方的面涂敷粘接剂的至少一个涂敷部，
向涂敷到所述第一基板的粘接剂和涂敷到所述第二基板的粘接剂双方照射电磁波的前照射部，
贴合所述第一基板中的涂敷了粘接剂的面和所述第二基板中的涂敷了粘接剂的面的贴合部，以及，
向所述第一基板和所述第二基板之间的粘接剂照射电磁波的后照射部。
5.如权利要求3或4所述的贴合装置，其特征在于，所述涂敷部具有至少一个旋转涂敷装置，该旋转涂敷装置通过使所述第一基板和所述第二基板旋转而延展粘接剂，
具有控制装置，该控制装置以在所述第一基板和所述第二基板上各自的旋转条件不同的方式控制所述旋转涂敷装置。
6.如权利要求3或4所述的贴合装置，其特征在于，所述涂敷部具有至少一个旋转涂敷装置，该旋转涂敷装置通过使所述第一基板和所述第二基板旋转而延展粘接剂，
具有控制装置，该控制装置以在所述第一基板和所述第二基板上各自的延展次数不同的方式控制所述旋转涂敷装置。
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WO2008038412A1 (en) 2008-04-03
KR20090042335A (ko) 2009-04-29
TW200832397A (en) 2008-08-01
JPWO2008038412A1 (ja) 2010-01-28
JP4831796B2 (ja) 2011-12-07
US20100024974A1 (en) 2010-02-04

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