TW409322B - Probe end cleaning sheet - Google Patents
Probe end cleaning sheet Download PDFInfo
- Publication number
- TW409322B TW409322B TW088102086A TW88102086A TW409322B TW 409322 B TW409322 B TW 409322B TW 088102086 A TW088102086 A TW 088102086A TW 88102086 A TW88102086 A TW 88102086A TW 409322 B TW409322 B TW 409322B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- cleaning
- sheet
- probe tip
- film
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
- B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10056234A JPH11238768A (ja) | 1998-02-20 | 1998-02-20 | プローブ先端クリーニングシート |
Publications (1)
Publication Number | Publication Date |
---|---|
TW409322B true TW409322B (en) | 2000-10-21 |
Family
ID=13021424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088102086A TW409322B (en) | 1998-02-20 | 1999-02-10 | Probe end cleaning sheet |
Country Status (6)
Country | Link |
---|---|
US (1) | US20020028641A1 (ja) |
EP (1) | EP0937541A3 (ja) |
JP (1) | JPH11238768A (ja) |
CN (1) | CN1232288A (ja) |
SG (1) | SG71910A1 (ja) |
TW (1) | TW409322B (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI417149B (zh) * | 2009-12-03 | 2013-12-01 | Int Test Solutions Inc | 用以清除測試器界面接觸元件和支持硬體之設備、裝置與方法 |
US9825000B1 (en) | 2017-04-24 | 2017-11-21 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
US10717618B2 (en) | 2018-02-23 | 2020-07-21 | International Test Solutions, Inc. | Material and hardware to automatically clean flexible electronic web rolls |
US10792713B1 (en) | 2019-07-02 | 2020-10-06 | International Test Solutions, Inc. | Pick and place machine cleaning system and method |
US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
US11756811B2 (en) | 2019-07-02 | 2023-09-12 | International Test Solutions, Llc | Pick and place machine cleaning system and method |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19952183B4 (de) * | 1999-10-29 | 2008-11-06 | Micronas Gmbh | Einrichtung zur Spitzenformung |
JP2002326169A (ja) * | 2001-05-02 | 2002-11-12 | Nihon Micro Coating Co Ltd | 接触子クリーニングシート及び方法 |
US6908364B2 (en) | 2001-08-02 | 2005-06-21 | Kulicke & Soffa Industries, Inc. | Method and apparatus for probe tip cleaning and shaping pad |
US7182672B2 (en) | 2001-08-02 | 2007-02-27 | Sv Probe Pte. Ltd. | Method of probe tip shaping and cleaning |
JP2005249409A (ja) | 2004-03-01 | 2005-09-15 | Oki Electric Ind Co Ltd | プローブ針用クリーニングシート |
JP4745814B2 (ja) * | 2005-12-19 | 2011-08-10 | 東京エレクトロン株式会社 | プローブの研磨部材 |
CN100504398C (zh) * | 2005-12-22 | 2009-06-24 | 王志忠 | 安装在测试卡上的探针表面处理的方法 |
JP2008281413A (ja) * | 2007-05-10 | 2008-11-20 | Micronics Japan Co Ltd | プローブのためのクリーニング装置 |
KR100893877B1 (ko) | 2007-08-06 | 2009-04-20 | 윌테크놀러지(주) | 프로브 카드용 니들 단부의 연마 방법 |
JP6279309B2 (ja) * | 2013-12-20 | 2018-02-14 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨用クッション、研磨装置、研磨方法、及び当該研磨方法により研磨された対象物を含む物品 |
JP6292397B2 (ja) * | 2014-04-23 | 2018-03-14 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP6531344B2 (ja) * | 2015-02-18 | 2019-06-19 | 株式会社東京精密 | プローブ装置 |
DE102016119746B4 (de) * | 2016-10-17 | 2024-02-08 | Matuschek Meßtechnik GmbH | Schleifscheibe |
CN112720231B (zh) * | 2020-12-30 | 2022-12-02 | 福建省佳美集团公司 | 一种陶瓷加工用抛光设备及抛光方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3135741B2 (ja) * | 1993-05-07 | 2001-02-19 | 富士写真フイルム株式会社 | 研磨体 |
JP3305557B2 (ja) * | 1995-04-10 | 2002-07-22 | 大日本印刷株式会社 | 研磨テープ、その製造方法および研磨テープ用塗工剤 |
JPH08294872A (ja) * | 1995-04-27 | 1996-11-12 | Fuji Photo Film Co Ltd | 研磨体 |
-
1998
- 1998-02-20 JP JP10056234A patent/JPH11238768A/ja active Pending
-
1999
- 1999-02-10 TW TW088102086A patent/TW409322B/zh not_active IP Right Cessation
- 1999-02-14 CN CN99103313.2A patent/CN1232288A/zh active Pending
- 1999-02-16 US US09/249,858 patent/US20020028641A1/en not_active Abandoned
- 1999-02-19 EP EP99301238A patent/EP0937541A3/en not_active Withdrawn
- 1999-02-19 SG SG1999000645A patent/SG71910A1/en unknown
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
US10239099B2 (en) | 2004-09-28 | 2019-03-26 | International Test Solutions, Inc. | Working surface cleaning system and method |
US10406568B2 (en) | 2004-09-28 | 2019-09-10 | International Test Solutions, Inc. | Working surface cleaning system and method |
US10195648B2 (en) | 2009-12-03 | 2019-02-05 | International Test Solutions, Inc. | Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware |
TWI417149B (zh) * | 2009-12-03 | 2013-12-01 | Int Test Solutions Inc | 用以清除測試器界面接觸元件和支持硬體之設備、裝置與方法 |
US9825000B1 (en) | 2017-04-24 | 2017-11-21 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
US10361169B2 (en) | 2017-04-24 | 2019-07-23 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
US11155428B2 (en) | 2018-02-23 | 2021-10-26 | International Test Solutions, Llc | Material and hardware to automatically clean flexible electronic web rolls |
US10717618B2 (en) | 2018-02-23 | 2020-07-21 | International Test Solutions, Inc. | Material and hardware to automatically clean flexible electronic web rolls |
US10843885B2 (en) | 2018-02-23 | 2020-11-24 | International Test Solutions, Inc. | Material and hardware to automatically clean flexible electronic web rolls |
US11434095B2 (en) | 2018-02-23 | 2022-09-06 | International Test Solutions, Llc | Material and hardware to automatically clean flexible electronic web rolls |
US10792713B1 (en) | 2019-07-02 | 2020-10-06 | International Test Solutions, Inc. | Pick and place machine cleaning system and method |
US11756811B2 (en) | 2019-07-02 | 2023-09-12 | International Test Solutions, Llc | Pick and place machine cleaning system and method |
US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
Also Published As
Publication number | Publication date |
---|---|
EP0937541A3 (en) | 2002-07-10 |
EP0937541A2 (en) | 1999-08-25 |
US20020028641A1 (en) | 2002-03-07 |
SG71910A1 (en) | 2000-04-18 |
CN1232288A (zh) | 1999-10-20 |
JPH11238768A (ja) | 1999-08-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |