US20020028641A1 - Probe end cleaning sheet - Google Patents

Probe end cleaning sheet Download PDF

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Publication number
US20020028641A1
US20020028641A1 US09/249,858 US24985899A US2002028641A1 US 20020028641 A1 US20020028641 A1 US 20020028641A1 US 24985899 A US24985899 A US 24985899A US 2002028641 A1 US2002028641 A1 US 2002028641A1
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US
United States
Prior art keywords
probe
cleaning
thin film
sheet
elastic sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/249,858
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English (en)
Inventor
Masao Okubo
Shunichiro Nishizaki
Shinichiro Kozaki
Teruhisa Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to NIHON DENSHIZAIRYO KABUSHIKI KAISHA reassignment NIHON DENSHIZAIRYO KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOZAKI, SHINICHIRO, SAKATA, TERUHISA, NISHIZAKI, SHUNICHIRO, OKUBO, MASAO
Publication of US20020028641A1 publication Critical patent/US20020028641A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural

Definitions

  • the invention relates to a probe end cleaning sheet for removing foreign matter adhered to the end of a probe.
  • the probe of a probe card for measuring various electric properties of semiconductor chips formed on a semiconductor wafer is pressed tight (overdriven) against the pad of semiconductor chips.
  • foreign matter such as powder of aluminum scraped off from the pad is adhered.
  • This foreign matter is particularly likely to be adhered to the end of the probe when the pad is composed of an alloy of aluminum and copper. Unless such foreign matter is removed from the end of the probe, faulty conduction occurs between the probe and the pad, and electric contact is worsened, and accurate characteristics cannot be measured. If the probe is left over for a long period, the contact resistance tends to be higher.
  • the end of the probe is scraped off.
  • the end of the probe is generally formed in a spherical form so as to contact smoothly with the pad, but this end is polished by the ceramic plate, and finally becomes flat.
  • the probe with a flat end cannot contact smoothly with the pad, and the contact resistance changes, and the pad is worn out.
  • the probe with a flat end cannot be repaired by the user, or the semiconductor device manufacturer, but can be repaired only by the probe card maker. Therefore, the user must either discard the probe with a flat end or request repair to the probe card maker.
  • the base material of the probe end cleaning member for example, silicone rubber or urethane rubber may be adhered to the end of the probe.
  • the foreign matter adhered from the pad can be removed by cleaning, but a new foreign matter may be adhered to the end of the probe.
  • foreign matter such as aluminum powder removed from the end of the probe is left over, and the capability of removing the foreign matter is lowered, and therefore cleaning cannot be done at the same position every time. Accordingly, it is required to change the position of the probe end cleaning member on every occasion of cleaning.
  • the invention is devised in the light of the above background, and it is hence an object thereof to present a probe end cleaning sheet capable of removing foreign matter without deforming the end of the probe, without allowing new foreign matter to adhere to the end of the probe.
  • the probe end cleaning sheet of the invention is a probe end cleaning sheet for removing foreign matter adhered to the end of a probe, comprising a thin film for cleaning having fine abrasive powder applied on the surface or a metal thin film for cleaning made of a metal having a hardness nearly same as or larger than that of the material for composing the probe, having a rough surface, an elastic sheet provided in a lower layer of this thin film for cleaning of metal thin film for cleaning and having an elasticity, and a board provided in a lower layer of this elastic sheet.
  • the thin film for cleaning or the metal thin film for cleaning is made of a material which is dented when the end of the probe is pressed with a specified load but is not torn by the end of the probe, and the elastic sheet is made of a material which is dented in the pressed portion by the end of the probe when the end of the probe is pressed to the thin film for cleaning or the metal thin film for cleaning with the specified load.
  • FIG. 1 is a schematic explanatory diagram of cleaning of a probe using a probe end cleaning sheet according to an embodiment of the invention.
  • FIG. 2 is a drawing of the probe end cleaning sheet in the embodiment of the invention, (A) being a schematic magnified sectional view, (B) being a schematic plan view.
  • FIG. 3 is a schematic structural view for explaining cleaning of the probe using the probe end cleaning sheet in the embodiment of the invention.
  • FIG. 4 is a drawing of a probe end cleaning sheet in other embodiment of the invention, (A) being a schematic magnified sectional view, (B) being a schematic plan view.
  • FIG. 5 is a schematic structural view for explaining cleaning of the probe using the probe end cleaning sheet in the embodiment of the invention.
  • FIG. 6 is a schematic explanatory diagram showing the shape of the end of the probe cleaned by the probe end cleaning sheet in the embodiment of the invention.
  • FIG. 1 is a schematic explanatory diagram of cleaning of a probe using a probe end cleaning sheet according to an embodiment of the invention
  • FIG. 2 is a drawing of the probe end cleaning sheet in the embodiment of the invention
  • (A) being a schematic magnified sectional view
  • (B) being a schematic plan view
  • FIG. 3 is a schematic structural view for explaining cleaning of the probe using the probe end cleaning sheet in the embodiment of the invention
  • FIG. 4 is a drawing of a probe end cleaning sheet in other embodiment of the invention
  • FIG. 5 is a schematic structural view for explaining cleaning of the probe using the probe end cleaning sheet in the embodiment of the invention
  • FIG. 5 is a schematic structural view for explaining cleaning of the probe using the probe end cleaning sheet in the embodiment of the invention
  • FIG. 6 is a schematic explanatory diagram showing the shape of the end of the probe cleaned by the probe end cleaning sheet in the embodiment of the invention.
  • the ratio of dimensions of the parts is determined for the convenience of drafting, and is completely different from the actual ratio of dimensions.
  • a probe end cleaning sheet 100 in an embodiment of the invention is, as shown in FIG. 1, a probe end cleaning sheet for removing foreign matter adhered to the end of a probe 211 , comprising a cleaning thin film 110 having fine abrasive powder 111 applied on the surface, an elastic sheet 120 provided in a lower layer of this cleaning thin film 110 and having an elasticity, and a board 130 provided in the lower layer of this elastic sheet 120 .
  • the cleaning thin film 110 is composed by, as shown in FIG. 2, applying the fine abrasive powder 111 on the surface of a thin film 112 with adhesive or the like.
  • fine abrasive powder 111 alumina powder, silicon carbide powder, diamond powder or the like may be used, and the material and size are properly determined depending on the material and size of the probe 211 .
  • An important point for the cleaning thin film 110 is that it should have a sufficient rigidity so that the end may not penetrate through the cleaning thin film 110 when the probe 211 is pressed against with a specified load. This is also delicately related with the characteristic of the elastic sheet 120 described below, and if the end of the probe 211 penetrates through the cleaning thin film 110 , the end of the probe 211 reaches up to the elastic sheet 120 provided in the lower layer of the cleaning thin film 110 , and therefore, as in the case of the conventional probe end cleaning member, a new foreign matter may be adhered to the end of the probe 211 .
  • the thickness dimension of this cleaning thin film 110 is preferred to be, for example, 100 micrometers or less.
  • the elastic sheet 120 is made of silicone rubber or urethane rubber having a uniform thickness dimension.
  • the reason of setting the elastic sheet 120 in a uniform thickness dimension is explained below. That is, if the elastic sheet 120 is not uniform in thickness dimension, when cleaning the probe 211 , the end of the probe 211 contacts with the probe end cleaning sheet 100 irregularly, and in the cleaning process, an excessive load is applied to the probe 211 coming into contact in the first place. Therefore, the thickness dimension of the elastic sheet 120 is preferred to be 1 millimeter or less.
  • the required hardness of the elastic sheet 120 is delicately related with the characteristics of the cleaning thin film 110 as mentioned above, and preferably the hardness should be such that it may be dented by a load of several grams to scores of grams per one probe 211 .
  • the elastic sheet 120 is made of material having such a hardness as to be in the pressing portion by the end of the probe 211 when the end of the probe 211 is pressed to the cleaning thin film with a specified load.
  • silicone rubber or urethane rubber may be used as the elastic sheet 120 .
  • the elastic sheet 120 is formed of silicone rubber or urethane rubber, it is an advantage that it is not necessary to glue the cleaning thin film 110 with adhesive or the like. That is, only by putting the cleaning thin film 110 tightly on the elastic sheet 120 made of silicone rubber or urethane rubber, the cleaning thin film 110 is sucked and fixed to the elastic sheet 120 , and its setting is easy. If the cleaning thin sheet 110 is glued to the elastic sheet 120 with adhesive or the like, if the adhesive is applied unevenly, in spite of uniform thickness dimension of the elastic sheet 120 , undulations are formed on the cleaning thin film 110 due to uneven application, and correct cleaning is impaired, but such problem does not occur because adhesive is not used.
  • the specified load for pressing the probe 211 is several grams to scores of grams per one probe 211 , and when the cleaning thin film 110 is made of silicon carbide, the elastic sheet 120 is silicone rubber, and the probe 211 is tungsten, it is preferably about 3 to 10 grams.
  • the board 130 is made of, for example, metal plate, ceramic plate, or silicone wafer.
  • the board 130 is required to have enough rigidity to be free from effects of deformation of the elastic sheet 120 , that is, the dent when the end of the probe 211 is pressed.
  • the probe end cleaning sheet 110 thus composed by laminating the cleaning thin film 110 , elastic sheet 120 , and board 130 sequentially from the upper layer side is formed in the same size and shape as the semiconductor wafer on which the semiconductor chip to be measured by the prober is formed. Therefore, the thickness dimension of the probe end cleaning sheet 100 is set at about 0 . 8 to 2 . 0 millimeters.
  • the following benefits are produced when the probe end cleaning sheet 100 is in the same size and shape as the semiconductor wafer forming the semiconductor chip thereon to be measured.
  • the semiconductor wafer forming the semiconductor chip to be measured is set in the prober, having a plurality held in one cassette, and each piece is taken out of the cassette, and electric characteristics are measured, and, by mixing probe end cleaning sheets 100 at a specified rate, for example, one probe end cleaning sheet 100 for every 20 semiconductor wafers, the probe 211 can be cleaned automatically.
  • the probe end cleaning sheet 100 is taken out, different from ordinary measurement, it is necessary to move up and down the probe 211 plural times, but it is possible to enter preliminarily the sequence of taking out the probe end cleaning sheet 100 , or to move the probe 211 up and down only in the case of probe end cleaning sheet 100 by detecting the probe end cleaning sheet 100 by some means.
  • probe end cleaning sheet 100 cleaning of the probe 211 is described below.
  • the prober 200 is roughly divided into a probe card 210 , a base 220 to which the probe card 210 is attached, and a suction table 230 for fixing the semiconductor wafer forming the semiconductor chip to be measured.
  • the probe card 210 includes a plurality of probes 211 disposed corresponding to the configuration of pads of semiconductor chips, a board 212 on which the probes 211 are mounted, and a probe support 213 mounted on the board 212 for supporting the probes 211 .
  • the probes 211 are mounted vertically on the board 212 , and the ends of the probes 211 contact with the pads vertically, and hence it is called the probe card of vertical operation type.
  • a nearly lateral Ushaped curvature 211 A is formed in order to keep a specified contact pressure between the pads and probes 211 by deforming when the ends are pressed against the pads.
  • the end of the probe 211 is formed in a spherical shape as shown in FIG. 6 (A).
  • the probe 211 is made of tungsten.
  • a wiring pattern 212 A connected to the probe 211 is formed, and the probe 211 is connected to the tester not shown in the drawing through this wiring pattern 212 A.
  • the probe support 213 is intended to prevent contact with an adjacent probe 211 when the probe 211 is pressed against the pad, and each probe 211 is inserted into an independent penetration hole (not shown).
  • the suction table 230 provided beneath the probe card 211 is to suck and fix not only the semiconductor wafer forming the semiconductor chip to be measured, but also the probe end cleaning sheet 100 .
  • the probe end cleaning sheet 100 is set at a specified position instead of the semiconductor wafer, that is, on the suction table 230 beneath the probe card 210 .
  • the probe end cleaning sheets 100 may be provided in the prober 200 aside from the semiconductor wafers forming the semiconductor chips to be measured, it may be designed to set the probe end cleaning sheet 100 when measurement of a specified number of semiconductor wafers is over.
  • the load of pushing the probe 211 to the probe end cleaning sheet 100 per probe is selected at a proper value by the material of the cleaning thin film 110 , elastic sheet 120 and probe 211 .
  • the fine abrasive powder 111 is applied to the cleaning thin film 110 , the surface is rough, and by this rough surface, the foreign matter adhered to the end of the probe 211 is removed. Further, as the elastic sheet 120 presses the probe 211 , it is dented according to the end shape of the probe 211 , and therefore if the fine abrasive powder 111 is applied on the surface of the cleaning thin film 110 , unlike the conventional ceramic plate, the end of the probe 211 is not scraped off at all.
  • the probe end cleaning sheet 100 is detached from the suction table 230 , and a new semiconductor wafer to be measured next is set, and the electric characteristics of the semiconductor chips formed on the new semiconductor wafer are measured in succession.
  • the cleaning thin film 110 is formed by applying fine abrasive powder 111 on the thin film 112 , but instead, as shown in FIG. 4, a cleaning metal thin film 140 may be used.
  • a cleaning metal thin film 140 the surface of a metal thin film 141 of, for example, tungsten is roughened by proper means such as sand blasting or etching to for a rough surface 142 . It is more effective to treat this surface with rhodium plating or the like.
  • the probe end cleaning sheet using such cleaning metal thin film 140 is formed, same as above, by laminating an elastic sheet 120 in the lower layer of the cleaning metal thin film 140 and a board 130 in the lower layer of the elastic sheet 120 , and the elastic sheet 120 and board 130 have same characteristics as mentioned above.
  • This cleaning metal thin film 140 is required to have enough rigidity so that the end of the probe 211 may not penetrate through the cleaning metal thin film 140 when the probe 211 is pressed. If the end of the probe 211 penetrates through the cleaning metal thin film 140 , the end of the probe 211 reaches up to the elastic sheet 120 provided in the lower layer of the cleaning metal thin film 140 , and therefore, as in the case of the conventional probe end cleaning member, a new foreign matter may be adhered to the end of the probe 211 .
  • the thickness dimension of the cleaning metal tin film 140 is preferred to be 5 micrometers to 50 micrometers when the material of the cleaning metal thin film 140 is tungsten, or 20 micrometers to 100 micrometers in the case of palladium.
  • the explanation so far relates to the probe card 210 of vertical operation type probe card in which the probe 211 contacts with the pad vertically, but, as shown in FIG. 5, it is similarly applied to the so-called cantilever type probe card in which the end of the probe 211 is folded and inclined to contact with the pad. Moreover, as shown in FIG. 6 (B), (C), in the case of the cantilever type probe card, the probe 211 may also have a flat end.
  • the probe end cleaning sheet of the invention is a probe end cleaning sheet for removing foreign matter adhered to the end of a probe, which comprises a thin film for cleaning having fine abrasive powder applied on the surface, an elastic sheet provided in a lower layer of this thin film for cleaning and having an elasticity, and a board provided in a lower layer of this elastic sheet, in which the thin film for cleaning is made of a material which is dented when the end of the probe is pressed with a specified load but is not torn by the end of the probe, and the elastic sheet is made of a material which is dented in the pressed portion by the end of the probe when the end of the probe is pressed to the thin film for cleaning with the specified load.
  • Other probe end cleaning sheet of the invention is a probe end cleaning sheet for removing foreign matter adhered to the end of a probe, which comprises a metal thin film for cleaning made of a metal having a hardness nearly same as or larger than that of the material for composing the probe, having a rough surface, an elastic sheet provided in a lower layer of this metal thin film for cleaning and having an elasticity, and a board provided in a lower layer of this elastic sheet, in which the metal thin film for cleaning is made of a material which is dented when the end of the probe is pressed with a specified load but is not torn by the end of the probe, and the elastic sheet is made of a material which is dented in the pressed portion by the end of the probe when the end of the probe is pressed to the metal thin film for cleaning with the specified load.
  • the specified load ranges from several grams to scores of grams, and a proper value may be selected depending on the material of the cleaning thin film, cleaning metal thin film, elastic sheet and probe.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Tests Of Electronic Circuits (AREA)
US09/249,858 1998-02-20 1999-02-16 Probe end cleaning sheet Abandoned US20020028641A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10056234A JPH11238768A (ja) 1998-02-20 1998-02-20 プローブ先端クリーニングシート
JP10-56234 1998-02-20

Publications (1)

Publication Number Publication Date
US20020028641A1 true US20020028641A1 (en) 2002-03-07

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Application Number Title Priority Date Filing Date
US09/249,858 Abandoned US20020028641A1 (en) 1998-02-20 1999-02-16 Probe end cleaning sheet

Country Status (6)

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US (1) US20020028641A1 (ja)
EP (1) EP0937541A3 (ja)
JP (1) JPH11238768A (ja)
CN (1) CN1232288A (ja)
SG (1) SG71910A1 (ja)
TW (1) TW409322B (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
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US20030089384A1 (en) * 2001-05-02 2003-05-15 Nihon Microcoating Co., Ltd. Cleaning sheet and method for a probe
US20050191952A1 (en) * 2004-03-01 2005-09-01 Kenji Mitarai Cleaning sheet for probe needles
US20080280542A1 (en) * 2007-05-10 2008-11-13 Kabushiki Kaisha Nihon Micronics Cleaning apparatus for a probe
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
DE102016119746A1 (de) * 2016-10-17 2018-04-19 Matuschek Meßtechnik GmbH Schleifscheibe
US10195648B2 (en) 2009-12-03 2019-02-05 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
US10717618B2 (en) 2018-02-23 2020-07-21 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
WO2021097121A1 (en) * 2019-11-14 2021-05-20 International Test Solutions, Inc. System and method for cleaning contact elements and support hardware or wire bonder using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method

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Publication number Priority date Publication date Assignee Title
DE19952183B4 (de) * 1999-10-29 2008-11-06 Micronas Gmbh Einrichtung zur Spitzenformung
US7182672B2 (en) 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
US6908364B2 (en) 2001-08-02 2005-06-21 Kulicke & Soffa Industries, Inc. Method and apparatus for probe tip cleaning and shaping pad
JP4745814B2 (ja) * 2005-12-19 2011-08-10 東京エレクトロン株式会社 プローブの研磨部材
CN100504398C (zh) * 2005-12-22 2009-06-24 王志忠 安装在测试卡上的探针表面处理的方法
KR100893877B1 (ko) 2007-08-06 2009-04-20 윌테크놀러지(주) 프로브 카드용 니들 단부의 연마 방법
JP6279309B2 (ja) * 2013-12-20 2018-02-14 スリーエム イノベイティブ プロパティズ カンパニー 研磨用クッション、研磨装置、研磨方法、及び当該研磨方法により研磨された対象物を含む物品
JP6292397B2 (ja) * 2014-04-23 2018-03-14 富士紡ホールディングス株式会社 研磨パッド
JP6531344B2 (ja) * 2015-02-18 2019-06-19 株式会社東京精密 プローブ装置
CN112720231B (zh) * 2020-12-30 2022-12-02 福建省佳美集团公司 一种陶瓷加工用抛光设备及抛光方法

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Publication number Priority date Publication date Assignee Title
JP3135741B2 (ja) * 1993-05-07 2001-02-19 富士写真フイルム株式会社 研磨体
JP3305557B2 (ja) * 1995-04-10 2002-07-22 大日本印刷株式会社 研磨テープ、その製造方法および研磨テープ用塗工剤
JPH08294872A (ja) * 1995-04-27 1996-11-12 Fuji Photo Film Co Ltd 研磨体

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030089384A1 (en) * 2001-05-02 2003-05-15 Nihon Microcoating Co., Ltd. Cleaning sheet and method for a probe
US20060030247A1 (en) * 2001-05-02 2006-02-09 Satoru Sato Cleaning sheet and method for a probe
US20070178814A1 (en) * 2001-05-02 2007-08-02 Nihon Micro Coating Co., Ltd. Method of cleaning a probe
US20050191952A1 (en) * 2004-03-01 2005-09-01 Kenji Mitarai Cleaning sheet for probe needles
US6960123B2 (en) 2004-03-01 2005-11-01 Oki Electric Industry Co., Ltd. Cleaning sheet for probe needles
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US10239099B2 (en) 2004-09-28 2019-03-26 International Test Solutions, Inc. Working surface cleaning system and method
US10406568B2 (en) 2004-09-28 2019-09-10 International Test Solutions, Inc. Working surface cleaning system and method
US20080280542A1 (en) * 2007-05-10 2008-11-13 Kabushiki Kaisha Nihon Micronics Cleaning apparatus for a probe
US10195648B2 (en) 2009-12-03 2019-02-05 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
US10919127B2 (en) 2016-10-17 2021-02-16 Matuschek Messtechnik Gmbh Grinding wheel
DE102016119746A1 (de) * 2016-10-17 2018-04-19 Matuschek Meßtechnik GmbH Schleifscheibe
DE102016119746B4 (de) 2016-10-17 2024-02-08 Matuschek Meßtechnik GmbH Schleifscheibe
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US10361169B2 (en) 2017-04-24 2019-07-23 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US10843885B2 (en) 2018-02-23 2020-11-24 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
US10717618B2 (en) 2018-02-23 2020-07-21 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
US11155428B2 (en) 2018-02-23 2021-10-26 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
US11434095B2 (en) 2018-02-23 2022-09-06 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
WO2021097121A1 (en) * 2019-11-14 2021-05-20 International Test Solutions, Inc. System and method for cleaning contact elements and support hardware or wire bonder using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer

Also Published As

Publication number Publication date
JPH11238768A (ja) 1999-08-31
TW409322B (en) 2000-10-21
EP0937541A2 (en) 1999-08-25
SG71910A1 (en) 2000-04-18
EP0937541A3 (en) 2002-07-10
CN1232288A (zh) 1999-10-20

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