EP0937541A3 - Probe end cleaning sheet - Google Patents

Probe end cleaning sheet Download PDF

Info

Publication number
EP0937541A3
EP0937541A3 EP99301238A EP99301238A EP0937541A3 EP 0937541 A3 EP0937541 A3 EP 0937541A3 EP 99301238 A EP99301238 A EP 99301238A EP 99301238 A EP99301238 A EP 99301238A EP 0937541 A3 EP0937541 A3 EP 0937541A3
Authority
EP
European Patent Office
Prior art keywords
probe
thin film
cleaning
elastic sheet
pressed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99301238A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0937541A2 (en
Inventor
Masao Nihon Denshizairyo Kabushiki Kaisha Okubo
Shin'ichiro Nihon Denshizairyo K.K. Kozaki
Shun'ichiro Nihon Denshizairyo K.K. Nishizaki
Teruhisa Nihon Denshizairyo K.K. Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Publication of EP0937541A2 publication Critical patent/EP0937541A2/en
Publication of EP0937541A3 publication Critical patent/EP0937541A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Tests Of Electronic Circuits (AREA)
EP99301238A 1998-02-20 1999-02-19 Probe end cleaning sheet Withdrawn EP0937541A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10056234A JPH11238768A (ja) 1998-02-20 1998-02-20 プローブ先端クリーニングシート
JP5623498 1998-02-20

Publications (2)

Publication Number Publication Date
EP0937541A2 EP0937541A2 (en) 1999-08-25
EP0937541A3 true EP0937541A3 (en) 2002-07-10

Family

ID=13021424

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99301238A Withdrawn EP0937541A3 (en) 1998-02-20 1999-02-19 Probe end cleaning sheet

Country Status (6)

Country Link
US (1) US20020028641A1 (ja)
EP (1) EP0937541A3 (ja)
JP (1) JPH11238768A (ja)
CN (1) CN1232288A (ja)
SG (1) SG71910A1 (ja)
TW (1) TW409322B (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19952183B4 (de) * 1999-10-29 2008-11-06 Micronas Gmbh Einrichtung zur Spitzenformung
JP2002326169A (ja) * 2001-05-02 2002-11-12 Nihon Micro Coating Co Ltd 接触子クリーニングシート及び方法
US6908364B2 (en) 2001-08-02 2005-06-21 Kulicke & Soffa Industries, Inc. Method and apparatus for probe tip cleaning and shaping pad
US7182672B2 (en) 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
JP2005249409A (ja) 2004-03-01 2005-09-15 Oki Electric Ind Co Ltd プローブ針用クリーニングシート
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
JP4745814B2 (ja) * 2005-12-19 2011-08-10 東京エレクトロン株式会社 プローブの研磨部材
CN100504398C (zh) * 2005-12-22 2009-06-24 王志忠 安装在测试卡上的探针表面处理的方法
JP2008281413A (ja) * 2007-05-10 2008-11-20 Micronics Japan Co Ltd プローブのためのクリーニング装置
KR100893877B1 (ko) 2007-08-06 2009-04-20 윌테크놀러지(주) 프로브 카드용 니들 단부의 연마 방법
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
JP6279309B2 (ja) * 2013-12-20 2018-02-14 スリーエム イノベイティブ プロパティズ カンパニー 研磨用クッション、研磨装置、研磨方法、及び当該研磨方法により研磨された対象物を含む物品
JP6292397B2 (ja) * 2014-04-23 2018-03-14 富士紡ホールディングス株式会社 研磨パッド
JP6531344B2 (ja) * 2015-02-18 2019-06-19 株式会社東京精密 プローブ装置
DE102016119746B4 (de) * 2016-10-17 2024-02-08 Matuschek Meßtechnik GmbH Schleifscheibe
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US11434095B2 (en) 2018-02-23 2022-09-06 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
CN112720231B (zh) * 2020-12-30 2022-12-02 福建省佳美集团公司 一种陶瓷加工用抛光设备及抛光方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5456734A (en) * 1993-05-07 1995-10-10 Fuji Photo Film Co., Ltd. Abrasive member
EP0737549A2 (en) * 1995-04-10 1996-10-16 Dai Nippon Printing Co., Ltd. Abrasive tape, process for producing it, and coating agent for abrasive tape
US5672185A (en) * 1995-04-27 1997-09-30 Fuji Photo Film Co., Ltd. Abrasive member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5456734A (en) * 1993-05-07 1995-10-10 Fuji Photo Film Co., Ltd. Abrasive member
EP0737549A2 (en) * 1995-04-10 1996-10-16 Dai Nippon Printing Co., Ltd. Abrasive tape, process for producing it, and coating agent for abrasive tape
US5672185A (en) * 1995-04-27 1997-09-30 Fuji Photo Film Co., Ltd. Abrasive member

Also Published As

Publication number Publication date
EP0937541A2 (en) 1999-08-25
TW409322B (en) 2000-10-21
US20020028641A1 (en) 2002-03-07
SG71910A1 (en) 2000-04-18
CN1232288A (zh) 1999-10-20
JPH11238768A (ja) 1999-08-31

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