經濟部中央揉率局負工消費合作社印製 409322 A7 ____B7_ 五、發明説明（丨） 本發明係有關於一種可除去黏附在探針末端之外來物 質的探針端部清潔片。 供測量形成於一半導體晶圓上之半導體晶片的各種電 性之探針板的探針，係被緊緊地壓抵於該等半導體晶片的 接點上。因此，乃會黏附著從該等接點上刮下之例如鋁粉 末的外來物質。當該接點係由銘與銅的合金組成等，該外 來物乃特別容易黏附於探針的端部。除非該等外來物質被 從探針端部除去，否則在探針與接點之間會發生無效的接 觸，並破壞電接觸，而使其正確的性質不能被測出。假使 該探針移開一段較長的時間，則其接觸電阻會趨於變高。 於是’為了解決該等問題，在每一定數目的探測次數 之後，乃須藉著清潔探針端部來將該等外來物質去除。 為了此等清潔，有一種方法係利用陶瓷板，及一種利 用探針端部清潔元件來碰刺探針末端的方法係已習知。 於前者方法’即利用一陶瓷板的方法中，乃使用一與 半導體晶圓的形狀相同之陶瓷板β即是，探針的端部係被 重壓抵於該陶瓷板如與探測的狀況相同，而使鋁粉或其它 外來物質被從該探針端部去除β 於後者方法，即利用一探針端部清潔元件的方法中， 探針端部係藉著將其探針末端剌穿該探針端部清潔元件而 被清潔。 但是’該前者方法’即是利用陶瓷板來清潔探針者， 乃會有下列問題。 即是，在多次的清潔之後，其探針的末端會被刮損。 本紙張尺度速用中國國家橾準（CNS ) A4规格（210X297公釐） n n Ί ,,--tr------.^- (請先閲讀背面之注意事項再填寫本頁) 4 Μ濟郏中夹揉準局貝工消资合作社印装 409322 Α7 Β7 $、發明説明（2 ) 探針端部通常係成球型俾可妥順地與接點接觸，但此端部 會被陶曼板磨光，而最後變成平直的。具有平直端部的探 針不能妥順地與接點觸接，且其接觸電阻會改變，而接點 會被磨損。此具有平直端部的探針並不能被使用者、或丰 導體裝置製造者所修復’而僅能由該探針板製造者來修復 。因此’使用者必須廢棄具有平直端部的探針，或向探針 板製造者要求修復。 在後者方法，即是利用探針端部清潔元件的方法中， 雖其係可以清潔而維持其造型，即在探針端部的圓球型， 但該探針端部清潔元件的基本材料，例如矽膠或胺基甲酸 乙酯橡膠，乃可能會黏附在該探針端部。換而言之，從接 點黏附的外來物質雖可被清潔除去，但一種新的外來物質 亦可能被黏附於該探針端部。而且，在該探針端部清潔元 件中’從該探針端部除去的外來物質例如鋁粉末等乃會留 存過多’而使其除去外來物質的能力降低，所以不能每一 次在相同的位置皆可完成清潔·»因此，其乃必須在每清潔 數次後即改變該探針端部清潔元件的位置。 本發明係由於上述背景而研發設計，故其目的主要係 在提供一種探針端部清潔片可以去除外來物質，而不會使 探針端部變形’且不會使新的外來物質黏附於探針端部。 本發明之探針端部清潔片係為一種可去除黏附在探針 端部之外來物質的探針端部清潔片，包含一清潔薄膜具有 細研磨粉塗佈於其表面，或一金屬清潔薄膜係由金屬製成 而具有大致相同於或大於構成探針之金屬的硬度，並具有 本紙張尺度適用中國國家揉準（CNS ) A4規格（210 X 297公釐） ---------參----'—tr------^ (請先閲讀背面之注意事項再敁寫本頁) 經濟部中央樣準局貝工消費合作社印製 409322 Α7 Β7 五、發明説明（3 ) 一粗链面，一彈性片設在該清潔缚膜或金屬清潔薄膜的底 層而具有彈性；及一板設在該彈性片的底層。 該清潔薄膜或金屬清潔薄膜係由一種材料所製成，當 探針端部以預定壓力.壓著時其會凹入但不會被探針末端穿 破；而該彈性片係由一種材料製成’當探針端部以該預定 壓力壓著於該清潔薄膜或金屬清潔薄膜時，其會在該探針 端部壓著部份凹入。 圖式之簡單說明 第1圚係為一使用本發明實施例之探針端部清潔片來 清潔探針的示意說明圖。 第2圖係為本發明實施例之探針端部清潔片的（A)放大 截面示意圊；（B)平面示意圊。 第3圖係為一結構示意圖用以說明使用本發明實施例 之探針端部清潔片來清潔探針。 第4圖係為本發明另一實施例之探針端部清潔片的（a) 放大載面示意圖；（B)平面示意圖。 第5圖係為一結構示意圖用以說明利用本發明另一實 施例之探針端部清潔片來清潔探針。 第ό圖係為一不意說明困不出以本發明實施例之探針 端部清潔片來清潔的探針端部之形狀。 第1圖係為一使用本發明實施例之探針端部清潔片來 清潔探針的示意說明圖；第2囷係為本發明實施例之探針 端部清潔片的（Α)放大載面示意圈，（Β)平面示意圖；第3 圖係為一結構示意圖用以說明使用本發明實施例之探針端 本紙張尺度通用中國國家標準（CNS)八4規格（2丨0><297公釐） I----_----装----'--’訂------腺 (請先閲讀背面之注意事項再V寫本頁) 6 409322 A7 B7 經濟部中央橾準局舅工消费合作杜印策 五、發明説明（4 ) 部清潔片來清潔探針；第4囷係為本發明另一實施例之探 針端部清潔片的（A)放大截面示意圖，（b)平面示意圖；第 5圈係為一結構示意圖用以說明利用本發明另一實施例之 探針端部清潔片來清潔探針；第6圓係為一示意說明圖示 出以本發明實施例之探針端部清潔片來清潔的探針端部之 形狀。同時，在各囷式t，其各部份的尺寸比例係為了繪 圚的方便，而完全不同於各尺寸的實際比例。 在本發明之一實施例中的探針端部清潔片1〇〇,如第1 圖所示’有一探針端部清潔片可除去黏附在一探針211末 端的外來物質’其包含一清潔薄膜no具有細研磨粉in塗 佈於表面上，一彈性片120設在該消潔薄膜11 〇之底層而具 有彈性，及一板130設於該彈性片120的底層。 如第2圖所示，該清潔薄膜11〇係以黏膠或類似物將細 研磨粉111塗佈於該薄膜112之表面上來構成β 該細研磨粉111乃可使用鋁粉、碳化矽粉、鑽石粉或 類似物等，其材料與大小最好視該探針211的材料及大小 來決定。 該清潔薄膜110很重要的一點係要具備足夠的剛性， 俾使該探針211被以一預定壓力壓抵於該清潔薄膜110時， 其末端不會刺穿該薄膜此亦精細地與下述之彈性片120 的性質有關，而若該探針211的末端穿過該清潔薄膜11〇， 該探針211的末端會達到設在該清潔薄膜11〇底層的彈性片 120 ’故假若使用習知的探針端部清潔元件，則會有一些 新的外來物質可能黏附於該探針211末端 本紙張又度適用中國國家標準（CNS > A4規格（210X29?公釐） I: .------^-------it------it (請先聞讀背面之注意事項再ir寫本頁) 經濟部中央標準局員工消费合作社印« 409322 A7 --~~______B7_______ 五、發明説明（5 ) 該清潔薄膜110的厚度尺寸，最好係為例如100微米或 者更少。 在另一方面，铱彈性片120係由具有均勻厚度的矽膠 或胺基甲酸乙酯橡膠所製成。於此，以均勻厚度尺寸來佈 設該彈性片120的理由乃說明如下。即，假使該彈性片120 的厚度不均勻一致，則當在清潔該探針211時，該探針211 的末端會不規則地觸接該探針端部清潔片100，而在清潔 過程中，會有一超過的壓力施加於該探針211來接觸於第 一個觸接的地方。因此，該彈性片120的厚度尺寸最好係 為1毫米或者更少。 該彈性片120須要的硬度如上所述乃很精細地與該清 潔薄膜110的性質有關，最好其硬度係為使每一探針211以 數克至許多克的壓力即能凹入。 即是’該彈性片120係由具有該等硬度之材料所製成 ’俾當該探針211的端部以預定壓力歷著於該清潔薄膜時 ’能形成該探針211末端的壓著部份。例如，如上所述， 矽膠或胺基甲酸乙酯橡膠可被用來當作該彈性片120 ^ 而且，當該彈性片120係由矽膠或胺基甲酸乙酯橡膠 所製成時，其有一優點係不必膠劑或類似物來黏住該清潔 薄膜110 »此即，只要將該清潔薄膜11〇緊壓在由矽膠或胺 基甲酸乙酯橡膠所製成的彈性片120上，該清潔薄膜11〇即 會被吸住並固定在該彈性片120上，故其乃容易安裝。假 使該清潔薄膜110係被以黏膠或類似物來黏住彈性片120， 萬一黏膠塗佈不均勻，則難然該彈性片12〇厚度尺寸一致， 本紙張尺度逍用中國國家梯準{ CNS ) A4規格（210X297公釐） ： ；^-.ir------^ {請先閲讀背面之注意事項再>爲本頁) 經濟部中央橾率扃負工消費合作社印装 402322 at _ B7 五、發明説明（< ) 0 7 但由於不均勻的黏著，在清潔薄膜110上會形成起伏高低 ’而損及正確的清潔操作，惟因為未使用膠劑故此等問題 不會發生· 壓著於該探針211的預定壓力為每一探針211數克至許 多克’而當該清潔薄膜110係由碳化矽製成，該彈性片120 由矽膠製成，且該探針211係為鎢時，其最好約為三至十 克。 另外’該板130係由例如金屬板、陶瓷板或矽晶圚等 所製成。該板130必須具有足夠的剛性以免受該彈性片120 變形所影響’即當該探針211末端壓著時的凹入。 該探針端部清潔片100乃由最上層依序疊合該清潔薄 膜Π0、彈性片120及板130等所組成，其形狀與大小乃相 同於該半導體晶圓’在該晶圓上的半導體晶片係將被該探 針所測量者。因此，該探針端部清潔片1〇〇的厚度乃被設 定成約0.8至2.0毫米左右》 當該探針端部清潔片100的大小和形狀相同於其上之 半導體晶片即將被測量的半導體晶圓時，乃會產生以下的 好處》 首先’該形成將被測量的半導體晶片之半導體晶圓係 被放在探測器中’有多數個被置於一匣盒中，而逐片被由 該匣盒中取出’以測量其電性，並以一定的比例，例如每 二十個半導體晶圓對一探針端部清潔片1〇〇來混合該等探 針端部清潔片100，探針211乃得以自動地被清潔。但是， 在此情況下，當該探針端部清潔片1〇〇被取出時，不同於 本紙張纽適用中關家料（CNS > A4^ (21Gx297公董） - -9 - I.-----^-------it------^ (請先閲讀背面之注意事項再本頁) 經濟部中央標準局負工消費合作杜印裝 409322 A7 _B7_ 五、發明説明（7 ) 一般的測量，其乃須將該探針211上下移動許多次，但僅 能在該探針端部清潔片1⑻有被以某些手段裝置檢測的情 況下，其才能進入先前將該探針端部清潔片100取出，或 上下移動該探針211的連串程序中。 該等探針端部清潔片1〇〇對探針211的清潔乃如下所述 〇 首先，有一使用即將被該探針端部清潔片100清潔的 探針211之探測器200乃被說明》 如第3圖所示’該探測器200係大略分成一探針板210 、一基座220其上附設該探針板210 ’及一吸枱230可供固 定形成要被測量的半導體晶片之半導體晶圓》 該探針板210包含多數的探針211佈列對應於半導體晶 片接點的配置，有一板212其上裝設該等探針211，及一探 針支架213設在該板212上可供撐持探針211。在該探針板 210中，各探針211係垂設在該板212上，且各探針211的端 部係垂向接觸各接點，因此被稱為垂直操作式的探針板。 同時，在該探針211上乃形成一近乎橫向U型的彎西部2〗1A ，俾使其末端壓抵於接點時，能在接點與探針211之間保 持一定的觸接壓力，該探針211的末端係形成園球狀如第6 圖所示。該探針211乃由鎢所製成。 在該探針板210的板212上，乃設有一線路囷案212A 連接於該探針21〗，而該探針211即經由此線路圖案212A 連接於未示在圈中的測試器。 該探針支架213係被用來當該探針211壓抵著接點時可 本紙張尺度適用中國國家禚準（CNS) A4規格（2IOX297公釐） ^ .------^----)—ir------^ (請先聞讀背面之注意事項再填為本頁) 10 409322 經濟部中央標準局β：工消費合作杜印裂 A7 B7 五、發明説明（8 ) 避免接觸相鄰的探針211 ’且各探針211乃被插入一獨立的 貫穿孔（未示出）。 設在該探針板211下方的吸枱230係用來吸住並固定該 形成將被測量的半導體晶片之半導體晶圓，及該探針端部 清潔片100 » 藉由該等構造的探測器200，探針211的端部乃於下列 程序中被該探針端部清潔片100所清潔。首先，該探針端 部清潔片100係被設在一特定位置來替代該半導體晶圓， 即是，位於該吸枱230上而在探針板210下方。於此定位， 除了如上述方法以對半導體晶圓之一定比例來混合該等探 針端部清潔片100，該等探針端部清潔片100可被設在該探 測器200中，位於形成將被測量的半導體晶片之半導體晶 圓的旁邊’其乃可在當一定數目的半導體晶圓被測量完後 ，用來設定該探針端部清潔片10(^ 當該探針端部清潔片100被定位在吸枱230上時，該等 探針板210及定位該探針端部清潔片1〇〇的吸枱230之任一 者或兩者一起上下移動’而使該探針211末端重複地壓抵 於該探針端部清潔片100的表面》 在此時，推迫探針211至該探針端部清潔片1〇〇之每一 探針的壓力，係由該等清潔薄膜110、彈性片120與探針2II 等之材質來選擇一適當的數值。 在此方法中，因探針211末端被壓抵於探針端部清潔 片100，如第1圖所示，而未使清潔薄膜i 1〇破裂，故由於 彈性片120所形成的凹入使其被包覆在清潔薄膜120的狀態 會一再重複。 因該細研磨粉111係被塗佈於清潔薄膜110，故其表面 粗糙，而藉由此等粗糙表面，黏附在探針211末端的外來 物質乃可被除去。而且，當彈性片120抵壓著探針211時， 本紙張尺度逋用中國_家揉準（CNS > A4规格（210X297公釐} ----------^----^--•訂------線 (請先閲讀背面之注f項再壤客本頁) 11 經濟部中央標準局属工消費合作社印製 409322 A7 ___B7_ 五、發明説明（9 ) 其係依據探針211的末端形狀來凹入，因此假使細研磨粉 111被塗佈於該清潔薄膜110之表面上，則不像習用的陶瓷 板，探針211的末端一點也不會被刮損。 當探針211的清潔完成後，該探針端部清潔片1〇〇乃從 吸枱230移除》嗣有一將要被測量的新半導體晶圓被置入 ，而由該新的半導體晶圓所形成之半導趙晶片的電性將繼 續被測量。 在此探針端部清潔片100中，該清潔薄膜110係藉塗佈 細研磨粉111於該薄膜112上所形成，但取而代之，如第4 圖所示’一清潔金屬薄膜140可被使用。於該清潔金屬薄 膜140中’金屬薄膜的表面141 ’例如鎢乃被以如喷砂或蝕 刻等適當手段來粗化成一粗糙面142»若以鍍铑或類似物 來處理該表面則將更為有效。 使用該等清潔金屬薄膜140之探針端部清潔片。有些 乃如前所述製成，即在該清潔金屬薄膜140的底層疊合一 彈性片120 ’並在該彈性片120的底層疊合一板130，而該 彈性片120與板130皆有與前述相同的性質。 此等清潔金屬薄膜140，如同前述的清潔薄膜11〇，乃 必須具有足夠的剛性，俾當探針211被壓著時其末端不會 穿透該清潔金屬薄膜140。假若探針211末端穿過該清潔金 屬薄膜140 ’則其末端會達到設在該清潔金屬薄膜14〇底層 的彈性>5 120，因此，若在習知的探針端部清潔元件之情 況下，可能會有新的外來物質黏附於該探針211末端。 該清潔金屬薄膜140的厚度尺寸，在其材質為鎢時， 本紙張ΛΑϋ财關家縣（CNS ) Α4ΛΙ^·~ΠΗ)Χ297公釐) ' • 12 - ---.------裝----Κ--.訂------線 (锖先閲讀背面之注項再r寫本頁) 經濟部中央標窣局貝工消費合作杜印製 A7 ------B7 五、發明説明（1〇 ) 係以5至50微米為佳，若為鈀時，則以2〇至ι00微米為宜。 舉例而言’若使用探針端部清潔月10〇，當該探針211 之末端接觸電阻為10歐姆，由於所積存的外來物質係藉著 壓抵探針211末端並上下移動探針211而被清潔大約十次， 該接觸電阻會變成0.5歐姆或者更少，依照試驗結果，在 測量生成於該半導想晶圓上之半導體晶片的電性時，將沒 有問題<* 迄此之說明乃有關於垂直操作式探針板21〇其探針211 係垂向地接觸接點’但如第5圖所示，其亦同樣地使用於 所謂懸臂式的探針板，其中探針211的端部係被摺曲並斜 向接觸接點。而且’如第6(B)(C)圖中所示，若為懸臂式 探針板，該探針211亦可具有一平頭端部。 本發明之探針端部清潔片係為一種可除去黏附在探針 末端之外來物質的探針端部清潔片，其包含一可供清潔的 薄膜具有細研磨粉塗佈於其表面，一彈性片設在該薄膜的 底層而具有彈性’及一板設在該彈性片的底層，其中該清 潔薄膜係由一種材料所製成，當探針末端以一特定壓力壓 著時其會凹入但不會被該探針末端穿破，而該彈性片係以 一種材料製成，當探針末端以該特定壓力壓著該清潔薄膜 時，其會在該探針末端壓著部份凹入。 因此，當該探針壓抵著該探針端部清潔片時，該探針 末端會被包覆於清潔薄膜中’而外來物質會被塗佈於該清 潔薄膜上的細研磨粉所除去。此時，因為該清潔薄膜與彈 性片係依據該探針末端的形狀而凹下，該探針末端乃不會 (210X297公釐） ί~~~'---.----裝------.訂------線 (锖先聞讀背面之注意事項再妒夂本頁) 經濟部中央樣準局負工消費合作社印袋 409322 A7 ______B7 五、發明説明（u ) 如在習用陶瓷板中般地被刮損。而且，由於探針末端沒有 穿透該清潔薄膜，組成該彈性片的材料乃不會黏附在該探 針末端而形成一種新的外來物質。又且，其外來物質可被 除去而不會使探針端部變形，故可使該探針端部清潔片避 免積存在探針末端的新外來物質。 本發明之另一探針端部清潔片係為一種可除去黏附在 探針末端之外來物質的探針端部清潔片，其包含一清潔金 屬薄膜由一種金屬所製成’具有近乎相同或大於組成該探 針的材料之硬度’並有一粗梭面，一彈性片設在該清潔金 屬薄膜的底層乃具有彈性’及一板設在該彈性片的底層， 其中該清潔金屬薄膜係由一種材料所製成，當該探針末端 以一定壓力壓著時其會凹下但不會被該探針端部穿破，而 該彈性片係由一種材料所製成’當該探針末端以一定壓力 壓著該清潔金屬薄膜等時’其會在探針末端屋著部份凹下 在該探針端部清潔片中’如同前述的探針端部清潔片 ’當該探針壓抵著探針端部清潔片時，該探針末端係被包 覆在該清潔薄膜中，而外來物質乃被塗佈於清潔薄膜上的 細研磨粉所除去。此時，由於該清潔薄膜與彈性片係依照 探針末端的形狀而凹入，故探針末端乃不會如在習用陶竞 板辛地到損。而且，因為該探針末端沒有穿透該清潔薄膜 ，組成該彈性片的材料不會黏著於探針末端而形成新的外 來物質。又且，其外來物質可被除去而不會使該探針變形 ，故可使該探針端部清潔片避免積存在探針末端的新外來 ^張尺度適用中园國家梯準（CNS ) A4规格（210X297公釐）------ -14 - I--丨.：--^----裝----_--訂------線 (請先閲讀背面之注意事項再球氣本頁) 409322 A7 B7 五、發明説明（12) 物質。 其特定壓力的範圍從幾克至許多克，而適當數值乃可 依該清潔薄膜、清潔.金屬薄膜、彈性片與探針等之材質來 選擇。 文件標號對照 100···探針端部清潔片 200…探測器 110···清潔薄膜 2Hl···探針板 11卜“細研磨粉 211…探針 112…薄膜 211A…變曲部 120…彈性片 212…板 130…板 212A…線路圊案 140···清潔金屬薄膜 213…支架 141…表面 220…基座 142·*·粗链面 230…吸枱 (請先S请背希之泣意事項存填W本\8〇 •装· 订 經濟部中央樣準局員工消费合作杜印製 本紙張尺度適用中國固家標準（CNS >八4規格（210X297公釐） 15Printed by the Consumers' Cooperative of the Central Rubbing Bureau of the Ministry of Economic Affairs 409322 A7 ____B7_ V. Description of the Invention (丨) The present invention relates to a probe tip cleaning sheet that can remove foreign substances adhered to the ends of the probe. Probes for measuring various electrical probe boards of semiconductor wafers formed on a semiconductor wafer are tightly pressed against the contacts of the semiconductor wafers. Therefore, foreign substances such as aluminum powder that are scraped from these contacts will adhere. When the contact is made of an alloy of copper and copper, the foreign object is particularly easy to adhere to the end of the probe. Unless such foreign matter is removed from the probe tip, an invalid contact will occur between the probe and the contact, and the electrical contact will be destroyed, making its correct properties undetectable. If the probe is removed for a longer period of time, its contact resistance will tend to increase. So to solve these problems, after every certain number of detections, the foreign matter must be removed by cleaning the tip of the probe. For such cleaning, there is a known method using a ceramic plate and a method using a probe tip cleaning member to strike the tip of the probe. In the former method, that is, a method using a ceramic plate, a ceramic plate having the same shape as the semiconductor wafer is used. That is, the end of the probe is pressed against the ceramic plate as if it is the same as the detection condition. In the latter method, aluminum powder or other foreign substances are removed from the probe tip. In the latter method, that is, by using a probe tip cleaning element, the probe tip is passed through the probe tip. The probe tip is cleaned by cleaning the element. However, the "the former method" is to use a ceramic plate to clean the probe, but has the following problems. That is, the tip of the probe is scratched after multiple cleanings. This paper is a quick-use China National Standard (CNS) A4 specification (210X297 mm) nn Ί ,,-tr ------. ^-(Please read the precautions on the back before filling this page) 4 Μ Printed in 409322 Α7 Β7 $, inventories (2) The end of the probe is usually a ball type, which can contact the contacts smoothly, but this end will be pottery. The man board was polished and eventually flattened. A probe with a straight end cannot properly contact the contact, and its contact resistance will change, and the contact will be worn. This probe with a straight end cannot be repaired by the user or the manufacturer of the conductor device ', but can only be repaired by the probe card manufacturer. Therefore, the user must discard the probe with the straight end, or ask the probe board manufacturer for repair. In the latter method, that is, the method using the probe tip cleaning element, although it can be cleaned and maintain its shape, that is, the ball type at the probe tip, the basic material of the probe tip cleaning element, For example, silicone or urethane rubber may adhere to the end of the probe. In other words, although a foreign substance adhering from a contact can be cleaned and removed, a new foreign substance may also be adhering to the tip of the probe. Furthermore, in the probe tip cleaning element, 'foreign material removed from the probe tip, such as aluminum powder, will remain too much,' thereby reducing its ability to remove foreign matter, so it cannot be used at the same location every time. Cleaning can be done »Therefore, it is necessary to change the position of the probe tip cleaning element after every cleaning. The present invention is developed and designed due to the above background, so the main purpose of the invention is to provide a probe tip cleaning sheet that can remove foreign substances without deforming the probe tip 'and does not cause new foreign substances to adhere to the probe. Needle end. The probe tip cleaning sheet of the present invention is a probe tip cleaning sheet that can remove foreign substances adhered to the probe tip, and includes a cleaning film with a fine abrasive powder coated on its surface, or a metal cleaning film It is made of metal with a hardness that is approximately the same as or greater than that of the metal constituting the probe, and has the paper size applicable to China National Standard (CNS) A4 (210 X 297 mm) -------- -Refer to '--tr ------ ^ (Please read the notes on the reverse side before writing this page) Printed by the Central Samples Bureau of the Ministry of Economy, Shellfish Consumer Cooperative, 409322 Α7 Β7 V. Description of the invention ( 3) a thick chain surface, an elastic sheet is provided on the bottom layer of the cleaning film or metal cleaning film to have elasticity; and a plate is provided on the bottom layer of the elastic sheet. The cleaning film or metal cleaning film is made of a material, and when the probe tip is pressed with a predetermined pressure, it will be recessed but not penetrated by the probe tip; and the elastic sheet is made of a material When the end of the probe is pressed against the cleaning film or the metal cleaning film with the predetermined pressure, it will be recessed at the end of the probe. Brief Description of the Drawings Fig. 1 is a schematic explanatory diagram of cleaning a probe using a probe tip cleaning sheet according to an embodiment of the present invention. Fig. 2 is an enlarged cross-sectional view (A) of a probe tip cleaning sheet according to an embodiment of the present invention; (B) a schematic plan view of a plane. Fig. 3 is a schematic structural diagram for explaining the probe cleaning using the probe tip cleaning sheet according to the embodiment of the present invention. FIG. 4 is a schematic (a) enlarged surface view of a probe tip cleaning sheet according to another embodiment of the present invention; and (B) a schematic plan view. Fig. 5 is a schematic structural diagram for explaining cleaning of a probe by using a probe tip cleaning sheet according to another embodiment of the present invention. FIG. 6 is a diagram illustrating a shape of a probe tip which cannot be cleaned by the probe tip cleaning sheet according to the embodiment of the present invention. FIG. 1 is a schematic explanatory diagram of cleaning a probe using a probe end cleaning sheet according to an embodiment of the present invention; and FIG. 2 is an (A) enlarged carrying surface of the probe end cleaning sheet according to an embodiment of the present invention. Schematic circle, (B) plan schematic diagram; FIG. 3 is a schematic structural diagram for explaining the use of the probe end of the embodiment of the present invention. Mm) I ----_---- installation ----'-- 'order ------ gland (please read the precautions on the back before writing this page) 6 409322 A7 B7 Ministry of Economic Affairs Central Government Bureau of Standards, Labor and Consumer Cooperation, Du Yince V. Description of the Invention (4) The cleaning sheet is used to clean the probe; The fourth series is (A) an enlarged section of the probe end cleaning sheet according to another embodiment of the present invention. Schematic diagram, (b) Plane schematic diagram; The fifth circle is a structural diagram for explaining the use of the probe end cleaning sheet of another embodiment of the present invention to clean the probe; the sixth circle is a schematic explanatory diagram showing The shape of the probe tip cleaned by the probe tip cleaning sheet according to the embodiment of the present invention. At the same time, in each formula t, the size ratio of each part is for the convenience of drawing, and it is completely different from the actual ratio of each size. In one embodiment of the present invention, a probe tip cleaning sheet 100, as shown in FIG. 1 'a probe tip cleaning sheet can remove foreign matter adhering to the end of a probe 211', which includes a cleaning The film no has a fine grinding powder in coated on the surface, an elastic sheet 120 is provided on the bottom layer of the cleaning film 110 and has elasticity, and a plate 130 is provided on the bottom layer of the elastic sheet 120. As shown in FIG. 2, the cleaning film 11 is formed by applying a fine grinding powder 111 on the surface of the film 112 with an adhesive or the like to form β. The fine grinding powder 111 may use aluminum powder, silicon carbide powder, The material and size of diamond powder or the like are preferably determined according to the material and size of the probe 211. An important point of the cleaning film 110 is that it has sufficient rigidity. When the probe 211 is pressed against the cleaning film 110 with a predetermined pressure, its end will not pierce the film. The properties of the elastic sheet 120 are related, and if the end of the probe 211 passes through the cleaning film 110, the end of the probe 211 will reach the elastic sheet 120 provided on the bottom layer of the cleaning film 110. New probe end cleaning element, some new foreign substances may adhere to the end of the probe 211. This paper is also applicable to Chinese national standards (CNS > A4 size (210X29? Mm) I: .--- --- ^ ------- it ------ it (Please read the notes on the back before writing this page) Printed by the Consumers' Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs «409322 A7-~~ ______B7_______ 5. Description of the invention (5) The thickness of the cleaning film 110 is preferably 100 micrometers or less. On the other hand, the iridium elastic sheet 120 is made of silicon rubber or urethane rubber with uniform thickness. The reason why the elastic sheet 120 is arranged with a uniform thickness The explanation is as follows. That is, if the thickness of the elastic sheet 120 is not uniform, when the probe 211 is cleaned, the end of the probe 211 will irregularly contact the probe end cleaning sheet 100, and the During the cleaning process, an excessive pressure is applied to the probe 211 to contact the first contacting place. Therefore, the thickness of the elastic sheet 120 is preferably 1 mm or less. The elastic sheet 120 requires As described above, the hardness is very closely related to the properties of the cleaning film 110, and it is preferable that the hardness is such that each probe 211 can be recessed with a pressure of several grams to many grams. That is, the elastic sheet 120 It is made of a material having such hardness, 'When the end of the probe 211 is exposed to the cleaning film with a predetermined pressure,' it can form a pressed portion of the end of the probe 211. For example, as described above Silicone or urethane rubber can be used as the elastic sheet 120. Moreover, when the elastic sheet 120 is made of silicone or urethane rubber, it has an advantage that no adhesive or Analogs to stick the cleaning film 110 »that is, as long as The cleaning film 110 is tightly pressed on the elastic sheet 120 made of silicone or urethane rubber. The cleaning film 110 is sucked and fixed on the elastic sheet 120, so it is easy to install. .If the cleaning film 110 is adhered to the elastic sheet 120 with adhesive or the like, in case the adhesive is not uniformly applied, it is difficult for the elastic sheet 120 to have the same thickness and size. Quasi {CNS) A4 specification (210X297 mm): ^-. Ir ------ ^ {Please read the notes on the back then > for this page) 402322 at _ B7 V. Description of the invention (<) 0 7 However, due to uneven adhesion, undulations will be formed on the cleaning film 110, which impairs the correct cleaning operation, but these problems are not caused by the absence of adhesive. What happens? The predetermined pressure on the probe 211 is several grams to many grams per probe 211. When the cleaning film 110 is made of silicon carbide, the elastic sheet 120 is made of silicon rubber, and the probe When the needle 211 is tungsten, it is preferably about three to ten grams. The plate 130 is made of, for example, a metal plate, a ceramic plate, or a silicon wafer. The plate 130 must have sufficient rigidity so as not to be affected by the deformation of the elastic sheet 120 ', that is, the depression when the tip of the probe 211 is pressed. The probe tip cleaning sheet 100 is composed of the uppermost layer sequentially stacking the cleaning film Π0, the elastic sheet 120, and the plate 130. The shape and size are the same as those of the semiconductor wafer on the wafer. The wafer will be measured by the probe. Therefore, the thickness of the probe tip cleaning sheet 100 is set to about 0.8 to 2.0 mm. When the probe tip cleaning sheet 100 has the same size and shape as the semiconductor wafer on which the semiconductor wafer is to be measured, The following benefits will be produced when the circle is round. First, "the semiconductor wafer system forming the semiconductor wafer to be measured is placed in a detector", most of them are placed in a box, and the wafers are taken from the box one by one. Take out the box 'to measure its electrical properties, and mix the probe end cleaning sheets 100 and probe 211 at a certain ratio, for example, one probe end cleaning sheet 100 every twenty semiconductor wafers. It is cleaned automatically. However, in this case, when the probe tip cleaning sheet 100 is taken out, it is different from the Zhongguan household materials (CNS > A4 ^ (21Gx297)) used in this paper--9-I.- ---- ^ ------- it ------ ^ (Please read the notes on the back first and then this page) Duty Packing 409322 A7 _B7_ V. Invention Explanation (7) In general measurement, the probe 211 must be moved up and down many times, but it can only enter the previous position if the probe end cleaning sheet 1 is detected by some means. The probe tip cleaning sheet 100 is taken out, or the probe 211 is moved up and down in a series of procedures. The cleaning of the probe 211 by the probe tip cleaning sheets 100 is as follows. First, there is a The probe 200 of the probe 211 cleaned by the probe end cleaning sheet 100 is explained. As shown in FIG. 3, the probe 200 is roughly divided into a probe board 210 and a base 220 on which the detector 200 is attached. The probe card 210 ′ and a suction table 230 can be used to fix a semiconductor wafer forming a semiconductor wafer to be measured. The probe card 210 includes most probes. The arrangement of 211 corresponds to the arrangement of the contacts of the semiconductor wafer. There is a board 212 on which the probes 211 are mounted, and a probe holder 213 is provided on the board 212 for supporting the probes 211. On the probe board 210 Here, each probe 211 is vertically mounted on the plate 212, and the ends of each probe 211 are in vertical contact with each contact, so it is referred to as a vertically-operated probe plate. The upper part forms a nearly U-shaped curved western part 2 1A. When its end is pressed against the contact point, a certain contact pressure can be maintained between the contact point and the probe 211. The end of the probe 211 is The formation of a spherical shape is shown in Fig. 6. The probe 211 is made of tungsten. On the board 212 of the probe board 210, a circuit case 212A is connected to the probe 21, and the The probe 211 is connected to a tester not shown in the circle via this circuit pattern 212A. The probe holder 213 is used when the probe 211 is pressed against the contact. CNS) A4 specification (2IOX297 mm) ^ .------ ^ ----) — ir ------ ^ (Please read the notes on the back before filling in this page) 10 409322 Economy unit Central Bureau of Standards β: Industrial and consumer cooperation Du Yincha A7 B7 V. Description of the invention (8) Avoid contact with adjacent probes 211 ′ and each probe 211 is inserted into an independent through hole (not shown). A suction table 230 provided below the probe card 211 is used to suck and fix the semiconductor wafer forming the semiconductor wafer to be measured, and the probe end cleaning sheet 100 »Detectors with these structures 200, the end of the probe 211 is cleaned by the probe end cleaning sheet 100 in the following procedure. First, the probe tip cleaning sheet 100 is set at a specific position instead of the semiconductor wafer, that is, it is located on the suction table 230 and below the probe card 210. Positioning here, in addition to mixing the probe tip cleaning sheets 100 in a certain ratio to the semiconductor wafer as described above, the probe tip cleaning sheets 100 may be provided in the detector 200 and located at the position where Next to the semiconductor wafer to be measured, it can be used to set the probe end cleaning sheet 10 after a certain number of semiconductor wafers have been measured (^ When the probe end cleaning sheet 100 When positioned on the suction table 230, any one or both of the probe plate 210 and the suction table 230 for positioning the probe end cleaning sheet 100 are moved up and down 'so that the ends of the probe 211 are repeated The ground is pressed against the surface of the probe end cleaning sheet 100. At this time, the pressure of each probe pushing the probe 211 to the probe end cleaning sheet 100 is caused by the cleaning films 110. Material of the elastic sheet 120, the probe 2II, etc. to select an appropriate value. In this method, the end of the probe 211 is pressed against the probe end cleaning sheet 100, as shown in FIG. The cleaning film i 10 is broken, so the recess formed by the elastic sheet 120 covers the cleaning film. The state of the film 120 will be repeated again and again. Since the fine grinding powder 111 is coated on the cleaning film 110, the surface thereof is rough, and the foreign matter adhering to the end of the probe 211 can be removed by the rough surface. Moreover, when the elastic sheet 120 is pressed against the probe 211, the paper size is in China_ 家装 准 (CNS > A4 size (210X297 mm) ---------- ^ ---- ^-• Order ------ line (please read the note f on the back first and then visit this page) 11 Printed by the Central Standards Bureau of the Ministry of Economic Affairs and printed by the Industrial and Consumer Cooperatives 409322 A7 ___B7_ V. Description of Invention (9) Its It is recessed according to the shape of the tip of the probe 211, so if the fine grinding powder 111 is coated on the surface of the cleaning film 110, unlike the conventional ceramic plate, the tip of the probe 211 will not be scratched at all. When the cleaning of the probe 211 is completed, the probe tip cleaning sheet 100 is removed from the suction table 230. A new semiconductor wafer to be measured is placed in the new semiconductor wafer. The electrical properties of the formed semiconductor wafer will continue to be measured. In this probe tip cleaning sheet 100, the cleaning film 110 is coated Fine grinding powder 111 is formed on the film 112, but instead, a clean metal film 140 may be used as shown in FIG. 4. In the clean metal film 140, the surface 141 of the metal film such as tungsten is used as Appropriate means such as sand blasting or etching to roughen a rough surface 142 »It is more effective if the surface is treated with rhodium plating or the like. Use these probe tip cleaning sheets for cleaning metal film 140. Some are It is made as described above, that is, an elastic sheet 120 ′ is laminated on the bottom of the clean metal film 140 and a plate 130 is laminated on the bottom of the elastic sheet 120, and the elastic sheet 120 and the plate 130 are the same as the foregoing. Nature. These cleaning metal films 140, like the aforementioned cleaning film 110, must have sufficient rigidity so that when the probe 211 is pressed, its ends do not penetrate the cleaning metal film 140. If the end of the probe 211 passes through the cleaning metal film 140 ', its end will reach the elasticity > 5 120 provided on the bottom layer of the cleaning metal film 140. Therefore, if the conventional probe tip cleaning element is used, A new foreign substance may be attached to the end of the probe 211. When the thickness of the clean metal film 140 is tungsten, the paper ΛΑϋ 财 关 家 县 (CNS) Α4ΛΙ ^ · ~ ΠΗ) × 297 mm) '• 12----.------ Install ---- K-. Order ------ line (锖 read the note on the back first and then write this page) The Central Bureau of the Ministry of Economy -B7 V. Description of the invention (10) is preferably from 5 to 50 microns, and if it is palladium, it is preferably from 20 to 00 microns. For example, 'If the end of the probe is cleaned for 10 months, when the contact resistance of the end of the probe 211 is 10 ohms, because the accumulated foreign matter is pressed against the end of the probe 211 and moves the probe 211 up and down, After being cleaned about ten times, the contact resistance will become 0.5 ohms or less. According to the test results, there will be no problems when measuring the electrical properties of the semiconductor wafers generated on the semiconductor wafer. <* Description so far There is a vertical-operated probe card 21. The probe 211 is in vertical contact with the contact point. However, as shown in FIG. 5, it is also used in the so-called cantilever probe card. The ends are bent and contact the contacts diagonally. Further, as shown in Figs. 6 (B) and (C), if it is a cantilever type probe card, the probe 211 may have a flat end. The probe end cleaning sheet of the present invention is a probe end cleaning sheet that can remove foreign substances adhered to the end of the probe. The probe end cleaning sheet includes a thin film that can be cleaned, a fine abrasive powder coated on the surface, and an elasticity. A sheet is provided on the bottom layer of the film to have elasticity ', and a plate is provided on the bottom layer of the elastic sheet, wherein the cleaning film is made of a material, which will be recessed when the probe tip is pressed with a specific pressure but It will not be punctured by the tip of the probe, and the elastic sheet is made of a material. When the tip of the probe is pressed against the cleaning film by the specific pressure, it will be recessed at the end of the probe. Therefore, when the probe is pressed against the probe end cleaning sheet, the tip of the probe will be coated in the cleaning film 'and the foreign substance will be removed by the fine abrasive powder coated on the cleaning film. At this time, because the cleaning film and the elastic sheet are recessed according to the shape of the end of the probe, the end of the probe is not (210X297 mm) ί ~~~ '---.---- install-- ----. Order ------ line (锖 first read the notes on the back and then jealous 夂 this page) printed bags 409322 A7 ______B7 from the Central Procurement Bureau of the Ministry of Economic Affairs V. Description of invention (u) Scratched as in conventional ceramic plates. Moreover, since the end of the probe does not penetrate the cleaning film, the material constituting the elastic sheet will not stick to the end of the probe and form a new foreign substance. Furthermore, the foreign matter can be removed without deforming the probe tip, so that the probe tip cleaning sheet can be prevented from accumulating new foreign matter at the probe tip. Another probe tip cleaning sheet of the present invention is a probe tip cleaning sheet that can remove foreign substances adhered to the end of the probe. The probe tip cleaning sheet includes a cleaning metal film made of a metal having almost the same or greater than The hardness of the material of the probe 'has a rough shuttle surface, an elastic sheet is elastic on the bottom of the clean metal film' and a plate is disposed on the bottom of the elastic sheet, wherein the clean metal film is made of a material It is made that when the tip of the probe is pressed with a certain pressure, it will sag but will not be broken by the tip of the probe, and the elastic sheet is made of a material. When the pressure is applied to the cleaning metal film, etc., 'it will be recessed at the tip end of the probe in the probe end cleaning sheet' as in the aforementioned probe end cleaning sheet, when the probe is pressed against the probe In the case of a needle-end cleaning sheet, the probe end is covered in the cleaning film, and foreign substances are removed by a fine grinding powder coated on the cleaning film. At this time, since the cleaning film and the elastic sheet are recessed according to the shape of the end of the probe, the end of the probe will not be damaged as hard as in the conventional ceramic plate. Moreover, because the end of the probe does not penetrate the cleaning film, the material constituting the elastic sheet will not stick to the end of the probe to form a new foreign substance. In addition, the foreign material can be removed without deforming the probe, so that the probe end cleaning sheet can be prevented from accumulating a new foreign ^ sheet at the end of the probe, which is applicable to the National Park Standard (CNS) A4. Specifications (210X297mm) ------ -14-I-- 丨.:-^ ---- installation ----_-- order ------ line (please read the first Cautions on this page) 409322 A7 B7 V. Description of the invention (12) Substance. The specific pressure ranges from a few grams to many grams, and the appropriate value can be selected according to the materials of the cleaning film, cleaning, metal film, elastic sheet, and probe. Reference to file number 100 ... Probe tip cleaning sheet 200 ... Detector 110 ... Cleaning film 2Hl ... Probe plate 11b "Fine grinding powder 211 ... Probe 112 ... Film 211A ... Bending part 120 ... Elastic sheet 212 ... plate 130 ... plate 212A ... line case 140 ... clean metal film 213 ... bracket 141 ... surface 220 ... base 142 ... * rough chain surface 230 ... suction table (please first please cry back) Written matter of interest \ 8〇 • Combination and ordering Consumption cooperation with employees of the Central Bureau of Standards, Ministry of Economic Affairs Du printed paper size applicable to Chinese solid standards (CNS > 8 4 specifications (210X297 mm) 15