JP2511806B2 - Probe tip cleaning material - Google Patents
Probe tip cleaning materialInfo
- Publication number
- JP2511806B2 JP2511806B2 JP6060059A JP6005994A JP2511806B2 JP 2511806 B2 JP2511806 B2 JP 2511806B2 JP 6060059 A JP6060059 A JP 6060059A JP 6005994 A JP6005994 A JP 6005994A JP 2511806 B2 JP2511806 B2 JP 2511806B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- cleaning member
- tip
- tip cleaning
- probe tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プローブの先端に付着
した異物を除去するプローブ先端クリーニング部材に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe tip cleaning member for removing foreign matter attached to the tip of a probe.
【０００２】[0002]
【従来の技術】半導体ウエハに形成された半導体チップ
の電気的所特性を測定するプローブカードのプローブ
は、半導体チップのパッドに押圧接触（オーバードライ
ブ）させられる。このため、プローブの先端には、パッ
ドが削りとられたアルミニウムの粉等の異物が付着す
る。この異物をプローブの先端から除去しないと、プロ
ーブとパッドとの間の導通不良が生じ、電気的接触が悪
化するので、正確な特性の測定が不可能になる。また、
プローブを長期間放置しておくと、接触抵抗が高くなる
傾向がある。2. Description of the Related Art A probe of a probe card for measuring electrical characteristics of a semiconductor chip formed on a semiconductor wafer is brought into pressure contact (overdrive) with a pad of the semiconductor chip. Therefore, foreign matter such as aluminum powder from which the pad has been scraped off adheres to the tip of the probe. If this foreign matter is not removed from the tip of the probe, poor conduction between the probe and the pad will occur and electrical contact will deteriorate, making accurate measurement of characteristics impossible. Also,
If the probe is left for a long time, the contact resistance tends to increase.
【０００３】そこで、所定回のプロービングを行うごと
に、プローブの先端をクリーニングして異物を除去する
ことが行われている。このクリーニングには、半導体ウ
エハと同形のセラミック板が用いられる。すなわち、プ
ローブの先端をプロービングと同様にセラミック板にオ
ーバードライブさせ、アルミニウムの粉等の異物をプロ
ーブの先端から除去するのである。Therefore, every time probing is performed a predetermined number of times, the tip of the probe is cleaned to remove foreign matter. For this cleaning, a ceramic plate having the same shape as the semiconductor wafer is used. That is, the tip of the probe is overdriven on the ceramic plate as in the case of probing to remove foreign matter such as aluminum powder from the tip of the probe.
【０００４】本願出願人は、かかる問題を解消するため
に、実願平５−５１３６９号を出願した。この出願に係
る考案は、導電性を有する母材に研磨材を付着させたも
のであり、研磨材としてはプローブより硬質であるもの
を使用している。The applicant of the present application has applied for Japanese Patent Application No. 5-51369 in order to solve such a problem. The invention according to this application is one in which an abrasive material is attached to a conductive base material, and an abrasive material that is harder than a probe is used.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、本願出
願人が以前に出願したプローブ先端クリーニング用研磨
板には以下のような問題点がある。すなわち、複数回の
クリーニング行われると、プローブの先端が研磨材によ
り削られるのである。プローブの先端はパッドに対して
滑らかに接触するように球状に形成されているが、この
先端が研磨材により研磨され、平坦になるのである。先
端が平坦になったプローブでは、パッドに対して滑らか
に接触することは不可能であり、接触抵抗の変化や、パ
ッドの削り量が多くなる等の問題が生じる。このよう
に、先端が平坦になったプローブの修正は、ユーザーで
ある半導体素子メーカーでは困難でありプローブカード
メーカーしかできないものである。従って、ユーザーは
先端が平坦になったプローブは廃棄するか、プローブカ
ードメーカーに修正を依頼しなければならなかった。However, the probe tip cleaning polishing plate previously filed by the applicant of the present application has the following problems. That is, when cleaning is performed a plurality of times, the tip of the probe is scraped by the abrasive. The tip of the probe is formed in a spherical shape so as to make a smooth contact with the pad, and the tip is polished by an abrasive to be flat. A probe having a flat tip cannot make smooth contact with a pad, which causes problems such as a change in contact resistance and an increase in the amount of pad scraping. As described above, it is difficult for a semiconductor device manufacturer who is a user to correct a probe having a flat tip, and only a probe card manufacturer can do it. Therefore, the user had to either discard the probe having a flat tip or ask the probe card maker to correct it.
【０００６】本発明は上記事情に鑑みて創案されたもの
で、複数回のクリーニングを繰り返してもプローブの先
端が研磨されず、プローブの寿命を長い間保つことがで
きるプローブ先端クリーニング部材を提供することを目
的としている。The present invention has been devised in view of the above circumstances, and provides a probe tip cleaning member capable of maintaining the life of the probe for a long time without polishing the tip of the probe even if cleaning is repeated a plurality of times. Is intended.
【０００７】[0007]
【課題を解決するための手段】本発明に係るプローブ先
端クリーニング部材は、プローブの先端に付着した異物
を除去するプローブ先端クリーニング部材であって、弾
性を有する母材に微粉研磨材を混入してなる。A probe tip cleaning member according to the present invention is a probe tip cleaning member for removing foreign matter adhering to the tip of a probe, wherein a fine abrasive powder is mixed into an elastic base material. Become.
【０００８】また、前記母材はシリコンゴム又はウレタ
ンゴムである。The base material is silicone rubber or urethane rubber.
【０００９】さらに、前記微粉研磨材はアルミナ、シリ
コンカーバイト又はダイヤモンド粉である。Further, the fine powder abrasive is alumina, silicon carbide or diamond powder.
【００１０】一方、このプローブ先端クリーニング部材
は、プローブにより電気的諸特性の測定が行われる半導
体ウエハと同一形状、同一寸法に形成されている。On the other hand, the probe tip cleaning member is formed in the same shape and size as the semiconductor wafer whose electrical characteristics are measured by the probe.
【００１１】[0011]
【実施例】図１は本発明の一実施例に係るプローブ先端
クリーニング部材の概略的平面図、図２はこのプローブ
先端クリーニング部材の使用方法を示す概略的正面図で
ある。1 is a schematic plan view of a probe tip cleaning member according to an embodiment of the present invention, and FIG. 2 is a schematic front view showing a method of using the probe tip cleaning member.
【００１２】本実施例に係るプローブ先端クリーニング
部材１００は、プローブ３００の先端に付着した異物を
除去するものであって、弾性を有する母材に微粉研磨材
２００を混入している。The probe tip cleaning member 100 according to the present embodiment removes foreign matter adhering to the tip of the probe 300, and the fine abrasive powder 200 is mixed in the elastic base material.
【００１３】まず、母材には、シリコンゴム又はウレタ
ンゴムが用いられ、電気的諸特性の測定が行われる半導
体ウエハと同一形状、同一寸法に形成される。この母材
には、成形前に微粉研磨材２００が所定の割合で混入さ
れている。First, silicon rubber or urethane rubber is used as the base material, and is formed in the same shape and size as the semiconductor wafer whose electrical characteristics are to be measured. The fine powder abrasive material 200 is mixed into the base material at a predetermined ratio before molding.
【００１４】微粉研磨材２００としては、アルミナ、シ
リコンカーバイト又はダイヤモンド粉が適している。か
かる微粉研磨材２００の材質や大きさ等は、プローブ３
００の材質、寸法等に応じて決定される。Alumina, silicon carbide or diamond powder is suitable as the fine powder abrasive 200. The material, size, etc. of the fine-powder abrasive material 200 are determined by the probe 3
00 is determined according to the material, size, etc.
【００１５】このような微粉研磨材２００が混入された
母材を硬化させて半導体ウエハと同一形状、同一寸法に
形成するのである。すると、表面に微粉研磨材２００が
均等に露出したプローブ先端クリーニング部材１００を
得ることができる。The base material in which the fine powder abrasive material 200 is mixed is cured to form the same shape and size as the semiconductor wafer. Then, it is possible to obtain the probe tip cleaning member 100 in which the fine abrasive 200 is evenly exposed on the surface.
【００１６】このようにして構成されたプローブ先端ク
リーニング部材１００の使用方法について図２を参照し
つつ説明する。プローブ先端クリーニング部材１００
は、上下動す平坦な台４００の上に載せられる。この
際、プローブ先端クリーニング部材１００は不用意に動
かないように接着剤や、図示しないクランプ等で台４０
０に取り付けられる。A method of using the probe tip cleaning member 100 thus constructed will be described with reference to FIG. Probe tip cleaning member 100
Is placed on a flat table 400 that moves up and down. At this time, the probe tip cleaning member 100 is fixed with an adhesive or a clamp (not shown) so as not to move carelessly.
It is attached to 0.
【００１７】所定回のプローピングが終了したプローブ
カード５００の下方に台４００を糸をさせ、プローブ３
００の先端がプローブ先端クリーニング部材１００に接
触するように台４００を上下動させる。The base 400 is threaded under the probe card 500 which has been probed a predetermined number of times, and the probe 3
The table 400 is moved up and down so that the tip of the probe 00 contacts the probe tip cleaning member 100.
【００１８】プローブ３００の先端は、プローブ先端ク
リーニング部材１００に接触し、プローブ先端クリーニ
ング部材１００の表面に露出した微粉研磨材２００がプ
ローブ３００の先端の異物を除去する。微粉研磨材２０
０が混入された母材は弾性を有しているので、台４００
の上下動に応じて変形するため、プローブ３００の先端
に過度の力を与えることがない。このため、プローブ３
００の先端が削り取られるのはごく僅かである。The tip of the probe 300 comes into contact with the probe tip cleaning member 100, and the fine abrasive 200 exposed on the surface of the probe tip cleaning member 100 removes foreign matter from the tip of the probe 300. Fine powder abrasive 20
Since the base material mixed with 0 has elasticity, the base 400
Since it is deformed according to the vertical movement of the probe, excessive force is not applied to the tip of the probe 300. Therefore, the probe 3
The tip of 00 is scarcely scraped off.
【００１９】なお、上述した実施例では、台４００を上
下動させるとして説明したが、プローブカード５００の
オーバードライブを利用する方法、すなわちプローブカ
ード５００を上下動させてもよい。In the above-mentioned embodiment, the base 400 is moved up and down, but a method using overdrive of the probe card 500, that is, the probe card 500 may be moved up and down.
【００２０】また、プローブ先端クリーニング部材１０
０を電気的諸特性が測定される複数個のＩＣチップが形
成された半導体ウエハと同一形状、同一寸法に形成して
おけば、プローブ先端クリーニング部材１００を半導体
ウエハに混在させることができる。すなわち、所定回の
プローピング毎に確実にプローブ３００のクリーニング
が自動的に行われるようになるので、よりスムーズなプ
ローブ３００のクリーニングが可能となる。Further, the probe tip cleaning member 10
If 0 is formed in the same shape and the same size as the semiconductor wafer having a plurality of IC chips whose electrical characteristics are measured, the probe tip cleaning member 100 can be mixed in the semiconductor wafer. That is, since the probe 300 is surely automatically cleaned every predetermined number of times of propping, the probe 300 can be cleaned more smoothly.
【００２１】[0021]
【発明の効果】本発明に係るプローブ先端クリーニング
部材は、プローブの先端に付着した異物を除去するプロ
ーブ先端クリーニング部材であって、弾性を有する母材
に微粉研磨材が混入されることによって構成されている
ので、プローブをクリーニングしても、母材によってプ
ローブの先端が削り取られるのはごく僅かである。この
ため、プローブの寿命をより長くすることができる。The probe tip cleaning member according to the present invention is a probe tip cleaning member for removing foreign matter adhering to the tip of a probe, and is constituted by mixing fine abrasive powder into an elastic base material. Therefore, even if the probe is cleaned, the tip of the probe is scarcely scraped off by the base material. Therefore, the life of the probe can be extended.
【００２２】また、前記母材はシリコンゴム又はウレタ
ンゴムであり、前記微粉研磨材はアルミナ、シリコンカ
ーバイト又はダイヤモンド粉であるので、安価なプロー
ブ先端クリーニング部材とすることができる。Since the base material is silicon rubber or urethane rubber and the fine powder abrasive is alumina, silicon carbide or diamond powder, an inexpensive probe tip cleaning member can be obtained.
【００２３】さらに、プローブ先端クリーニング部材を
プローブにより電気的諸特性の測定が行われる半導体ウ
エハと同一形状、同一寸法に形成しておくと、半導体ウ
エハにプローブ先端クリーニング部材を混在させておく
ことができるので、所定回のプローピング毎に確実にプ
ローブのクリーニングが自動的に行われるようになる。
すなわち、よりスムーズなプローブのクリーニングが可
能となる。Further, if the probe tip cleaning member is formed in the same shape and the same size as the semiconductor wafer whose electrical characteristics are measured by the probe, the probe tip cleaning member may be mixed in the semiconductor wafer. As a result, the probe can be reliably and automatically cleaned every predetermined number of times of propping.
That is, the probe can be cleaned more smoothly.
【図１】本発明の一実施例に係るプローブ先端クリーニ
ング部材の概略的平面図である。FIG. 1 is a schematic plan view of a probe tip cleaning member according to an embodiment of the present invention.
【図２】このプローブ先端クリーニング部材の使用方法
を示す概略的正面図である。FIG. 2 is a schematic front view showing a method of using this probe tip cleaning member.
１００ プローブ先端クリーニング部材 ２００ 微粉研磨材 ３００ プローブ 100 Probe tip cleaning member 200 Fine powder abrasive 300 Probe
Claims (4)
るプローブ先端クリーニング部材において、弾性を有す
る母材に微粉研磨材を混入してなることを特徴とするプ
ローブ先端クリーニング部材。1. A probe tip cleaning member for removing foreign matter adhering to the tip of a probe, characterized in that a fine abrasive powder is mixed into an elastic base material.
ムであることを特徴とする請求項１記載のプローブ先端
クリーニング部材。2. The probe tip cleaning member according to claim 1, wherein the base material is silicone rubber or urethane rubber.
ーバイト又はダイヤモンド粉であることを特徴とする請
求項１又は２記載のプローブ先端クリーニング部材。3. The probe tip cleaning member according to claim 1, wherein the fine powder abrasive is alumina, silicon carbide or diamond powder.
われる半導体ウエハと同一形状、同一寸法に形成されて
いることを特徴とする請求項１、２又は３記載のプロー
ブ先端クリーニング部材。4. The probe tip cleaning member according to claim 1, wherein the probe tip cleaning member is formed in the same shape and same size as a semiconductor wafer whose electrical characteristics are measured by the probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6060059A JP2511806B2 (en) | 1994-03-03 | 1994-03-03 | Probe tip cleaning material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6060059A JP2511806B2 (en) | 1994-03-03 | 1994-03-03 | Probe tip cleaning material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07244074A JPH07244074A (en) | 1995-09-19 |
| JP2511806B2 true JP2511806B2 (en) | 1996-07-03 |
Family
ID=13131140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6060059A Expired - Lifetime JP2511806B2 (en) | 1994-03-03 | 1994-03-03 | Probe tip cleaning material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511806B2 (en) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6118289A (en) * | 1997-03-10 | 2000-09-12 | Canon Kabushiki Kaisha | Cleaning method and cleaning device and cleaning tool for board electrical-test probes, and board electrical-test device and method |
| US6306187B1 (en) | 1997-04-22 | 2001-10-23 | 3M Innovative Properties Company | Abrasive material for the needle point of a probe card |
| EP1621893B1 (en) * | 1997-07-24 | 2007-04-25 | Mitsubishi Denki Kabushiki Kaisha | Device for removing foreign matter adhering to a probe tip face |
| JPH1187438A (en) * | 1997-09-03 | 1999-03-30 | Mitsubishi Electric Corp | Member and method for cleaning of probe tip, and test method for semiconductor wafer |
| JPH11111753A (en) * | 1997-10-01 | 1999-04-23 | Mitsubishi Electric Corp | Semiconductor device |
| JP2002307316A (en) * | 2001-04-09 | 2002-10-23 | Nihon Micro Coating Co Ltd | Instrument for cleaning tip and side face of contact |
| KR100857642B1 (en) | 2001-04-09 | 2008-09-08 | 니혼 미크로 코팅 가부시끼 가이샤 | Implement for cleaning tip and lateral surface of contactor |
| JP2002326169A (en) * | 2001-05-02 | 2002-11-12 | Nihon Micro Coating Co Ltd | Contact cleaning sheet and method |
| JP3888197B2 (en) | 2001-06-13 | 2007-02-28 | 三菱電機株式会社 | Member for removing foreign matter adhering to probe tip, cleaning method and probing device for foreign matter adhering to probe tip |
| US6908364B2 (en) * | 2001-08-02 | 2005-06-21 | Kulicke & Soffa Industries, Inc. | Method and apparatus for probe tip cleaning and shaping pad |
| US7182672B2 (en) | 2001-08-02 | 2007-02-27 | Sv Probe Pte. Ltd. | Method of probe tip shaping and cleaning |
| US6813804B2 (en) * | 2002-06-06 | 2004-11-09 | Samsung Electronics Co., Ltd. | Apparatus and method for cleaning probe card contacts |
| US7712177B2 (en) | 2003-03-20 | 2010-05-11 | Nitto Denko Corporation | Cleaning sheet and its production method as well as transporting member having such cleaning sheet |
| US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
| KR100893877B1 (en) * | 2007-08-06 | 2009-04-20 | 윌테크놀러지(주) | Method of polishing end portion of needle for probe card |
| JP4992760B2 (en) * | 2008-02-28 | 2012-08-08 | 株式会社デンソー | Mounting method of semiconductor device |
| US8371316B2 (en) | 2009-12-03 | 2013-02-12 | International Test Solutions, Inc. | Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware |
| JP2012233811A (en) * | 2011-05-06 | 2012-11-29 | Nitto Denko Corp | Cleaning sheet, cleaning member, cleaning method, and conduction test device |
| US9825000B1 (en) | 2017-04-24 | 2017-11-21 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
| KR20200135363A (en) | 2018-02-23 | 2020-12-02 | 인터내셔널 테스트 솔루션즈, 인코포레이티드 | New materials and hardware to automatically clean flexible electronic web rolls |
| US11756811B2 (en) | 2019-07-02 | 2023-09-12 | International Test Solutions, Llc | Pick and place machine cleaning system and method |
| US10792713B1 (en) | 2019-07-02 | 2020-10-06 | International Test Solutions, Inc. | Pick and place machine cleaning system and method |
| US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
| US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
| US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
-
1994
- 1994-03-03 JP JP6060059A patent/JP2511806B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07244074A (en) | 1995-09-19 |
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