JP2002307316A - Instrument for cleaning tip and side face of contact - Google Patents
Instrument for cleaning tip and side face of contactInfo
- Publication number
- JP2002307316A JP2002307316A JP2001110576A JP2001110576A JP2002307316A JP 2002307316 A JP2002307316 A JP 2002307316A JP 2001110576 A JP2001110576 A JP 2001110576A JP 2001110576 A JP2001110576 A JP 2001110576A JP 2002307316 A JP2002307316 A JP 2002307316A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- contact
- substrate
- cleaning tool
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 43
- 238000005498 polishing Methods 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000002985 plastic film Substances 0.000 claims abstract description 19
- 239000006260 foam Substances 0.000 claims description 10
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 description 14
- 238000012360 testing method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
- B24D3/002—Flexible supporting members, e.g. paper, woven, plastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
- B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Cleaning In General (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Cleaning Implements For Floors, Carpets, Furniture, Walls, And The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、集積回路を組み付
けた半導体デバイスのような平板状被検査体の検査に用
いる接触子の先端及び側面に付着した異物を除去するの
に適したクリーニング具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning tool suitable for removing foreign matter adhering to the tip and side surfaces of a contact used for inspection of a flat inspection object such as a semiconductor device having an integrated circuit. Things.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】半導体
ウエーハ上に、様々なウエーハ製造プロセスを経て、半
導体素子や集積回路が作り込まれ、複数のチップが製作
される。この半導体ウエーハ上に製作されたチップは、
通電試験を経て、半導体ウエーハから切り出され、パッ
ケージングされる。このパッケージングの前後にも同様
の通電試験が行われ、良品と不良品とに厳密に選別され
る。2. Description of the Related Art Semiconductor devices and integrated circuits are manufactured on semiconductor wafers through various wafer manufacturing processes, and a plurality of chips are manufactured. Chips fabricated on this semiconductor wafer are:
After an electrical test, it is cut out from the semiconductor wafer and packaged. A similar energization test is performed before and after this packaging, and strict selection is made between non-defective products and defective products.
【０００３】このような通電試験は、ウエーハプローバ
などの既知の試験機器を使用して行われ、テスタの電極
としての探針（接触子）とチップの電極（パッド又はリ
ード）との移動による位置合わせと、接触子とチップの
電極との接触とを繰り返し、テスタによりチップの各種
電気的測定が行われる。Such an energization test is performed using a known test device such as a wafer prober, and the position is determined by movement of a probe (contact) as an electrode of a tester and an electrode (pad or lead) of a chip. The alignment and the contact between the contact and the electrode of the chip are repeated, and various electrical measurements of the chip are performed by the tester.
【０００４】このような接触子とチップの電極との移動
による位置合わせと接触とを繰り返す際、接触子の先端
がチップの電極上を滑り、このとき、チップの電極の一
部が接触子の先端により削り取られ、これが異物として
接触子の先端や側面に付着する。When the positioning and the contact are repeated by moving the contact and the electrode of the chip, the tip of the contact slides on the electrode of the chip. It is scraped off by the tip and adheres to the tip and side surfaces of the contact as foreign matter.
【０００５】この接触子に付着する異物は、アルミニウ
ムなどの金属であり、この金属が酸化すると、接触子と
チップの電極との間の電気的な接触抵抗が大きくなり、
正確な各種電気的測定が行えない、という不都合が生じ
る。The foreign matter adhering to the contact is a metal such as aluminum. When the metal is oxidized, the electrical contact resistance between the contact and the electrode of the chip increases,
There is a disadvantage that accurate various electrical measurements cannot be performed.
【０００６】このため、接触子の先端部分のクリーニン
グを所定の接触回数毎に行って、接触子の先端部分から
異物を除去する必要がある。Therefore, it is necessary to clean the tip of the contact every predetermined number of times of contact to remove foreign matter from the tip of the contact.
【０００７】このような接触子の先端部分からの異物の
除去は、通電試験に使用される上記のウエーハプローバ
などの試験機器を使用して行われ、試験機器に取り付け
られる被検査体（半導体ウエーハ）に代えて、これと同
様の形状のクリーニング用具を試験機器に取り付けて行
われる。The removal of foreign matter from the tip of the contact is performed by using a test device such as the above-described wafer prober used for the energization test, and a test object (semiconductor wafer) attached to the test device is removed. ) Is performed by attaching a cleaning tool having a similar shape to the test equipment.
【０００８】従来、このようなクリーニング用具とし
て、砥石、ガラス、セラミックスなどの硬質研磨板（例
えば、特開平７−１９９１４１号公報、特開平５−２０
９８９６号公報、特開平５−１６６８９３号公報、特開
平４−９６３４２号公報、特開平３−１０５９４０号公
報、特開平３−１０１７６号公報、特開平３−７６２４
２号公報、特開平２−２９３９号公報、特開平１−２８
２８２９号公報を参照）、又は表面に凹凸を有する弾性
体の表面に研磨層を形成させたもの（例えば、特開２０
００−３３２０６９号公報を参照）が使用され、上記の
通電試験と同様に、クリーニング用具の表面に接触子を
押し付けて行われる。Conventionally, as such a cleaning tool, a hard polished plate made of a grindstone, glass, ceramics or the like (for example, JP-A-7-199141, JP-A-5-20)
9896, JP-A-5-166893, JP-A-4-96342, JP-A-3-105940, JP-A-3-10176, JP-A-3-7624
No. 2, JP-A-2-2939, JP-A-1-28
No. 2829) or an elastic body having irregularities on the surface and a polishing layer formed on the surface (for example, see Japanese Patent Application Laid-Open No.
No. 00-332069), and the contact is pressed against the surface of the cleaning tool as in the above-described energization test.
【０００９】しかし、硬質研磨板からなるクリーニング
用具では、この研磨板表面に接触子を過度に押し付ける
と、接触子の先端部分が変形するので、この押付圧力を
低くする必要があり、接触子の先端のクリーニングしか
行えず、また弾性体の表面に研磨層を形成したクリーニ
ング用具では、接触子の先端のクリーニングが十分に行
えず、接触子の側面のクリーニングしか行えず、このた
め、従来は、接触子の先端のクリーニングを行うための
クリーニング用具と、側面のクリーニングを行うための
ものとを通電試験機器に交換して取り付けなければなら
ず、クリーニングに時間と手間がかかっていた。However, in the case of a cleaning tool made of a hard polishing plate, if the contact is excessively pressed against the surface of the polishing plate, the tip of the contact is deformed. Therefore, it is necessary to reduce the pressing pressure. With a cleaning tool in which only the tip can be cleaned and the polishing layer is formed on the surface of the elastic body, the tip of the contact cannot be sufficiently cleaned and only the side of the contact can be cleaned. A cleaning tool for cleaning the tip of the contact and a cleaning tool for cleaning the side face have to be replaced and attached to a current-testing device, which requires time and labor for cleaning.
【００１０】したがって、本発明の目的は、接触子の先
端と側面を一つのクリーニング用具でクリーニングでき
る、容易簡単な構成のクリーニング用具を提供すること
である。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cleaning tool having an easy and simple structure that can clean the tip and side surfaces of a contact with a single cleaning tool.
【００１１】[0011]
【課題を解決するための手段】上記目的を達成する本発
明のクリーニング用具は、基板、この基板の表面に横に
並べて固定した少なくとも二種類の中間シート、及びこ
れら中間シートのそれぞれの表面に形成した研磨層から
構成され、これら二種類の中間シートのうちの一種類の
中間シートとして、弾力性を有する弾性シートが使用さ
れ、他の種類の中間シートとして、プラスチックシート
が使用される。接触子の側面は、弾性シート上に固定し
た研磨層によってクリーニングされ、接触子の先端は、
プラスチックシート上に固定した研磨層によってクリー
ニングされる。According to the present invention, there is provided a cleaning tool, comprising: a substrate; at least two kinds of intermediate sheets fixed laterally to the surface of the substrate; and a surface formed on each of the intermediate sheets. An elastic sheet having elasticity is used as one of the two types of intermediate sheets, and a plastic sheet is used as the other type of intermediate sheet. The sides of the contact are cleaned by a polishing layer fixed on the elastic sheet, and the tip of the contact is
It is cleaned by a polishing layer fixed on a plastic sheet.
【００１２】弾性シートとして、表面に孔を有し、内部
に気泡を有する多孔質の発泡シートが使用され、好適
に、発泡シートの表面に形成される研磨層が、発泡シー
トの表面の孔に対応する孔を有する多孔質の表面を有す
る。As the elastic sheet, a porous foamed sheet having holes on the surface and having bubbles inside is used, and preferably, a polishing layer formed on the surface of the foamed sheet is formed on the pores on the surface of the foamed sheet. It has a porous surface with corresponding pores.
【００１３】各中間シートの表面に固定した研磨層の高
さを調節するため、スペーサが使用され、このスペーサ
は、基板の表面に固定され、このスペーサの表面に中間
シートが固定される。In order to adjust the height of the polishing layer fixed on the surface of each intermediate sheet, a spacer is used, the spacer is fixed on the surface of the substrate, and the intermediate sheet is fixed on the surface of the spacer.
【００１４】基板として、周囲にオリエンテーションフ
ラット又はノッチを有する円形又は四角形状の基板が使
用される。As the substrate, a circular or square substrate having an orientation flat or a notch around it is used.
【００１５】[0015]
【発明の実施の形態】本発明の実施の形態は、図３に示
されるような既知のウエーハプローバに装着して、接触
子の先端部分をクリーニングするためのクリーニング用
具であり、図１に示すように、このクリーニング用具１
０は、接触子の側面をクリーニングするための研磨面１
５と先端をクリーニングするための研磨面１９をそれぞ
れ一つづつ有するものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention is a cleaning tool which is mounted on a known wafer prober as shown in FIG. 3 to clean a tip portion of a contact, and is shown in FIG. So, this cleaning tool 1
0 is a polished surface 1 for cleaning the side surface of the contact.
5 and one polishing surface 19 for cleaning the tip.
【００１６】図１に示すように、クリーニング用具１０
は、基板１１、この基板１１の表面に横に並べて固定し
た二種類の中間シート、及びこれら中間シートのそれぞ
れの表面に形成した研磨層１４、１７から構成され、こ
れら二種類の中間シートのうちの一種類の中間シートが
弾力性を有する弾性シート１２であり、他の種類の中間
シートがプラスチックシート１６である。As shown in FIG. 1, a cleaning tool 10 is provided.
Is composed of a substrate 11, two types of intermediate sheets fixed side by side on the surface of the substrate 11, and polishing layers 14, 17 formed on the respective surfaces of these intermediate sheets. Of these two types of intermediate sheets, One type of intermediate sheet is an elastic sheet 12 having elasticity, and the other type of intermediate sheet is a plastic sheet 16.
【００１７】図示の例では、基板１１として、周囲にオ
リエンテーションフラット３０を有する円形のものが使
用される。これは、本発明のクリーニング用具１０をウ
エーハプローバ（図３）に装着して接触子のクリーニン
グを行う際に、オリエンテーションフラット３０を位置
あわせ用マークとして使用し、クリーニング時にクリー
ニング用具と接触子の先端との相対的な位置関係を正確
に調整できるからであり、オリエンテーションフラット
３０を有する基板１１に代えて、周囲にノッチ（図示せ
ず）を有するものを使用してもよい。また、円形ではな
く他の形状、例えば四角形の基板（図示せず）を使用し
てもよい。基板１１の材料としては、容易に変形し得な
い硬質の材料が使用され、例えば、金属やプラスチック
が使用される。このような基板１１の形状や材料は、適
宜に変更し得るものである。In the illustrated example, a circular substrate having an orientation flat 30 around the substrate 11 is used. This is because when the cleaning tool 10 of the present invention is mounted on a wafer prober (FIG. 3) to clean the contact, the orientation flat 30 is used as a positioning mark, and the cleaning tool and the tip of the contact are used during cleaning. This is because the relative positional relationship with the substrate 11 can be accurately adjusted. Instead of the substrate 11 having the orientation flat 30, a substrate having a notch (not shown) around the substrate may be used. Further, a substrate other than a circular shape, for example, a square substrate (not shown) may be used. As a material of the substrate 11, a hard material that cannot be easily deformed is used, for example, metal or plastic. The shape and material of such a substrate 11 can be appropriately changed.
【００１８】図示の例では、一方の中間シートとして、
図２（ａ）に示すように、裏面に裏当てシート１３を付
けた、表面に孔３１を有し、内部に気泡３２を有する多
孔質の発泡シート１２が使用される。In the illustrated example, as one of the intermediate sheets,
As shown in FIG. 2A, a porous foam sheet 12 having a backing sheet 13 on the back surface, having holes 31 on the front surface, and having bubbles 32 inside is used.
【００１９】このような発泡シート１２は、プラスチッ
クシートなどの裏当てシート１３の表面にウレタン等の
発泡原液を塗布し、これを発泡させて裏当てシート１３
の表面に発泡層を形成し、この発泡層の表面部分をナイ
フやバフ研磨などの手段によって除去したものであり、
発泡シート１２の表面には、内部に入り込む孔３１が形
成される。Such a foamed sheet 12 is prepared by applying a foaming stock solution such as urethane to the surface of a backing sheet 13 such as a plastic sheet and foaming the same.
A foam layer is formed on the surface of the foam layer, and the surface portion of the foam layer is removed by means such as a knife or buff polishing.
Holes 31 are formed in the surface of the foam sheet 12 to enter the inside.
【００２０】この発泡シート１２の表面に形成される研
磨層１４は、図２（ａ）に示すように、発泡シート１２
の表面の孔３１に対応する孔を有する多孔質の表面を有
することが好ましい。The polishing layer 14 formed on the surface of the foamed sheet 12 is, as shown in FIG.
It is preferable to have a porous surface having pores corresponding to the pores 31 on the surface.
【００２１】これは、このような多孔質の表面の研磨層
１４を形成することで、研磨層１４の表面に押し付けら
れた接触子２２の先端部分が、研磨層１４の表面の孔の
内部に入り込み、この孔の内部で、接触子２２の先端部
分に損傷を与えることなく、接触子２２の側面に付着し
た異物がクリーニングされるからである。This is because, by forming the polishing layer 14 having such a porous surface, the tip portion of the contact 22 pressed against the surface of the polishing layer 14 is located inside the hole on the surface of the polishing layer 14. This is because foreign matter adhering to the side surface of the contact 22 is cleaned without entering the hole and damaging the tip of the contact 22 inside the hole.
【００２２】この中間シートは、中間シートの裏面（図
示の例では、裏当てシート１３の裏面）に両面粘着シー
トを付けたり、接着剤又は粘着剤を塗布し、この接着剤
の層を介して基板１１の表面に固定され得る。In the intermediate sheet, a double-sided pressure-sensitive adhesive sheet is applied to the back surface of the intermediate sheet (in the illustrated example, the back surface of the backing sheet 13), or an adhesive or a pressure-sensitive adhesive is applied. It can be fixed to the surface of the substrate 11.
【００２３】また、図示の例では、他方の中間シート１
６として、プラスチックシートが使用される。このプラ
スチックシートとして、ポリエステル、ポリエチレンテ
レフタレート（ＰＥＴ）、ポリプロピレンなどの既知の
プラスチック材料からなる、表面が平坦なシートが使用
される。ここで、このプラスチックシート１６は、上記
の発泡シート１２と比較して弾力性が低く、図２（ｂ）
に示すように、この表面に形成された研磨層１７によっ
て接触子２２の先端がクリーニングされる。In the illustrated example, the other intermediate sheet 1
For 6, a plastic sheet is used. As the plastic sheet, a flat sheet made of a known plastic material such as polyester, polyethylene terephthalate (PET), or polypropylene is used. Here, the plastic sheet 16 has lower elasticity than the foamed sheet 12 described above, and FIG.
As shown in (1), the tip of the contact 22 is cleaned by the polishing layer 17 formed on the surface.
【００２４】図示の例では、二種類の中間シートを基板
１１の表面に並べて固定しているが、三種類以上の中間
シートを基板１１の表面に固定してもよい。すなわち、
他の種類の中間シートとして、織布や不織布からなるシ
ートを使用し、この表面に研磨層を形成し、裏面に両面
粘着テープなどの裏当てシートを付けて、基板１１の表
面に固定してもよい。このような中間シートの種類の選
択は適宜に行い得るものである。In the illustrated example, two types of intermediate sheets are arranged and fixed on the surface of the substrate 11, but three or more types of intermediate sheets may be fixed on the surface of the substrate 11. That is,
As another type of intermediate sheet, a sheet made of woven or non-woven fabric is used, a polishing layer is formed on this surface, and a backing sheet such as a double-sided adhesive tape is attached on the back side, and fixed to the surface of the substrate 11. Is also good. Such selection of the type of the intermediate sheet can be appropriately performed.
【００２５】これら中間シートの表面に形成される研磨
層１４、１７は、中間シートの表面に、ポリエステル
系、ウレタン系の樹脂溶液中にアルミナ、シリコンカー
バイト、酸化セリウム、ダイヤモンド等の既知の平均粒
径１〜２μｍの粒子からなる砥粒を分散した研磨塗料を
塗布し、これを乾燥させて形成されるものであり、中間
シートの表面にわたって一様に平坦な研磨層を形成して
もよいし、直線状、水玉状に配置した研磨層を形成して
もよい。The polishing layers 14 and 17 formed on the surface of the intermediate sheet are formed on a surface of the intermediate sheet in a polyester-based or urethane-based resin solution by using a known average of alumina, silicon carbide, cerium oxide, diamond, or the like. It is formed by applying a polishing coating material in which abrasive particles composed of particles having a particle size of 1 to 2 μm are dispersed and drying the coating, and may form a uniform and flat polishing layer over the surface of the intermediate sheet. Then, a polishing layer arranged in a linear or polka dot shape may be formed.
【００２６】図示の例では、プラスチックシート１６
は、スペーサ１８を介して基板１１の表面に固定され
る。これは、プラスチックシート１６の表面に形成され
る研磨層１７の表面１９は平坦であり、この研磨層１７
の表面１９と接触子２２との間の距離の測定を正確に行
えるため、スペーサ１８によって、プラスチックシート
１６の表面に形成した研磨層１４の高さと、上記の発泡
シート１２の表面に形成した研磨層１５の高さとを揃え
ることができるためである。スペーサ１８として、硬質
のもの、例えば、金属やプラスチックからなるものが使
用される。In the illustrated example, the plastic sheet 16
Is fixed to the surface of the substrate 11 via the spacer 18. This is because the surface 19 of the polishing layer 17 formed on the surface of the plastic sheet 16 is flat,
Since the distance between the surface 19 of the plastic sheet 16 and the contact 22 can be accurately measured, the height of the polishing layer 14 formed on the surface of the plastic sheet 16 and the polishing This is because the height of the layer 15 can be made uniform. As the spacer 18, a hard material, for example, a material made of metal or plastic is used.
【００２７】次に、図１に示す本発明のクリーニング用
具１０を図３に示すウエーハプローバ２０に装着して、
接触子２２のクリーニングを行う。Next, the cleaning tool 10 of the present invention shown in FIG. 1 is mounted on a wafer prober 20 shown in FIG.
The contact 22 is cleaned.
【００２８】図示のウエーハプローバ２０による接触子
２２の先端部分のクリーニングは、半導体ウエーハなど
の被検査体に代えて上記の本発明のクリーニング用具１
０を取り付けた取付台２３を水平、垂直方向に移動して
位置合わせを行い、クリーニング用具１０をプローブカ
ード２１の接触子２２に押し付けて行われる。接触子２
２の先端をクリーニングするときは、プラスチックシー
ト上に研磨層を形成した部分（図１の符号１９で示す部
分）を接触子２２の位置に移動し、接触子２２の側面を
クリーニングするときは、発泡シート上に研磨層を形成
した部分（図１の符号１５で示す部分）を接触子２２の
位置に移動する。このような位置合わせは、コンピュー
タなどの手段により正確に行うことができる。The cleaning of the tip portion of the contact 22 by the wafer prober 20 shown in the drawing is performed by using the cleaning tool 1 of the present invention instead of the object to be inspected such as a semiconductor wafer.
The cleaning tool 10 is pressed against the contacts 22 of the probe card 21 by moving the mounting table 23 to which the “0” is mounted in the horizontal and vertical directions to perform positioning. Contact 2
When the tip of No. 2 is to be cleaned, the portion where the polishing layer is formed on the plastic sheet (the portion indicated by reference numeral 19 in FIG. 1) is moved to the position of the contact 22, and when cleaning the side surface of the contact 22, The portion where the polishing layer is formed on the foam sheet (the portion indicated by reference numeral 15 in FIG. 1) is moved to the position of the contact 22. Such alignment can be accurately performed by means such as a computer.
【００２９】＜実施例＞ 本発明のクリーニング用具を
製造した。実施例では、本発明のクリーニング用具の中
間シートとして、表面部分をバフ研磨により除去し、表
面に気泡を露出させた発泡ポリウレタンシートと、ポリ
エチレンテレフタレート（ＰＥＴ）シートとの二種類の
中間シートを使用した。<Example> A cleaning tool of the present invention was manufactured. In the examples, two types of intermediate sheets are used as the intermediate sheet of the cleaning tool of the present invention: a foamed polyurethane sheet whose surface is removed by buffing to expose bubbles on the surface, and a polyethylene terephthalate (PET) sheet. did.
【００３０】まず、ウレタン系の樹脂溶液中に平均粒径
１μｍのアルミナ粒子を分散させて研磨塗料を調製し、
この研磨塗料を、リバース塗工法にて、厚さ５００μｍ
の発泡ポリウレタンシートと厚さ１００μｍのＰＥＴシ
ートのそれぞれの表面に塗布し、乾燥させて、それぞれ
のシート表面に厚さ１０μｍの研磨層を形成した。First, an abrasive paint is prepared by dispersing alumina particles having an average particle diameter of 1 μm in a urethane resin solution.
This polishing paint is applied to a thickness of 500 μm by a reverse coating method.
Was applied to each surface of a foamed polyurethane sheet and a PET sheet having a thickness of 100 μm, and dried to form a polishing layer having a thickness of 10 μm on the surface of each sheet.
【００３１】基板として、周囲にオリエンテーションフ
ラットを円形の金属盤を使用し、この金属盤の表面の半
分の領域に、上記の発泡ポリウレタンシートを接着剤で
固定し、残り半分の領域に、厚さ４００μｍの金属製の
半円形のスペーサを接着剤で固定した後、このスペーサ
の表面に上記のＰＥＴシートを接着剤で固定して、本発
明のクリーニング用語を製造した。As a substrate, a circular metal plate having an orientation flat around it is used, and the above-mentioned foamed polyurethane sheet is fixed with an adhesive to a half area of the surface of the metal disk, and a thickness is set to the other half area. After fixing a 400 μm metal semicircular spacer with an adhesive, the above PET sheet was fixed on the surface of the spacer with an adhesive to produce the cleaning term of the present invention.
【００３２】[0032]
【発明の効果】本発明が以上のように構成されるので、
接触子の先端と側面に付着した異物を接触子の先端部分
に損傷を与えずに一つのクリーニング用具で除去するこ
とができ、異物の付着量や付着強度によって中間シート
を選定することで高いクリーニング効果が得られる、と
いう効果を奏する。As the present invention is configured as described above,
Foreign matter adhering to the tip and side of the contact can be removed with a single cleaning tool without damaging the tip of the contact, and high cleaning is achieved by selecting an intermediate sheet according to the amount and strength of the foreign matter. The effect that an effect is acquired is produced.
【図１】図１（ａ）は、実施例のクリーニング用具の平
面図を示し、図１（ｂ）は、図１（ａ）のＡＡ線断面図
を示す。FIG. 1A is a plan view of a cleaning tool according to an embodiment, and FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A.
【図２】図２（ａ）及び（ｂ）は、それぞれ、研磨層を
形成した発泡シートの断面図を示し、図２（ｃ）は、研
磨層を形成したプラスチックシートの断面図を示す。FIGS. 2A and 2B are cross-sectional views of a foamed sheet on which a polishing layer is formed, and FIG. 2C is a cross-sectional view of a plastic sheet on which a polishing layer is formed.
【図３】図３は、ウエーハプローバの側面を略示する。FIG. 3 schematically illustrates a side view of a wafer prober.
１０・・・本発明のクリーニング用具 １１・・・基板 １２・・・発泡シート １３・・・裏当てシート １４・・・研磨層 １５・・・研磨面 １６・・・プラスチックシート １７・・・研磨層 １８・・・スペーサ １９・・・研磨面 ２０・・・ウエーハプローバ ２１・・・プローブカード ２２・・・接触子 ２３・・・取付台 ３０・・・オリエンテーションフラット ３１・・・孔 ３２・・・気泡 DESCRIPTION OF SYMBOLS 10 ... Cleaning tool of this invention 11 ... Substrate 12 ... Foam sheet 13 ... Backing sheet 14 ... Polishing layer 15 ... Polishing surface 16 ... Plastic sheet 17 ... Polishing Layer 18 Spacer 19 Polished surface 20 Wafer prober 21 Probe card 22 Contact 23 Mounting base 30 Orientation flat 31 Hole 32・ Bubble
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｇ０１Ｒ 31/26 Ｇ０１Ｒ 31/26 Ｊ ４Ｍ１０６ 31/28 Ｈ０１Ｌ 21/66 Ｂ Ｈ０１Ｌ 21/66 Ｇ０１Ｒ 31/28 Ｋ Ｆターム(参考） 2G003 AA10 AG04 AG08 AG12 AH05 2G011 AA02 AA17 AB06 AC13 AC14 AE03 AF07 2G132 AF02 AL03 AL11 3B116 AA47 BA01 BA23 3C063 AA10 AB07 BA34 BC03 BC09 BF01 BG08 BG22 EE01 4M106 AA01 BA01 DD18 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) G01R 31/26 G01R 31/26 J 4M106 31/28 H01L 21/66 B H01L 21/66 G01R 31/28 K F term (reference) 2G003 AA10 AG04 AG08 AG12 AH05 2G011 AA02 AA17 AB06 AC13 AC14 AE03 AF07 2G132 AF02 AL03 AL11 3B116 AA47 BA01 BA23 3C063 AA10 AB07 BA34 BC03 BC09 BF01 BG08 BG22 EE01 4M106 AA01 BA01 DD
Claims (5)
た少なくとも二種類の中間シート、及びこれら中間シー
トのそれぞれの表面に形成した研磨層、から成り、前記
二種類の中間シートのうちの一種類の中間シートが、弾
力性を有する弾性シートであり、他の種類がプラスチッ
クシートである、接触子の先端及び側面をクリーニング
するためのクリーニング用具。An intermediate sheet comprising: a substrate; at least two types of intermediate sheets fixed side by side on the surface of the substrate; and a polishing layer formed on each surface of the intermediate sheets. A cleaning tool for cleaning a tip and a side surface of a contact, wherein one kind of intermediate sheet is an elastic sheet having elasticity and another kind is a plastic sheet.
内部に気泡を有する多孔質の発泡シートが使用される、
請求項１のクリーニング用具。2. The elastic sheet has a hole on its surface,
A porous foam sheet having bubbles inside is used,
The cleaning tool of claim 1.
が、前記発泡シートの表面の孔に対応する孔を有する多
孔質の表面を有する、請求項２のクリーニング用具。3. The cleaning tool according to claim 2, wherein the polishing layer formed on the surface of the foam sheet has a porous surface having holes corresponding to the holes on the surface of the foam sheet.
面に固定したスペーサの表面に固定され、このスペーサ
によって、前記プラスチックシートの表面に形成した研
磨層の高さが調節される、請求項１のクリーニング用
具。4. The plastic sheet according to claim 1, wherein the plastic sheet is fixed to a surface of a spacer fixed to the surface of the substrate, and the height of a polishing layer formed on the surface of the plastic sheet is adjusted by the spacer. Cleaning tools.
ンフラット又はノッチを有する円形又は四角形状の基板
が使用される、請求項１のクリーニング用具。5. The cleaning tool according to claim 1, wherein a circular or square substrate having an orientation flat or a notch around the substrate is used as the substrate.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001110576A JP2002307316A (en) | 2001-04-09 | 2001-04-09 | Instrument for cleaning tip and side face of contact |
| TW091106728A TW522078B (en) | 2001-04-09 | 2002-04-03 | Instrument for cleaning tip and side face of contact |
| PCT/JP2002/003493 WO2002083364A1 (en) | 2001-04-09 | 2002-04-08 | Implement for cleaning tip and lateral surface of contactor |
| KR1020027016712A KR100857642B1 (en) | 2001-04-09 | 2002-04-08 | Implement for cleaning tip and lateral surface of contactor |
| US10/289,494 US7254861B2 (en) | 2001-04-09 | 2002-11-05 | Device for cleaning tip and side surfaces of a probe |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001110576A JP2002307316A (en) | 2001-04-09 | 2001-04-09 | Instrument for cleaning tip and side face of contact |
| US10/289,494 US7254861B2 (en) | 2001-04-09 | 2002-11-05 | Device for cleaning tip and side surfaces of a probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002307316A true JP2002307316A (en) | 2002-10-23 |
Family
ID=32852587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001110576A Pending JP2002307316A (en) | 2001-04-09 | 2001-04-09 | Instrument for cleaning tip and side face of contact |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2002307316A (en) |
| TW (1) | TW522078B (en) |
| WO (1) | WO2002083364A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340629A (en) * | 2003-05-13 | 2004-12-02 | Japan Electronic Materials Corp | Probe tip cleaning member, and probe tip cleaning method |
| WO2008120519A1 (en) * | 2007-03-29 | 2008-10-09 | Advantest Corporation | Tcp handling apparatus |
| JP2011112532A (en) * | 2009-11-27 | 2011-06-09 | Japan Electronic Materials Corp | Probe cleaning member |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5078355A (en) * | 1973-11-09 | 1975-06-26 | ||
| JPH0263965A (en) * | 1988-08-30 | 1990-03-05 | Isuzu Motors Ltd | Rear-wheel steering actuator |
| JPH07244074A (en) * | 1994-03-03 | 1995-09-19 | Nippon Denshi Zairyo Kk | Probe tip cleaning member |
| JPH10300777A (en) * | 1997-04-22 | 1998-11-13 | Sumitomo 3M Ltd | Abrasive for probe of probe card |
| JP2000332069A (en) * | 1999-05-21 | 2000-11-30 | Micronics Japan Co Ltd | Cleaning member of end of contactor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3430213B2 (en) * | 1997-04-08 | 2003-07-28 | 東京エレクトロン株式会社 | Soft cleaner and cleaning method |
-
2001
- 2001-04-09 JP JP2001110576A patent/JP2002307316A/en active Pending
-
2002
- 2002-04-03 TW TW091106728A patent/TW522078B/en not_active IP Right Cessation
- 2002-04-08 WO PCT/JP2002/003493 patent/WO2002083364A1/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5078355A (en) * | 1973-11-09 | 1975-06-26 | ||
| JPH0263965A (en) * | 1988-08-30 | 1990-03-05 | Isuzu Motors Ltd | Rear-wheel steering actuator |
| JPH07244074A (en) * | 1994-03-03 | 1995-09-19 | Nippon Denshi Zairyo Kk | Probe tip cleaning member |
| JPH10300777A (en) * | 1997-04-22 | 1998-11-13 | Sumitomo 3M Ltd | Abrasive for probe of probe card |
| JP2000332069A (en) * | 1999-05-21 | 2000-11-30 | Micronics Japan Co Ltd | Cleaning member of end of contactor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340629A (en) * | 2003-05-13 | 2004-12-02 | Japan Electronic Materials Corp | Probe tip cleaning member, and probe tip cleaning method |
| JP4565813B2 (en) * | 2003-05-13 | 2010-10-20 | 日本電子材料株式会社 | Probe tip cleaning member |
| WO2008120519A1 (en) * | 2007-03-29 | 2008-10-09 | Advantest Corporation | Tcp handling apparatus |
| JPWO2008120519A1 (en) * | 2007-03-29 | 2010-07-15 | 株式会社アドバンテスト | TCP handling equipment |
| JP2011112532A (en) * | 2009-11-27 | 2011-06-09 | Japan Electronic Materials Corp | Probe cleaning member |
Also Published As
| Publication number | Publication date |
|---|---|
| TW522078B (en) | 2003-03-01 |
| WO2002083364A1 (en) | 2002-10-24 |
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