WO2008120519A1 - Tcp handling apparatus - Google Patents

Tcp handling apparatus Download PDF

Info

Publication number
WO2008120519A1
WO2008120519A1 PCT/JP2008/053517 JP2008053517W WO2008120519A1 WO 2008120519 A1 WO2008120519 A1 WO 2008120519A1 JP 2008053517 W JP2008053517 W JP 2008053517W WO 2008120519 A1 WO2008120519 A1 WO 2008120519A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
tcp
tcp handler
probe card
carrier tape
Prior art date
Application number
PCT/JP2008/053517
Other languages
French (fr)
Japanese (ja)
Inventor
Hisashi Murano
Katsuhiro Imaizumi
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to JP2009507437A priority Critical patent/JPWO2008120519A1/en
Publication of WO2008120519A1 publication Critical patent/WO2008120519A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning

Abstract

In a TCP handler (2), a carrier tape (5) whereupon a plurality of TCPs are formed is transferred, the carrier tape (5) is pressed to a probe card (8) having a probe (81) electrically connected to a test head (10), and a test pad of the TCP is connected to the probe (81) of the probe card (8). Thus, the TCP handler successively tests the TCPs. The TCP handler is provided with a cleaning member (93) which is inserted between the carrier tape (5) and the probe card (8) by a cleaning stage (91) for cleaning the probe (81) of the probe card (8). By the TCP handler (2), the probe (81) can be easily cleaned even during a time when the TCP handler (2) is operated.
PCT/JP2008/053517 2007-03-29 2008-02-28 Tcp handling apparatus WO2008120519A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009507437A JPWO2008120519A1 (en) 2007-03-29 2008-02-28 TCP handling equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-089810 2007-03-29
JP2007089810 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120519A1 true WO2008120519A1 (en) 2008-10-09

Family

ID=39808103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053517 WO2008120519A1 (en) 2007-03-29 2008-02-28 Tcp handling apparatus

Country Status (4)

Country Link
JP (1) JPWO2008120519A1 (en)
KR (1) KR20090132617A (en)
TW (1) TW200902997A (en)
WO (1) WO2008120519A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059010A (en) * 2009-09-11 2011-03-24 Ueno Seiki Kk Test contact, its cleaning method, and semiconductor manufacturing device
JP2011149917A (en) * 2009-12-22 2011-08-04 Micronics Japan Co Ltd Probe cleaning unit, and panel inspection device and probe cleaning method having the same
EP2426794A1 (en) * 2010-09-06 2012-03-07 Rasco GmbH Cleaning a contactor in a test-in-strip handler for ICs
JP2022003330A (en) * 2020-06-12 2022-01-11 致茂電子股▲分▼有限公司Chroma Ate Inc. Cleaning jig

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012068032A (en) * 2010-09-21 2012-04-05 Tesetsuku:Kk Tcp testing device
KR102440287B1 (en) * 2020-08-24 2022-09-06 (주)퓨쳐하이테크 Loading Apparatus Of Electronic Components And Test Apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0679149U (en) * 1993-04-23 1994-11-04 安藤電気株式会社 Tape carrier with polishing sheet
JPH11145212A (en) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd Cleaning device for probe card
JPH11295392A (en) * 1998-04-15 1999-10-29 Micronics Japan Co Ltd Device for removing foreign matter adhering to probe
JP2000223539A (en) * 1999-01-29 2000-08-11 Tokyo Electron Ltd Cleaner and cleaning method
JP2002307316A (en) * 2001-04-09 2002-10-23 Nihon Micro Coating Co Ltd Instrument for cleaning tip and side face of contact
WO2004068154A1 (en) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Tcp handling device and positional deviation correcting method for the same
JP2006208009A (en) * 2005-01-25 2006-08-10 Ricoh Co Ltd Circuit board inspection device, storage medium, circuit board inspection method, circuit board manufacturing method, and circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0679149U (en) * 1993-04-23 1994-11-04 安藤電気株式会社 Tape carrier with polishing sheet
JPH11145212A (en) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd Cleaning device for probe card
JPH11295392A (en) * 1998-04-15 1999-10-29 Micronics Japan Co Ltd Device for removing foreign matter adhering to probe
JP2000223539A (en) * 1999-01-29 2000-08-11 Tokyo Electron Ltd Cleaner and cleaning method
JP2002307316A (en) * 2001-04-09 2002-10-23 Nihon Micro Coating Co Ltd Instrument for cleaning tip and side face of contact
WO2004068154A1 (en) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Tcp handling device and positional deviation correcting method for the same
JP2006208009A (en) * 2005-01-25 2006-08-10 Ricoh Co Ltd Circuit board inspection device, storage medium, circuit board inspection method, circuit board manufacturing method, and circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059010A (en) * 2009-09-11 2011-03-24 Ueno Seiki Kk Test contact, its cleaning method, and semiconductor manufacturing device
JP2011149917A (en) * 2009-12-22 2011-08-04 Micronics Japan Co Ltd Probe cleaning unit, and panel inspection device and probe cleaning method having the same
EP2426794A1 (en) * 2010-09-06 2012-03-07 Rasco GmbH Cleaning a contactor in a test-in-strip handler for ICs
JP2022003330A (en) * 2020-06-12 2022-01-11 致茂電子股▲分▼有限公司Chroma Ate Inc. Cleaning jig
JP7274525B2 (en) 2020-06-12 2023-05-16 致茂電子股▲分▼有限公司 Cleaning jig

Also Published As

Publication number Publication date
KR20090132617A (en) 2009-12-30
JPWO2008120519A1 (en) 2010-07-15
TW200902997A (en) 2009-01-16

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