4 4265 6 at B7 經濟部中央標準局貝工消費合作社印裝 五、發明説明（1 ) 當一種材料受到外加應力或其它形式的應力如熱梯度 所形成的應力時，會使材料內部存在一殘留應力或稱內應 力，且所有的殘留應力將呈現自我平衡狀態，亦即合力及 合力矩均爲零。一種材料若殘留應力過大或殘留應力分佈 不均時，加工製成品即容易產生變形。 隨著工業技術不斷精進，工業產品愈趨小型化，對於 精密度的要求相對提高，在成品精密度的控制上亦趨嚴 格，例如以金屬薄板片沖壓精密電子零組件。成形加工的 電子零組件，會造成成品變形的主要因素：一爲成形過程 中導入的殘留應力過大：另一原因則爲原材料本身殘留應 力太大與殘留應力分佈不均。 一般殘留應力發生的原因有（一）塑性加工：諸如軋 延、伸線（drawing)、擠型、彎曲、鍛造等；（二）加工、 接合、塗覆製程：例如焊接、化學氣相蒸著、物理氣相蒸 著、硏磨等；（三）熱處理：例如水淬、雷射或電漿熱處 理、滲碳、滲氮等。 目前量測殘留應力的方法有（一）鑽孔法（hole-drilling method) : 經由鑽孔 ，量測其週圍應變釋放情 形’計算其應力値；（二）切片法（sectioning method):利用化學蝕刻方法除去試片表層一定厚度，然 後量測板片之變形量，再計算其應力値；（三）X射線繞射 法（x-ray diffraction method):如美國專利 5, 1 48,45 8，利用X射線繞射量測表面應力，爲一種非破 壞檢測方法，但其量測的範圍非常小；（四）超音波法：如 本紙張尺度逋用中國B家揉车（CNS ) A4规榕（210X297公釐） 83.3.10,000 3 (請先閱讀背面之注意事項再填寫本頁)4 4265 6 at B7 Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (1) When a material is subjected to external stress or other forms of stress such as those caused by thermal gradients, a residue will exist inside the material Stress or internal stress, and all residual stresses will present a state of self-equilibrium, that is, the resultant force and resultant torque are zero. If the residual stress of a material is too large or the residual stress distribution is uneven, the processed product is liable to deform. With the continuous advancement of industrial technology, industrial products are becoming more and more miniaturized, and the requirements for precision are relatively high. Control of the precision of finished products is also becoming stricter, such as stamping precision electronic components with thin metal sheets. The main causes of deformation of the finished electronic components are: first, the residual stress introduced during the forming process is too large; and the other reason is that the residual stress of the raw material is too large and the residual stress is unevenly distributed. Common causes of residual stress are (1) plastic processing: such as rolling, drawing, extrusion, bending, forging, etc .; (2) processing, joining, coating processes: such as welding, chemical vapor deposition , Physical vapor deposition, honing, etc .; (3) heat treatment: such as water quenching, laser or plasma heat treatment, carburizing, nitriding, etc. The current methods for measuring residual stress are (a) hole-drilling method: measuring the surrounding strain release situation through drilling to calculate its stress; (b) sectioning method: using chemistry The etching method removes a certain thickness of the surface layer of the test piece, and then measures the deformation of the plate, and then calculates the stress 値; (c) X-ray diffraction method: such as US Patent 5, 1 48, 45 8 The use of X-ray diffraction to measure surface stress is a non-destructive detection method, but its measurement range is very small; (4) Ultrasound method: If this paper is scaled, the Chinese B-type car (CNS) A4 regulations are used Ficus (210X297 mm) 83.3.10,000 3 (Please read the notes on the back before filling this page)
V 訂 線. 經濟部中央樣準局貝工消費合作社印装 ! W A7 _B7 _ 五、發明説明（2 ) 美國專利5,29,4 3 5，利用音波的變化計算殘留應力値； 及（五）磁力法（magnetic method):如美國專利 5,1 64,669，適用於鐵磁性材料，利用磁化和彈性應變之 關係計算殘留應力値。 以上方法各有其特色，例如鑽孔法、X射線繞射法等 方法屬於局部小區域殘留應力的量測，其它方法雖然可以 量測較大面積的應力，但基本上均著重於單點應力絕對値 的求取，對於因材料內部殘留應力分佈不均勻造成的變形 之檢測，確是一點幫助都沒有。 針對習知殘留應力檢測方法之缺點，本發明主要目的 爲提供一種殘留應力分佈之檢測方法，以殘留應力相對値 爲考量因素，檢測待測物的殘留應力分佈情形。本發明另 一目的爲提供一種殘留應力的檢測方法，做爲金屬板片進 料品管之檢驗方法。本發明再一目的爲提供一種殘留應力 的檢測方法，做爲金屬板片分條品管之檢驗方法。本發明 又一目的爲提供一種殘留應力的檢測方法，做爲加工成品 品質的檢驗方法。 緣是爲達前揭目的，本發明係關於一種殘留應力分佈 之檢測方法，將待測物以化學蝕刻製程形成梳狀之懸臂 樑，量測每一根懸臂樑在化學蝕刻製程後之翹曲量，得該 待測物殘留應力分佈之狀況。由於殘留應力的存在範圍爲 材料降伏強度（yield stress)範圍內，其應力値並不是很 大，它對於外加應力的導入非常敏感，因此本發明主要特 色是以完全無外加應力導入的方式檢驗殘留應力，它是屬 本紙張尺度逍用中國國家搮丰（CNS > A4規格（210X297公釐） S3.110,000 4 (請先閔讀背面之注意事項再填寫本頁) -s 線. _ _B7_ _ _B7_ 經濟央標準局貝工消費合作杜印装 83.3. !0,〇〇〇 五、發明説明（3 ) 於一種全體性的檢測方式，而不是如習知檢測方法的局部 區域檢驗，此一檢測方法可以完全呈現應力分佈之情形’ 適合應用於精密零件用之厚度^ mm金屬板片及其加 工成品如導線架的變形檢測。 以下將配合圖式’對本發明做更進一步說明。 第一圖爲化學蝕刻製程後，翹曲量量測示意圖： 參考圖號B:化學蝕刻製程前，待測板片位置； 參考圖號A:化學蝕刻製程後，懸臂樑位置； 參考圖號V··翹曲量。 第二圖爲化學蝕刻底片示意圖： 參考圖號L:懸臂樑之長度； 參考圖號X:懸臂樑之寬度； 參考圖號D:相臨懸臂樑之間矩。 第三圖爲厚度0.25mm銅片，經化學蝕刻製程後，其 懸臂樑寬度及間矩爲2mm之翹曲量量測。 第四圖爲厚度〇.25mm銅片，經化學蝕刻製程後，其 懸臂樑寬度及間矩爲Umm之翹曲量量測。 第五圖爲厚度〇.25mm銅片’經化學蝕刻製程後’其 懸臂樑寬度及間矩爲1mm之翹曲量量測。 第六圖爲厚度〇.25mm銅片’經化學蝕刻製程後’其 懸臂樑寬度及間矩爲0.75111111之翹曲量量測。 第七圖爲導線架示意圖。 第八圖爲經化學蝕刻製程後’除去邊框之導線架示意 本紙張尺度逍用中國Η家梯率（CNS ) A4说格（ (諳先M讀背面之注意事項再填寫本頁) 訂 線· 5 442656 A7 B7_ 五、發明説明（4 ) (請先H讀背面之注項再填寫本頁) 在金屬薄板片之檢測方面，其檢測方法爲將金屬薄板 片經化學蝕刻製程，利用蝕刻液蝕刻成如梳狀之懸臂樑， 然後量測每一個懸臂樑之翹曲量。翹曲量之量測如第一圖 所示，爲經化學蝕刻製程後，懸臂樑末端和原金屬板片間 之位差。其實施方法與一般金屬製品之蝕刻製程雷同，步 驟包括：（一）板片淸洗；（二）前處理；（三）壓膜：（四）曝 光；（五）顯影；（六）蝕刻；（七）光阻劑去除及（八）翹曲量 量測。 線· 經濟部中央樣準局貝工消費合作社印製 本發明技術重點之一爲化學蝕刻底片設計，如第二圖 所示之化學蝕刻底片示意圖，經由懸臂樑寬度X及懸臂樑 間距D的選擇，不同懸臂樑寬度與懸臂樑間距，顯現出金 屬板片不同之翹曲量。第三、四、五、六圖爲厚度 0.25mm之銅板片經化學蝕刻製程後，懸臂樑寬度及間距 分別爲2mm、1.5mm、1.0mm及0.75mm之题曲量量 測。（長度L固定不變）。當蝕刻後之懸臂樑寬度愈窄》翹 曲愈嚴重，此一現象顯示金屬板片加工條件愈精細，金屬 板片之翹曲量愈大，其變形愈明顯。利用此一檢測方法， 依加工成品之規格需求，訂定金屬板片之殘留應力等級， 愈精細之加工成品，其要求之殘留應力等級愈小’才不致 於造成成品之變形。 依材料力學的原理，每一個懸臂樑和翹曲量之間的關 係如下公式所示：Thread V. Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs! W A7 _B7 _ V. Description of the invention (2) US patent 5,29,4 3 5, using the change of sound waves to calculate the residual stress 値; and (五) Magnetic method: such as US patent 5,1 64,669, suitable for ferromagnetic materials, using the relationship between magnetization and elastic strain to calculate the residual stress 値. Each of the above methods has its own characteristics. For example, the drilling method, X-ray diffraction method, etc. belong to the measurement of residual stress in a small local area. Although other methods can measure stress in a large area, they basically focus on single-point stress. The determination of absolute chirp does not help the detection of the deformation caused by the uneven distribution of the residual stress in the material. In view of the shortcomings of the conventional residual stress detection method, the main purpose of the present invention is to provide a detection method of residual stress distribution, which takes the relative stress of the residual stress into consideration to detect the residual stress distribution of the test object. Another object of the present invention is to provide a method for detecting residual stress, which is used as a method for inspecting the feeding tube of a metal plate. It is still another object of the present invention to provide a method for detecting residual stress as a method for inspecting the quality control of a strip of metal plates. Another object of the present invention is to provide a method for detecting residual stress as a method for inspecting the quality of a finished product. In order to achieve the purpose of the previous disclosure, the present invention relates to a method for detecting residual stress distribution. The test object is formed into a comb-shaped cantilever beam by a chemical etching process, and the warpage of each cantilever beam after the chemical etching process is measured. Measurement to obtain the condition of the residual stress distribution of the test object. Since the range of residual stress is in the range of yield stress of the material, the stress 値 is not very large, and it is very sensitive to the introduction of applied stress. Therefore, the main feature of the present invention is to check the residual in a way of completely introducing no applied stress. Stress, it belongs to the Chinese paper standard (CNS > A4 size (210X297 mm)) S3.110,000 4 (Please read the notes on the back before filling this page) -s line. _ _B7_ _ _B7_ Shell and Consumer Cooperation of the Economic Central Bureau of Standards, Du Duan 83.3.! 0, 005. Description of the Invention (3) This is a general inspection method, not a local area inspection such as the conventional inspection method. The method can fully present the situation of stress distribution. It is suitable for deformation detection of ^ mm metal plates and processed products such as lead frames for precision parts. The invention will be further explained below with the drawings. The first figure is Schematic diagram of warpage measurement after chemical etching process: Reference drawing No. B: Position of plate to be tested before chemical etching process; Reference drawing No. A: Hanging after chemical etching process Beam position; refer to drawing number V ·· warpage. The second picture is a schematic view of chemical etching film: reference drawing number L: length of cantilever beam; reference drawing number X: width of cantilever beam; reference drawing number D: adjacent cantilever Moment between beams. The third picture is a copper sheet with a thickness of 0.25mm. After the chemical etching process, the width of the cantilever beam and the warpage are measured with a warpage of 2mm. The fourth picture is a copper sheet with a thickness of 0.25mm. After the etching process, the width and the moment of the cantilever beam are measured by the warpage of Umm. The fifth figure is the thickness of the 0.25mm copper sheet 'after the chemical etching process' and the amount of warpage of the cantilever beam and the moment is 1mm Measurement. The sixth picture shows the warpage measurement of the cantilever beam width and the moment between the copper plate with a thickness of 0.25mm 'after the chemical etching process' and the inter-moment of 0.75111111. The seventh picture is a schematic diagram of the lead frame. After the etching process, the lead frame with the frame removed is an indication of the use of Chinese paper grades (CNS) A4. ((Please read the precautions on the back before filling this page). Threading · 5 442656 A7 B7_ V. Description of the Invention (4) (Please read the note on the back before filling this page) In terms of detection, the detection method is to chemically etch a metal sheet into a comb-shaped cantilever beam using an etching solution, and then measure the warpage amount of each cantilever beam. The measurement of the warpage amount is the first The figure shows the position difference between the end of the cantilever beam and the original metal sheet after the chemical etching process. The implementation method is the same as that of the general metal product etching process. The steps include: (a) plate cleaning; (b) Pretreatment; (3) Lamination: (4) Exposure; (5) Development; (6) Etching; (7) Photoresist removal; and (8) Warpage measurement. Industrial and consumer cooperatives printed one of the technical highlights of the present invention for the design of chemically etched negatives. As shown in the second diagram of the chemically etched negatives, different cantilever beam widths and cantilever beam distances were selected through the choice of cantilever width X and cantilever beam distance D , Showing different amounts of warpage of metal plates. The third, fourth, fifth, and sixth pictures are the measurement of the inflection of the cantilever beam width and spacing of 2mm, 1.5mm, 1.0mm, and 0.75mm after the chemical etching process of the copper plate with a thickness of 0.25mm. (The length L is fixed). The narrower the width of the cantilever beam after etching, the more serious the warpage. This phenomenon shows that the finer the processing conditions of the metal sheet, the greater the amount of warpage of the metal sheet, and the more obvious its deformation. With this test method, the residual stress level of the metal sheet is determined according to the specifications of the finished product. The finer the finished product, the smaller the required residual stress level will not cause deformation of the finished product. According to the principle of material mechanics, the relationship between each cantilever beam and the amount of warpage is as follows:
V = qL4/8EI 本紙張尺度逍用中國國家樣準（CNS) A4说格(2丨0X297公釐） 83.3. ι〇,〇〇〇 6 4 42 6 5 6 a? B7 五、發明説明（5 ) 其中V爲懸臂樑末端之翹曲量； q爲殘留應力： L爲懸臂樑長度； E 爲彈性係數（modulus of elasticity); I 爲慣性矩（moment of inertia)。 由上公式可知，同一懸臂樑，其翹曲量和懸臂樑之長 度4次方成正比。對不同懸臂樑，其懸臂樑長度相同時， 其翹曲量和殘留應力成正比，即殘留應力大之懸臂樑，翹 曲量亦大。又上述公式中慣性矩的大小與懸臂樑的寬度成 正比，因此當懸樑臂的寬度愈大時，翹曲量愈小。 以金屬薄板片及其導線架加工成品爲例，若欲成型不 同長度之導線架時，導線架引腳（lead)長度愈長，則原材 料板片的殘留應力要求愈小，否則容易造成引腳變形。又 若欲成型之導線架，其引腳數愈多，則原材料板片的殘留 應力要求愈小，否則容易造成引腳變形。由此可藉由導線 架在加工成型時之導線翹曲量量測，進一步建立導線架加 工廠在原材料板片的進料品管篩檢標準。 另一方面在導線架成品檢驗，一般1C構裝廠在構裝 過程中，對於較細間距的導線架或外引腳（outer lead) 較長的導線架，在導線架邊框被除去後，亦有因殘留應力 引起之變形的問題，此時外引腳末端已無任何支撐固定， 可視同一懸臂樑，因此本發明亦可針對導線架此一變形現 象作一檢測。導線架成品之檢驗，其實施之方法類同於金 本紙張尺度逍用中國®家樣準（CNS ) A4说格（210X297公釐） 7 (請先閎讀背面之注意事項再填寫本頁) -aV = qL4 / 8EI The paper size is in accordance with China National Standard (CNS) A4 parity (2 丨 0X297 mm) 83.3. Ι〇, 〇〇〇6 4 42 6 5 6 a? B7 V. Description of the invention (5 ) Where V is the amount of warpage at the end of the cantilever beam; q is the residual stress: L is the length of the cantilever beam; E is the modulus of elasticity; I is the moment of inertia. It can be known from the above formula that the warp of the same cantilever beam is proportional to the fourth power of the length of the cantilever beam. For different cantilever beams, when the length of the cantilever beam is the same, the amount of warpage is proportional to the residual stress, that is, for a cantilever beam with a large residual stress, the amount of warpage is also large. In the above formula, the moment of inertia is proportional to the width of the cantilever beam. Therefore, the larger the width of the cantilever arm, the smaller the amount of warpage. Taking metal sheet and its lead frame processed product as an example, if you want to form lead frames of different lengths, the longer the lead length of the lead frame, the smaller the residual stress requirements of the raw material sheet, otherwise it is easy to cause the lead Deformation. In addition, if the lead frame to be formed has more pins, the residual stress requirements of the raw material sheet will be smaller, otherwise the pins will be easily deformed. In this way, through the measurement of the warpage of the lead frame during the processing and forming, it is possible to further establish the screening standard for the incoming product tube of the raw material sheet in the lead frame processing factory. On the other hand, during the inspection of the finished lead frame, generally, during the assembly process of the 1C assembly plant, the finer-pitch lead frame or the outer lead with a longer lead frame are also removed after the lead frame is removed. There is a problem of deformation due to residual stress. At this time, the end of the outer pin is fixed without any support and can be seen as the same cantilever beam. Therefore, the present invention can also detect the deformation of the lead frame. The inspection method of the finished lead frame is implemented in the same way as the gold paper standard. Easy to use China® Home Sample Standard (CNS) A4 (210X297 mm) 7 (Please read the precautions on the back before filling out this page) -a
經濟ΐ央揉準局貞工消费合作社印裝 83. 3.10,000 Ο 65 6 Α7 Β7 五、發明説明（6) 屬板片之檢測步驟=如第七圖所示之導線架，經由化學蝕 刻的方式將導線架邊框除去，得如第八圖之圖案。由於導 線架之外引腳裸露，因外引腳末端將完全失去支撐’其產 生變形之原理和懸臂樑相同。若導線架原來存在的殘留應 力大，則外引腳之翹曲量大，使得導線架變形。由此可藉 由導線架之外引腳翹曲量量測，進一步建立導線架的品質 篩檢標準。 綜上所述，本發明之殘留應力分佈檢測方法，有別於 習知之殘留應力量測方法，能有效地應用於全面檢測金屬 板片及其加工成品之殘留應力分佈，並依其檢測結果，做 爲品質管理之篩選標準，具有工業上實用價値，應合於申 請發明專利之條件。凡依本發明申請專利範圍之特徵及精 神所做之各種變化及修飾，皆應仍屬本發明涵蓋之範圍。 (請先Μ讀背面之注意事項再填寫本頁) 訂 經濟部中央揉準局®c工消費合作社印装 813.10,000 本紙張尺度逍用中國Η家揉率（CNS ) A4洗格（210X297公釐） 8Printed by the Central Economic and Trade Commission of the People's Republic of China. 83. 3.10,000 Ο 65 6 Α7 Β7 V. Description of the invention (6) Testing steps for metal plates = lead frame as shown in Figure 7, chemically etched The frame of the lead frame is removed in a manner similar to the pattern in the eighth figure. Because the outer pins of the lead frame are exposed, the ends of the outer pins will completely lose their support, and the deformation principle is the same as that of the cantilever beam. If the original residual stress of the lead frame is large, the amount of warpage of the outer pins is large, which will cause the lead frame to deform. Therefore, the quality of the lead frame can be further established by measuring the warpage of the pins outside the lead frame. In summary, the residual stress distribution detection method of the present invention is different from the conventional residual stress measurement method, and can be effectively applied to comprehensively detect the residual stress distribution of metal plates and processed products, and according to the detection results, As a screening standard for quality management, it has a practical price in industry and should be eligible for applying for an invention patent. All changes and modifications made according to the characteristics and spirit of the scope of patent application of the present invention shall still fall within the scope of the present invention. (Please read the precautions on the back before filling in this page.) Order printed by the Central Government Bureau of the Ministry of Economic Affairs® C Industrial Consumer Cooperative Co., Ltd. 813.10,000 This paper size is free to use China's household rubbing rate (CNS) A4 washing grid (210X297) Centimeters) 8