CN114414595A - Method for evaluating stress distribution of thin metal plate strip - Google Patents
Method for evaluating stress distribution of thin metal plate strip Download PDFInfo
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- CN114414595A CN114414595A CN202111599617.6A CN202111599617A CN114414595A CN 114414595 A CN114414595 A CN 114414595A CN 202111599617 A CN202111599617 A CN 202111599617A CN 114414595 A CN114414595 A CN 114414595A
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- 239000002184 metal Substances 0.000 title claims abstract description 72
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000009826 distribution Methods 0.000 title claims abstract description 35
- 238000005530 etching Methods 0.000 claims abstract description 49
- 238000005452 bending Methods 0.000 claims abstract description 46
- 238000005096 rolling process Methods 0.000 claims abstract description 9
- 238000005260 corrosion Methods 0.000 claims description 22
- 230000007797 corrosion Effects 0.000 claims description 22
- 239000002390 adhesive tape Substances 0.000 claims description 14
- 238000005070 sampling Methods 0.000 claims 1
- 238000009662 stress testing Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 238000011156 evaluation Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001683 neutron diffraction Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/10—Different kinds of radiation or particles
- G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
- G01N2223/1016—X-ray
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/633—Specific applications or type of materials thickness, density, surface weight (unit area)
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- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
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Abstract
A method for evaluating stress distribution of a thin metal plate strip comprises the steps of etching and cutting the thin metal plate strip along a rolling direction and a transverse direction to prepare a sample strip, carrying out half-etching on the sample strip along a thickness direction, measuring the bending height of the sample strip when the plate strip is horizontally placed and the lateral bending amount of the sample strip when the plate strip is vertically placed, evaluating the stress distribution condition of the plate strip in the thickness direction through the bending height and the lateral bending amount of the sample strip, and applying the stress distribution condition to potential plate shapes of metal in a half-etching processing process for judging, thereby indicating a measuring method for quantitative stress testing. When the deflection height is larger than or equal to 0.5mm, determining that the stress distribution is not uniform, and measuring the stress of the upper surface and the lower surface of the plate belt, the 1/4 thickness, the 1/2 thickness and the 3/4 thickness by adopting X rays; when the deflection height is <0.5mm, the stress distribution is further judged by the amount of side bending. When the lateral bending is more than or equal to 20mm, the uneven distribution of the stress of the plate strip can be judged, and the stress of the upper surface and the lower surface of the plate strip, the thickness of 1/4, the thickness of 1/2 and the thickness of 3/4 are measured by adopting X rays. When the lateral bending is less than 20mm, the thickness stress can be judged to be uniform, and only the stress of a single surface needs to be measured by X-rays.
Description
Technical Field
The invention relates to the technical field of stress evaluation, in particular to a method for evaluating stress distribution of a thin metal plate strip.
Background
The electronic industry uses a semi-etching process to process metal parts such as a soaking plate, a lead frame and the like, and has higher requirements on the apparent plate shape and the potential plate shape of raw materials. In the production of thin metal strips, hot rolling, cold rolling, heat treatment, shearing and other processes are generally carried out, residual stress is generated in different degrees in each process, and particularly, stress distribution is inconsistent among different parts of strips due to non-uniform deformation or non-uniform temperature. Although the internal stress of the metal plate strip can be reduced by continuous tension annealing, stretch bending, straightening and other processes in the subsequent process of the thin metal plate strip, the evaluation method of the internal stress of the whole process flow and different batches is lacked, so that each control procedure cannot obtain effective stress feedback.
The methods for measuring the internal stress can be divided into a nondestructive method and a destructive method, wherein the nondestructive method comprises an X-ray method, an ultrasonic method, an indentation strain resistance method, a magnetic method and a neutron diffraction method, and the destructive method comprises a blind hole method, a strip deformation method and a notch method. The internal stress test method for the sheet material comprises an X-ray method, a strip deformation method and the like.
According to japanese standard JBMA-T304-201, when evaluating the edge stress of a copper plate strip, the edge is striped and the deflection, lateral bending, torsion, etc. are characterized, considering that the deflection deformation is related to the stress distribution in the thickness direction, the test value is affected by the reverse bending and the dead weight, theoretically, it is proportional to the square of the stripe length, inversely proportional to the thickness, and proportional to the stress gradient. The method is suitable for evaluating the stress of the edge part of the punching material due to slitting.
For etching metal strips, the etching graph of a downstream processing plant is generally adopted to carry out half etching to evaluate whether the stress of the strips is qualified, the stress judgment lacks contrast, and the evaluation result lacks universality. However, it is difficult to optimize the number of test points for stress evaluation by using all X-ray tests, and the test cost is high.
Disclosure of Invention
Aiming at the defects of the prior art, the invention overcomes the problems of non-uniform stress evaluation standard and high cost, and provides an evaluation method for stress distribution of thin (thickness is below 1 mm) metal plates and strips.
The invention is realized by the following technical scheme.
A method of evaluating stress distribution in a thin metal strip, the method comprising: the method comprises the steps of respectively adopting an etching method to strip a rectangular sample strip with the width of 2-50 mm and the length of 100 +/-0.5 mm in the rolling direction and the transverse direction of the middle part of a metal plate strip, connecting one end of the sample strip with the metal plate strip, etching the other end of the sample strip, carrying out half-etching on the sample strip in the thickness direction, counting the deflection condition of the sample strip when the metal plate strip is horizontally placed, vertically placing the metal plate strip to measure the lateral bending amount of the sample strip when the deflection height of the sample strip with any half-etching depth is less than 0.5mm, and evaluating the stress distribution condition of the metal plate strip in the thickness direction through the lateral bending amount.
Further, the splines are half-etched to a depth of one or more of 1/4, 1/2, 3/4 of the sheet metal strip thickness.
Further, when the deflection height of the sample strip at any half etching depth is more than or equal to 0.5mm, the stress distribution of the metal strip can be judged to be non-uniform, and the stress of the upper surface and the lower surface of the metal strip, the 1/4 thickness part, the 1/2 thickness part and the 3/4 thickness part is measured by adopting X-rays.
Further, when the lateral bending amount is larger than or equal to 20mm, the stress distribution of the metal plate strip can be judged to be uneven, and the stress of the upper surface, the stress of the lower surface, the stress of the 1/4 thickness part, the stress of the 1/2 thickness part and the stress of the 3/4 thickness part of the metal plate strip are measured by adopting X rays; when the lateral bending amount is less than 20mm, the stress distribution of the metal plate strip can be judged to be uniform, and only the stress on the surface of the metal plate strip is measured by adopting X-rays.
Further, firstly, the two sides of the metal plate strip are protected by adhering corrosion-resistant adhesive tapes, one side of the metal plate strip is carved with a notch of a required sample strip, the other side of the metal plate strip is carved with a notch corresponding to a half-etching part on the sample strip, then the corrosion-resistant adhesive tapes covered on the half-etching part are removed, etching is carried out to a required depth, finally the corrosion-resistant adhesive tapes of the half-etching part are adhered, then the corrosion-resistant adhesive tapes of the notch of the required sample strip are removed, and the notch of the required sample strip is etched.
Further, when the lateral bending amount of the sample strip is measured when the metal plate strip is vertically placed, the length direction of the sample strip is parallel to the horizontal plane, the non-corroded substrate surface (namely the metal plate strip) in the lateral bending direction of the sample strip is used as a reference line, and the lateral bending amount of the sample strip is measured by adopting an image measuring instrument or a laser three-coordinate instrument.
The beneficial technical effects of the invention are as follows: the stress of the metal plate strip is systematically evaluated by combining a half-etching striping method and an X-ray method, stress distribution is judged according to the deflection or lateral bending condition of a half-etching striping spline, and the position and the number of X-ray detection points are determined, so that the stress of the metal plate strip is sufficiently quantitatively evaluated, and the evaluation cost can be reduced.
Drawings
Fig. 1 is a moment analysis of the rotation of the metal strip.
Fig. 2 is a typical stress distribution model for a thin metal plate.
FIG. 3 is a schematic diagram of a thin metal plate undergoing half-etching and stripe division, wherein (a) is a front side scribe pattern and (b) is a back side scribe pattern, wherein white portions are etched portions.
FIG. 4 is a schematic diagram showing the measurement of the bending height (a) and the bending amount (b) of a sample strip of a half-etched metal strip.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
FIG. 1 shows the analysis of different deformation characteristic moments when an etched sample strip is horizontally placed, wherein a deformation symmetrical plane of deflection is a 1/2 thickness plane, a rotating shaft is parallel to the transverse direction of the strip, namely the TD direction, a stressed rigid thin rod is parallel to the normal direction of the strip, namely the ND direction, and stress parallel to the surface has a rotating effect on the deflection.
Fig. 2 shows a typical stress distribution model for a thin metal plate, which has guaranteed flatness before half-etching, but has been etched at different depths to find that the moment is not balanced, causing deflection or curl. By adopting the method, the deformation constraint, particularly the constraint in the thickness direction, is released by changing the dimensions of the strip in the width direction and the thickness direction, the stress distribution is speculated by etching a metal sample strip, carrying out half etching and testing the deflection of the sample strip, wherein the relation between the bending moment and the stress of the sample strip can be expressed as follows:
wherein σ is the stress of each point of the sample strip parallel to the surface of the metal plate strip, t0Residual thickness of the sample at half-etching, w0Is the width of the spline, /)0Is the length of the spline, K is the coefficient, M is the bending moment of the spline, t is the thickness, w is the width, and l is the length.
Before stress evaluation, the flatness of the metal plate strip needs to be measured, and whether the requirements of standards on the flatness are met or not is judged.
Specifically, the method for evaluating the stress distribution of the thin metal plate strip comprises the following steps: respectively stripping a rectangular sample strip with the width of 2-50 mm and the length of 100 +/-0.5 mm in the rolling direction and the transverse direction of the middle part of the metal plate strip by an etching method, connecting one end of the sample strip with the metal plate strip, etching the other end of the sample strip, and simultaneously carrying out half-etching on the sample strip in the thickness direction, wherein the half-etching depth is one or more of 1/4, 1/2 and 3/4 of the thickness of the metal plate strip, the bending condition of the sample strip when the metal plate strip is horizontally placed is counted, and the bending condition of the sample strip is shown in fig. 4 (a). And when the deflection height of any half etching depth sample strip is less than 0.5mm, measuring the lateral bending of the sample strip when the metal strip is vertically placed, and evaluating the stress distribution condition of the metal strip in the thickness direction according to the lateral bending amount, wherein the measurement is shown in figure 4 (b).
The stress analysis process of the metal plate strip comprises the steps of protection, etching, corrosion, measurement and the like.
First, both sides of a sample to be measured (i.e., a thin metal plate) are tightly covered with an acid-resistant transparent adhesive tape. The middle part of one surface of the thin metal plate, namely the part which is more than 12.5mm away from the edge, is carved with a rectangular strip and a corrosion seam at the edge part by using a steel ruler and a sharp blade, wherein the width of the rectangular strip is 20 +/-0.2 mm, the length of the rectangular strip is 100 +/-0.5 mm, the length direction of the rectangular strip is parallel to the rolling direction, the starting end of the rectangular rolling direction is not carved with the corrosion seam, the width of the corrosion seam is 0.5 mm-1 mm, and the corrosion-resistant adhesive tape at the position is reserved after the carving. And scribing a frame with the thickness of more than 21 x 101mm on the other surface corresponding to the etching pattern, ensuring that the corrosion joint and the sample strip are covered, and removing the corrosion-resistant adhesive tape on the surface, wherein the surface is marked as a semi-etching surface.
Secondly, the concentrated nitric acid and the deionized water are mixed into corrosive liquid with the ratio of 1:10, the thin metal plate is stably placed in the nitric acid for corrosion, and the part of the thin metal plate, from which the adhesive tape is removed, namely the half-etched surface is firstly corroded to the designated position of the thickness. Cleaning and drying the half-etched surface, sticking the half-etched surface with a corrosion-resistant adhesive tape, corroding the corrosion joint on the other surface, taking out the half-etched surface from the corrosive liquid after most of the corrosion joint is corroded, cleaning the half-etched surface in clean water, and removing all the corrosion-resistant adhesive tape. If part of the corrosion liquid is not corroded, the part which is not corroded is corroded by sucking the corrosion liquid by a suction pipe. And finally, thoroughly cleaning and drying the thin metal plate strip, wherein the deformation of the etching part is prevented in the cleaning and drying process.
The etched metal strip is then placed on a horizontal table of a height gauge, and the height of deflection of the sample strip is measured using the height gauge. When the deflection height is larger than or equal to 0.5mm, the stress distribution of the metal plate strip can be judged to be uneven, and the stress of the upper surface and the lower surface of the metal plate strip, the 1/4 thickness part, the 1/2 thickness part and the 3/4 thickness part is measured by adopting X rays. And when the deflection height is less than 0.5mm, judging the stress distribution condition by measuring the lateral bending amount of the sample strip when the metal plate strip is vertically placed.
When the lateral bending amount of the sample strip is measured, the thin metal plate strip after half etching splitting is clamped by flat tongs to be vertically placed and fixed, as shown in fig. 4(b), the length direction of the sample strip is parallel to the horizontal plane and is placed below an image measuring instrument or a laser three-coordinate instrument, a basal body surface which is not corroded in the lateral bending direction is selected as a datum line, and the distance from the top point of the bent sample strip to the datum line is measured to obtain the lateral bending amount of the half etching sample strip. And evaluating whether the stress state of the thin metal plate strip is qualified or not through the lateral bending amount. When the lateral bending amount is larger than or equal to 20mm, the stress distribution can be judged to be uneven, and the stress of the upper surface and the lower surface of the plate belt, the 1/4 thickness, the 1/2 thickness and the 3/4 thickness part is measured by adopting X rays. When the lateral bending amount is less than 20mm, the stress can be judged to be uniform, and the single surface stress of the metal plate strip can be measured only by X-rays.
Example 1:
taking a C194 copper plate strip with the dimensions of 0.308mm thickness, 200mm width and 250mm length (rolling direction), carrying out spline etching according to the figure 1, and half-etching to half the thickness of the copper plate strip (namely, the thickness is 0.154mm), wherein the width of the spline is 20mm and the length of the spline is 100mm, measuring the bending height of the spline when the copper plate strip is horizontally placed, and measuring the lateral bending amount of the spline when the copper plate strip is vertically placed because the bending height is less than 0.5mm, wherein the measured values are shown in the table 1. Because the deflection height is less than 0.5mm and the lateral bending amount is less than 20mm when the copper plate is vertically placed, the stress of the copper plate is judged to be qualified, namely the stress is uniformly distributed, and the surface stress is 25MPa measured by X-ray.
TABLE 1 evaluation of the parameters of copper strip after etching
Example 2:
taking a C194 copper strip with the dimensions of 0.308mm thickness, 200mm width and 250mm length (rolling direction), strip etching is carried out according to the figure 1, and half etching is carried out until half of the thickness of the copper strip (namely, the thickness is 0.154mm), wherein the width of the strip is 20mm, the length of the strip is 100mm, the bending height of the strip is measured when the copper strip is flatly placed, and the measured values are shown in the table 2. Because the deflection height of the horizontally placed sample strip is more than 0.5mm, the stress of the copper plate is judged to be unqualified, namely the stress distribution is not uniform, the stress of the upper surface of the copper plate is-170 MPa, the stress of the lower surface of the copper plate is-156 MPa, the stress of 1/4 thickness part is-100 MPa, the stress of the central part (namely 1/2 thickness) is-50 MPa, the stress of 3/4 thickness part is-80 MPa, and the maximum stress difference reaches 120 MPa.
TABLE 2 evaluation of the parameters of copper strips after etching
Example 3:
taking a C194 copper plate strip with the dimensions of 0.308mm thickness, 200mm width and 250mm length (rolling direction), carrying out spline etching according to the figure 1, and half-etching to a specified depth, wherein the width of a spline is 20mm, the length of the spline is 100mm, and measuring the deflection height of the spline when the copper plate strip is flatly placed, and the measured values are shown in the table 3. The deflection height of the horizontally placed sample strip is more than 0.5mm, the stress distribution of the copper plate is judged to be unqualified, namely the stress distribution is not uniform, the upper surface stress is-213 MPa, the lower surface stress is-180 MPa, the stress of 1/4 thickness parts is-112 MPa, the stress of a central part is-34 MPa, the stress of 3/4 thickness parts is-147 MPa, and the maximum stress difference reaches 179 MPa.
TABLE 3 evaluation of the parameters of the copper strip after etching
The invention can overcome the problems of non-uniform stress evaluation standard and high cost, and develops a spline half-etching method, which utilizes the deformation generated by uneven stress distribution in the thickness direction to evaluate the stress difference between the central part and the surface of the plate by measuring the deflection height or the lateral bending amount, so that the stress evaluation method can be uniform, and the X-ray detection scheme is optimized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention. It should be noted that other equivalent modifications can be made by those skilled in the art in light of the teachings of the present invention, and all such modifications can be made as are within the scope of the present invention.
Claims (6)
1. A method of evaluating stress distribution in a thin metal strip, the method comprising: the method comprises the steps of respectively adopting an etching method to strip a rectangular sample strip with the width of 2-50 mm and the length of 100 +/-0.5 mm in the rolling direction and the transverse direction of the middle part of a metal plate strip, connecting one end of the sample strip with the metal plate strip, etching the other end of the sample strip, carrying out half-etching on the sample strip in the thickness direction, counting the deflection condition of the sample strip when the metal plate strip is horizontally placed, vertically placing the metal plate strip to measure the lateral bending amount of the sample strip when the deflection height of the sample strip with any half-etching depth is less than 0.5mm, and evaluating the stress distribution condition of the metal plate strip in the thickness direction through the lateral bending amount.
2. The method of claim 1 wherein the strip is half-etched to a depth of one or more of 1/4, 1/2, 3/4 of the thickness of the strip.
3. The method of claim 1, wherein when the deflection height of the strip at any half etching depth is not less than 0.5mm, the stress distribution of the strip is determined to be non-uniform, and the stresses of the upper and lower surfaces of the strip, the 1/4 thickness portion, the 1/2 thickness portion and the 3/4 thickness portion are measured by X-ray.
4. The method of claim 1, wherein when the amount of lateral bending is not less than 20mm, the stress distribution of the metal strip is determined to be non-uniform, and the stresses of the upper and lower surfaces, the 1/4 thickness part, the 1/2 thickness part and the 3/4 thickness part of the metal strip are measured by X-ray; when the lateral bending amount is less than 20mm, the stress distribution of the metal plate strip can be judged to be uniform, and only the stress on the surface of the metal plate strip is measured by adopting X-rays.
5. The method of claim 1, wherein the metal strip is protected by applying corrosion-resistant adhesive tapes to both sides, one side of the metal strip is scribed with the desired cut of the strip, the other side is scribed with the cut corresponding to the half-etched portion of the strip, the corrosion-resistant adhesive tape covering the half-etched portion is removed, the strip is etched to a desired depth, the corrosion-resistant adhesive tape is finally applied to the half-etched portion, the corrosion-resistant adhesive tape is removed from the cut of the desired strip, and the cut of the desired strip is etched.
6. The method of claim 1, wherein when the amount of lateral bending of the strip is measured when the strip is vertically positioned, the length direction of the strip is parallel to the horizontal plane, the non-corroded base surface in the lateral bending direction of the sampling strip is used as a reference line, and the amount of lateral bending of the strip is measured by using an image measuring instrument or a laser three-coordinate measuring instrument.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0626944A (en) * | 1992-07-08 | 1994-02-04 | Hitachi Ltd | Method for measuring stress of thin film, and method and device for manufacturing test piece for stress measurement |
| CN1082192A (en) * | 1993-05-04 | 1994-02-16 | 西安冶金建筑学院 | The measuring method of thin plate unrelieved stress |
| JPH07227620A (en) * | 1994-02-18 | 1995-08-29 | Kobe Steel Ltd | Strip material for electric and electronic parts for half etching and their production |
| CN102980923A (en) * | 2012-11-20 | 2013-03-20 | 上海实达精密不锈钢有限公司 | Internal stress detection method of cold-rolled precise metal thin belt |
| CN110243516A (en) * | 2019-06-05 | 2019-09-17 | 中铝材料应用研究院有限公司 | A kind of method of real-time testing plate internal residual stress distribution |
| CN113533673A (en) * | 2021-07-26 | 2021-10-22 | 中国科学院宁波材料技术与工程研究所 | Metal foil strip internal stress distribution measuring method based on layer-by-layer thinning |
| CN113776715A (en) * | 2021-09-10 | 2021-12-10 | 中铜华中铜业有限公司 | Method for detecting residual stress of lead frame material |
-
2021
- 2021-12-24 CN CN202111599617.6A patent/CN114414595A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0626944A (en) * | 1992-07-08 | 1994-02-04 | Hitachi Ltd | Method for measuring stress of thin film, and method and device for manufacturing test piece for stress measurement |
| CN1082192A (en) * | 1993-05-04 | 1994-02-16 | 西安冶金建筑学院 | The measuring method of thin plate unrelieved stress |
| JPH07227620A (en) * | 1994-02-18 | 1995-08-29 | Kobe Steel Ltd | Strip material for electric and electronic parts for half etching and their production |
| CN102980923A (en) * | 2012-11-20 | 2013-03-20 | 上海实达精密不锈钢有限公司 | Internal stress detection method of cold-rolled precise metal thin belt |
| CN110243516A (en) * | 2019-06-05 | 2019-09-17 | 中铝材料应用研究院有限公司 | A kind of method of real-time testing plate internal residual stress distribution |
| CN113533673A (en) * | 2021-07-26 | 2021-10-22 | 中国科学院宁波材料技术与工程研究所 | Metal foil strip internal stress distribution measuring method based on layer-by-layer thinning |
| CN113776715A (en) * | 2021-09-10 | 2021-12-10 | 中铜华中铜业有限公司 | Method for detecting residual stress of lead frame material |
Non-Patent Citations (1)
| Title |
|---|
| 路俊攀: "铜及铜合金板带材分条变形测量方法探讨", 《理化检验-物理分册》, vol. 40, no. 3, 31 March 2004 (2004-03-31), pages 132 - 134 * |
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