TW396493B - Reactor for the processing of wafers, with a protection devicet - Google Patents

Reactor for the processing of wafers, with a protection devicet Download PDF

Info

Publication number
TW396493B
TW396493B TW087107821A TW87107821A TW396493B TW 396493 B TW396493 B TW 396493B TW 087107821 A TW087107821 A TW 087107821A TW 87107821 A TW87107821 A TW 87107821A TW 396493 B TW396493 B TW 396493B
Authority
TW
Taiwan
Prior art keywords
reactor
wafers
storage
wafer
chamber
Prior art date
Application number
TW087107821A
Other languages
English (en)
Chinese (zh)
Inventor
Wolfgang Volle
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of TW396493B publication Critical patent/TW396493B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Control Of Position Or Direction (AREA)
TW087107821A 1997-06-17 1998-05-20 Reactor for the processing of wafers, with a protection devicet TW396493B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19725527A DE19725527A1 (de) 1997-06-17 1997-06-17 Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung

Publications (1)

Publication Number Publication Date
TW396493B true TW396493B (en) 2000-07-01

Family

ID=7832699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087107821A TW396493B (en) 1997-06-17 1998-05-20 Reactor for the processing of wafers, with a protection devicet

Country Status (5)

Country Link
US (1) US6385503B2 (cg-RX-API-DMAC7.html)
EP (1) EP0886302A3 (cg-RX-API-DMAC7.html)
JP (1) JPH1116989A (cg-RX-API-DMAC7.html)
DE (1) DE19725527A1 (cg-RX-API-DMAC7.html)
TW (1) TW396493B (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127044A (ja) * 1999-10-29 2001-05-11 Hitachi Ltd 真空処理装置および真空処理システム
US6662070B1 (en) * 2000-03-08 2003-12-09 Advanced Micro Devices, Inc. Wafer rotation randomization in cluster tool processing
DE10103253A1 (de) * 2001-01-25 2002-08-01 Leica Microsystems Verfahren und Anordnung zum Transportieren und Inspizieren von Halbleitersubstraten
DE10123062A1 (de) * 2001-05-11 2002-11-21 Steag Hamatech Ag Vorrichtung und Verfahren zum Bewegen von Substraten mit Bewegungskopplung
JP3832294B2 (ja) * 2001-08-31 2006-10-11 株式会社ダイフク 荷保管設備
DE10239311B4 (de) * 2002-08-27 2004-08-26 Infineon Technologies Ag Justagehorde und Verfahren zur Justierung einer Hubeinrichtung in einer Bestückungseinheit für Waferhorden
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment
DE102006015089A1 (de) * 2006-03-31 2007-10-11 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur Scheibenhandhabung in Halbleiterprozessanlagen
CN102315085B (zh) * 2010-06-30 2013-12-18 中芯国际集成电路制造(北京)有限公司 一种等离子体刻蚀机反应腔均匀环倾斜警报装置
US10777438B2 (en) 2013-10-18 2020-09-15 Brooks Automation, Inc. Processing apparatus

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0611069B2 (ja) * 1985-11-05 1994-02-09 キヤノン株式会社 ウエハ整列装置
US4705951A (en) * 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
JPH0743245B2 (ja) * 1987-07-03 1995-05-15 キヤノン株式会社 アライメント装置
JPH0410639A (ja) * 1990-04-27 1992-01-14 Tokyo Electron Ltd 基板処理装置
JPH0475362A (ja) * 1990-07-18 1992-03-10 Canon Inc ウエハ搬送装置
JP2868645B2 (ja) * 1991-04-19 1999-03-10 東京エレクトロン株式会社 ウエハ搬送装置、ウエハの傾き検出方法、およびウエハの検出方法
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5539323A (en) * 1993-05-07 1996-07-23 Brooks Automation, Inc. Sensor for articles such as wafers on end effector
JPH06338558A (ja) * 1993-05-28 1994-12-06 Tel Varian Ltd 検出装置及び処理装置
US5563798A (en) 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
US5606251A (en) * 1994-07-15 1997-02-25 Ontrak Systems, Inc. Method and apparatus for detecting a substrate in a substrate processing system
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system

Also Published As

Publication number Publication date
JPH1116989A (ja) 1999-01-22
EP0886302A3 (de) 2004-04-07
US20010043860A1 (en) 2001-11-22
DE19725527A1 (de) 1998-12-24
EP0886302A2 (de) 1998-12-23
US6385503B2 (en) 2002-05-07

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