DE19725527A1 - Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung - Google Patents

Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung

Info

Publication number
DE19725527A1
DE19725527A1 DE19725527A DE19725527A DE19725527A1 DE 19725527 A1 DE19725527 A1 DE 19725527A1 DE 19725527 A DE19725527 A DE 19725527A DE 19725527 A DE19725527 A DE 19725527A DE 19725527 A1 DE19725527 A1 DE 19725527A1
Authority
DE
Germany
Prior art keywords
reactor
magazine
wafer
wafers
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19725527A
Other languages
German (de)
English (en)
Inventor
Wolfgang Volle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Patentverwaltung GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH filed Critical Philips Patentverwaltung GmbH
Priority to DE19725527A priority Critical patent/DE19725527A1/de
Priority to TW087107821A priority patent/TW396493B/zh
Priority to EP98201936A priority patent/EP0886302A3/de
Priority to JP10166528A priority patent/JPH1116989A/ja
Priority to US09/097,977 priority patent/US6385503B2/en
Publication of DE19725527A1 publication Critical patent/DE19725527A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Control Of Position Or Direction (AREA)
DE19725527A 1997-06-17 1997-06-17 Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung Withdrawn DE19725527A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19725527A DE19725527A1 (de) 1997-06-17 1997-06-17 Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung
TW087107821A TW396493B (en) 1997-06-17 1998-05-20 Reactor for the processing of wafers, with a protection devicet
EP98201936A EP0886302A3 (de) 1997-06-17 1998-06-09 Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung
JP10166528A JPH1116989A (ja) 1997-06-17 1998-06-15 反応器
US09/097,977 US6385503B2 (en) 1997-06-17 1998-06-16 Reactor for the processing of wafers, with a protection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19725527A DE19725527A1 (de) 1997-06-17 1997-06-17 Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung

Publications (1)

Publication Number Publication Date
DE19725527A1 true DE19725527A1 (de) 1998-12-24

Family

ID=7832699

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19725527A Withdrawn DE19725527A1 (de) 1997-06-17 1997-06-17 Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung

Country Status (5)

Country Link
US (1) US6385503B2 (cg-RX-API-DMAC7.html)
EP (1) EP0886302A3 (cg-RX-API-DMAC7.html)
JP (1) JPH1116989A (cg-RX-API-DMAC7.html)
DE (1) DE19725527A1 (cg-RX-API-DMAC7.html)
TW (1) TW396493B (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10239311A1 (de) * 2002-08-27 2004-03-18 Infineon Technologies Ag Justagehorde
DE102006015089A1 (de) * 2006-03-31 2007-10-11 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur Scheibenhandhabung in Halbleiterprozessanlagen

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127044A (ja) * 1999-10-29 2001-05-11 Hitachi Ltd 真空処理装置および真空処理システム
US6662070B1 (en) * 2000-03-08 2003-12-09 Advanced Micro Devices, Inc. Wafer rotation randomization in cluster tool processing
DE10103253A1 (de) * 2001-01-25 2002-08-01 Leica Microsystems Verfahren und Anordnung zum Transportieren und Inspizieren von Halbleitersubstraten
DE10123062A1 (de) * 2001-05-11 2002-11-21 Steag Hamatech Ag Vorrichtung und Verfahren zum Bewegen von Substraten mit Bewegungskopplung
JP3832294B2 (ja) * 2001-08-31 2006-10-11 株式会社ダイフク 荷保管設備
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment
CN102315085B (zh) * 2010-06-30 2013-12-18 中芯国际集成电路制造(北京)有限公司 一种等离子体刻蚀机反应腔均匀环倾斜警报装置
US10777438B2 (en) 2013-10-18 2020-09-15 Brooks Automation, Inc. Processing apparatus

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0611069B2 (ja) * 1985-11-05 1994-02-09 キヤノン株式会社 ウエハ整列装置
US4705951A (en) * 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
JPH0743245B2 (ja) * 1987-07-03 1995-05-15 キヤノン株式会社 アライメント装置
JPH0410639A (ja) * 1990-04-27 1992-01-14 Tokyo Electron Ltd 基板処理装置
JPH0475362A (ja) * 1990-07-18 1992-03-10 Canon Inc ウエハ搬送装置
JP2868645B2 (ja) * 1991-04-19 1999-03-10 東京エレクトロン株式会社 ウエハ搬送装置、ウエハの傾き検出方法、およびウエハの検出方法
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5539323A (en) * 1993-05-07 1996-07-23 Brooks Automation, Inc. Sensor for articles such as wafers on end effector
JPH06338558A (ja) * 1993-05-28 1994-12-06 Tel Varian Ltd 検出装置及び処理装置
US5563798A (en) 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
US5606251A (en) * 1994-07-15 1997-02-25 Ontrak Systems, Inc. Method and apparatus for detecting a substrate in a substrate processing system
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10239311A1 (de) * 2002-08-27 2004-03-18 Infineon Technologies Ag Justagehorde
DE10239311B4 (de) * 2002-08-27 2004-08-26 Infineon Technologies Ag Justagehorde und Verfahren zur Justierung einer Hubeinrichtung in einer Bestückungseinheit für Waferhorden
DE102006015089A1 (de) * 2006-03-31 2007-10-11 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur Scheibenhandhabung in Halbleiterprozessanlagen

Also Published As

Publication number Publication date
TW396493B (en) 2000-07-01
JPH1116989A (ja) 1999-01-22
EP0886302A3 (de) 2004-04-07
US20010043860A1 (en) 2001-11-22
EP0886302A2 (de) 1998-12-23
US6385503B2 (en) 2002-05-07

Similar Documents

Publication Publication Date Title
DE102004044973B4 (de) Kontrolle eines Überwachungsbereiches
DE69636872T2 (de) Vakuumbehandlungsanlage und Halbleiterfertigungsstrasse die diese verwendet
DE69206294T2 (de) Ladungsschleuse und Wafertransportsysteme.
EP1641687B2 (de) Kommissionierplatz und verfahren zum kommissionieren mit einem lichtgitter
DE4038807C2 (de) Vorrichtung zum automatischen Trennen und Zuführen von Chips
DE69404015T2 (de) Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile
EP1224689B1 (de) Anlage zur bearbeitung von wafern
EP1950585B1 (de) Verfahren und Vorrichtung zur Sicherheitsüberwachung eines Durchgangs
EP0886302A2 (de) Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung
DE69934978T2 (de) Ausrichtungsvorrichtung und benutzung dieser vorrichtung in einem halbleiterherstellungsapparat
EP0686303B1 (de) Vorrichtung und verfahren zum transportieren von flachen gegenständen, insbesondere von substraten
EP1856730A1 (de) Verfahren zur positionierung eines wafers
EP1166337B1 (de) Anlage zur fertigung von halbleiterprodukten
EP2108879B1 (de) Verfahren und Vorrichtung zur Überwachung eines Durchgangs
EP1177570A1 (de) Einrichtung zum handhaben von substraten innerhalb und ausserhalb eines reinstarbeitsraumes
DE4310149C2 (de) Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes
EP1873442A1 (de) Verfahren und Vorrichtung zur Sicherheitsüberwachung eines Durchgangs
WO2010045750A1 (de) Speichervorrichtun
DE19981278B4 (de) Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels
WO2024125889A2 (de) Anlage und verfahren für das handling von trays
DE10197066B3 (de) Behälter für Halbleiterprodukte und Vorrichtung zum Handhaben eines Behälters für Halbleiterprodukte
DE4309092A1 (de) Verfahren und Vorrichtung zur Handhabung und zum Transport von Wafern in Reinst-Räumen
DE69424579T2 (de) Verfahren und Montagevorrichtung zum Montieren eines Bauelements auf eine spezifische Position
DE102011120565A1 (de) Vorrichtung und verfahren zum vermessen eines scheibenförmigen substrats
DE60038727T2 (de) Automatisches Kalibrationssystem für einen Wafertransferroboter

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: PHILIPS CORPORATE INTELLECTUAL PROPERTY GMBH, 2233

8127 New person/name/address of the applicant

Owner name: PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH, 20

8110 Request for examination paragraph 44
8139 Disposal/non-payment of the annual fee