US20010043860A1 - Reactor for the processing of wafers, with a protection device - Google Patents
Reactor for the processing of wafers, with a protection device Download PDFInfo
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- US20010043860A1 US20010043860A1 US09/097,977 US9797798A US2001043860A1 US 20010043860 A1 US20010043860 A1 US 20010043860A1 US 9797798 A US9797798 A US 9797798A US 2001043860 A1 US2001043860 A1 US 2001043860A1
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 104
- 238000012545 processing Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 27
- 230000008569 process Effects 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 230000004888 barrier function Effects 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 238000012544 monitoring process Methods 0.000 claims abstract description 5
- 230000032258 transport Effects 0.000 claims description 48
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000001960 triggered effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012634 fragment Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Definitions
- the invention relates to a reactor for processing wafers comprising at least one process chamber, at least one transport chamber with a transport robot for the wafers, and at least one magazine for wafers with a lifting mechanism.
- Known devices for processing semiconductors usually consist of a reactor with several process chambers and one transport chamber.
- a loading and unloading unit is coupled thereto.
- the semiconductor slices (or wafers) are taken from a storage unit comprising a magazine for a plurality of wafers and a lifting mechanism by means of a transport robot which is arranged in the transport chamber, and are loaded via the transport chamber into one of the process chambers.
- the robot loads the wafers consecutively into several process chambers in which the wafer is exposed to different processes.
- the process chambers are accordingly simultaneously occupied by different wafers which are stored again in the magazine of the storage unit between two processes (for example, if a process chamber is occupied) or after the final process. Since a vacuum atmosphere obtains in the entire reactor, and the individual chambers can be closed by means of valves, these processes can run automatically without a wafer entering the atmosphere.
- U.S. Pat. No. 4,819,167 describes a system and a method for the recognition of the center of a circular semiconductor wafer for the manufacture of integrated circuits (wafer 15 ).
- the exact position of a moving object (wafer) can be determined by a robot during transport so as to support the accuracy of this movement.
- Several sensors are provided for determining the relative position of the wafer, which is present on a movable support which follows a given path, with respect to a chosen point to which the support with the wafer is being moved.
- the sensors are triggered by starting and end points of the wafer and supply corresponding signals. The position is calculated from these signals.
- the position of a moving wafer with respect to an internal storage unit with a magazine with lifting mechanism is determined by means of an arrangement of several optical sensors which are positioned transversely to the direction of movement.
- the sensors are fastened to an entry slot inside a transport chamber so as to form a row perpendicular to the direction of movement of the support (vacuum loadlock chamber 11 , cf. e.g. ref. no. 47 in FIGS. 1, 2, 3 and 5 ), in which chamber the internal storage unit is present.
- vacuum loadlock chamber 11 cf. e.g. ref. no. 47 in FIGS. 1, 2, 3 and 5
- To find the center of the wafer several sensors are necessary, on whose signals a complicated calculation is then carried out.
- the position of the wafer is determined up to the internal storage unit only during the transport by means of the support. The system described is only capable of ensuring that the wafer will be in a given position relative to the support when it is on the support (column 1 , lines 35 - 55 ).
- U.S. Pat. No. 5,563,798 describes a wafer positioning system for an automated wafer processing installation (reactor) with several process chambers (processing chambers 6 ).
- the position of the wafer ( 10 ) is determined here in that the position of a wafer transport robot ( 18 ) is identified while the wafer is being moved thereby.
- Sensors are provided for this purpose on a transparent cover of a centrally arranged transport chamber (transfer chamber 16 ).
- the light beams of the optical sensors then passes through the cover and the transport chamber to reflectors provided on the bottom thereof, which reflect the beam back.
- a detector in the sensor recognizes the interruption of the light beam by a wafer which is being moved through the transport chamber.
- the position of the wafer transport robot is then measured on the basis of at least two measured values and is corrected if a deviation from the correct position of the wafer transport robot is detected.
- the position of the wafer is calculated from the measured values in an intricate calculation, and the deviation from the correct position is compensated by a linear and rotational adjustment of the wafer transport robot. The object of this is to achieve that the wafer transport robot transports the wafer correctly into its next position inside the reactor.
- an optical detection device is provided in the reactor for monitoring the positions of the wafers stored in a magazine.
- the optical detection device which may comprise in particular a photoelectric barrier formed by a transmitter (LED) and a receiver (photodiode), is provided inside the reactor according to the invention.
- LED transmitter
- photodiode photodiode
- all wafers stored therein in a magazine with several superimposed compartments can thus be monitored. It is possible in this manner to monitor not only the wafers which were just taken out or put in by the transport robot but also all other wafers present in the magazine. If a wafer in the magazine has a shifted position, the operation of the lifting mechanism would lead to damage of the wafer if the distance to the wall is too small.
- a particularly suitable protection against damage is formed by a check of whether a minimum distance is maintained between the wafer and a housing wall surrounding the magazine.
- the detection device switches to an alarm state the moment one of the deposited wafers passes below the minimum distance.
- the alarm state may be achieved, for example, by the interruption of the light beam of a photoelectric barrier, which will then have a different output signal. In any case, it will differ unequivocally from a normal operational state in which the detection takes place and in which no incorrect position is detected.
- the optical detection device is advantageously provided against the housing wall which is closest to the magazine, in a narrow range of the volume in which the magazine movement takes place.
- the detection mechanism is not triggered as long as no wafer in the magazine has erred from its correct position.
- the magazine can be transported upward or downward, or horizontally for changing the magazine, by the lining mechanism without damage taking place.
- the detection signal is triggered. It is possible then in particular to block the lifting mechanism by which a projecting wafer would otherwise be damaged when it is moved from a wider into a narrower range.
- An embodiment of the invention as defined in claim 4 has the advantage that the photoelectric barriers in this manner monitor the sides of the magazine where the wafers are moved into and from the magazine. These are preferential locations for shifts in position, which would remain unnoticed on account of the greater distances to the housing walls. These sides, accordingly, are particularly in danger as regards wafer damage during transport by the lifting mechanism.
- the processing unit receives the detection signal and generates one or several corresponding control signals.
- the relevant control signal is supplied to a control unit of the reactor which is in charge of the automatic process sequence. It is possible in this manner to influence directly the control of the reactor in order to take countermeasures in the alarm state of the detection device, for example switching-off of the drive motors for the lifting mechanism.
- the processing unit in addition takes into account further information such as, for example, the position of the transport robot, which could also trigger the alarm during taking out or inserting of a wafer. If a detection signal comes from several photoelectric barriers, several control signals will be given in dependence on the component signals which each comprise the information about the interruption of the light beam.
- a warning lamp may be switched on in the case of a slight displacement of a wafer, whereas the control signal for switching the drive motors off is not given except in case of a critical displacement.
- an acoustic and/or optical warning signal may then be advantageously given in the vicinity of the reactor and in a higher process control unit.
- the process control is formed, for example, by a computer which is connected to several individual production units via a local area network (LAN).
- LAN local area network
- FIG. 1 shows a reactor for processing semiconductor slices (or wafers) as described in the preamble of claim 1, and
- FIG. 2 is a diagram of a storage unit according to the invention with a magazine for wafers and a lifting mechanism, shown in cross-section.
- the reactor shown in FIG. 1 is one which is also known, for example, from “Vakuumbe fürung 2” by Uwe Behringer et al., VDI-Verlag Düsseldorf, 1995.
- the reactor 1 comprises a transport chamber 2 in which a transport robot 3 is present.
- the transport robot 3 is rotationally journaled and is capable of radial movements forward and back.
- Several process chambers 5 are coupled to the central transport chamber 2 via respective valves 4 and are arranged in a ring around the transport robot 3 .
- an internal magazine 6 capable of holding several wafers 7 is mounted in a position in the ring around the center of rotation of the transport robot 3 .
- the wafers 7 are deposited one above the other in the internal magazine 6 , which can be moved vertically for this purpose by means of a lifting mechanism.
- Two additional, external magazines 9 and 10 for wafers 7 are coupled to the transport chamber 2 via a lock 8 behind the internal magazine 6 so that they lie in an external storage unit 11 .
- the two magazines 9 and 10 also each comprise a lifting mechanism and can each hold several wafers 7 . Magazine 9 or 10 can be moved to the lock 8 through a horizontal displacement of the storage unit 11 , so that the transport robot 3 can grip the wafers 7 stored in the relevant magazine.
- a vacuum atmosphere is maintained in the entire reactor 1 so that the wafers 7 under treatment do not come into contact with the outer atmosphere between process steps.
- the individual chambers are separated from one another by means of slot-shaped valves 4 .
- One or several wafers 7 in the as yet unprocessed state (blanks) in a magazine are loaded into the external storage unit 11 , which then forms a closed system with the reactor 1 .
- the transport robot 3 can take the wafers 7 from the magazine 9 through the lock 8 which connects the storage unit 11 to the polygonal transport chamber 2 .
- the transport robot 3 is for this purpose arranged with rotation possibility in the center of the transport chamber 1 and comprises a support on which a wafer 7 can be transported.
- the transport robot 3 takes a wafer 7 from the magazine 9 or the magazine 6 .
- the wafer 7 is then laid in one of the process chambers 5 which are closed with a valve 4 .
- different processes can take place simultaneously in the individual process chambers 5 , and several wafers 7 can be processed.
- the processes form part of one manufacturing step, so that the wafers 7 can be inserted consecutively into the relevant process chambers 5 without having to be exposed to the outer atmosphere in between.
- the wafers 7 are stored in the magazine 6 between the individual processes and not laid into magazine 9 until after the final process in this reactor 1 .
- the magazine 10 is moved to opposite the lock 8 , and the first wafer 7 is taken therefrom for processing. It this position, it is possible to exchange the magazine 9 against a new magazine containing blanks.
- FIG. 2 is a cross-sectional view showing the magazine 6 with its lifting mechanism 12 , which magazine is present in the transport chamber 2 .
- the lock 8 and the transport robot 3 which moves the wafers 7 into and from the magazine 6 , are also shown.
- the transport robot 3 in FIG. 2 is in a return position in which the magazine 6 can be moved up and down for the supply of wafers 7 .
- Two emitter diodes 13 and 14 are provided at the lower side of the reactor 1 , each forming a photoelectric barrier with respective photodiodes 15 and 16 mounted to the upper side.
- a processing unit 17 and a control unit 18 of the reactor 1 are coupled thereto.
- the light beam Since the light beam always extends parallel to the magazine 6 , it will be interrupted by each and every wafer 7 irrespective of the size thereof when this wafer is shifted too far from its position. A too far displacement of a wafer 7 in the region of the lock 8 or the transport robot 3 does not cause any problems yet because of the larger diameter of the reactor 1 .
- the lifting mechanism 12 moves a wafer into a narrower range, however, damage may arise owing to a collision with the housing wall in the transitional range. The relevant wafer will be destroyed and will cause damage to other wafers in the magazine 6 owing to chipped fragments.
- a minimum distance to be observed by a shifted wafer 7 to the housing wall of the transport chamber 2 can be set by a suitable arrangement of the photoelectric barriers 13 to 16 .
- the relevant photoelectric barrier switches to an alarm state and supplies a control signal which signalizes an interruption.
- the control signal is received by the processing unit 17 and processed.
- a triggering signal is generated which causes the control unit 18 to stop the drive motors of the lifting mechanism 12 and the transport robot 3 .
- a manual restart must be carried out, after the reactor 1 has been visually inspected.
Abstract
Description
- The invention relates to a reactor for processing wafers comprising at least one process chamber, at least one transport chamber with a transport robot for the wafers, and at least one magazine for wafers with a lifting mechanism.
- Known devices for processing semiconductors usually consist of a reactor with several process chambers and one transport chamber. A loading and unloading unit is coupled thereto. The semiconductor slices (or wafers) are taken from a storage unit comprising a magazine for a plurality of wafers and a lifting mechanism by means of a transport robot which is arranged in the transport chamber, and are loaded via the transport chamber into one of the process chambers. The robot loads the wafers consecutively into several process chambers in which the wafer is exposed to different processes. The process chambers are accordingly simultaneously occupied by different wafers which are stored again in the magazine of the storage unit between two processes (for example, if a process chamber is occupied) or after the final process. Since a vacuum atmosphere obtains in the entire reactor, and the individual chambers can be closed by means of valves, these processes can run automatically without a wafer entering the atmosphere.
- U.S. Pat. No. 4,819,167 describes a system and a method for the recognition of the center of a circular semiconductor wafer for the manufacture of integrated circuits (wafer15). The exact position of a moving object (wafer) can be determined by a robot during transport so as to support the accuracy of this movement. Several sensors (see, for example, 61-66 in FIG. 3 and the accompanying description) are provided for determining the relative position of the wafer, which is present on a movable support which follows a given path, with respect to a chosen point to which the support with the wafer is being moved. The sensors are triggered by starting and end points of the wafer and supply corresponding signals. The position is calculated from these signals. In particular, the position of a moving wafer with respect to an internal storage unit with a magazine with lifting mechanism (internal storage elevator 19) is determined by means of an arrangement of several optical sensors which are positioned transversely to the direction of movement. The sensors are fastened to an entry slot inside a transport chamber so as to form a row perpendicular to the direction of movement of the support (
vacuum loadlock chamber 11, cf. e.g. ref. no. 47 in FIGS. 1, 2, 3 and 5), in which chamber the internal storage unit is present. To find the center of the wafer, several sensors are necessary, on whose signals a complicated calculation is then carried out. In addition, the position of the wafer is determined up to the internal storage unit only during the transport by means of the support. The system described is only capable of ensuring that the wafer will be in a given position relative to the support when it is on the support (column 1, lines 35-55). - Furthermore, U.S. Pat. No. 5,563,798 describes a wafer positioning system for an automated wafer processing installation (reactor) with several process chambers (processing chambers6). The position of the wafer (10) is determined here in that the position of a wafer transport robot (18) is identified while the wafer is being moved thereby. Sensors are provided for this purpose on a transparent cover of a centrally arranged transport chamber (transfer chamber 16). The light beams of the optical sensors then passes through the cover and the transport chamber to reflectors provided on the bottom thereof, which reflect the beam back. A detector in the sensor recognizes the interruption of the light beam by a wafer which is being moved through the transport chamber. The position of the wafer transport robot is then measured on the basis of at least two measured values and is corrected if a deviation from the correct position of the wafer transport robot is detected. To achieve this, the position of the wafer is calculated from the measured values in an intricate calculation, and the deviation from the correct position is compensated by a linear and rotational adjustment of the wafer transport robot. The object of this is to achieve that the wafer transport robot transports the wafer correctly into its next position inside the reactor.
- Methods and devices according to the present art have the disadvantage that only the position of the wafer being transported at a given moment can be observed, checked, and corrected, as applicable. In addition, at most a check for the moment of the measurement can be made in that way. Corrective adjustment quantities for the transport robot must be calculated from the measurement results, which quantities again are valid for the moment only, if no further, inadvertent movements of the wafer take place. However, it is quite possible for a disturbance of wafers to take place, in particular of those which are deposited in an internal or external storage unit in a magazine. For example, translatory movements of the external storage unit can shift the deposited wafers in the case of a magazine exchange, whereupon these wafers may be destroyed by the lifting mechanism in a subsequent vertical or horizontal adjustment of the magazine.
- It is accordingly an object of the invention to provide a device which ensures a better protection against damage also of wafers which are stored in a magazine.
- This object of the invention is achieved in that an optical detection device is provided in the reactor for monitoring the positions of the wafers stored in a magazine. The optical detection device, which may comprise in particular a photoelectric barrier formed by a transmitter (LED) and a receiver (photodiode), is provided inside the reactor according to the invention. Given a suitable arrangement, all wafers stored therein in a magazine with several superimposed compartments can thus be monitored. It is possible in this manner to monitor not only the wafers which were just taken out or put in by the transport robot but also all other wafers present in the magazine. If a wafer in the magazine has a shifted position, the operation of the lifting mechanism would lead to damage of the wafer if the distance to the wall is too small. This is true in particular if the wafer is moved from a wider into a narrower region. Since especially the previously deposited wafers may become shifted through shocks caused by frequent loading, unloading, and displacing of the magazine, a check of these wafers is of major importance. This is true in particular when several magazines are present which may be utilized consecutively. Damage may additionally arise then when the magazine is displaced. A limitation of the position monitoring to that wafer which is being moved by the transport robot at any given moment leads to frequent wafer damage and is accordingly insufficient. It is only a detection device according to the invention which provides a reliable monitoring also of those wafers whose processing in the reactor has been completed. These wafers are usually stored in a magazine which is not coupled to the transport chamber at that moment, but which is held ready for being taken from the reactor. Damage is particularly disadvantageous economically because an expensive process has been completed here. It should be noted in this connection that the damage to a wafer usually causes subsequent damage to other wafers in the relevant magazine caused by chipped fragments.
- Preferred embodiments of the invention are indicated in
claims - An embodiment of the invention as defined in claim 4 has the advantage that the photoelectric barriers in this manner monitor the sides of the magazine where the wafers are moved into and from the magazine. These are preferential locations for shifts in position, which would remain unnoticed on account of the greater distances to the housing walls. These sides, accordingly, are particularly in danger as regards wafer damage during transport by the lifting mechanism.
- A further development of the invention is indicated in
claims - An embodiment of the invention will be explained in more detail below with reference to the drawing, in which:
- FIG. 1 shows a reactor for processing semiconductor slices (or wafers) as described in the preamble of
claim 1, and - FIG. 2 is a diagram of a storage unit according to the invention with a magazine for wafers and a lifting mechanism, shown in cross-section.
- The reactor shown in FIG. 1 is one which is also known, for example, from “
Vakuumbeschichtung 2” by Uwe Behringer et al., VDI-Verlag Düsseldorf, 1995. Thereactor 1 comprises atransport chamber 2 in which atransport robot 3 is present. Thetransport robot 3 is rotationally journaled and is capable of radial movements forward and back.Several process chambers 5 are coupled to thecentral transport chamber 2 via respective valves 4 and are arranged in a ring around thetransport robot 3. In addition, aninternal magazine 6 capable of holdingseveral wafers 7 is mounted in a position in the ring around the center of rotation of thetransport robot 3. Thewafers 7 are deposited one above the other in theinternal magazine 6, which can be moved vertically for this purpose by means of a lifting mechanism. Two additional,external magazines wafers 7 are coupled to thetransport chamber 2 via alock 8 behind theinternal magazine 6 so that they lie in anexternal storage unit 11. The twomagazines several wafers 7.Magazine lock 8 through a horizontal displacement of thestorage unit 11, so that thetransport robot 3 can grip thewafers 7 stored in the relevant magazine. - A vacuum atmosphere is maintained in the
entire reactor 1 so that thewafers 7 under treatment do not come into contact with the outer atmosphere between process steps. The individual chambers are separated from one another by means of slot-shaped valves 4. One orseveral wafers 7 in the as yet unprocessed state (blanks) in a magazine are loaded into theexternal storage unit 11, which then forms a closed system with thereactor 1. Thetransport robot 3 can take thewafers 7 from themagazine 9 through thelock 8 which connects thestorage unit 11 to thepolygonal transport chamber 2. Thetransport robot 3 is for this purpose arranged with rotation possibility in the center of thetransport chamber 1 and comprises a support on which awafer 7 can be transported. By moving the support in longitudinal direction, thetransport robot 3 takes awafer 7 from themagazine 9 or themagazine 6. Thewafer 7 is then laid in one of theprocess chambers 5 which are closed with a valve 4. In this manner different processes can take place simultaneously in theindividual process chambers 5, andseveral wafers 7 can be processed. Preferably, the processes form part of one manufacturing step, so that thewafers 7 can be inserted consecutively into therelevant process chambers 5 without having to be exposed to the outer atmosphere in between. Thewafers 7 are stored in themagazine 6 between the individual processes and not laid intomagazine 9 until after the final process in thisreactor 1. After all thewafers 7 frommagazine 9 have been processed, themagazine 10 is moved to opposite thelock 8, and thefirst wafer 7 is taken therefrom for processing. It this position, it is possible to exchange themagazine 9 against a new magazine containing blanks. - FIG. 2 is a cross-sectional view showing the
magazine 6 with itslifting mechanism 12, which magazine is present in thetransport chamber 2. Thelock 8 and thetransport robot 3, which moves thewafers 7 into and from themagazine 6, are also shown. Thetransport robot 3 in FIG. 2 is in a return position in which themagazine 6 can be moved up and down for the supply ofwafers 7. Twoemitter diodes reactor 1, each forming a photoelectric barrier withrespective photodiodes processing unit 17 and acontrol unit 18 of thereactor 1 are coupled thereto. - Since the light beam always extends parallel to the
magazine 6, it will be interrupted by each and everywafer 7 irrespective of the size thereof when this wafer is shifted too far from its position. A too far displacement of awafer 7 in the region of thelock 8 or thetransport robot 3 does not cause any problems yet because of the larger diameter of thereactor 1. When thelifting mechanism 12 moves a wafer into a narrower range, however, damage may arise owing to a collision with the housing wall in the transitional range. The relevant wafer will be destroyed and will cause damage to other wafers in themagazine 6 owing to chipped fragments. A minimum distance to be observed by a shiftedwafer 7 to the housing wall of thetransport chamber 2 can be set by a suitable arrangement of thephotoelectric barriers 13 to 16. When the minimum distance is exceeded in downward direction, the relevant photoelectric barrier switches to an alarm state and supplies a control signal which signalizes an interruption. The control signal is received by theprocessing unit 17 and processed. When the alarm state is triggered, and further information has been taken into account, a triggering signal is generated which causes thecontrol unit 18 to stop the drive motors of thelifting mechanism 12 and thetransport robot 3. A manual restart must be carried out, after thereactor 1 has been visually inspected. Further information describing the instantaneous process condition in thereactor 1 must be made available to theprocessing unit 17 because, for example, thetransport robot 3 would otherwise also generate an alarm state when putting in or taking out awafer 7. This is why a reaction follows an interruption of thephotoelectric barriers 13 to 16 only while thetransport robot 3 is in the return position. In addition, a warning lamp (not shown) on theprocessing unit 17 and/or thecontrol unit 18 indicates the alarm state.
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE19725527.2 | 1997-06-17 | ||
DE19725527A DE19725527A1 (en) | 1997-06-17 | 1997-06-17 | Reactor for processing wafers with a protective device |
DE19725527 | 1997-06-17 |
Publications (2)
Publication Number | Publication Date |
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US20010043860A1 true US20010043860A1 (en) | 2001-11-22 |
US6385503B2 US6385503B2 (en) | 2002-05-07 |
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US09/097,977 Expired - Fee Related US6385503B2 (en) | 1997-06-17 | 1998-06-16 | Reactor for the processing of wafers, with a protection device |
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US (1) | US6385503B2 (en) |
EP (1) | EP0886302A3 (en) |
JP (1) | JPH1116989A (en) |
DE (1) | DE19725527A1 (en) |
TW (1) | TW396493B (en) |
Cited By (2)
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CN102315085A (en) * | 2010-06-30 | 2012-01-11 | 中芯国际集成电路制造(上海)有限公司 | Uniform ring inclination warning device for reaction cavity of plasma body etching machine |
WO2015057959A1 (en) * | 2013-10-18 | 2015-04-23 | Brooks Automation, Inc. | Processing apparatus |
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1997
- 1997-06-17 DE DE19725527A patent/DE19725527A1/en not_active Withdrawn
-
1998
- 1998-05-20 TW TW087107821A patent/TW396493B/en not_active IP Right Cessation
- 1998-06-09 EP EP98201936A patent/EP0886302A3/en not_active Withdrawn
- 1998-06-15 JP JP10166528A patent/JPH1116989A/en active Pending
- 1998-06-16 US US09/097,977 patent/US6385503B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102315085A (en) * | 2010-06-30 | 2012-01-11 | 中芯国际集成电路制造(上海)有限公司 | Uniform ring inclination warning device for reaction cavity of plasma body etching machine |
WO2015057959A1 (en) * | 2013-10-18 | 2015-04-23 | Brooks Automation, Inc. | Processing apparatus |
CN105814677A (en) * | 2013-10-18 | 2016-07-27 | 布鲁克斯自动化公司 | Processing apparatus |
US10777438B2 (en) | 2013-10-18 | 2020-09-15 | Brooks Automation, Inc. | Processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
DE19725527A1 (en) | 1998-12-24 |
EP0886302A2 (en) | 1998-12-23 |
TW396493B (en) | 2000-07-01 |
JPH1116989A (en) | 1999-01-22 |
US6385503B2 (en) | 2002-05-07 |
EP0886302A3 (en) | 2004-04-07 |
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