TW369676B - Electronic device producing apparatus and process for the same - Google Patents
Electronic device producing apparatus and process for the sameInfo
- Publication number
- TW369676B TW369676B TW086114387A TW86114387A TW369676B TW 369676 B TW369676 B TW 369676B TW 086114387 A TW086114387 A TW 086114387A TW 86114387 A TW86114387 A TW 86114387A TW 369676 B TW369676 B TW 369676B
- Authority
- TW
- Taiwan
- Prior art keywords
- quartz
- chamber
- roof
- electronic device
- semiconductor substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/916—Differential etching apparatus including chamber cleaning means or shield for preventing deposits
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26211996 | 1996-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW369676B true TW369676B (en) | 1999-09-11 |
Family
ID=17371321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086114387A TW369676B (en) | 1996-10-02 | 1997-10-02 | Electronic device producing apparatus and process for the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US6007673A (zh) |
EP (1) | EP0838838B1 (zh) |
KR (1) | KR100432391B1 (zh) |
DE (1) | DE69739711D1 (zh) |
TW (1) | TW369676B (zh) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW371779B (en) * | 1996-01-26 | 1999-10-11 | Matsushita Electric Ind Co Ltd | Apparatus for manufacturing semiconductor device |
WO1998031845A1 (en) * | 1997-01-16 | 1998-07-23 | Bottomfield, Layne, F. | Vapor deposition components and corresponding methods |
JP3449459B2 (ja) * | 1997-06-02 | 2003-09-22 | 株式会社ジャパンエナジー | 薄膜形成装置用部材の製造方法および該装置用部材 |
US6323132B1 (en) | 1998-01-13 | 2001-11-27 | Applied Materials, Inc. | Etching methods for anisotropic platinum profile |
KR20010034127A (ko) | 1998-01-13 | 2001-04-25 | 조셉 제이. 스위니 | 이방성 플라티늄 프로화일을 위한 에칭 방법 |
JP2972707B1 (ja) * | 1998-02-26 | 1999-11-08 | 松下電子工業株式会社 | プラズマエッチング装置及びプラズマエッチング方法 |
JP3488383B2 (ja) * | 1998-05-29 | 2004-01-19 | 信越石英株式会社 | ドライエッチング用石英ガラス部材およびそれを装着したドライエッチング装置 |
US6511914B2 (en) * | 1999-01-22 | 2003-01-28 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
JP4294176B2 (ja) * | 1999-09-13 | 2009-07-08 | 株式会社山形信越石英 | 表面が砂目加工された石英物品の洗浄方法 |
US6165276A (en) * | 1999-09-17 | 2000-12-26 | United Microelectronics Corp. | Apparatus for preventing plasma etching of a wafer clamp in semiconductor fabrication processes |
US6423175B1 (en) * | 1999-10-06 | 2002-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for reducing particle contamination in an etcher |
KR100575856B1 (ko) * | 1999-10-28 | 2006-05-03 | 주식회사 하이닉스반도체 | 식각챔버내 이물질발생 방지방법 |
EP1252359B1 (en) * | 1999-12-02 | 2020-03-11 | OEM Group, Inc | Method of operating a platinum etch reactor |
KR20010054515A (ko) * | 1999-12-07 | 2001-07-02 | 윤종용 | 스퍼터링장치의 실드(shield) 구조 |
US20020069970A1 (en) * | 2000-03-07 | 2002-06-13 | Applied Materials, Inc. | Temperature controlled semiconductor processing chamber liner |
US6623595B1 (en) * | 2000-03-27 | 2003-09-23 | Applied Materials, Inc. | Wavy and roughened dome in plasma processing reactor |
EP1187170B1 (en) * | 2000-08-29 | 2007-05-09 | Heraeus Quarzglas GmbH & Co. KG | Plasma resistant quartz glass jig |
US6777045B2 (en) * | 2001-06-27 | 2004-08-17 | Applied Materials Inc. | Chamber components having textured surfaces and method of manufacture |
US20030047464A1 (en) * | 2001-07-27 | 2003-03-13 | Applied Materials, Inc. | Electrochemically roughened aluminum semiconductor processing apparatus surfaces |
US7964085B1 (en) | 2002-11-25 | 2011-06-21 | Applied Materials, Inc. | Electrochemical removal of tantalum-containing materials |
US20040129221A1 (en) * | 2003-01-08 | 2004-07-08 | Jozef Brcka | Cooled deposition baffle in high density plasma semiconductor processing |
US7059269B2 (en) * | 2003-02-13 | 2006-06-13 | Steris, Inc. | Pulsed electric field system for decontamination of biological agents on a dielectric sheet material |
US20040221959A1 (en) * | 2003-05-09 | 2004-11-11 | Applied Materials, Inc. | Anodized substrate support |
US8372205B2 (en) * | 2003-05-09 | 2013-02-12 | Applied Materials, Inc. | Reducing electrostatic charge by roughening the susceptor |
US7910218B2 (en) | 2003-10-22 | 2011-03-22 | Applied Materials, Inc. | Cleaning and refurbishing chamber components having metal coatings |
US20050178331A1 (en) * | 2004-02-13 | 2005-08-18 | Fourtner Lawrence C. | Electrode assembly and method for producing an electrode plate |
WO2005104203A1 (ja) * | 2004-03-31 | 2005-11-03 | Fujitsu Limited | 基板処理装置および半導体装置の製造方法 |
CN1973363B (zh) * | 2004-06-21 | 2011-09-14 | 东京毅力科创株式会社 | 等离子体处理装置和方法 |
JPWO2006008889A1 (ja) * | 2004-07-20 | 2008-05-01 | シャープ株式会社 | プラズマ処理装置 |
US7670436B2 (en) | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
US7579067B2 (en) | 2004-11-24 | 2009-08-25 | Applied Materials, Inc. | Process chamber component with layered coating and method |
US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
US7762114B2 (en) | 2005-09-09 | 2010-07-27 | Applied Materials, Inc. | Flow-formed chamber component having a textured surface |
US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US20070125646A1 (en) | 2005-11-25 | 2007-06-07 | Applied Materials, Inc. | Sputtering target for titanium sputtering chamber |
US8173228B2 (en) * | 2006-01-27 | 2012-05-08 | Applied Materials, Inc. | Particle reduction on surfaces of chemical vapor deposition processing apparatus |
JP5001862B2 (ja) * | 2006-01-31 | 2012-08-15 | 東京エレクトロン株式会社 | マイクロ波プラズマ処理装置 |
KR100855107B1 (ko) * | 2006-02-27 | 2008-08-29 | 주식회사 엘지화학 | 초박형 반투과 반사용 아크로매틱 1/4 파장 위상차 필름적층체 및 그 제조방법 |
US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US8444926B2 (en) * | 2007-01-30 | 2013-05-21 | Applied Materials, Inc. | Processing chamber with heated chamber liner |
US7942969B2 (en) | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
CN101632329B (zh) * | 2007-06-11 | 2012-10-31 | 东京毅力科创株式会社 | 等离子体处理装置及处理方法 |
JP5213530B2 (ja) * | 2008-06-11 | 2013-06-19 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP5453768B2 (ja) * | 2008-11-05 | 2014-03-26 | 豊田合成株式会社 | 化合物半導体製造装置、化合物半導体の製造方法、および化合物半導体製造用治具 |
JP5478058B2 (ja) * | 2008-12-09 | 2014-04-23 | 国立大学法人東北大学 | プラズマ処理装置 |
US9793126B2 (en) | 2010-08-04 | 2017-10-17 | Lam Research Corporation | Ion to neutral control for wafer processing with dual plasma source reactor |
US9039911B2 (en) | 2012-08-27 | 2015-05-26 | Lam Research Corporation | Plasma-enhanced etching in an augmented plasma processing system |
WO2014149143A1 (en) * | 2013-03-15 | 2014-09-25 | Applied Materials, Inc. | Enhanced productivity for an etch system through polymer management |
US9245761B2 (en) | 2013-04-05 | 2016-01-26 | Lam Research Corporation | Internal plasma grid for semiconductor fabrication |
US9230819B2 (en) | 2013-04-05 | 2016-01-05 | Lam Research Corporation | Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing |
US9017526B2 (en) | 2013-07-08 | 2015-04-28 | Lam Research Corporation | Ion beam etching system |
US9147581B2 (en) | 2013-07-11 | 2015-09-29 | Lam Research Corporation | Dual chamber plasma etcher with ion accelerator |
US10008366B2 (en) * | 2015-09-08 | 2018-06-26 | Applied Materials, Inc. | Seasoning process for establishing a stable process and extending chamber uptime for semiconductor chip processing |
CN111566778A (zh) * | 2018-01-08 | 2020-08-21 | 朗姆研究公司 | 管理等离子体处理副产物材料的组件和工艺 |
CN108899295A (zh) * | 2018-07-06 | 2018-11-27 | 宁波江丰电子材料股份有限公司 | 蚀刻腔室以及蚀刻腔室加工方法 |
CN109786194B (zh) * | 2018-12-20 | 2020-10-30 | 丰豹智能科技(上海)有限公司 | 一种改变离子束方向的装置 |
CN110211900B (zh) * | 2019-05-31 | 2022-02-25 | 昆山国显光电有限公司 | 一种天板及干刻设备 |
CN111041452B (zh) * | 2019-12-03 | 2022-06-10 | 武汉华星光电半导体显示技术有限公司 | 下电极及化学气相沉积装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5562160A (en) * | 1978-11-01 | 1980-05-10 | Canon Inc | Forming method for film by glow discharge |
JPH01211921A (ja) * | 1988-02-19 | 1989-08-25 | Toshiba Corp | ドライエッチング装置 |
US4891499A (en) * | 1988-09-09 | 1990-01-02 | Texas Instruments Incorporated | Method and apparatus for real-time wafer temperature uniformity control and slip-free heating in lamp heated single-wafer rapid thermal processing systems |
US5135629A (en) * | 1989-06-12 | 1992-08-04 | Nippon Mining Co., Ltd. | Thin film deposition system |
EP0413239B1 (en) * | 1989-08-14 | 1996-01-10 | Applied Materials, Inc. | Gas distribution system and method of using said system |
ES2076385T3 (es) * | 1990-03-02 | 1995-11-01 | Applied Materials Inc | Procedimiento para preparar una armadura, con el fin de reducir las particulas dentro de una camara de deposicion fisica de vapor. |
JPH0590214A (ja) * | 1991-09-30 | 1993-04-09 | Tokyo Ohka Kogyo Co Ltd | 同軸型プラズマ処理装置 |
US5401319A (en) * | 1992-08-27 | 1995-03-28 | Applied Materials, Inc. | Lid and door for a vacuum chamber and pretreatment therefor |
JPH06196421A (ja) * | 1992-12-23 | 1994-07-15 | Sumitomo Metal Ind Ltd | プラズマ装置 |
US5474649A (en) * | 1994-03-08 | 1995-12-12 | Applied Materials, Inc. | Plasma processing apparatus employing a textured focus ring |
JP3094816B2 (ja) * | 1994-10-25 | 2000-10-03 | 信越半導体株式会社 | 薄膜の成長方法 |
-
1997
- 1997-10-01 US US08/942,441 patent/US6007673A/en not_active Expired - Lifetime
- 1997-10-02 EP EP97117175A patent/EP0838838B1/en not_active Expired - Lifetime
- 1997-10-02 TW TW086114387A patent/TW369676B/zh not_active IP Right Cessation
- 1997-10-02 KR KR1019970051003A patent/KR100432391B1/ko not_active IP Right Cessation
- 1997-10-02 DE DE69739711T patent/DE69739711D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0838838B1 (en) | 2009-12-23 |
US6007673A (en) | 1999-12-28 |
KR19980032528A (ko) | 1998-07-25 |
EP0838838A2 (en) | 1998-04-29 |
DE69739711D1 (de) | 2010-02-04 |
EP0838838A3 (en) | 1999-04-14 |
KR100432391B1 (ko) | 2004-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |