TW363274B - Memory-cell arrangement and its production method - Google Patents

Memory-cell arrangement and its production method

Info

Publication number
TW363274B
TW363274B TW086117262A TW86117262A TW363274B TW 363274 B TW363274 B TW 363274B TW 086117262 A TW086117262 A TW 086117262A TW 86117262 A TW86117262 A TW 86117262A TW 363274 B TW363274 B TW 363274B
Authority
TW
Taiwan
Prior art keywords
gate
electrodes
memory
production method
cell arrangement
Prior art date
Application number
TW086117262A
Other languages
English (en)
Inventor
Josef Willer
Hans Reisinger
Wolfgang Krautschneider
Franz Hofmann
Basse Paul-Werner Von
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW363274B publication Critical patent/TW363274B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
TW086117262A 1996-12-17 1997-11-19 Memory-cell arrangement and its production method TW363274B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19652547A DE19652547C2 (de) 1996-12-17 1996-12-17 Speicherzellenanordnung mit Grabenstruktur und einem Gatedielektrikum, das ein Material mit Ladungsträger-Haftstellen enthält, und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
TW363274B true TW363274B (en) 1999-07-01

Family

ID=7815048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086117262A TW363274B (en) 1996-12-17 1997-11-19 Memory-cell arrangement and its production method

Country Status (8)

Country Link
US (1) US6445046B1 (zh)
EP (1) EP0946985B1 (zh)
JP (1) JP2001506410A (zh)
KR (1) KR20000057583A (zh)
CN (1) CN1139131C (zh)
DE (2) DE19652547C2 (zh)
TW (1) TW363274B (zh)
WO (1) WO1998027594A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6947471B1 (en) 1998-01-05 2005-09-20 Intel Corporation Method for using encoded spreading codes to achieve high bit densities in a direct-sequence spread spectrum communication system
WO2000054335A1 (en) * 1999-03-09 2000-09-14 Koninklijke Philips Electronics N.V. Semiconductor device comprising a non-volatile memory
US6284637B1 (en) * 1999-03-29 2001-09-04 Chartered Semiconductor Manufacturing Ltd. Method to fabricate a floating gate with a sloping sidewall for a flash memory
DE19955602A1 (de) * 1999-11-18 2001-05-31 Infineon Technologies Ag Nichtflüchtige Halbleiter- Speicherzelle sowie Verfahren zu deren Herstellung
JP4730999B2 (ja) * 2000-03-10 2011-07-20 スパンション エルエルシー 不揮発性メモリの製造方法
DE10051483A1 (de) * 2000-10-17 2002-05-02 Infineon Technologies Ag Nichtflüchtige Halbleiterspeicherzellenanordnung und Verfahren zu deren Herstellung
US6580120B2 (en) * 2001-06-07 2003-06-17 Interuniversitair Microelektronica Centrum (Imec Vzw) Two bit non-volatile electrically erasable and programmable memory structure, a process for producing said memory structure and methods for programming, reading and erasing said memory structure
JP2003031700A (ja) * 2001-07-12 2003-01-31 Sony Corp 不揮発性半導体記憶装置、その動作方法および製造方法
JP2003078045A (ja) * 2001-09-03 2003-03-14 Sony Corp 不揮発性半導体記憶装置およびその製造方法
JP2005056889A (ja) * 2003-08-04 2005-03-03 Renesas Technology Corp 半導体記憶装置およびその製造方法
KR100540478B1 (ko) * 2004-03-22 2006-01-11 주식회사 하이닉스반도체 전하 트랩을 갖는 게이트유전체를 포함한 휘발성 메모리셀 트랜지스터 및 그 제조 방법
US7244638B2 (en) * 2005-09-30 2007-07-17 Infineon Technologies Ag Semiconductor memory device and method of production
CN101136373B (zh) * 2006-08-31 2010-11-17 旺宏电子股份有限公司 非易失性存储器的制造方法
JP2011171755A (ja) * 2011-04-15 2011-09-01 Renesas Electronics Corp 半導体装置
US11469235B2 (en) * 2019-09-27 2022-10-11 Nanya Technology Corporation Semiconductor device and method for fabricating the same
CN111933644B (zh) * 2020-08-10 2024-02-02 合肥晶合集成电路股份有限公司 闪存单元及其制造方法
CN116156890B (zh) * 2023-04-19 2023-07-18 杭州领开半导体技术有限公司 Nor闪存阵列的制作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731163A (en) * 1972-03-22 1973-05-01 United Aircraft Corp Low voltage charge storage memory element
US4047974A (en) 1975-12-30 1977-09-13 Hughes Aircraft Company Process for fabricating non-volatile field effect semiconductor memory structure utilizing implanted ions to induce trapping states
JPH0321069A (ja) * 1989-06-19 1991-01-29 Matsushita Electron Corp 半導体装置の製造方法
US5200355A (en) 1990-12-10 1993-04-06 Samsung Electronics Co., Ltd. Method for manufacturing a mask read only memory device
JP2655765B2 (ja) 1991-05-29 1997-09-24 ローム株式会社 半導体装置
JPH0529584A (ja) * 1991-07-25 1993-02-05 Nec Kyushu Ltd 読み出し専用半導体メモリ
JPH05251669A (ja) * 1992-03-06 1993-09-28 Matsushita Electron Corp 半導体記憶装置およびその書き換え方法
US6310373B1 (en) * 1992-10-23 2001-10-30 Symetrix Corporation Metal insulator semiconductor structure with polarization-compatible buffer layer
JP2795107B2 (ja) * 1992-11-26 1998-09-10 日本電気株式会社 半導体装置の製造方法
US5393233A (en) * 1993-07-14 1995-02-28 United Microelectronics Corporation Process for fabricating double poly high density buried bit line mask ROM
JPH07254651A (ja) 1994-03-16 1995-10-03 Toshiba Corp 半導体集積回路装置
DE19510042C2 (de) * 1995-03-20 1997-01-23 Siemens Ag Festwert-Speicherzellenanordnung und Verfahren zu deren Herstellung
JP3171122B2 (ja) * 1995-11-27 2001-05-28 ソニー株式会社 半導体記憶装置および半導体記憶装置の情報読出方法
DE19600422C1 (de) 1996-01-08 1997-08-21 Siemens Ag Elektrisch programmierbare Speicherzellenanordnung und Verfahren zu deren Herstellung
US5814853A (en) * 1996-01-22 1998-09-29 Advanced Micro Devices, Inc. Sourceless floating gate memory device and method of storing data
US5768192A (en) * 1996-07-23 1998-06-16 Saifun Semiconductors, Ltd. Non-volatile semiconductor memory cell utilizing asymmetrical charge trapping

Also Published As

Publication number Publication date
DE19652547A1 (de) 1998-06-18
EP0946985B1 (de) 2001-08-16
CN1240536A (zh) 2000-01-05
CN1139131C (zh) 2004-02-18
KR20000057583A (ko) 2000-09-25
WO1998027594A1 (de) 1998-06-25
DE59704333D1 (de) 2001-09-20
US6445046B1 (en) 2002-09-03
DE19652547C2 (de) 2002-04-25
EP0946985A1 (de) 1999-10-06
JP2001506410A (ja) 2001-05-15

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