TW349269B - Deformable substrate assembly for adhesively bonded electronic device - Google Patents

Deformable substrate assembly for adhesively bonded electronic device

Info

Publication number
TW349269B
TW349269B TW085109945A TW85109945A TW349269B TW 349269 B TW349269 B TW 349269B TW 085109945 A TW085109945 A TW 085109945A TW 85109945 A TW85109945 A TW 85109945A TW 349269 B TW349269 B TW 349269B
Authority
TW
Taiwan
Prior art keywords
poly
ethylene
electronic device
substrate assembly
napthanate
Prior art date
Application number
TW085109945A
Other languages
English (en)
Chinese (zh)
Inventor
Peter Brent Hogerton
Kenneth Ernst Carlson
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Application granted granted Critical
Publication of TW349269B publication Critical patent/TW349269B/zh

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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    • H01L23/5328—Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/2804—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW085109945A 1995-08-29 1996-08-15 Deformable substrate assembly for adhesively bonded electronic device TW349269B (en)

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US52113495A 1995-08-29 1995-08-29

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TW349269B true TW349269B (en) 1999-01-01

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TW085109945A TW349269B (en) 1995-08-29 1996-08-15 Deformable substrate assembly for adhesively bonded electronic device

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US (1) US5714252A (enExample)
EP (1) EP0847594B1 (enExample)
JP (1) JPH11510649A (enExample)
KR (1) KR19990044151A (enExample)
CN (1) CN1194059A (enExample)
DE (1) DE69622412T2 (enExample)
TW (1) TW349269B (enExample)
WO (1) WO1997008749A1 (enExample)

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TWI450799B (zh) * 2010-03-26 2014-09-01 Toyo Tire & Rubber Co Polishing pad and manufacturing method thereof, and manufacturing method of semiconductor device
TWI877132B (zh) * 2019-02-04 2025-03-21 日商索尼半導體解決方案公司 電子裝置

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US5700398A (en) * 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
JPH1041694A (ja) * 1996-07-25 1998-02-13 Sharp Corp 半導体素子の基板実装構造及びその実装方法
JP3928753B2 (ja) * 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
WO1998015593A1 (en) * 1996-10-08 1998-04-16 Fibercote Industries, Inc. Sheet material for core support
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KR19990044151A (ko) 1999-06-25
HK1012521A1 (en) 1999-08-06
DE69622412D1 (de) 2002-08-22
DE69622412T2 (de) 2003-03-20
WO1997008749A1 (en) 1997-03-06
EP0847594B1 (en) 2002-07-17
CN1194059A (zh) 1998-09-23
EP0847594A1 (en) 1998-06-17
JPH11510649A (ja) 1999-09-14
US5714252A (en) 1998-02-03

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