TW318971B - High density connector - Google Patents

High density connector Download PDF

Info

Publication number
TW318971B
TW318971B TW85113693A TW85113693A TW318971B TW 318971 B TW318971 B TW 318971B TW 85113693 A TW85113693 A TW 85113693A TW 85113693 A TW85113693 A TW 85113693A TW 318971 B TW318971 B TW 318971B
Authority
TW
Taiwan
Prior art keywords
item
patent application
recess
contact
conductive
Prior art date
Application number
TW85113693A
Other languages
English (en)
Inventor
A Lemke Timothy
W Houtz Timothy
Original Assignee
Connector Systems Tech Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24925797&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW318971(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Connector Systems Tech Nv filed Critical Connector Systems Tech Nv
Application granted granted Critical
Publication of TW318971B publication Critical patent/TW318971B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/564—Terminals characterised by their manufacturing process
    • H01M50/566—Terminals characterised by their manufacturing process by welding, soldering or brazing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

一插座。 .根據申凊專利範圍第2 G㉟之電連接器，其中該插座係 與具有類似之信號和接地接點陣列之插頭匹配。 22·根據中請㈣範圍第2G項之電連接器，其中該插座具 有外盍，此外盍具有多個接點接收槽，且係附加於該 基座壁上。 23.根據中請專利範圍第22項之電連接器，其中該外蓋具 有一橫向的周圍壁。 24·根據申凊專利範圍第2 3項之電連接器，其中具有一閂 鎖裝置以將該外蓋固定於基座壁上。 25. 根據申請專利範圍第12 ?員之電連接器，其中信號腳係 以一間隔配置方式設置。 26. 根據申請專利範圍第2 5項之電連接器，其中元件具有 多個側邊，一電力/接地接點係以與該側邊之一呈平行 關係的方式配置。 27. 根據申請專利範圍第2 5項之電連接器，其中該信號接 點各熔接於一焊料球上。 28. 根據申請專利範圍第2 6項之電連接器，其中每一接地/ 電力接點係熔接於至少一焊料球上。 29·根據申請專利範圍第丨丨項之電連接器，其中該絕緣外 奴的接點支撑延伸係抵住轉接地的至少之一。 30.根據申請專利範圍第2 2項之電連接器，其中該外殼的 一接點支撐延伸係延伸至該至少一個槽内，以抵住接點 - 〇 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公羡） 318971 A8 B8 C8 D8 經濟部中央榡準局員工消費合作社印製 申請專利範圍 3L -種用以將一外部導電元件《置在包含有一外側和一内 側的電導體上之方法，包含下列步騾： (a) 在孩導電元件的外側上提供至少一個凹陷； (b) k供一個自鄰近該導體元件内側延伸至該外殼外側 上之凹陷之導電接點； (幻將一導電元件放置在外殼之外側上之凹陷内；和 (d)加熱放置在凹陷内之導電元件至足以軟化該金屬元 件的溫度，並使該金屬.元件熔接於延伸至該凹陷内 之接點。 32·根據申請專利範闺第3 i項之方法，其中該導電元件具 有一熔化溫度，以及在步驟（d)中金屬元件係被加熱至 大於該熔化溫度之溫度。 33.根據申請專利範圍第32項之方法，其中該接點之熔化 溫度大於該金屬元件之熔化溫度，且該導電元件被加熱 至小於該接點熔化溫度的溫度。 34·根據申請專利範圍第3 1項之方法，其中該金屬元件是 球形的。 35·根據申請專利範圍第3 4項之方法，其中該凹陷有一寬 度和該導電元件有一直徑，且該直徑係由該寬度的 5 0% 至 200% 〇 36.根據申請專利範圍第3 5項之方法，其中該凹陷有一深 度’且該深度是為該凹陷之寬度的5 0 %至約200%。 37·根據申請專利範圍第3 4項之方法，其中該凹陷之截两 可以是任何正多角形。 (請先閲讀背面之注意事項再填寫本頁)
C8 D8 '申請專利範圍 (請先閲讀背面之注意事項再填寫本頁} 根據申μ專利範圍第3 4項之方法，其中該凹陷之截面 是正方形。 根據申叩專利範圍第3 4項之方法.，其中該凹陷之截面 是圓形。 根據申凊專利範圍第3 5項之方法，其中該接點延伸至 邊凹陷的程度是凹陷之深度的2 5 %至約7 5 %。 根據申叩專利範圍第31項之方法，其中該導電元件包 含一焊料組合物。 2·根據申請專利範圍第4 1項之方法，其中該焊料組合物 為一最低熔點的坪料組合物。 •根據申凊專利範圍第4 1項之方法，其中在步驟（c)之 則’先將一焊料可撓物放置於該凹陷中。 44·根據申晴專利範圍第4 3項之方法，其中該凹陷有一基 座表面，其上被覆以該焊料可撓物層。 45·根據申請專利範圍第44項之方法，其中該凹陷被充填 有該焊料可撓物。 經濟部中央標隼局員工消費合作社印製 46·根據申請專利範圍第4 1項之方法，其中該金屬元件被 加熱至最高800°F的溫度。 47·板據申請專利範圍第4 6項之方法，其中該金屬元件係 以紅外線對流方式加熱。 48·根據申請專利範圍第47項之方法，其中在加熱期間， 導體元件係被放置在一移動的傳送器上。 49·根據申請專利範圍第48項之方法，其中該導電元件被 加熱約5至1 〇分鐘。 本紙張尺度適用中國國家標準（CNS )八4規格（21〇Χ297公釐） A8 B8 ^·------- C8 、 ____________D8 穴、申請專利範圍 .根據申請專利範圍第4 9項之方法，其中該連接器係移 經許多連續的加熱相。 一種以用以將一外導電接點放置在一具有外側和一内側 的兒連接器之元件上製得之產品，包含下列步驟： (a) 在孩導電元件的外側上提供至少一個凹陷； (b) 提供一個自鄰近該導體元件内側延伸至該外殼外側 上之凹陷之導電接點； ()將導電元件放置在外殼之外側上之凹陷内；和 (d)加熱放置在凹陷内之導電元件至足以軟化該金屬元 件的溫度，並使該金屬元件熔接於延伸至該凹陷内 之接點。 52·根據申請專利範圍第5丨項之產品，其中該導電元件具 有一熔化溫度，且在步驟（d)中，金屬元件係被加熱至 大於該熔化溫度之溫度。 53. 根據申請專利範圍第5 2項之產品，其中該接點之熔化 溫度大於該金屬元件之熔化溫度，且該導電元件被加熱 至小於該接點熔化溫度的溫度。 經濟部中央標隼局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁} 54. 根據申請專利範圍第51項之產品，其中該金屬元件是 竦形的。 55·根據申請專利範圍第54項之產品，其中該凹陷有一寬 度和孩導電元件有一直徑，且該直徑係由該寬度的 5 0% 至 200% 〇 56·根據申請專利範圍第5 5項之產品，其中該凹陷有一深 度，且該深度之大小是由凹陷之寬度的2 5 y。至7 5 %。 _—--- - -_ 本紙張AAii用巾關家料（CNS ) Α4規格（ 210X297公釐） 一----- J丄δν/丄 A8 B8 C8 D8 經濟部中央標隼局員工消費合作社印裝 其中該凹陷之截面 其中該凹陷之截面 其中該凹陷之截面 其中該接點延伸至 申請專利範圍 57·根據申請專利範圍第5 4項之產品 可以是任何正多角形。 58.根據申請專利範圍第5 4項之產品 是正方形。 59·根據申請專利範圍第5 4項之產品 是圓形。 6〇·根據申請專利範圍第55項之產品 琢凹陷的程度是凹陷之深度的2 5 %至約7 5 %。 61.根據申請專利範圍第51項之產品，其中該導電元件包 含一焊料組合物。 62·根據申請專利範圍第61項之產品，其中該焊料組合物 為一最低熔點的焊料組合物。 63. ^據申請專利範圍第61項之產品，其中在步驟⑷之 如’先將一焊料可撓物放置於該凹陷中。 64. 根據申請專利範圍第63項之產品，其中該凹陷有一基 座表面’其上被覆以該焊料可撓物層。 65. 根據申請專利範圍第64項之產品，其中該凹陷被充填 有該焊料可撓物。 ' 66·根據申請專利範圍第61項之產品，其中該金屬元件被 加熱至最高800°F的溫度。 67·根據申請專利範圍第66項之產品，其中該金屬元件係 以紅外線對流方式加熱。 68.根據申請專利範圍第67項之產品，其中在加熱期間， 導體元件係被放置在一移動的傳送器上。 本紙張认適用 (請先閲讀背面之注意事項再填寫本頁)
、1T 經濟部中央標準局員工消費合作社印製 六、申請專利範圍 ,T申Μ專利範圍第6 8項之產品，其中該導電元件被 加熱約5至1 0分鐘。 7〇.=申請專利範圍第69項之產品，其中該連接器係移 、左許多連續的加熱相。 ^ 私連接器之接點，包含有一端點標記區域， ::f接點係可連接於—坪接球上，且該端點標記被鍍 】、可h接材料，一接點區域呈相_關係與該端點標記 μ万^叹置，且被鍍有貴金屬，一中間區域被設置在該 而·、’、占‘记和孩接點區域之間，且該中間區域被鍍以一非 可烊接性材料。 72.,據申請專利範圍第71項之接點，其中該可焊接金屬 疋自金和錫中選出。 73.根據申請專利範圍帛71項之接點，其中該貴金屬是 金。 74·根據申請專利範圍第71項之接點，其中該非可焊接性 金屬是鎳。 75· -種電連接器元件，具有至少一平坦化的接點，此接點 ^有相對的王側和相對的負端，且流接點係裝設於該外 殼的一槽内，和一一般呈角錐形的突緣係自該槽延伸至 約該接點的主側之一上。 76· —種電連接器，包含·· 一絕緣組件，該組件具有一接點承接側和一裝設側； 一裝設在絕緣組件上之電子端點，該端點在絕緣組件 勺接站承接側上設有一接點部分和一裝設部分，該裝設 中國國胁( (請先閲讀背面之注意事項再填寫本頁) 訂 —ϋ HI ml ^ϋ.
申請專利範圍 經濟部中央標隼局員工消費合作社印製 部刀具有一部分延伸至該絕緣組件的固接部分，和一由 '部刀延伸至絕緣主體的裝設側之外表面上的導電 加熱可熔的區域。 •根據申凊專利範圍第7 6項之電連接器，其中： 、、、巴、彖、、且件的裝設表面内設有一凹陷，該凹陷中設有 固區域的一部分，和該可溶區域的一部分被設置在凹 槽中。 78. m專利範圍第76項之電連接器，在該絕緣組件 包含多個端點，該端點係配置成一陣列。 79. =申請專利範琴第78項之電連接器，其中在該陣列 的每一方向上的端點數目超過2。 80·根據申請專利範圍第76項之電連接器，其中該可炼性 區域包含焊料。 81.申請專利範圍第8。，之電連接器，其中該焊料呈 種氣造一電連接器之方法，包含以下支色复二 將一接點端點裝設於一絕緣組件的一表面上，且1# 點的-部分延伸至該絕緣組件内，朝 ：： 二表面； 卞妁罘 將一導電材料主體放置在該第二表面上；和 將邊導電王體固定在該端點向第二表面 1據申請專利範圍第82項之方法，其中該 由—可熔性材料製成。 疋 84·根據申請專利範圍第83項之方法，其中該可炫性材料 本紙張尺度適用 ( ( 210X297^ )_ (請先閎讀背面之注意事項再填寫本頁) 訂 0
申請專利範圍 經濟部中央標準局員工消費合作社印裝 為焊料。 85.根據申請專利 接於端點上的步=括:项之方法，其中將導電主體固 端點部分與導電二之間了可流動的黏固材料放置於該 固：乾圍第，5项之方法，其中該可流動的黏 導電組上且該固接步驟包括回流烊料膏以將 由焊利軏圍'8°項之方法’其中該導電主體是 I種：用以表面黏著於-電路基質的電子元件，包含有： 電：1Γ材㈣成的主體，該主體具有-能被放置在 上黏者表面’和一向該黏著表面延伸的開口； 伸：,二於該主體上的導電組件，該導電组件包括一延 二口朝向孩黏著表面之端點部分，和一自該端 =向㈣著表面延仲的固接部分，以在電路基質與 熔間建立電連接性，該固接部分包括-加熱可 亥黏煮表面上包含^ 89.=請專利範圍第88項之電予元件，其中該固接部 分包括一焊料球。 牧n 9〇.=據中料利範圍第51項之產品，其中該接點元件被 ’、又以一可焊性材料，該材料被熔接於導電元件上，且在 它鄰近於與導電元件焊接處被鍍以非可焊接性材料。 — — — — — —-I ί I (請先閱讀背面之注意事項再填寫本頁)
、1T • m ί n n I— 1 · ^mJULUM ( CNS ) A4il^ ( 210X297^ )
TW85113693A 1996-10-10 1996-11-09 High density connector TW318971B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/728,194 US6024584A (en) 1996-10-10 1996-10-10 High density connector

Publications (1)

Publication Number Publication Date
TW318971B true TW318971B (en) 1997-11-01

Family

ID=24925797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW85113693A TW318971B (en) 1996-10-10 1996-11-09 High density connector

Country Status (5)

Country Link
US (4) US6024584A (zh)
KR (1) KR19980032738A (zh)
HU (1) HU229998B1 (zh)
PL (2) PL192425B1 (zh)
TW (1) TW318971B (zh)

Families Citing this family (113)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6543129B2 (en) * 1995-11-03 2003-04-08 Teka Interconnections Systems, Inc. Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US6431889B1 (en) * 1997-12-23 2002-08-13 Berg Technology, Inc. High density edge card connector
US6406336B1 (en) * 1998-01-20 2002-06-18 Fci Americas Technology, Inc. Contact with anti-skiving feature
US6272741B1 (en) * 1998-07-24 2001-08-14 Autosplice, Inc. Hybrid solder ball and pin grid array circuit board interconnect system and method
US6530790B1 (en) 1998-11-24 2003-03-11 Teradyne, Inc. Electrical connector
TW421335U (en) * 1998-12-24 2001-02-01 Hon Hai Prec Ind Co Ltd Receptacle connector
JP2000277885A (ja) * 1999-03-25 2000-10-06 Berg Technol Inc 電気コネクタおよびその製造方法
US6495916B1 (en) * 1999-04-06 2002-12-17 Oki Electric Industry Co., Ltd. Resin-encapsulated semiconductor device
JP4414017B2 (ja) 1999-05-25 2010-02-10 モレックス インコーポレイテド Ｉｃソケット
US6398558B1 (en) 1999-08-04 2002-06-04 Fci Americas Technology, Inc. Electrical connector and contact therefor
US6217348B1 (en) * 1999-08-09 2001-04-17 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US7754979B2 (en) * 1999-09-20 2010-07-13 Teka Interconnections Systems, Inc. Solder-bearing wafer for use in soldering operations
US6471526B1 (en) 1999-12-16 2002-10-29 Fci Americas Technology, Inc. Electrical connector with strain relief feature
US6206267B1 (en) * 1999-12-30 2001-03-27 3Com Corporation Full coverage thermal couple
US6758702B2 (en) * 2000-02-24 2004-07-06 Fci Americas Technology, Inc. Electrical connector with compression contacts
US6535105B2 (en) 2000-03-30 2003-03-18 Avx Corporation Electronic device and process of making electronic device
US6969265B2 (en) * 2000-05-18 2005-11-29 Infineon Technologies Ag Electrically connecting integrated circuits and transducers
TW471743U (en) 2000-08-25 2002-01-01 Jau Pei Cheng Electrical connector
DE60134108D1 (de) * 2000-10-25 2008-07-03 Japan Aviation Electron Eine elektronische Komponente und zugehöriges Herstellungsverfahren
FR2816111B1 (fr) 2000-10-26 2003-01-03 Framatome Connectors Int Dispositif optoelectronique emetteur recepteur
US6558170B1 (en) 2000-11-22 2003-05-06 Fci Americas Technology, Inc. Strain relief for BGA connector
JP2002176069A (ja) * 2000-12-06 2002-06-21 Nec Corp 電気的接続端子の構造とその製造方法
US7115986B2 (en) * 2001-05-02 2006-10-03 Micron Technology, Inc. Flexible ball grid array chip scale packages
US6641410B2 (en) 2001-06-07 2003-11-04 Teradyne, Inc. Electrical solder ball contact
JP3413186B2 (ja) * 2001-07-13 2003-06-03 モルデック株式会社 コネクタ及びその製造方法
US6869292B2 (en) * 2001-07-31 2005-03-22 Fci Americas Technology, Inc. Modular mezzanine connector
SG122743A1 (en) 2001-08-21 2006-06-29 Micron Technology Inc Microelectronic devices and methods of manufacture
US6655965B2 (en) * 2001-11-28 2003-12-02 Fci Americas Technology, Inc. Interconnect device for electrically coupling a test system to a circuit board adapted for use with a ball-grid array connector
SG104293A1 (en) 2002-01-09 2004-06-21 Micron Technology Inc Elimination of rdl using tape base flip chip on flex for die stacking
US6699048B2 (en) * 2002-01-14 2004-03-02 Fci Americas Technology, Inc. High density connector
JP4360771B2 (ja) * 2002-01-17 2009-11-11 矢崎総業株式会社 ヒューズ接続端子の基板への取付構造
US6830463B2 (en) * 2002-01-29 2004-12-14 Fci Americas Technology, Inc. Ball grid array connection device
SG115455A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Methods for assembly and packaging of flip chip configured dice with interposer
US6975035B2 (en) 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
SG121707A1 (en) * 2002-03-04 2006-05-26 Micron Technology Inc Method and apparatus for flip-chip packaging providing testing capability
SG115456A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
SG115459A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Flip chip packaging using recessed interposer terminals
SG111935A1 (en) * 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
US6669499B2 (en) 2002-04-09 2003-12-30 Tyco Electronics Corporation Contact for pin grid array connector and method of forming same
US20040018773A1 (en) * 2002-07-29 2004-01-29 Fci Americas Technology, Inc. Printed circuit board assembly having a BGA connection
US6860741B2 (en) 2002-07-30 2005-03-01 Avx Corporation Apparatus and methods for retaining and placing electrical components
US6928727B2 (en) * 2002-07-30 2005-08-16 Avx Corporation Apparatus and method for making electrical connectors
US6851954B2 (en) 2002-07-30 2005-02-08 Avx Corporation Electrical connectors and electrical components
US20040036170A1 (en) * 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
US6755668B2 (en) * 2002-11-20 2004-06-29 Tyco Electronics Corporation Surface mounted socket assembly
KR20040061250A (ko) * 2002-12-30 2004-07-07 삼성전자주식회사 핀 커넥터에 접합 가능한 인쇄 회로 기판 및 그 제조 방법
US6623284B1 (en) 2003-01-07 2003-09-23 Hon Hai Precision Ind. Co., Ltd. Electrical connector
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
TW568456U (en) * 2003-05-16 2003-12-21 Hon Hai Prec Ind Co Ltd Electrical connector
US7099118B2 (en) * 2003-06-02 2006-08-29 Seagate Technology Llc One-piece suspension assembly including interconnect
US6830457B1 (en) * 2003-07-14 2004-12-14 Hon Hai Precision Ind. Co., Ltd Multi-function pick-up cap for electrical connector
US6918776B2 (en) * 2003-07-24 2005-07-19 Fci Americas Technology, Inc. Mezzanine-type electrical connector
US7059873B2 (en) * 2003-12-09 2006-06-13 Fci Americas Technology, Inc. LGA-BGA connector housing and contacts
US7001190B2 (en) * 2004-04-26 2006-02-21 Tyco Electronics Corporation Repairable ball grid array contact
US6955545B1 (en) 2004-04-27 2005-10-18 Tyco Electronics Corporation Two piece ball grid array
JP4709502B2 (ja) * 2004-05-14 2011-06-22 タイコエレクトロニクスジャパン合同会社 基板実装型電気コネクタ
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US6979238B1 (en) * 2004-06-28 2005-12-27 Samtec, Inc. Connector having improved contacts with fusible members
US7422447B2 (en) * 2004-08-19 2008-09-09 Fci Americas Technology, Inc. Electrical connector with stepped housing
US20060148283A1 (en) * 2004-12-30 2006-07-06 Minich Steven E Surface-mount electrical connector with strain-relief features
US7172438B2 (en) * 2005-03-03 2007-02-06 Samtec, Inc. Electrical contacts having solder stops
US20060196857A1 (en) * 2005-03-03 2006-09-07 Samtec, Inc. Methods of manufacturing electrical contacts having solder stops
US7371131B2 (en) 2005-04-04 2008-05-13 Fci Americas Technology, Inc. Connector having retentive rib
US20060273718A1 (en) * 2005-06-03 2006-12-07 Jian Wang Electronic device including workpieces and a conductive member therebetween
US20060282002A1 (en) * 2005-06-10 2006-12-14 Treatyou Medical Technology Co. Respiratory testing system
US7097465B1 (en) * 2005-10-14 2006-08-29 Hon Hai Precision Ind. Co., Ltd. High density connector with enhanced structure
US20070117268A1 (en) * 2005-11-23 2007-05-24 Baker Hughes, Inc. Ball grid attachment
WO2007061233A1 (en) * 2005-11-24 2007-05-31 Yoon-Sik Choi Connector
KR200407900Y1 (ko) * 2005-11-24 2006-02-06 윤 식 최 커넥터
KR100736117B1 (ko) * 2006-05-15 2007-07-06 (주) 라모스테크놀러지 금속 스텐실과 이를 이용한 스크린 프린터 및 메모리모듈의 복구 방법
US7635278B2 (en) * 2007-08-30 2009-12-22 Fci Americas Technology, Inc. Mezzanine-type electrical connectors
JP4862796B2 (ja) * 2007-09-28 2012-01-25 山一電機株式会社 高速伝送用高密度コネクタ
US8147254B2 (en) * 2007-11-15 2012-04-03 Fci Americas Technology Llc Electrical connector mating guide
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
GB0815306D0 (en) * 2008-08-21 2008-09-24 Sarantel Ltd An antenna and a method of manufacturing an antenna
US8277241B2 (en) * 2008-09-25 2012-10-02 Fci Americas Technology Llc Hermaphroditic electrical connector
US8004072B2 (en) * 2008-10-15 2011-08-23 Qimonda Ag Packaging systems and methods
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
JP5350962B2 (ja) * 2009-09-30 2013-11-27 富士通株式会社 電子部品、基板ユニット及び情報処理装置
CN102668726B (zh) * 2009-12-24 2015-07-01 古河电气工业株式会社 注塑成型基板与实装零件的安装结构
US9142932B2 (en) 2010-04-20 2015-09-22 Hon Hai Precision Industry Co., Ltd. Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint
EP2624034A1 (en) 2012-01-31 2013-08-07 Fci Dismountable optical coupling device
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
US8899993B2 (en) 2012-08-07 2014-12-02 Amphenol InterCon Systems, Inc. Interposer plate
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
CN112086780B (zh) 2014-10-23 2022-11-01 安费诺富加宜（亚洲）私人有限公司 夹层式电连接器
CN107548530A (zh) 2016-04-29 2018-01-05 慧与发展有限责任合伙企业 压配式引脚转换器
US11239639B2 (en) 2016-09-30 2022-02-01 TE Connectivity Services Gmbh Assembly and method for sealing a bundle of wires
US10109947B2 (en) 2017-02-07 2018-10-23 Te Connectivity Corporation System and method for sealing electrical terminals
US10103458B2 (en) 2017-02-07 2018-10-16 Te Connectivity Corporation System and method for sealing electrical terminals
US10483661B2 (en) 2017-02-07 2019-11-19 Te Connectivity Corporation System and method for sealing electrical terminals
US10404014B2 (en) 2017-02-17 2019-09-03 Fci Usa Llc Stacking electrical connector with reduced crosstalk
CN110800171B (zh) 2017-04-28 2021-11-02 富加宜（美国）有限责任公司 高频bga连接器
US10405448B2 (en) 2017-04-28 2019-09-03 Fci Usa Llc High frequency BGA connector
CN107437673B (zh) * 2017-06-23 2019-04-26 番禺得意精密电子工业有限公司 电连接器
US10297946B1 (en) 2018-04-19 2019-05-21 Te Connectivity Corporation Apparatus and methods for sealing electrical connections
US10470313B1 (en) 2018-07-02 2019-11-05 Te Connectivity Corporation Solder ball module for contact assembly of an electrical connector
US11257612B2 (en) 2018-07-26 2022-02-22 TE Connectivity Services Gmbh Assembly and method for sealing a bundle of wires
USD950498S1 (en) * 2018-11-05 2022-05-03 Samtec, Inc. Connector
CN109301565B (zh) * 2018-11-30 2023-09-05 安费诺商用电子产品(成都)有限公司 一种插拔连接器端子组件
USD922329S1 (en) * 2019-05-10 2021-06-15 Semiconductor Components Industries, Llc Press-fit pin case
CN112918399B (zh) * 2019-12-05 2022-03-22 深圳市高科润电子有限公司 一种基于v型槽散热的新能源汽车控制器集成装置
CN114744423A (zh) * 2020-12-24 2022-07-12 山一电机株式会社 连接器套件以及封盖
CN114678709A (zh) * 2020-12-24 2022-06-28 山一电机株式会社 连接器以及连接器套件

Family Cites Families (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2980881A (en) 1958-04-14 1961-04-18 United Carr Fastener Corp Connector and snap-in contact therefor
US3320658A (en) * 1964-06-26 1967-05-23 Ibm Method of making electrical connectors and connections
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
GB1434833A (en) * 1972-06-02 1976-05-05 Siemens Ag Solder carrying electrical connector wires
US3864004A (en) * 1972-11-30 1975-02-04 Du Pont Circuit board socket
US3865462A (en) 1973-03-07 1975-02-11 Amp Inc Preloaded contact and latchable housing assembly
US3838382A (en) 1973-07-13 1974-09-24 Itt Retention system for electrical contacts
JPS5535238B2 (zh) * 1975-01-24 1980-09-12
US4140361A (en) 1975-06-06 1979-02-20 Sochor Jerzy R Flat receptacle contact for extremely high density mounting
US4056302A (en) * 1976-06-04 1977-11-01 International Business Machines Corporation Electrical connection structure and method
US4274700A (en) * 1977-10-12 1981-06-23 Bunker Ramo Corporation Low cost electrical connector
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
US4395086A (en) 1981-04-20 1983-07-26 The Bendix Corporation Electrical contact for electrical connector assembly
DE3173078D1 (en) * 1981-12-29 1986-01-09 Ibm Soldering method of pins to eyelets of conductors formed on a ceramic substrate
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
JPS6072663A (ja) * 1983-09-28 1985-04-24 Fujitsu Ltd 低融点金属球接続方法
US4678250A (en) * 1985-01-08 1987-07-07 Methode Electronics, Inc. Multi-pin electrical header
JPS61176086A (ja) * 1985-01-29 1986-08-07 富士通株式会社 電気的接続装置の接点ピン溶着方法
US4641426A (en) * 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US4767344A (en) * 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
EP0263222B1 (en) * 1986-10-08 1992-03-25 International Business Machines Corporation Method of forming solder terminals for a pinless ceramic module
JPS63128574A (ja) * 1986-11-19 1988-06-01 株式会社日立製作所 コネクタピン
US4722470A (en) * 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
JPH0795554B2 (ja) * 1987-09-14 1995-10-11 株式会社日立製作所 はんだ球整列装置
JPH0278893A (ja) * 1988-09-14 1990-03-19 Sanden Corp 熱交換器とその製造方法
US5024372A (en) * 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
JPH0775270B2 (ja) * 1989-04-20 1995-08-09 沖電気工業株式会社 ベアチップの実装構造
US5098311A (en) * 1989-06-12 1992-03-24 Ohio Associated Enterprises, Inc. Hermaphroditic interconnect system
JP2590450B2 (ja) * 1990-02-05 1997-03-12 株式会社村田製作所 バンプ電極の形成方法
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5111991A (en) * 1990-10-22 1992-05-12 Motorola, Inc. Method of soldering components to printed circuit boards
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
US5350292A (en) 1991-04-04 1994-09-27 Magnetek Electrical half connector with contact-centering vanes
US5131871A (en) * 1991-04-16 1992-07-21 Molex Incorporated Universal contact pin electrical connector
US5118027A (en) * 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
US5199885A (en) 1991-04-26 1993-04-06 Amp Incorporated Electrical connector having terminals which cooperate with an edge of a circuit board
US5120237A (en) 1991-07-22 1992-06-09 Fussell Don L Snap on cable connector
US5229016A (en) * 1991-08-08 1993-07-20 Microfab Technologies, Inc. Method and apparatus for dispensing spherical-shaped quantities of liquid solder
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5222649A (en) * 1991-09-23 1993-06-29 International Business Machines Apparatus for soldering a semiconductor device to a circuitized substrate
US5207372A (en) * 1991-09-23 1993-05-04 International Business Machines Method for soldering a semiconductor device to a circuitized substrate
US5255839A (en) * 1992-01-02 1993-10-26 Motorola, Inc. Method for solder application and reflow
US5338208A (en) * 1992-02-04 1994-08-16 International Business Machines Corporation High density electronic connector and method of assembly
GB9205088D0 (en) * 1992-03-09 1992-04-22 Amp Holland Shielded back plane connector
US5269453A (en) * 1992-04-02 1993-12-14 Motorola, Inc. Low temperature method for forming solder bump interconnections to a plated circuit trace
GB2269335A (en) * 1992-08-04 1994-02-09 Ibm Solder particle deposition
US5284287A (en) * 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
JP3338527B2 (ja) * 1992-10-07 2002-10-28 富士通株式会社 高密度積層形のコネクタ、及び、コネクタの設計方法
US5324569A (en) * 1993-02-26 1994-06-28 Hewlett-Packard Company Composite transversely plastic interconnect for microchip carrier
US5489750A (en) * 1993-03-11 1996-02-06 Matsushita Electric Industrial Co., Ltd. Method of mounting an electronic part with bumps on a circuit board
US5613882A (en) * 1993-03-19 1997-03-25 The Whitaker Corporation Connector latch and polarizing structure
US5275330A (en) * 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5279028A (en) * 1993-04-30 1994-01-18 The Whitaker Corporation Method of making a pin grid array and terminal for use therein
US5518410A (en) * 1993-05-24 1996-05-21 Enplas Corporation Contact pin device for IC sockets
JP3303109B2 (ja) * 1993-05-31 2002-07-15 シチズン時計株式会社 半田ボール供給装置と供給方法
US5358417A (en) * 1993-08-27 1994-10-25 The Whitaker Corporation Surface mountable electrical connector
US5354218A (en) * 1993-09-16 1994-10-11 Molex Incorporated Electrical connector with improved terminal latching means
US5346118A (en) * 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5442852A (en) * 1993-10-26 1995-08-22 Pacific Microelectronics Corporation Method of fabricating solder ball array
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
JPH07142489A (ja) * 1993-11-17 1995-06-02 Matsushita Electric Ind Co Ltd バンプの形成方法
JP3008768B2 (ja) * 1994-01-11 2000-02-14 松下電器産業株式会社 バンプの形成方法
JPH0883662A (ja) * 1994-01-13 1996-03-26 Furukawa Electric Co Ltd:The スーパーマイクロコネクタの製造方法
US5495668A (en) * 1994-01-13 1996-03-05 The Furukawa Electric Co., Ltd. Manufacturing method for a supermicro-connector
US5377902A (en) * 1994-01-14 1995-01-03 Microfab Technologies, Inc. Method of making solder interconnection arrays
US5435482A (en) * 1994-02-04 1995-07-25 Lsi Logic Corporation Integrated circuit having a coplanar solder ball contact array
US5431332A (en) * 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5491303A (en) * 1994-03-21 1996-02-13 Motorola, Inc. Surface mount interposer
US5498167A (en) 1994-04-13 1996-03-12 Molex Incorporated Board to board electrical connectors
JP3102259B2 (ja) * 1994-04-21 2000-10-23 株式会社村田製作所 高圧コネクタ
JP3309099B2 (ja) * 1994-05-18 2002-07-29 信越ポリマー株式会社 回路基板と表面実装型ｌｓｉとの接続方法
JPH0831873A (ja) * 1994-07-15 1996-02-02 Furukawa Electric Co Ltd:The スーパーマイクロコネクタ及びその製造方法
US5516030A (en) * 1994-07-20 1996-05-14 Compaq Computer Corporation Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
US5519580A (en) * 1994-09-09 1996-05-21 Intel Corporation Method of controlling solder ball size of BGA IC components
US5499487A (en) * 1994-09-14 1996-03-19 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
US5542174A (en) * 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
US5462456A (en) 1994-10-11 1995-10-31 The Whitaker Corporation Contact retention device for an electrical connector
US5477933A (en) * 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5593322A (en) * 1995-01-17 1997-01-14 Dell Usa, L.P. Leadless high density connector
JP3779346B2 (ja) * 1995-01-20 2006-05-24 日本発条株式会社 Ｌｓｉパッケージ用ソケット
EP1679765B1 (en) * 1995-06-12 2012-04-25 Fci Low cross talk and impedance controlled electrical connector
US5702255A (en) * 1995-11-03 1997-12-30 Advanced Interconnections Corporation Ball grid array socket assembly
US5746608A (en) 1995-11-30 1998-05-05 Taylor; Attalee S. Surface mount socket for an electronic package, and contact for use therewith
US5833498A (en) 1995-12-28 1998-11-10 Berg Technology, Inc. Electrical connector having improved retention feature and receptacle for use therein
US5643009A (en) * 1996-02-26 1997-07-01 The Whitaker Corporation Electrical connector having a pivot lock
US5718607A (en) * 1996-03-01 1998-02-17 Molex Incorporated System for terminating the shield of a high speed cable
US5730606A (en) * 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
WO1997045896A1 (en) 1996-05-30 1997-12-04 The Whitaker Corporation Surface mountable electrical connector
US6042389A (en) 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6139336A (en) 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface

Also Published As

Publication number Publication date
HU0600083D0 (en) 2006-04-28
KR100473311B1 (zh) 2006-04-28
PL192432B1 (pl) 2006-10-31
US6079991A (en) 2000-06-27
US6024584A (en) 2000-02-15
PL192425B1 (pl) 2006-10-31
KR19980032738A (ko) 1998-07-25
HU229998B1 (en) 2015-04-28
US6358068B1 (en) 2002-03-19
US6164983A (en) 2000-12-26

Similar Documents

Publication Publication Date Title
TW318971B (en) High density connector
TW406454B (en) High density connector and method of manufacture
US5336118A (en) Method of making a pin grid array and terminal for use therein
EP0127680B1 (en) Connector containing fusible material and having intrinsic temperature control
US5010233A (en) Self regulating temperature heater as an integral part of a printed circuit board
TW419678B (en) Electrical devices
US4533896A (en) Fuse for thick film device
JPH0750128A (ja) 超小型ヒューズ
KR970005579B1 (ko) 시이트(sheet)재료 가열장치
US3524960A (en) Metal coated plastic plug as electrical connector and switch
US5357074A (en) Electrical interconnection device
JPH0773791A (ja) 温度ヒューズと抵抗体の組立体
US6530776B1 (en) Method and apparatus of connection to an electrical film device
TWI437763B (zh) 電纜連接用連接器
GB2050067A (en) Circuit boards
US7365286B2 (en) Heater assembly including housing with strain relief features
WO1996017405A1 (en) Electrical connection method
CA1244144A (en) Positive temperature coefficient thermistor device
US3360631A (en) Package assembly
JPH0792358B2 (ja) 電気式点火装置用点火器
US5288959A (en) Device for electrically interconnecting opposed contact arrays
KR940007633A (ko) 화상 가열 장치 및 가열기
JP2003217416A5 (zh)
JPH05283146A (ja) 厚膜抵抗発熱体
TWI730493B (zh) 具有加熱功能的非導電薄膜以及電子裝置

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent