TW313542B - - Google Patents
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- Publication number
- TW313542B TW313542B TW085106393A TW85106393A TW313542B TW 313542 B TW313542 B TW 313542B TW 085106393 A TW085106393 A TW 085106393A TW 85106393 A TW85106393 A TW 85106393A TW 313542 B TW313542 B TW 313542B
- Authority
- TW
- Taiwan
- Prior art keywords
- aforementioned
- item
- patent application
- substance
- solid sphere
- Prior art date
Links
- 239000007787 solid Substances 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 241001417527 Pempheridae Species 0.000 claims description 2
- 230000001174 ascending effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000004898 kneading Methods 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 17
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000000048 melt cooling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/065—Spherical particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
- Glanulating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17012895A JP3765321B2 (ja) | 1995-06-13 | 1995-06-13 | 中実球体製造装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW313542B true TW313542B (enExample) | 1997-08-21 |
Family
ID=15899176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085106393A TW313542B (enExample) | 1995-06-13 | 1996-05-29 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5778964A (enExample) |
| EP (1) | EP0776726A4 (enExample) |
| JP (1) | JP3765321B2 (enExample) |
| AU (1) | AU5844596A (enExample) |
| TW (1) | TW313542B (enExample) |
| WO (1) | WO1996041699A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501663B1 (en) | 2000-02-28 | 2002-12-31 | Hewlett Packard Company | Three-dimensional interconnect system |
| US6565342B1 (en) * | 2000-11-17 | 2003-05-20 | Accurus Scientific Co. Ltd. | Apparatus for making precision metal spheres |
| US9216469B2 (en) * | 2013-10-18 | 2015-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Indirect printing bumping method for solder ball deposition |
| CN106735264A (zh) * | 2016-10-12 | 2017-05-31 | 侯明玉 | 冶金颗粒浇铸熔液分流器 |
| CN107486652B (zh) * | 2017-08-18 | 2019-08-27 | 安徽鼎恒再制造产业技术研究院有限公司 | 一种半自动焊芯初步包裹装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT119306B (de) * | 1925-04-07 | 1930-10-10 | Chemische Produkte Vormals H S | Verfahren zur Herstellung von Leim und Gelatine in Körner-, Grieß- oder Pulverform. |
| NL100194C (enExample) * | 1955-12-16 | |||
| JPS5415540B2 (enExample) * | 1974-01-16 | 1979-06-15 | ||
| DE2635147C3 (de) * | 1976-08-05 | 1979-02-08 | Sandvik Conveyor Gmbh, 7012 Fellbach | Vorrichtung zur Herstellung von festen Teilchen |
| JPS605804A (ja) * | 1983-06-23 | 1985-01-12 | Tanaka Kikinzoku Kogyo Kk | 微小金属球の製造方法 |
| DE3604169A1 (de) * | 1986-02-10 | 1987-08-13 | Klebchemie M G Becker Gmbh | Abschmelzbare patrone, insbesondere schmelzkleberpatrone |
| JPH0466603A (ja) * | 1990-07-06 | 1992-03-03 | Nippon Steel Corp | 微細金属球の製造方法 |
| JP2917595B2 (ja) * | 1991-07-19 | 1999-07-12 | 松下電器産業株式会社 | 金属ボールの形成方法 |
| GB9200936D0 (en) * | 1992-01-16 | 1992-03-11 | Sprayforming Dev Ltd | Improvements in the processing of metals and alloys |
-
1995
- 1995-06-13 JP JP17012895A patent/JP3765321B2/ja not_active Expired - Lifetime
-
1996
- 1996-05-29 TW TW085106393A patent/TW313542B/zh not_active IP Right Cessation
- 1996-05-30 EP EP96919999A patent/EP0776726A4/en not_active Withdrawn
- 1996-05-30 AU AU58445/96A patent/AU5844596A/en not_active Abandoned
- 1996-05-30 WO PCT/JP1996/001454 patent/WO1996041699A1/ja not_active Ceased
- 1996-05-30 US US08/776,307 patent/US5778964A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| AU5844596A (en) | 1997-01-09 |
| EP0776726A1 (en) | 1997-06-04 |
| JPH091392A (ja) | 1997-01-07 |
| WO1996041699A1 (en) | 1996-12-27 |
| US5778964A (en) | 1998-07-14 |
| EP0776726A4 (en) | 1999-01-27 |
| JP3765321B2 (ja) | 2006-04-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |