Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3457—Solder materials or compositions; Methods of application thereof
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
  • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F1/06—Metallic powder characterised by the shape of the particles
  • B22F1/065—Spherical particles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
  • B22F9/00—Making metallic powder or suspensions thereof
  • B22F9/02—Making metallic powder or suspensions thereof using physical processes
  • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
  • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
  • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3457—Solder materials or compositions; Methods of application thereof
  • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Definitions

• the present invention relates to a solid sphere manufacturing apparatus for manufacturing a solid sphere-shaped solder alloy or the like.
• the diameter of the solder balls varies, and it is necessary to classify only solder balls having a constant diameter with a high accuracy of, for example, ⁇ 0.02 mm as sphericity. There was a problem that the solder ball was expensive and expensive, because it was extremely difficult.
• an object of the present invention is to provide a solid sphere manufacturing apparatus capable of manufacturing a solid sphere such as a solder sphere having a high sphericity and high dimensional accuracy and omitting a step of classifying the solid sphere. Disclosure of the invention
• the present invention has a plurality of holes that penetrate and open on the top and bottom surfaces.
• the surface is a flat plate composed of a material that has poor wettability with a substance in a molten or semi-molten state,
• a cylinder communicating with the space
• a piston that presses the substance in the space By raising the inside of the cylinder, a piston that presses the substance in the space, passes through the plurality of holes, and ejects the substance on the upper surface of the flat plate;
• the present invention includes a heating device for heating the material or the metal paste ejected to the upper surface by heating the flat plate itself. Instead of the heating device, the material or the metal paste ejected to the upper surface is provided. In some cases, a heating device is provided to heat the atmosphere in which the metal is present to a temperature at which the surface tension of the substance or metal paste can act.
• the piston when the piston rises in the cylinder, it presses the molten or semi-molten substance or metal paste in the space, passes through the plurality of holes of the flat plate, and places it on the upper surface of the flat plate. Let it squirt.
• the flat plate is made of a material or a material having poor wettability with the metal paste, that is, the flat plate has a property of having a large contact angle between the two, so that the material or the plate is formed at the time of this ejection. If the metal paste exerts surface tension, it becomes a sphere, but if the surface tension is not sufficiently exerted due to low temperature, etc., it is difficult to form a complete sphere. If a cylindrical body is formed at the time of this ejection, the material or metal paste ejected to the upper surface is heated to exert a surface tension to form a sphere.
• the solvent is evaporated by heating.
• the weight per substance or metal paste is controlled extremely accurately, so that when the sphere is cooled, the sphericity and dimensions are reduced.
• Highly accurate solid spheres such as solder alloys can be manufactured, and the step of classifying solid spheres can be omitted.
• FIG. 1 is a configuration diagram of one embodiment of the present invention
• FIG. 2 is a configuration diagram of one embodiment of the present invention.
• FIG. 1 is a configuration diagram of one embodiment of the present invention for a solder alloy.
• the flat plate 1 has a plurality of holes 2 penetrating the upper surface 1a and the lower surface 1b.
• the flat plate 1 is made of stainless steel that has poor wettability with the solder alloy material 4 to form a solid sphere.
• aluminum nitride is used.
• (A 1 N) material is used, or the upper surface 1a is coated with aluminum nitride.
• the space 3 is filled with a material 4 such as a solder alloy in a molten or semi-molten state, is in contact with the bottom surface 1 b, and is sealed by the container 11.
• the substance 4 is injected from an inlet (not shown) provided in the container 11 and is sealed by a lid (not shown).
• the cylinder 10 communicates with the space 3.
• the space 3 is formed only in the cylinder 10 using a cylinder 10 having a larger diameter, and the container 11 is omitted.
• a metal paste in which a metal powder and a solvent are kneaded may be used.
• the driving device for vertically moving the piston 5 includes a pulse motor 8, a control circuit 9 for controlling the rotation of the pulse motor 8, and a micrometer 10 rotated by the pulse motor 8 to vertically move the piston 5.
• the heating device (not shown) is made of a nichrome wire or the like, and jets out onto the upper surface la of the flat plate 1 to heat the substance 4 in the state of forming the sphere 6b, and further controls the heating to obtain a solid sphere with high sphericity This is a device for forming a sphere 6.
• the apparatus may include a heating device for generating laser light, infrared lamp irradiation, and hot air.
• the diameter of the upper surface 1a of the hole 2 may be formed smaller than the diameter of the lower surface 1b to form a taper. Due to this taper, the material 4 or the metal paste can be easily cut from the hole 2.
• the flat plate 1 is formed in a disk shape, and a plurality of holes 2 are provided at symmetrical positions from the center of the flat plate 1. Thereby, the pushing force of the substance 4 or the metal paste from the hole 2 by the piston 5 is made uniform.
• a flat plate 1 made of stainless steel having a thickness of 3 mm is provided with a hole 2 having a diameter of 0.6 mm ⁇ , and a space 3 is made up of 60% by weight of Sn and 40% by weight of Pb.
• the molten solder alloy substance 4 was filled.
• the pulse motor 8 was rotated twice by the control circuit 9, and the piston 5 was pushed up by the micrometer 10 to push the substance 4.
• the substance 4 passes through the plurality of holes 2 and is ejected onto the upper surface 1a of the flat plate 1 as a cylindrical body 6a as shown in FIG. 1, and the ejected material exerts a surface tension.
• the ejected material exerts a surface tension.
• it becomes a sphere 6b, as shown in FIG.
• the spherical body 6b is formed by heating with a heating device.
• the sphericity was heated to 190 ° C (eutectic molten state) for 1 minute, as shown in FIG. An almost perfect solid sphere 6 of 0.01% was obtained.
• the reason why a solid sphere 6 with high sphericity can be obtained is that, for example, the weight per substance of substance 4 is extremely accurately controlled by a pulse motor. Because you can. As a result, the manufactured solid sphere 6 of the solder alloy was sufficiently usable for BGA.
• a paste using solder powder for example, propyl alcohol or a 5% polyvinyl alcohol solution was used as a solvent, and heated to 200 ° C. after ejection.
• a sweeper (not shown) for collecting the solid sphere 6 at a predetermined position may be provided.
• the step of ejecting the substance 4 to the upper surface 1a of the flat plate 1 is preferably performed in a non-oxidizing atmosphere such as nitrogen.

Landscapes

• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Nanotechnology (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacture Of Metal Powder And Suspensions Thereof (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Powder Metallurgy (AREA)
• Glanulating (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=15899176

Family Applications (1)

Country Status (6)

Families Citing this family (5)

Citations (3)

Family Cites Families (6)

• 1995
  • 1995-06-13 JP JP17012895A patent/JP3765321B2/ja not_active Expired - Lifetime
• 1996
  • 1996-05-29 TW TW085106393A patent/TW313542B/zh not_active IP Right Cessation
  • 1996-05-30 EP EP96919999A patent/EP0776726A4/en not_active Withdrawn
  • 1996-05-30 AU AU58445/96A patent/AU5844596A/en not_active Abandoned
  • 1996-05-30 US US08/776,307 patent/US5778964A/en not_active Expired - Lifetime
  • 1996-05-30 WO PCT/JP1996/001454 patent/WO1996041699A1/ja not_active Ceased

Patent Citations (3)

Non-Patent Citations (1)

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