JP3765321B2 - 中実球体製造装置 - Google Patents

中実球体製造装置 Download PDF

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Publication number
JP3765321B2
JP3765321B2 JP17012895A JP17012895A JP3765321B2 JP 3765321 B2 JP3765321 B2 JP 3765321B2 JP 17012895 A JP17012895 A JP 17012895A JP 17012895 A JP17012895 A JP 17012895A JP 3765321 B2 JP3765321 B2 JP 3765321B2
Authority
JP
Japan
Prior art keywords
molten
solvent
semi
solder alloy
metal powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17012895A
Other languages
English (en)
Japanese (ja)
Other versions
JPH091392A (ja
Inventor
寅之輔 川口
明一 前園
Original Assignee
日本アルミット株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本アルミット株式会社 filed Critical 日本アルミット株式会社
Priority to JP17012895A priority Critical patent/JP3765321B2/ja
Priority to TW085106393A priority patent/TW313542B/zh
Priority to EP96919999A priority patent/EP0776726A4/en
Priority to US08/776,307 priority patent/US5778964A/en
Priority to AU58445/96A priority patent/AU5844596A/en
Priority to PCT/JP1996/001454 priority patent/WO1996041699A1/ja
Publication of JPH091392A publication Critical patent/JPH091392A/ja
Application granted granted Critical
Publication of JP3765321B2 publication Critical patent/JP3765321B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/065—Spherical particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Glanulating (AREA)
JP17012895A 1995-06-13 1995-06-13 中実球体製造装置 Expired - Lifetime JP3765321B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP17012895A JP3765321B2 (ja) 1995-06-13 1995-06-13 中実球体製造装置
TW085106393A TW313542B (enExample) 1995-06-13 1996-05-29
EP96919999A EP0776726A4 (en) 1995-06-13 1996-05-30 DEVICE FOR PRODUCING SOLID BALLS
US08/776,307 US5778964A (en) 1995-06-13 1996-05-30 Solid spherical body manufacturing apparatus
AU58445/96A AU5844596A (en) 1995-06-13 1996-05-30 Solid sphere manufacturing device
PCT/JP1996/001454 WO1996041699A1 (en) 1995-06-13 1996-05-30 Solid sphere manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17012895A JP3765321B2 (ja) 1995-06-13 1995-06-13 中実球体製造装置

Publications (2)

Publication Number Publication Date
JPH091392A JPH091392A (ja) 1997-01-07
JP3765321B2 true JP3765321B2 (ja) 2006-04-12

Family

ID=15899176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17012895A Expired - Lifetime JP3765321B2 (ja) 1995-06-13 1995-06-13 中実球体製造装置

Country Status (6)

Country Link
US (1) US5778964A (enExample)
EP (1) EP0776726A4 (enExample)
JP (1) JP3765321B2 (enExample)
AU (1) AU5844596A (enExample)
TW (1) TW313542B (enExample)
WO (1) WO1996041699A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501663B1 (en) 2000-02-28 2002-12-31 Hewlett Packard Company Three-dimensional interconnect system
US6565342B1 (en) * 2000-11-17 2003-05-20 Accurus Scientific Co. Ltd. Apparatus for making precision metal spheres
US9216469B2 (en) * 2013-10-18 2015-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Indirect printing bumping method for solder ball deposition
CN106735264A (zh) * 2016-10-12 2017-05-31 侯明玉 冶金颗粒浇铸熔液分流器
CN107486652B (zh) * 2017-08-18 2019-08-27 安徽鼎恒再制造产业技术研究院有限公司 一种半自动焊芯初步包裹装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT119306B (de) * 1925-04-07 1930-10-10 Chemische Produkte Vormals H S Verfahren zur Herstellung von Leim und Gelatine in Körner-, Grieß- oder Pulverform.
NL100194C (enExample) * 1955-12-16
JPS5415540B2 (enExample) * 1974-01-16 1979-06-15
DE2635147C3 (de) * 1976-08-05 1979-02-08 Sandvik Conveyor Gmbh, 7012 Fellbach Vorrichtung zur Herstellung von festen Teilchen
JPS605804A (ja) * 1983-06-23 1985-01-12 Tanaka Kikinzoku Kogyo Kk 微小金属球の製造方法
DE3604169A1 (de) * 1986-02-10 1987-08-13 Klebchemie M G Becker Gmbh Abschmelzbare patrone, insbesondere schmelzkleberpatrone
JPH0466603A (ja) * 1990-07-06 1992-03-03 Nippon Steel Corp 微細金属球の製造方法
JP2917595B2 (ja) * 1991-07-19 1999-07-12 松下電器産業株式会社 金属ボールの形成方法
GB9200936D0 (en) * 1992-01-16 1992-03-11 Sprayforming Dev Ltd Improvements in the processing of metals and alloys

Also Published As

Publication number Publication date
AU5844596A (en) 1997-01-09
EP0776726A1 (en) 1997-06-04
TW313542B (enExample) 1997-08-21
JPH091392A (ja) 1997-01-07
WO1996041699A1 (en) 1996-12-27
US5778964A (en) 1998-07-14
EP0776726A4 (en) 1999-01-27

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