TW307863B - - Google Patents
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- Publication number
- TW307863B TW307863B TW083107807A TW83107807A TW307863B TW 307863 B TW307863 B TW 307863B TW 083107807 A TW083107807 A TW 083107807A TW 83107807 A TW83107807 A TW 83107807A TW 307863 B TW307863 B TW 307863B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- calendar
- suspension system
- item
- areas
- Prior art date
Links
- 239000000725 suspension Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 24
- 238000003860 storage Methods 0.000 claims description 14
- 238000013016 damping Methods 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 238000013500 data storage Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 2
- 229910052716 thallium Inorganic materials 0.000 claims 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 229910000851 Alloy steel Inorganic materials 0.000 claims 1
- 241000555745 Sciuridae Species 0.000 claims 1
- 238000007391 self-medication Methods 0.000 claims 1
- 239000003190 viscoelastic substance Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 65
- 238000000034 method Methods 0.000 description 14
- 238000005452 bending Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 230000036316 preload Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241000824268 Kuma Species 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 210000001217 buttock Anatomy 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 239000010959 steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 1
- 241000972773 Aulopiformes Species 0.000 description 1
- 241000237519 Bivalvia Species 0.000 description 1
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000283070 Equus zebra Species 0.000 description 1
- 241000735495 Erica <angiosperm> Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229930194542 Keto Natural products 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- 241000353097 Molva molva Species 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 241001080061 Talides Species 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 235000020639 clam Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 210000000936 intestine Anatomy 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 235000019515 salmon Nutrition 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B21/00—Head arrangements not specific to the method of recording or reproducing
- G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
- G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
- G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Magnetic Record Carriers (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21391394A | 1994-03-15 | 1994-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW307863B true TW307863B (en, 2012) | 1997-06-11 |
Family
ID=22797008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083107807A TW307863B (en, 2012) | 1994-03-15 | 1994-08-25 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US5594607A (en, 2012) |
| EP (1) | EP0673019B1 (en, 2012) |
| JP (1) | JP2633491B2 (en, 2012) |
| KR (1) | KR0156444B1 (en, 2012) |
| CN (1) | CN1063570C (en, 2012) |
| DE (1) | DE69512295T2 (en, 2012) |
| MY (1) | MY111722A (en, 2012) |
| TW (1) | TW307863B (en, 2012) |
Families Citing this family (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07262540A (ja) * | 1994-03-17 | 1995-10-13 | Fujitsu Ltd | 磁気ディスク装置のアクチュエータアームアセンブリ |
| US5839193A (en) * | 1994-04-15 | 1998-11-24 | Hutchinson Technology Incorporated | Method of making laminated structures for a disk drive suspension assembly |
| JP3173714B2 (ja) * | 1994-12-08 | 2001-06-04 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | サスペンション・システム |
| KR19990008454A (ko) * | 1995-05-08 | 1999-01-25 | 앤드류크라이더 | 경량 판독/기록 헤드를 지지하는 현가 장치 설계 |
| US5946163A (en) * | 1995-06-07 | 1999-08-31 | Seagate Technology, Inc. | Actuator assembly flexible circuit with reduced stiffness |
| JP3400248B2 (ja) * | 1995-08-30 | 2003-04-28 | インターナショナル・ビジネス・マシーンズ・コーポレーション | ディスク・ドライブ装置用のヘッド・サスペンションのロード・ビーム |
| SG43433A1 (en) * | 1995-10-27 | 1997-10-17 | Tdk Corp | Suspension slider-suspension assmebly assembly carriage device and manufacturing method of the suspension |
| JP3139950B2 (ja) * | 1995-12-01 | 2001-03-05 | 株式会社日立製作所 | 磁気ディスク装置のロードビームとガイドアームにおける配線構造 |
| US6556382B1 (en) | 1996-03-29 | 2003-04-29 | Hutchinson Technology, Inc. | Mass balancing for optimizing suspension resonance performance |
| US5892637A (en) * | 1996-05-10 | 1999-04-06 | International Business Machines Corporation | Multi-piece integrated suspension assembly for a magnetic storage system |
| US5818662A (en) * | 1996-07-15 | 1998-10-06 | International Business Machines Corporation | Static attitude and stiffness control for an integrated suspension |
| US5883758A (en) * | 1996-08-07 | 1999-03-16 | Hutchinson Technology Incorporated | Lead structure with stainless steel base for attachment to a suspension |
| US5991122A (en) * | 1996-09-24 | 1999-11-23 | Hutchinson Technology Incorporated | Method for designing a suspension having weakening structures for resonance-optimized side profile |
| JPH10162532A (ja) * | 1996-12-03 | 1998-06-19 | Nitto Denko Corp | 制振材及びそれを用いたヘッドサスペンション |
| JP3756650B2 (ja) | 1996-12-19 | 2006-03-15 | ハッチンソン テクノロジー インコーポレーティッド | 絶縁体層温湿補整のための平衡パラレルリード線を備えた一体型リード線懸架装置フレクシャ |
| US5982584A (en) * | 1996-12-19 | 1999-11-09 | Hutchinson Technology Incorporated | Integrated lead suspension flexure with serially arranged metal-backed and suspended insulator portions for hygrothermal compensation |
| US6147839A (en) * | 1996-12-23 | 2000-11-14 | Hutchinson Technology, Inc. | Head suspension with outriggers extending across a spring region |
| US6275358B1 (en) * | 1997-01-21 | 2001-08-14 | Maxtor Corporation | Conductor trace array having passive stub conductors |
| US6038102A (en) * | 1997-01-21 | 2000-03-14 | Quantum Corporation | Conductor trace array having interleaved passive conductors |
| US6057989A (en) * | 1997-02-26 | 2000-05-02 | Brush Wellman, Inc. | Composite disk drive armset |
| TW408300B (en) * | 1997-03-19 | 2000-10-11 | Sony Corp | Magnetic head device |
| US5781380A (en) * | 1997-04-01 | 1998-07-14 | Western Digital Corporation | Swing-type actuator assembly having internal conductors |
| JPH1131314A (ja) * | 1997-07-08 | 1999-02-02 | Minebea Co Ltd | 磁気ヘッド支持体 |
| US5978178A (en) * | 1997-08-15 | 1999-11-02 | Questek Innovations, Inc. | Disk drive actuator assembly with arm having high stiffness to mass ratio |
| US6021022A (en) * | 1997-10-27 | 2000-02-01 | Seagate Technology, Inc. | Flexure displacement limiter-flex circuit interconnect |
| US6612016B1 (en) | 1997-12-18 | 2003-09-02 | Hutchinson Technology Incorporated | Method of making integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation |
| US5949617A (en) * | 1997-12-29 | 1999-09-07 | Headway Technologies, Inc. | Dynamic-absorber for the suppression of suspension vibrations |
| US5956212A (en) * | 1997-12-29 | 1999-09-21 | Headway Technologies, Inc. | Static attitude adjustment of a trace-suspension assembly |
| AU2112499A (en) * | 1998-01-16 | 1999-08-02 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College, The | Induction microscanner |
| JP3257500B2 (ja) * | 1998-02-27 | 2002-02-18 | ティーディーケイ株式会社 | 磁気ヘッド装置 |
| US6055132A (en) * | 1998-06-04 | 2000-04-25 | Internatinal Business Machines Corporation | Integrated lead suspension flexure for attaching a micro-actuator with a transducer slider |
| DE19833388C2 (de) * | 1998-07-24 | 2003-05-15 | Ibm | Verfahren zur gezielten Beeinflussung der Schwingungen von fein- bzw. mikromechanischen Träger-Systemen |
| US6125015A (en) * | 1998-12-04 | 2000-09-26 | Read-Rite Corporation | Head gimbal assembly with low stiffness flex circuit and ESD Protection |
| US6867948B1 (en) | 1999-01-22 | 2005-03-15 | Seagate Technology Llc | Disc drives having flexible circuits with liquid crystal polymer dielectric |
| US6249404B1 (en) | 1999-02-04 | 2001-06-19 | Read-Rite Corporation | Head gimbal assembly with a flexible printed circuit having a serpentine substrate |
| US6424499B1 (en) * | 1999-03-31 | 2002-07-23 | Quantum Corporation | Flexible trace interconnect array for multi-channel tape head |
| US6366426B1 (en) | 1999-04-21 | 2002-04-02 | Seagate Technology Llc | Apparatus and method for reducing structural vibrations in a disc drive utilizing fusible alloys |
| US6704164B1 (en) * | 1999-04-30 | 2004-03-09 | Fujitsu Limited | Vibration reducing members for head suspensions |
| US6388842B1 (en) | 1999-05-12 | 2002-05-14 | Seagate Technology Llc | Disc drive suspension bend section and method |
| US6512658B1 (en) | 1999-05-12 | 2003-01-28 | Seagate Technology Llc | Viscoelastic voice coil damper for disc drives |
| US6381099B1 (en) * | 1999-06-11 | 2002-04-30 | Magnecomp Corporation | Wireless suspension with interrupted load beam |
| US6310746B1 (en) | 1999-06-23 | 2001-10-30 | Read-Rite Corporation | Piezoelectric vibration damping for disk drives |
| US6353515B1 (en) | 1999-09-20 | 2002-03-05 | Innovex, Inc. | Flex suspension assembly for disk drive |
| US6563676B1 (en) * | 1999-09-28 | 2003-05-13 | Maxtor Corporation | Disk drive actuator arm |
| US6807332B1 (en) | 2000-11-06 | 2004-10-19 | Western Digital (Fremont), Inc. | Piezoelectric actuated optical switch |
| KR100392635B1 (ko) * | 2000-12-12 | 2003-07-23 | 삼성전자주식회사 | 충격 감쇠장치를 갖는 디스크 드라이브의 액추에이터 |
| US6714385B1 (en) * | 2001-04-16 | 2004-03-30 | Hutchinson Technology Inc. | Apparatus and method for controlling common mode impedance in disk drive head suspensions |
| US6522624B2 (en) | 2001-05-03 | 2003-02-18 | Seagate Technology Llc | Attachment and microactuation aids in a laminated suspension |
| DE50112386D1 (de) * | 2001-05-08 | 2007-05-31 | Siemens Ag | Verfahren und vorrichtung zur datenübertragung in einem multiträgersystem mit paralleler concatenierter kodierung und modulation |
| US6977798B2 (en) * | 2001-05-23 | 2005-12-20 | Seagate Technology Llc | Stiffened suspension for a storage device having a layer of composite material |
| US6967821B2 (en) | 2001-07-10 | 2005-11-22 | Seagate Technology Llc | Head gimbal assembly including dampening for air bearing vibration |
| US6741424B1 (en) * | 2001-08-31 | 2004-05-25 | Hutchinson Technology, Inc. | Head suspension with rail and stiffener combination |
| US7088553B2 (en) * | 2002-04-25 | 2006-08-08 | Satya Prakash Arya | Laminated suspension load beam design with dual primary metal layers sandwiching intermediate secondary layer |
| US6731466B2 (en) | 2002-04-25 | 2004-05-04 | International Business Machines, Inc. | Suspension with integral constrained and sandwiched layer damping |
| JP4056296B2 (ja) * | 2002-05-21 | 2008-03-05 | スリーエム イノベイティブ プロパティズ カンパニー | 制振部材、その製造方法及び制振部材を備えたサスペンション装置 |
| US7046483B2 (en) | 2002-05-28 | 2006-05-16 | Hitachi Global Storage Technologies Netherlands B.V. | Copper gimbal and gimbal damping for integrated lead suspension |
| EP1557832A4 (en) * | 2002-10-30 | 2008-03-12 | Fujitsu Ltd | TIP DRESS FOR A MAGNETIC HEAD AND MAGNETIC PLATE DRIVE |
| US7414813B2 (en) * | 2003-06-24 | 2008-08-19 | Hitachi Global Storage Technologies Netherlands B.V. | Vibration damped flexible circuit for use in a hard disk drive |
| US7224554B2 (en) * | 2003-06-30 | 2007-05-29 | Seagate Technology Llc | Suspension load beam with a composite damping core |
| JP4298455B2 (ja) * | 2003-09-30 | 2009-07-22 | キヤノン株式会社 | 走査型画像表示装置 |
| US7119993B2 (en) * | 2003-11-14 | 2006-10-10 | Seagate Technology Llc | Actuator assembly including a circuit assembly and a damper therefor |
| US7420778B2 (en) * | 2003-12-22 | 2008-09-02 | Seagate Technology Llc | Suspension component with sealed damping layer |
| US7898771B2 (en) * | 2004-02-27 | 2011-03-01 | Seagate Technology Llc | Head suspension assembly having a high damping high stiffness component |
| JP4019068B2 (ja) * | 2004-05-10 | 2007-12-05 | 日東電工株式会社 | 回路付サスペンション基板 |
| US7606000B1 (en) * | 2005-05-03 | 2009-10-20 | Hutchinson Technology Incorporated | Offset structure for disk drive head suspension |
| JP4170323B2 (ja) * | 2005-07-20 | 2008-10-22 | 富士通株式会社 | ヘッドスライダ用サスペンション |
| KR100797220B1 (ko) * | 2006-11-21 | 2008-01-23 | 엘에스전선 주식회사 | 라미네이션 공정을 포함하는 연성 동박 적층판의 제조 방법 |
| US20080158725A1 (en) * | 2006-12-29 | 2008-07-03 | Toshiki Hirano | Vibration damping utilizing a patterned visco-elastic polymer |
| US7859795B2 (en) * | 2007-06-28 | 2010-12-28 | Hitachi Global Storage Technologies, Netherlands, B.V. | Outer actuator arm constrained layer dampers |
| US8270120B2 (en) * | 2007-11-30 | 2012-09-18 | Hitachi Global Storage Technologies, Netherlands B.V. | Flex cable assembly damper |
| US8142671B1 (en) | 2008-08-12 | 2012-03-27 | Western Digital Technologies, Inc. | Method to fabricate a damped suspension assembly |
| US8159785B1 (en) | 2008-08-27 | 2012-04-17 | Western Digital Technologies, Inc. | Disk drive suspension having a constraint layer and a base region with a bridge section extending across a gap between lateral sections |
| US8493689B2 (en) * | 2009-06-15 | 2013-07-23 | Seagate Technology Llc | Protective layer on gimbal for scratch mitigation |
| US20130155547A1 (en) * | 2011-12-19 | 2013-06-20 | Hajime Eguchi | Damping material to increase a damping ratio |
| DE102016111531B4 (de) | 2016-06-23 | 2022-02-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Optischer Scanner |
| JP6802688B2 (ja) * | 2016-11-02 | 2020-12-16 | 日東電工株式会社 | 配線回路基板 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5330310A (en) * | 1976-09-01 | 1978-03-22 | Fujitsu Ltd | Magnetic head assembly of floating type |
| US4543295A (en) * | 1980-09-22 | 1985-09-24 | The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration | High temperature polyimide film laminates and process for preparation thereof |
| EP0060358B1 (en) * | 1981-03-18 | 1984-11-21 | International Business Machines Corporation | Head support arm and head/arm assemblies for disk files |
| US4760478A (en) * | 1983-03-30 | 1988-07-26 | International Business Machines | Visco-elastically damped magnetic head suspension assembly |
| EP0243507B1 (en) * | 1985-10-31 | 1992-03-11 | MITSUI TOATSU CHEMICALS, Inc. | Flexible laminate for printed circuit board and process for its production |
| GB2193833B (en) * | 1986-08-12 | 1990-09-19 | Hutchinson Technology | Magnetic head arm assembly |
| US4761699A (en) * | 1986-10-28 | 1988-08-02 | International Business Machines Corporation | Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file |
| US4991045A (en) * | 1987-12-21 | 1991-02-05 | Hutchinson Technology, Inc. | Suspension assembly |
| JPH01189083A (ja) * | 1988-01-23 | 1989-07-28 | Fujitsu Ltd | 磁気ディスク装置 |
| US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
| JPH01248372A (ja) * | 1988-03-29 | 1989-10-03 | Toshiba Corp | 磁気ヘッド支持装置 |
| JPH02218078A (ja) * | 1989-02-17 | 1990-08-30 | Kyocera Corp | 浮動磁気ヘッドスライダの取付け構造 |
| US5208712A (en) * | 1989-06-01 | 1993-05-04 | Quantum Corporation | Data head load beam for height compacted, low power fixed head and disk assembly |
| US4996623A (en) * | 1989-08-07 | 1991-02-26 | International Business Machines Corporation | Laminated suspension for a negative pressure slider in a data recording disk file |
| JPH0391173A (ja) * | 1989-09-01 | 1991-04-16 | Hitachi Ltd | 磁気ヘッド組立体 |
| JPH0734547Y2 (ja) * | 1989-12-07 | 1995-08-02 | アルプス電気株式会社 | 磁気ヘッドの支持機構 |
| JPH03278382A (ja) * | 1990-03-28 | 1991-12-10 | Hitachi Ltd | 磁気ヘッド支持機構 |
| US5408372A (en) * | 1990-09-07 | 1995-04-18 | Karam, Ii; Raymond M. | Transducer suspension damping via microstiffening |
| BR9104482A (pt) * | 1990-11-29 | 1992-06-23 | Hewlett Packard Co | Braco de carga para mecanismo de acionamento de disco |
| JPH04219618A (ja) * | 1990-12-19 | 1992-08-10 | Fujitsu Ltd | 磁気ヘッド支持機構の製造方法 |
| US5187625A (en) * | 1991-01-22 | 1993-02-16 | Hutchinson Technology Incorporated | Laminated load beam |
| JPH0536048A (ja) * | 1991-07-29 | 1993-02-12 | Nippon Mektron Ltd | 磁気ヘツド用ジンバル配線体及びその製造法 |
| CA2090708A1 (en) * | 1992-04-30 | 1993-10-31 | Jeffrey Merritt Mckay | Combination transducer/slider/suspension and method for making |
| US5434731A (en) * | 1992-11-12 | 1995-07-18 | Seagate Technology, Inc. | Process for making a one-piece flexure for small magnetic heads |
-
1994
- 1994-08-25 TW TW083107807A patent/TW307863B/zh active
- 1994-12-27 JP JP6324553A patent/JP2633491B2/ja not_active Expired - Fee Related
- 1994-12-30 MY MYPI94003575A patent/MY111722A/en unknown
-
1995
- 1995-02-03 KR KR1019950001894A patent/KR0156444B1/ko not_active Expired - Fee Related
- 1995-02-15 CN CN95101971A patent/CN1063570C/zh not_active Expired - Fee Related
- 1995-03-08 EP EP95301486A patent/EP0673019B1/en not_active Expired - Lifetime
- 1995-03-08 DE DE69512295T patent/DE69512295T2/de not_active Expired - Lifetime
- 1995-06-07 US US08/477,461 patent/US5594607A/en not_active Expired - Lifetime
- 1995-08-16 US US08/515,936 patent/US5606477A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| MY111722A (en) | 2000-11-30 |
| CN1063570C (zh) | 2001-03-21 |
| EP0673019A1 (en) | 1995-09-20 |
| KR950026708A (ko) | 1995-10-16 |
| JP2633491B2 (ja) | 1997-07-23 |
| DE69512295T2 (de) | 2000-04-20 |
| DE69512295D1 (de) | 1999-10-28 |
| US5594607A (en) | 1997-01-14 |
| CN1114768A (zh) | 1996-01-10 |
| KR0156444B1 (ko) | 1998-12-15 |
| US5606477A (en) | 1997-02-25 |
| EP0673019B1 (en) | 1999-09-22 |
| JPH07262537A (ja) | 1995-10-13 |
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