TW303481B - - Google Patents

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Publication number
TW303481B
TW303481B TW085102423A TW85102423A TW303481B TW 303481 B TW303481 B TW 303481B TW 085102423 A TW085102423 A TW 085102423A TW 85102423 A TW85102423 A TW 85102423A TW 303481 B TW303481 B TW 303481B
Authority
TW
Taiwan
Prior art keywords
cleaning
washing
patent application
item
project
Prior art date
Application number
TW085102423A
Other languages
English (en)
Chinese (zh)
Original Assignee
Omi Tadahiro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Tadahiro filed Critical Omi Tadahiro
Application granted granted Critical
Publication of TW303481B publication Critical patent/TW303481B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW085102423A 1995-03-06 1996-02-29 TW303481B (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4598295 1995-03-06
JP10884095A JP3923097B2 (ja) 1995-03-06 1995-05-02 洗浄装置

Publications (1)

Publication Number Publication Date
TW303481B true TW303481B (https=) 1997-04-21

Family

ID=26386084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085102423A TW303481B (https=) 1995-03-06 1996-02-29

Country Status (5)

Country Link
US (1) US5944907A (https=)
JP (1) JP3923097B2 (https=)
KR (1) KR100422923B1 (https=)
TW (1) TW303481B (https=)
WO (1) WO1996027898A1 (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4157185B2 (ja) * 1997-02-26 2008-09-24 財団法人国際科学振興財団 洗浄液及び洗浄方法
US20020157686A1 (en) * 1997-05-09 2002-10-31 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
US7163588B2 (en) * 1997-05-09 2007-01-16 Semitool, Inc. Processing a workpiece using water, a base, and ozone
US20050034745A1 (en) * 1997-05-09 2005-02-17 Semitool, Inc. Processing a workpiece with ozone and a halogenated additive
US6869487B1 (en) * 1997-05-09 2005-03-22 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
US7416611B2 (en) * 1997-05-09 2008-08-26 Semitool, Inc. Process and apparatus for treating a workpiece with gases
US7264680B2 (en) * 1997-05-09 2007-09-04 Semitool, Inc. Process and apparatus for treating a workpiece using ozone
US6240933B1 (en) * 1997-05-09 2001-06-05 Semitool, Inc. Methods for cleaning semiconductor surfaces
US6701941B1 (en) 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
US7404863B2 (en) * 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone
US7378355B2 (en) * 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US20050215063A1 (en) * 1997-05-09 2005-09-29 Bergman Eric J System and methods for etching a silicon wafer using HF and ozone
US6348157B1 (en) 1997-06-13 2002-02-19 Tadahiro Ohmi Cleaning method
JP4001662B2 (ja) * 1997-06-27 2007-10-31 株式会社半導体エネルギー研究所 シリコンの洗浄方法および多結晶シリコンの作製方法
JP4135780B2 (ja) * 1997-08-29 2008-08-20 ユーシーティー株式会社 薬液定量注入装置および方法
TW426874B (en) * 1998-10-14 2001-03-21 United Microelectronics Corp Method for cleaning a semiconductor wafer
WO2001007177A1 (en) * 1999-07-23 2001-02-01 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
RU2209853C2 (ru) * 1999-11-23 2003-08-10 Федеральное государственное унитарное предприятие Конструкторское бюро транспортного машиностроения Способ очистки металлических поверхностей оборудования и устройство для его осуществления
US6371134B2 (en) 2000-01-31 2002-04-16 Advanced Micro Devices, Inc. Ozone cleaning of wafers
US6190062B1 (en) 2000-04-26 2001-02-20 Advanced Micro Devices, Inc. Cleaning chamber built into SEM for plasma or gaseous phase cleaning
DE10036691A1 (de) * 2000-07-27 2002-02-14 Wacker Siltronic Halbleitermat Verfahren zur chemischen Behandlung von Halbleiterscheiben
US6861007B2 (en) * 2001-03-02 2005-03-01 Micron Technology, Inc. Method for removing organic material from a substrate and for oxidizing oxidizable material thereon
DE10239773B3 (de) * 2002-08-29 2004-02-26 Wacker Siltronic Ag Halbleiterscheibe und Verfahren zur Reinigung einer Halbleiterscheibe
US6890452B2 (en) * 2002-11-08 2005-05-10 3M Innovative Properties Company Fluorinated surfactants for aqueous acid etch solutions
US7169323B2 (en) * 2002-11-08 2007-01-30 3M Innovative Properties Company Fluorinated surfactants for buffered acid etch solutions
CN1321755C (zh) * 2003-01-21 2007-06-20 友达光电股份有限公司 清洗硅表面的方法以及用此方法制造薄膜晶体管的方法
US20070068558A1 (en) * 2005-09-06 2007-03-29 Applied Materials, Inc. Apparatus and methods for mask cleaning
US8030182B2 (en) * 2005-09-20 2011-10-04 Tadahiro Ohmi Semiconductor device manufacturing method and semiconductor manufacturing apparatus
US20100147777A1 (en) 2005-10-05 2010-06-17 Lion Corporation Ozone Oxidation Accelerator, Ozone Oxidation Accelerator Composition, and Ozone Treatment Method
US10935896B2 (en) * 2016-07-25 2021-03-02 Applied Materials, Inc. Cleaning solution mixing system with ultra-dilute cleaning solution and method of operation thereof
CN121219828A (zh) * 2023-04-21 2025-12-26 Asml荷兰有限公司 衬底处理

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02164707A (ja) * 1988-12-19 1990-06-25 Mitsui Toatsu Chem Inc 三弗化窒素ガスの精製方法
JP3217116B2 (ja) * 1992-03-06 2001-10-09 日産化学工業株式会社 低表面張力洗浄用組成物
JPH0641770A (ja) * 1992-07-27 1994-02-15 Daikin Ind Ltd シリコンウエハ表面の処理方法

Also Published As

Publication number Publication date
JP3923097B2 (ja) 2007-05-30
US5944907A (en) 1999-08-31
KR19980702525A (ko) 1998-07-15
JPH08306655A (ja) 1996-11-22
WO1996027898A1 (en) 1996-09-12
KR100422923B1 (ko) 2004-07-01

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