TW303471B - - Google Patents
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- Publication number
- TW303471B TW303471B TW085110259A TW85110259A TW303471B TW 303471 B TW303471 B TW 303471B TW 085110259 A TW085110259 A TW 085110259A TW 85110259 A TW85110259 A TW 85110259A TW 303471 B TW303471 B TW 303471B
- Authority
- TW
- Taiwan
- Prior art keywords
- resistor
- ptc
- terminal
- metal
- ministry
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 49
- 230000005611 electricity Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 19
- 239000000203 mixture Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 7
- 230000005347 demagnetization Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000035935 pregnancy Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP95202149 | 1995-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW303471B true TW303471B (https=) | 1997-04-21 |
Family
ID=8220555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085110259A TW303471B (https=) | 1995-08-07 | 1996-08-22 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5777541A (https=) |
| EP (1) | EP0784859B1 (https=) |
| JP (1) | JPH11500872A (https=) |
| DE (1) | DE69636245T2 (https=) |
| TW (1) | TW303471B (https=) |
| WO (1) | WO1997006537A2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI639169B (zh) | 2017-05-16 | 2018-10-21 | 聚鼎科技股份有限公司 | 表面黏著型過電流保護元件 |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6023403A (en) | 1996-05-03 | 2000-02-08 | Littlefuse, Inc. | Surface mountable electrical device comprising a PTC and fusible element |
| US6215388B1 (en) * | 1996-09-27 | 2001-04-10 | Therm-Q-Disc, Incorporated | Parallel connected PTC elements |
| US5929744A (en) * | 1997-02-18 | 1999-07-27 | General Electric Company | Current limiting device with at least one flexible electrode |
| US6535103B1 (en) | 1997-03-04 | 2003-03-18 | General Electric Company | Current limiting arrangement and method |
| US5977861A (en) * | 1997-03-05 | 1999-11-02 | General Electric Company | Current limiting device with grooved electrode structure |
| FR2761204B1 (fr) * | 1997-03-24 | 1999-05-14 | Siemens Automotive Sa | Dispositif de distribution d'energie electrique dans plusieurs circuits alimentes en paralleles, et procede de fabrication de ce dispositif |
| AU7712098A (en) * | 1997-06-04 | 1998-12-21 | Tyco Electronics Corporation | Circuit protection devices |
| US6020808A (en) | 1997-09-03 | 2000-02-01 | Bourns Multifuse (Hong Kong) Ltd. | Multilayer conductive polymer positive temperature coefficent device |
| CN1183556C (zh) * | 1997-10-03 | 2005-01-05 | 泰科电子雷伊化学株式会社 | 电器件及其制造方法 |
| US6282072B1 (en) | 1998-02-24 | 2001-08-28 | Littelfuse, Inc. | Electrical devices having a polymer PTC array |
| US6172591B1 (en) * | 1998-03-05 | 2001-01-09 | Bourns, Inc. | Multilayer conductive polymer device and method of manufacturing same |
| US5973383A (en) * | 1998-04-09 | 1999-10-26 | Honeywell Inc. | High temperature ZrN and HfN IR scene projector pixels |
| US6606023B2 (en) | 1998-04-14 | 2003-08-12 | Tyco Electronics Corporation | Electrical devices |
| US6133820A (en) * | 1998-08-12 | 2000-10-17 | General Electric Company | Current limiting device having a web structure |
| US6582647B1 (en) | 1998-10-01 | 2003-06-24 | Littelfuse, Inc. | Method for heat treating PTC devices |
| US6838972B1 (en) * | 1999-02-22 | 2005-01-04 | Littelfuse, Inc. | PTC circuit protection devices |
| US6854176B2 (en) * | 1999-09-14 | 2005-02-15 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| US6640420B1 (en) * | 1999-09-14 | 2003-11-04 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| US6429533B1 (en) | 1999-11-23 | 2002-08-06 | Bourns Inc. | Conductive polymer device and method of manufacturing same |
| US6628498B2 (en) | 2000-08-28 | 2003-09-30 | Steven J. Whitney | Integrated electrostatic discharge and overcurrent device |
| US6411191B1 (en) | 2000-10-24 | 2002-06-25 | Eaton Corporation | Current-limiting device employing a non-uniform pressure distribution between one or more electrodes and a current-limiting material |
| US7038572B2 (en) * | 2001-03-19 | 2006-05-02 | Vishay Dale Electronics, Inc. | Power chip resistor |
| JP2002305101A (ja) * | 2001-04-05 | 2002-10-18 | Murata Mfg Co Ltd | 表面実装型正特性サーミスタおよびその製造方法 |
| US20030026053A1 (en) * | 2001-08-06 | 2003-02-06 | James Toth | Circuit protection device |
| DE10201262B4 (de) * | 2002-01-15 | 2006-09-07 | Webasto Ag | Widerstandsheizelement |
| US6981319B2 (en) * | 2003-02-13 | 2006-01-03 | Shrier Karen P | Method of manufacturing devices to protect election components |
| JP4135651B2 (ja) * | 2003-03-26 | 2008-08-20 | 株式会社村田製作所 | 積層型正特性サーミスタ |
| DE50305966D1 (de) * | 2003-09-11 | 2007-01-25 | Catem Gmbh & Co Kg | Elektrische Heizvorrichtung mit versiegeltem Heizelement |
| CN100462328C (zh) * | 2003-12-02 | 2009-02-18 | 天津大学 | 石墨/酚醛树脂/(Ba1－x－y,Srx,Pby)TiO3基PTC热敏电阻及制备方法 |
| CN2735515Y (zh) * | 2004-09-10 | 2005-10-19 | 聚鼎科技股份有限公司 | 过电流保护组件 |
| US7218492B2 (en) * | 2004-09-17 | 2007-05-15 | Electronic Polymers, Inc. | Devices and systems for electrostatic discharge suppression |
| US7119655B2 (en) * | 2004-11-29 | 2006-10-10 | Therm-O-Disc, Incorporated | PTC circuit protector having parallel areas of effective resistance |
| US20090027821A1 (en) * | 2007-07-26 | 2009-01-29 | Littelfuse, Inc. | Integrated thermistor and metallic element device and method |
| KR100922471B1 (ko) * | 2007-09-27 | 2009-10-21 | 삼성에스디아이 주식회사 | 이차전지용 보호회로기판 및 이를 이용한 이차 전지 |
| US7847673B2 (en) * | 2007-10-18 | 2010-12-07 | Xerox Corporation | Duplex-attachment of ceramic disk PTC to substrates |
| US8289122B2 (en) * | 2009-03-24 | 2012-10-16 | Tyco Electronics Corporation | Reflowable thermal fuse |
| DE102012109801B4 (de) * | 2012-10-15 | 2015-02-05 | Borgwarner Ludwigsburg Gmbh | Elektrische Heizvorrichtung |
| CN205016317U (zh) * | 2015-06-30 | 2016-02-03 | 瑞侃电子(上海)有限公司 | 可回流焊的正温度系数电路保护器件 |
| CN106328326A (zh) * | 2015-06-30 | 2017-01-11 | 瑞侃电子(上海)有限公司 | 可回流焊的正温度系数电路保护器件 |
| US10304596B1 (en) * | 2017-11-09 | 2019-05-28 | Fuzetec Technology Co., Ltd. | PTC circuit protection device and method of making the same |
| JP1671885S (https=) * | 2019-09-19 | 2020-11-02 | ||
| USD933025S1 (en) * | 2019-09-19 | 2021-10-12 | Smart Electronics Inc. | Circuit protection element |
| USD933023S1 (en) * | 2019-09-19 | 2021-10-12 | Smart Electronics Inc. | Circuit protection element |
| WO2022150342A1 (en) * | 2021-01-06 | 2022-07-14 | Bourns, Inc. | Multi-layer electrical device |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3824328A (en) * | 1972-10-24 | 1974-07-16 | Texas Instruments Inc | Encapsulated ptc heater packages |
| US4246468A (en) * | 1978-01-30 | 1981-01-20 | Raychem Corporation | Electrical devices containing PTC elements |
| US4315237A (en) * | 1978-12-01 | 1982-02-09 | Raychem Corporation | PTC Devices comprising oxygen barrier layers |
| NL7906442A (nl) * | 1979-08-28 | 1981-03-03 | Philips Nv | Samengesteld thermistorelement. |
| JPS57166474U (https=) * | 1981-04-13 | 1982-10-20 | ||
| US5064997A (en) * | 1984-07-10 | 1991-11-12 | Raychem Corporation | Composite circuit protection devices |
| EP0400167B1 (de) * | 1989-05-30 | 1994-10-26 | Siemens Aktiengesellschaft | Niveaufühler mit hohem Signalhub für Flüssigkeiten, insbesondere chemisch aggressive Flüssigkeiten |
| JP2990679B2 (ja) * | 1990-01-16 | 1999-12-13 | 株式会社村田製作所 | チタン酸バリウム系半導体磁器組成物 |
| JPH03215356A (ja) * | 1990-01-16 | 1991-09-20 | Murata Mfg Co Ltd | チタン酸バリウム系半導体磁器組成物 |
| JPH03215354A (ja) * | 1990-01-16 | 1991-09-20 | Murata Mfg Co Ltd | チタン酸バリウム系半導体磁器組成物 |
| JP3003201B2 (ja) * | 1990-10-31 | 2000-01-24 | 株式会社村田製作所 | チタン酸バリウム系半導体磁器組成物 |
| JP3273468B2 (ja) * | 1990-10-31 | 2002-04-08 | 株式会社村田製作所 | チタン酸バリウム系半導体磁器組成物 |
| DE4230848C1 (de) * | 1992-09-15 | 1993-12-23 | Siemens Matsushita Components | Vielfachkaltleiter |
| US5471034A (en) * | 1993-03-17 | 1995-11-28 | Texas Instruments Incorporated | Heater apparatus and process for heating a fluid stream with PTC heating elements electrically connected in series |
| JPH06302404A (ja) * | 1993-04-16 | 1994-10-28 | Murata Mfg Co Ltd | 積層型正特性サ−ミスタ |
| US5437905A (en) * | 1994-05-17 | 1995-08-01 | Park; Andrew D. | Ballistic laminate structure in sheet form |
-
1996
- 1996-07-29 EP EP96923021A patent/EP0784859B1/en not_active Expired - Lifetime
- 1996-07-29 WO PCT/IB1996/000757 patent/WO1997006537A2/en not_active Ceased
- 1996-07-29 JP JP9508262A patent/JPH11500872A/ja not_active Ceased
- 1996-07-29 DE DE69636245T patent/DE69636245T2/de not_active Expired - Fee Related
- 1996-08-05 US US08/692,144 patent/US5777541A/en not_active Expired - Fee Related
- 1996-08-22 TW TW085110259A patent/TW303471B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI639169B (zh) | 2017-05-16 | 2018-10-21 | 聚鼎科技股份有限公司 | 表面黏著型過電流保護元件 |
| US10141089B1 (en) | 2017-05-16 | 2018-11-27 | Polytronics Technology Corp. | Surface-mountable over-current protection device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0784859B1 (en) | 2006-06-14 |
| JPH11500872A (ja) | 1999-01-19 |
| DE69636245D1 (de) | 2006-07-27 |
| US5777541A (en) | 1998-07-07 |
| WO1997006537A3 (en) | 1997-03-27 |
| EP0784859A2 (en) | 1997-07-23 |
| DE69636245T2 (de) | 2007-04-12 |
| WO1997006537A2 (en) | 1997-02-20 |
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