TW288158B - - Google Patents

Info

Publication number
TW288158B
TW288158B TW085101515A TW85101515A TW288158B TW 288158 B TW288158 B TW 288158B TW 085101515 A TW085101515 A TW 085101515A TW 85101515 A TW85101515 A TW 85101515A TW 288158 B TW288158 B TW 288158B
Authority
TW
Taiwan
Application number
TW085101515A
Original Assignee
Samsug Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsug Electronics Co Ltd filed Critical Samsug Electronics Co Ltd
Application granted granted Critical
Publication of TW288158B publication Critical patent/TW288158B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054Methods of obtaining the confinement
    • H01S5/2059Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
    • H01S5/2063Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by particle bombardment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054Methods of obtaining the confinement
    • H01S5/2081Methods of obtaining the confinement using special etching techniques

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Semiconductor Memories (AREA)
TW085101515A 1995-02-16 1996-02-07 TW288158B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950002915A KR0161389B1 (ko) 1995-02-16 1995-02-16 마스크 및 이를 사용한 패턴형성방법

Publications (1)

Publication Number Publication Date
TW288158B true TW288158B (zh) 1996-10-11

Family

ID=19408231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101515A TW288158B (zh) 1995-02-16 1996-02-07

Country Status (4)

Country Link
EP (1) EP0731387A3 (zh)
JP (1) JPH08250446A (zh)
KR (1) KR0161389B1 (zh)
TW (1) TW288158B (zh)

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KR100548534B1 (ko) * 1999-04-22 2006-02-02 주식회사 하이닉스반도체 셀 프로 젝션 마스크
US6534425B1 (en) 1999-12-02 2003-03-18 Seagate Technology Llc Mask design and method for controlled profile fabrication
JP4616439B2 (ja) * 2000-02-10 2011-01-19 大日本印刷株式会社 カラーフィルタの製造方法
WO2001067499A1 (en) * 2000-03-08 2001-09-13 Nanyang Technological University School Of Electrical & Electronic Engineering Multiple bandgap photonic integration
WO2001067569A1 (en) * 2000-03-08 2001-09-13 Nanyang Technological University Plasma based process for photonic integration
KR20020089386A (ko) * 2000-03-08 2002-11-29 엔티유 벤처스 피티이 엘티디. 양자 우물 혼정
WO2001071427A1 (en) * 2000-03-20 2001-09-27 Motorola Inc. Photo-lithographic method for semiconductors
US6420247B1 (en) 2000-04-10 2002-07-16 Motorola, Inc. Method of forming structures on a semiconductor including doping profiles using thickness of photoresist
JP4615682B2 (ja) * 2000-08-07 2011-01-19 セイコーインスツル株式会社 Mos型トランジスタの製造方法
JP3556591B2 (ja) * 2000-09-29 2004-08-18 Hoya株式会社 グレートーンマスクにおけるグレートーン部の欠陥修正方法
KR100498575B1 (ko) * 2000-12-26 2005-07-01 호야 가부시키가이샤 그레이톤 마스크
JP4834235B2 (ja) * 2001-03-12 2011-12-14 東芝モバイルディスプレイ株式会社 グレートーン露光用フォトマスク
JP2002287370A (ja) * 2001-03-27 2002-10-03 Mitsubishi Electric Corp 光学素子の製造方法
KR100464204B1 (ko) * 2001-06-08 2005-01-03 엘지.필립스 엘시디 주식회사 그레이톤 마스크 및 이를 이용한 액정디스플레이 제조방법
JP4743571B2 (ja) * 2001-06-21 2011-08-10 大日本印刷株式会社 カラーフィルタの作製方法およびカラーフィルタ
DE10134462B4 (de) * 2001-07-16 2004-07-01 Infineon Technologies Ag Verfahren zur Planarisierung der Oberfläche eines Halbleiterwafers und Vorrichtung zur Durchführung dieses Verfahrens
KR100393230B1 (ko) * 2001-08-16 2003-07-31 삼성전자주식회사 잔막율을 조절할 수 있는 포토레지스트 패턴의 형성방법
JP2003173015A (ja) * 2001-09-28 2003-06-20 Hoya Corp グレートーンマスクの製造方法
JP4632103B2 (ja) * 2001-10-01 2011-02-16 セイコーエプソン株式会社 フォトマスク
JP4278944B2 (ja) * 2002-09-24 2009-06-17 東芝松下ディスプレイテクノロジー株式会社 光センサ素子、これを用いた平面表示装置
US6828068B2 (en) * 2003-01-23 2004-12-07 Photronics, Inc. Binary half tone photomasks and microscopic three-dimensional devices and method of fabricating the same
KR100574966B1 (ko) * 2004-01-20 2006-05-02 삼성전자주식회사 포토마스크 및 이를 이용한 투과율 및 위상 조절 방법
WO2006038164A1 (en) * 2004-10-08 2006-04-13 Koninklijke Philips Electronics N.V. Semiconductor device having substrate comprising layer with different thicknesses and method of manufacturing the same
JP4641835B2 (ja) * 2005-03-16 2011-03-02 リコー光学株式会社 位相シフター光学素子の製造方法及び得られる素子
US8035103B2 (en) 2005-08-11 2011-10-11 Sharp Kabushiki Kaisha Circuit board, electronic device, and method for producing circuit board
JP4961990B2 (ja) * 2005-12-14 2012-06-27 大日本印刷株式会社 マスクブランクおよび階調マスク
JP4826754B2 (ja) * 2006-03-23 2011-11-30 セイコーエプソン株式会社 固体撮像素子の製造方法及び固体撮像素子
KR100831675B1 (ko) * 2006-05-09 2008-05-22 주식회사 하이닉스반도체 베스트 포커스를 설정하기 위한 포토 마스크 및 이를이용한 베스트 포커스 설정방법
JP5200439B2 (ja) * 2006-07-21 2013-06-05 大日本印刷株式会社 カラーフィルタの製造方法
KR100796609B1 (ko) * 2006-08-17 2008-01-22 삼성에스디아이 주식회사 Cmos 박막 트랜지스터의 제조방법
KR100818963B1 (ko) * 2006-11-14 2008-04-04 삼성에스디아이 주식회사 하프 톤 포토마스크를 이용한 전계방출소자의 제조방법
JP4836258B2 (ja) * 2006-11-20 2011-12-14 株式会社リコー 半導体レーザアレイ製造方法、面発光型半導体レーザアレイ、光走査装置、画像形成装置、光伝送モジュール及び光伝送システム
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JP4935452B2 (ja) * 2007-03-26 2012-05-23 凸版印刷株式会社 グレーマスク及びグレーマスク用パターン製造方法
JP4930324B2 (ja) * 2007-10-29 2012-05-16 セイコーエプソン株式会社 薄膜トランジスタの製造方法
JP5178209B2 (ja) 2008-01-16 2013-04-10 岩手東芝エレクトロニクス株式会社 半導体装置の製造方法
JP5336226B2 (ja) * 2008-02-26 2013-11-06 Hoya株式会社 多階調フォトマスクの製造方法
KR101499232B1 (ko) * 2008-04-10 2015-03-06 삼성디스플레이 주식회사 규소 결정화용 마스크 및 이를 이용한 다결정 규소 박막형성 방법과 박막 트랜지스터의 제조 방법
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CN102881571B (zh) * 2012-09-28 2014-11-26 京东方科技集团股份有限公司 有源层离子注入方法及薄膜晶体管有源层离子注入方法
JPWO2014203881A1 (ja) * 2013-06-21 2017-02-23 富士電機株式会社 炭化珪素半導体素子の製造方法
CN103941481A (zh) * 2013-06-27 2014-07-23 上海中航光电子有限公司 一种掩模板的设计
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KR20150138687A (ko) * 2014-06-02 2015-12-10 인텔렉츄얼 키스톤 테크놀로지 엘엘씨 이온주입용 멀티패턴마스크 및 이를 이용한 이온주입방법
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WO2018067500A1 (en) 2016-10-05 2018-04-12 Magic Leap, Inc. Fabricating non-uniform diffraction gratings
JP2019159003A (ja) * 2018-03-09 2019-09-19 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法
DE102018114664A1 (de) * 2018-06-19 2019-12-19 Infineon Technologies Ag Halbleitervorrichtung, Retikel und Verfahren zum Herstellen einer Halbleitervorrichtung
CN110164944A (zh) * 2019-06-03 2019-08-23 京东方科技集团股份有限公司 显示基板及其制造方法、掩膜版、显示装置
JP6993530B1 (ja) * 2020-12-25 2022-01-13 株式会社エスケーエレクトロニクス フォトマスク、フォトマスクの製造方法、表示装置の製造方法
FR3127628A1 (fr) * 2021-09-24 2023-03-31 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé de fabrication d’un moule pour nano-impression et moule associé

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Also Published As

Publication number Publication date
EP0731387A2 (en) 1996-09-11
KR0161389B1 (ko) 1999-01-15
EP0731387A3 (en) 1996-11-27
JPH08250446A (ja) 1996-09-27
KR960032085A (ko) 1996-09-17

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