TW271010B - - Google Patents

Info

Publication number
TW271010B
TW271010B TW084104722A TW84104722A TW271010B TW 271010 B TW271010 B TW 271010B TW 084104722 A TW084104722 A TW 084104722A TW 84104722 A TW84104722 A TW 84104722A TW 271010 B TW271010 B TW 271010B
Authority
TW
Taiwan
Application number
TW084104722A
Original Assignee
Samsug Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsug Electronics Co Ltd filed Critical Samsug Electronics Co Ltd
Application granted granted Critical
Publication of TW271010B publication Critical patent/TW271010B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/33—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor extending under the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/036—Making the capacitor or connections thereto the capacitor extending under the transistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688—Integrated circuits having a three-dimensional layout
    • H01L27/0694—Integrated circuits having a three-dimensional layout comprising components formed on opposite sides of a semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/928—Front and rear surface processing
TW084104722A 1994-05-13 1995-05-12 TW271010B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940010487A KR0135803B1 (ko) 1994-05-13 1994-05-13 상.하로 분리된 커패시터를 갖는 반도체 메모리장치 및 그 제조방법

Publications (1)

Publication Number Publication Date
TW271010B true TW271010B (zh) 1996-02-21

Family

ID=19383014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084104722A TW271010B (zh) 1994-05-13 1995-05-12

Country Status (8)

Country Link
US (2) US5684316A (zh)
EP (1) EP0682372B1 (zh)
JP (1) JP3571108B2 (zh)
KR (1) KR0135803B1 (zh)
CN (1) CN1092403C (zh)
DE (1) DE69523091T2 (zh)
RU (1) RU2194338C2 (zh)
TW (1) TW271010B (zh)

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CN1044948C (zh) * 1994-06-22 1999-09-01 现代电子产业株式会社 用于制造半导体器件叠层电容器的方法
KR960009188A (ko) * 1994-08-10 1996-03-22 김주용 반도체소자의 전하보존전극 제조방법
US6831322B2 (en) * 1995-06-05 2004-12-14 Fujitsu Limited Semiconductor memory device and method for fabricating the same
JPH0955440A (ja) * 1995-08-17 1997-02-25 Sony Corp 半導体装置及び半導体装置の製造方法
US6218237B1 (en) 1996-01-03 2001-04-17 Micron Technology, Inc. Method of forming a capacitor
KR19980028402A (ko) * 1996-10-22 1998-07-15 문정환 디램(dram) 셀의 구조 및 그 제조 방법
JP3749776B2 (ja) * 1997-02-28 2006-03-01 株式会社東芝 半導体装置
JP3914618B2 (ja) * 1997-09-24 2007-05-16 エルピーダメモリ株式会社 半導体集積回路装置
US6074910A (en) * 1998-01-27 2000-06-13 Integrated Silicon Solution, Inc. Self-aligned storage node definition in a DRAM that exceeds the photolithography limit
US6184152B1 (en) 1998-01-27 2001-02-06 Integrated Silicon Solution Inc. Method for fabricating stacked capacitor for a dynamic random access memory
KR100268419B1 (ko) * 1998-08-14 2000-10-16 윤종용 고집적 반도체 메모리 장치 및 그의 제조 방법
US6242302B1 (en) * 1998-09-03 2001-06-05 Micron Technology, Inc. Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry
US6330181B1 (en) 1998-09-29 2001-12-11 Texas Instruments Incorporated Method of forming a gate device with raised channel
US6423596B1 (en) 1998-09-29 2002-07-23 Texas Instruments Incorporated Method for two-sided fabrication of a memory array
US6133083A (en) * 1998-12-22 2000-10-17 United Microelectronics Corp. Method to fabricate embedded DRAM
US6150678A (en) * 1999-02-11 2000-11-21 Vanguard International Semiconductor Corporation Method and pattern for avoiding micro-loading effect in an etching process
US6214687B1 (en) 1999-02-17 2001-04-10 Micron Technology, Inc. Method of forming a capacitor and a capacitor construction
US6083788A (en) * 1999-03-26 2000-07-04 Infineon Technologies North America Corp. Stacked capacitor memory cell and method of manufacture
DE19914496A1 (de) 1999-03-30 2000-10-05 Siemens Ag Speicherzellenanordnung und Verfahren zu deren Herstellung
KR100335778B1 (ko) * 1999-04-08 2002-05-09 박종섭 반도체 소자 및 그 제조 방법
DE19929210C1 (de) * 1999-06-25 2000-10-26 Infineon Technologies Ag SOI-Substrat und Verfahren zu dessen Herstellung
DE19943760C1 (de) 1999-09-13 2001-02-01 Infineon Technologies Ag DRAM-Zellenanordnung und Verfahren zu deren Herstellung
US6300179B1 (en) * 1999-09-24 2001-10-09 Texas Instruments Incorporated Gate device with access channel formed in discrete post and method
US6603168B1 (en) 2000-04-20 2003-08-05 Agere Systems Inc. Vertical DRAM device with channel access transistor and stacked storage capacitor and associated method
US6465331B1 (en) * 2000-08-31 2002-10-15 Micron Technology, Inc. DRAM fabricated on a silicon-on-insulator (SOI) substrate having bi-level digit lines
DE10065664B4 (de) * 2000-12-29 2005-07-28 Infineon Technologies Ag Integrierte Halbleiterspeicheranordnung
DE10065669A1 (de) * 2000-12-29 2002-07-11 Infineon Technologies Ag Verfahren zur Herstellung einer integrierten Halbleiterspeicheranordnung
US6552383B2 (en) * 2001-05-11 2003-04-22 Micron Technology, Inc. Integrated decoupling capacitors
US20030119272A1 (en) * 2001-12-26 2003-06-26 Ga Won Lee Semiconductor device and method for forming the same
KR100480601B1 (ko) * 2002-06-21 2005-04-06 삼성전자주식회사 반도체 메모리 소자 및 그 제조방법
US7005329B2 (en) * 2003-11-28 2006-02-28 Hynix Semiconductor Inc. Method for manufacturing semiconductor device
US20110143506A1 (en) * 2009-12-10 2011-06-16 Sang-Yun Lee Method for fabricating a semiconductor memory device
US7858468B2 (en) * 2008-10-30 2010-12-28 Micron Technology, Inc. Memory devices and formation methods
KR101120676B1 (ko) * 2008-12-11 2012-03-23 이상윤 반도체 메모리 장치의 제조 방법
KR101881750B1 (ko) * 2012-02-29 2018-07-25 삼성전자주식회사 정보 저장 소자 및 그 제조 방법
TWI702599B (zh) * 2019-07-12 2020-08-21 華邦電子股份有限公司 動態隨機存取記憶體及其製造方法

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JPS5243521A (en) * 1975-10-01 1977-04-05 Otake Hitoshi Nonnfocus rule for drawing perspectives
KR930007522B1 (ko) * 1985-03-08 1993-08-12 가부시끼 가이샤 히다찌세이사꾸쇼 종형 커패시터를 사용한 반도체메모리
JPS63239969A (ja) * 1987-03-27 1988-10-05 Sony Corp メモリ装置
JPS6442166A (en) * 1987-08-10 1989-02-14 Nippon Telegraph & Telephone Semiconductor device and manufacture thereof
JPH02106958A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体装置
JP2586182B2 (ja) * 1989-05-31 1997-02-26 日本電気株式会社 半導体メモリセルおよびその製造方法
US5089869A (en) * 1989-08-08 1992-02-18 Matsushita Electric Industrial Co. Ltd. Semiconductor memory device
US5123765A (en) * 1991-04-01 1992-06-23 Connell Daniel J O Disposable toothbrush
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US5055898A (en) * 1991-04-30 1991-10-08 International Business Machines Corporation DRAM memory cell having a horizontal SOI transfer device disposed over a buried storage node and fabrication methods therefor
JPH04343267A (ja) * 1991-05-21 1992-11-30 Nec Kyushu Ltd 半導体記憶装置
US5573967A (en) * 1991-12-20 1996-11-12 Industrial Technology Research Institute Method for making dynamic random access memory with fin-type stacked capacitor
JPH05243521A (ja) * 1992-03-02 1993-09-21 Fujitsu Ltd 半導体メモリ装置
US5559350A (en) * 1992-07-08 1996-09-24 Kabushiki Kaisha Toshiba Dynamic RAM and method of manufacturing the same
US5585284A (en) * 1993-07-02 1996-12-17 Hyundai Electronics Industries Co., Ltd. Method of manufacturing a SOI DRAM
US5439840A (en) * 1993-08-02 1995-08-08 Motorola, Inc. Method of forming a nonvolatile random access memory capacitor cell having a metal-oxide dielectric
US5436185A (en) * 1994-08-12 1995-07-25 United Microelectronics Corporation Method of fabricating a ROM device with a negative code implant mask

Also Published As

Publication number Publication date
US5684316A (en) 1997-11-04
EP0682372A1 (en) 1995-11-15
KR950034443A (ko) 1995-12-28
DE69523091D1 (de) 2001-11-15
KR0135803B1 (ko) 1998-04-24
RU95107653A (ru) 1997-05-10
RU2194338C2 (ru) 2002-12-10
CN1113610A (zh) 1995-12-20
JPH0846157A (ja) 1996-02-16
US5661063A (en) 1997-08-26
DE69523091T2 (de) 2002-07-11
EP0682372B1 (en) 2001-10-10
CN1092403C (zh) 2002-10-09
JP3571108B2 (ja) 2004-09-29

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