TW250592B - - Google Patents

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Publication number
TW250592B
TW250592B TW083111754A TW83111754A TW250592B TW 250592 B TW250592 B TW 250592B TW 083111754 A TW083111754 A TW 083111754A TW 83111754 A TW83111754 A TW 83111754A TW 250592 B TW250592 B TW 250592B
Authority
TW
Taiwan
Prior art keywords
adhesive film
anisotropic conductive
patent application
particles
item
Prior art date
Application number
TW083111754A
Other languages
English (en)
Chinese (zh)
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Application granted granted Critical
Publication of TW250592B publication Critical patent/TW250592B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
TW083111754A 1993-12-16 1994-12-16 TW250592B (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31639093A JP3408301B2 (ja) 1993-12-16 1993-12-16 異方性導電膜

Publications (1)

Publication Number Publication Date
TW250592B true TW250592B (enrdf_load_stackoverflow) 1995-07-01

Family

ID=18076551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111754A TW250592B (enrdf_load_stackoverflow) 1993-12-16 1994-12-16

Country Status (8)

Country Link
EP (1) EP0734576B1 (enrdf_load_stackoverflow)
JP (1) JP3408301B2 (enrdf_load_stackoverflow)
KR (1) KR100359175B1 (enrdf_load_stackoverflow)
CN (1) CN1137324A (enrdf_load_stackoverflow)
DE (1) DE69427037T2 (enrdf_load_stackoverflow)
MY (1) MY113832A (enrdf_load_stackoverflow)
TW (1) TW250592B (enrdf_load_stackoverflow)
WO (1) WO1995016998A1 (enrdf_load_stackoverflow)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4113582B2 (ja) * 1995-04-24 2008-07-09 スリーエム カンパニー ポリオレフィン表面用感圧接着剤
AU711287B2 (en) * 1996-05-16 1999-10-07 Minnesota Mining And Manufacturing Company Adhesive compositions and methods of use
JP5378261B2 (ja) * 1997-02-14 2013-12-25 日立化成株式会社 回路部材接続用接着剤
WO1998044067A1 (en) 1997-03-31 1998-10-08 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
US7604868B2 (en) 1997-03-31 2009-10-20 Hitachi Chemical Company, Ltd. Electronic circuit including circuit-connecting material
JP3226889B2 (ja) * 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
KR100575467B1 (ko) * 1999-12-30 2006-05-03 삼성토탈 주식회사 자기점착이 가능한 보호필름용 수지 조성물
KR100398315B1 (ko) * 2001-02-12 2003-09-19 한국과학기술원 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법
US7033668B2 (en) 2001-08-23 2006-04-25 Tesa Ag Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
TW200538522A (en) * 2004-02-16 2005-12-01 Hitachi Chemical Co Ltd Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same
DE602004014257D1 (de) 2004-06-02 2008-07-17 Sony Ericsson Mobile Comm Ab Transparente leitende Antenne für ein tragbares Kommunikationsgerät
KR100622598B1 (ko) * 2004-12-08 2006-09-19 엘에스전선 주식회사 피티씨 특성을 갖는 이방 도전성 접착제
WO2007006633A1 (en) * 2005-07-08 2007-01-18 Cypak Ab Use of heat-activated adhesive for manufacture and a device so manufactured
WO2008084811A1 (ja) 2007-01-10 2008-07-17 Hitachi Chemical Company, Ltd. 回路部材接続用接着剤及びこれを用いた半導体装置
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
TWI389999B (zh) * 2007-12-18 2013-03-21 Cheil Ind Inc 黏著性組成物及使用該黏著性組成物的各向異性導電膜
JP2010010142A (ja) * 2009-10-07 2010-01-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
TWI540590B (zh) * 2011-05-31 2016-07-01 住友電木股份有限公司 半導體裝置
US9111847B2 (en) * 2012-06-15 2015-08-18 Infineon Technologies Ag Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
CN112946797B (zh) * 2021-02-19 2023-10-31 晋江联兴反光材料有限公司 一种复合金属层的反光膜及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608377A (ja) * 1983-06-28 1985-01-17 Matsushita Electric Ind Co Ltd 異方導電性接着剤
JPS60133079A (ja) * 1983-12-21 1985-07-16 Seikosha Co Ltd 異方導電性接着剤
JPS619472A (ja) * 1984-06-22 1986-01-17 Seikosha Co Ltd 異方導電性接着剤

Also Published As

Publication number Publication date
JPH07211145A (ja) 1995-08-11
DE69427037D1 (de) 2001-05-10
MY113832A (en) 2002-06-29
DE69427037T2 (de) 2001-11-15
EP0734576B1 (en) 2001-04-04
JP3408301B2 (ja) 2003-05-19
KR100359175B1 (ko) 2003-01-15
CN1137324A (zh) 1996-12-04
EP0734576A1 (en) 1996-10-02
WO1995016998A1 (en) 1995-06-22
KR960706680A (ko) 1996-12-09

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