TW228637B - - Google Patents

Info

Publication number
TW228637B
TW228637B TW081102071A TW81102071A TW228637B TW 228637 B TW228637 B TW 228637B TW 081102071 A TW081102071 A TW 081102071A TW 81102071 A TW81102071 A TW 81102071A TW 228637 B TW228637 B TW 228637B
Authority
TW
Taiwan
Application number
TW081102071A
Inventor
Irie Hisao
Original Assignee
Furukaw Denki Kogyo Kk
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3084384A external-priority patent/JPH04297089A/ja
Priority claimed from JP3084383A external-priority patent/JPH04297091A/ja
Application filed by Furukaw Denki Kogyo Kk, Harima Chemicals Inc filed Critical Furukaw Denki Kogyo Kk
Application granted granted Critical
Publication of TW228637B publication Critical patent/TW228637B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW081102071A 1991-03-26 1992-03-19 TW228637B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3084384A JPH04297089A (ja) 1991-03-26 1991-03-26 半田コートプリント回路基板
JP3084383A JPH04297091A (ja) 1991-03-26 1991-03-26 半田コートプリント回路基板とその製造方法

Publications (1)

Publication Number Publication Date
TW228637B true TW228637B (zh) 1994-08-21

Family

ID=26425431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081102071A TW228637B (zh) 1991-03-26 1992-03-19

Country Status (10)

Country Link
US (1) US5296649A (zh)
EP (1) EP0509262B1 (zh)
KR (1) KR960001352B1 (zh)
CN (1) CN1034706C (zh)
BR (1) BR9201047A (zh)
CA (1) CA2063682C (zh)
DE (1) DE69204516T2 (zh)
ES (1) ES2079713T3 (zh)
MY (1) MY108034A (zh)
TW (1) TW228637B (zh)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
DE69326009T2 (de) * 1993-11-02 2000-02-24 Koninklijke Philips Electronics N.V., Eindhoven Verfahren zur Lotbeschichtung und Lötpaste dafür
KR100203997B1 (ko) * 1993-12-06 1999-06-15 하세가와 요시히로 땜납석출용 조성물 및 이조성물을 사용한 장착법
US5385289A (en) * 1994-02-08 1995-01-31 Digital Equipment Corporation Embedded features for registration measurement in electronics manufacturing
US6826827B1 (en) * 1994-12-29 2004-12-07 Tessera, Inc. Forming conductive posts by selective removal of conductive material
EP0854768A1 (en) 1995-10-06 1998-07-29 Brown University Research Foundation Soldering methods and compositions
JP3491414B2 (ja) * 1995-11-08 2004-01-26 三菱電機株式会社 回路基板
US5668058A (en) * 1995-12-28 1997-09-16 Nec Corporation Method of producing a flip chip
US6403891B1 (en) * 1998-03-27 2002-06-11 Intel Corporation Metallization removal under the laser mark area for substrates
US6596947B1 (en) * 2000-01-28 2003-07-22 Sony Chemicals Corp. Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
US6840430B2 (en) * 1998-07-30 2005-01-11 Sony Chemicals, Corp. Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards
US6323435B1 (en) * 1998-07-31 2001-11-27 Kulicke & Soffa Holdings, Inc. Low-impedance high-density deposited-on-laminate structures having reduced stress
US6613986B1 (en) * 1998-09-17 2003-09-02 Ibiden Co., Ltd. Multilayer build-up wiring board
ES2154593B1 (es) * 1999-06-08 2001-10-16 Mecanismos Aux Es Ind S L Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.
JP3205548B2 (ja) * 1999-10-01 2001-09-04 ソニーケミカル株式会社 多層フレキシブル配線板
JP3227444B2 (ja) * 1999-11-10 2001-11-12 ソニーケミカル株式会社 多層構造のフレキシブル配線板とその製造方法
US6361823B1 (en) * 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
JP2003031728A (ja) * 2001-07-13 2003-01-31 Alps Electric Co Ltd Ｉｃチップおよびその取付構造
JP4142312B2 (ja) * 2002-02-28 2008-09-03 ハリマ化成株式会社 析出型はんだ組成物及びはんだ析出方法
US6933449B2 (en) * 2002-07-10 2005-08-23 Intel Corporation Selective area solder placement
US20040084206A1 (en) * 2002-11-06 2004-05-06 I-Chung Tung Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
US7168608B2 (en) * 2002-12-24 2007-01-30 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for hermetic seal formation
US7159758B1 (en) * 2003-06-26 2007-01-09 Emc Corporation Circuit board processing techniques using solder fusing
US7453157B2 (en) * 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
US7942182B2 (en) * 2005-06-14 2011-05-17 Cufer Asset Ltd. L.L.C. Rigid-backed, membrane-based chip tooling
JP4813255B2 (ja) * 2006-05-23 2011-11-09 パナソニック株式会社 配線基板及びその製造方法ならびに半導体装置
US7569164B2 (en) * 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
US8709934B2 (en) * 2007-06-05 2014-04-29 Stats Chippac Ltd. Electronic system with vertical intermetallic compound
WO2009116601A1 (ja) * 2008-03-19 2009-09-24 古河電気工業株式会社 コネクタ用金属材料およびその製造方法
US8536458B1 (en) * 2009-03-30 2013-09-17 Amkor Technology, Inc. Fine pitch copper pillar package and method
JP5465942B2 (ja) * 2009-07-16 2014-04-09 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US9137903B2 (en) 2010-12-21 2015-09-15 Tessera, Inc. Semiconductor chip assembly and method for making same
CN103427085A (zh) * 2013-07-29 2013-12-04 昆山元崧电子科技有限公司 一种电池板镍片焊接产品
CN103747623B (zh) * 2013-12-31 2017-01-04 广州兴森快捷电路科技有限公司 含小间距焊盘的印制线路板及其制备方法
CN103874342B (zh) * 2014-03-26 2017-07-04 新华三技术有限公司 电路板组装方法及电路板
JP2016111069A (ja) * 2014-12-03 2016-06-20 イビデン株式会社 パッケージ基板
CN108866353B (zh) * 2017-05-15 2020-11-17 中南大学 一种从甲基磺酸铋溶液中回收铋的方法
WO2019120583A1 (en) 2017-12-22 2019-06-27 Huawei Technologies Co., Ltd. Flex on board anisotropic conductive adhesive interconnection
CN111182737B (zh) * 2018-11-13 2021-08-03 上海和辉光电股份有限公司 柔性线路板及其制造方法
US20220322530A1 (en) * 2020-04-24 2022-10-06 HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. Circuit board and preparation method thereof
CN111640678A (zh) * 2020-06-28 2020-09-08 安徽富信半导体科技有限公司 一种半导体元件加工方法及成型工艺
CN114501829B (zh) * 2020-10-27 2024-05-31 鹏鼎控股(深圳)股份有限公司 线路板及其制备方法

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Publication number Priority date Publication date Assignee Title
US3986255A (en) * 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
US3964666A (en) * 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
US4412566A (en) * 1979-11-23 1983-11-01 Amp Incorporated Apparatus for transposing a pair of parallel and adjacent conductors into a vertical relationship
JPS62296495A (ja) * 1986-05-12 1987-12-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 部品を制御回路上の表面のはんだパツドに取付ける方法
JPH0747233B2 (ja) * 1987-09-14 1995-05-24 古河電気工業株式会社 半田析出用組成物および半田析出方法
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
JPH02310941A (ja) * 1989-05-26 1990-12-26 Mitsui Mining & Smelting Co Ltd バンプを有するプリント回路基板およびバンプの形成方法
US5118029A (en) * 1989-11-30 1992-06-02 The Furukawa Electric Co., Ltd. Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
JP3344621B2 (ja) * 1997-08-26 2002-11-11 株式会社荏原製作所 汚泥の脱水装置及びその方法

Also Published As

Publication number Publication date
US5296649A (en) 1994-03-22
KR920019228A (ko) 1992-10-22
MY108034A (en) 1996-07-30
KR960001352B1 (ko) 1996-01-26
EP0509262A2 (en) 1992-10-21
CN1034706C (zh) 1997-04-23
DE69204516T2 (de) 1996-04-04
EP0509262A3 (en) 1992-12-16
CA2063682C (en) 1997-04-15
EP0509262B1 (en) 1995-09-06
ES2079713T3 (es) 1996-01-16
CA2063682A1 (en) 1992-09-27
CN1065372A (zh) 1992-10-14
DE69204516D1 (de) 1995-10-12
BR9201047A (pt) 1992-11-24

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