TW209300B - - Google Patents

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Publication number
TW209300B
TW209300B TW081101978A TW81101978A TW209300B TW 209300 B TW209300 B TW 209300B TW 081101978 A TW081101978 A TW 081101978A TW 81101978 A TW81101978 A TW 81101978A TW 209300 B TW209300 B TW 209300B
Authority
TW
Taiwan
Prior art keywords
glass
composition
item
patent application
glasses
Prior art date
Application number
TW081101978A
Other languages
English (en)
Chinese (zh)
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of TW209300B publication Critical patent/TW209300B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
TW081101978A 1991-04-16 1992-03-16 TW209300B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/685,911 US5114885A (en) 1991-04-16 1991-04-16 Encapsulant composition

Publications (1)

Publication Number Publication Date
TW209300B true TW209300B (enExample) 1993-07-11

Family

ID=24754177

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081101978A TW209300B (enExample) 1991-04-16 1992-03-16

Country Status (7)

Country Link
US (1) US5114885A (enExample)
EP (1) EP0509438A3 (enExample)
JP (1) JPH05116984A (enExample)
KR (1) KR950006199B1 (enExample)
CN (1) CN1065876A (enExample)
CA (1) CA2065782A1 (enExample)
TW (1) TW209300B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3079715B2 (ja) * 1990-12-18 2000-08-21 松下電器産業株式会社 結晶化ガラス
JPH06145841A (ja) * 1992-11-11 1994-05-27 Sumitomo Electric Ind Ltd 複合部材
US5792716A (en) * 1997-02-19 1998-08-11 Ferro Corporation Thick film having acid resistance
JP3904102B2 (ja) * 1997-08-06 2007-04-11 日本電気硝子株式会社 プラズマディスプレーパネル用誘電体形成材料
US6171987B1 (en) 1997-12-29 2001-01-09 Ben-Gurion University Of The Negev Cadmium-free and lead-free glass compositions, thick film formulations containing them and uses thereof
JP2000207938A (ja) * 1999-01-13 2000-07-28 Murata Mfg Co Ltd 絶縁性ガラスペ―スト及び厚膜回路部品
WO2003045864A1 (fr) * 2001-11-30 2003-06-05 Asahi Glass Company, Limited Composition de scellement et materiau de scellement
US7176152B2 (en) 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
WO2017098854A1 (ja) * 2015-12-09 2017-06-15 日本電気硝子株式会社 封孔剤、封孔剤塗布液、耐食性被膜、高温部材及び高温部材の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL109459C (enExample) * 1960-01-26
US3088835A (en) * 1961-09-15 1963-05-07 Owens Illinois Glass Co Thermally devitrifiable sealing glasses
US3959543A (en) * 1973-05-17 1976-05-25 General Electric Company Non-linear resistance surge arrester disc collar and glass composition thereof
DE3501100A1 (de) * 1985-01-15 1986-07-17 Schott Glaswerke, 6500 Mainz Optisches cdo- und tho(pfeil abwaerts)2(pfeil abwaerts)-freies glas mit brechwerten 1,73 - 1,78 und abbezahlen 30 - 34 und mit sehr guter entglasungsstabilitaet
DE3625873A1 (de) * 1986-07-31 1988-02-04 Siemens Ag Lotglas und verfahren zum herstellen einer lotverbindung zwischen substraten aus silizium
DE4005011C1 (enExample) * 1990-02-19 1991-04-25 Schott Glaswerke, 6500 Mainz, De

Also Published As

Publication number Publication date
CA2065782A1 (en) 1992-10-17
CN1065876A (zh) 1992-11-04
EP0509438A3 (en) 1993-06-09
US5114885A (en) 1992-05-19
EP0509438A2 (en) 1992-10-21
KR920019687A (ko) 1992-11-19
JPH05116984A (ja) 1993-05-14
KR950006199B1 (ko) 1995-06-12

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