KR920019687A - 봉입재 조성물 - Google Patents

봉입재 조성물 Download PDF

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Publication number
KR920019687A
KR920019687A KR1019920006276A KR920006276A KR920019687A KR 920019687 A KR920019687 A KR 920019687A KR 1019920006276 A KR1019920006276 A KR 1019920006276A KR 920006276 A KR920006276 A KR 920006276A KR 920019687 A KR920019687 A KR 920019687A
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KR
South Korea
Prior art keywords
composition
glass
weight percent
thick film
dispersed
Prior art date
Application number
KR1019920006276A
Other languages
English (en)
Other versions
KR950006199B1 (ko
Inventor
호마달리 자콥
Original Assignee
미리암 디. 메코너헤이
이.아이.듀우판 드 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미리암 디. 메코너헤이, 이.아이.듀우판 드 네모아 앤드 캄파니 filed Critical 미리암 디. 메코너헤이
Publication of KR920019687A publication Critical patent/KR920019687A/ko
Application granted granted Critical
Publication of KR950006199B1 publication Critical patent/KR950006199B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)

Abstract

내용 없음

Description

봉입재 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (11)

15 내지 34.5 중량%의 Zno, 41 내지 65 중량%의 PbO, 10 내지 30 중량%의 B2O3, 0.5 내지 15 중량%의 SiO2, 0.5 내지 10 중량%의 SnO2및 0 내지 7 중량의 Al2O3또는 이들의혼합물로 이루어진 결정성 유리 조성물.
유기 매질 중에 분산된 제1항의 유리의 미분 입자로 이루어진 후막 조성물.
유리의 전체 조성이 제1항의 유리 조성물에 대응하는, 복수개의 결정성 유리의 미분 입자로 이루어진 후막 조성물.
제3항에 있어서, 조성물의 분산 고체가 필수적으로 납 아연 붕산염 유리, 납 붕규산염 유리, SiO2및 Cr2O3의 혼합물로 이루어진 후막 조성물.
혼합물의 전체 조성이 제1항의 유리 조성물에 대응하는, 결정성 유리의 미분 입자와 금속 산화물의 혼합물인 후막 조성물.
제1항에 있어서 510 내지 560℃의 온도에서 소성되어 PbZn2B2O6의 대부분의 양이 나머지 유리 중에 분산되어 이루어진 복수개의 결정상을 형성하는 조성물.
제1항에 있어서, 25 내지 34.5%의 ZnO를 함유하는 조성물.
제1항에 있어서, 40 내지 50%의 PbO를 함유하는 조성물.
제1항에 있어서, 10 내지 18%의 B2O3을 함유하는 조성물.
휘발성 용매 중에 용해된 중합체로 이루어진 유기 매질 중에 분산된 제1항의 조성물의 미분 입자로 이루어진 후막 페이스트.
고체 중합체로 이루어진 유기 매질 중에 분산된 제1항의 조성물의 미분 입자로 이루어진 그린 테이프(green tape).
※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019920006276A 1991-04-06 1992-04-15 봉입재 조성물 KR950006199B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/685,911 US5114885A (en) 1991-04-16 1991-04-16 Encapsulant composition
US685,911 1991-04-16

Publications (2)

Publication Number Publication Date
KR920019687A true KR920019687A (ko) 1992-11-19
KR950006199B1 KR950006199B1 (ko) 1995-06-12

Family

ID=24754177

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920006276A KR950006199B1 (ko) 1991-04-06 1992-04-15 봉입재 조성물

Country Status (7)

Country Link
US (1) US5114885A (ko)
EP (1) EP0509438A3 (ko)
JP (1) JPH05116984A (ko)
KR (1) KR950006199B1 (ko)
CN (1) CN1065876A (ko)
CA (1) CA2065782A1 (ko)
TW (1) TW209300B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3079715B2 (ja) * 1990-12-18 2000-08-21 松下電器産業株式会社 結晶化ガラス
JPH06145841A (ja) * 1992-11-11 1994-05-27 Sumitomo Electric Ind Ltd 複合部材
US5792716A (en) * 1997-02-19 1998-08-11 Ferro Corporation Thick film having acid resistance
JP3904102B2 (ja) * 1997-08-06 2007-04-11 日本電気硝子株式会社 プラズマディスプレーパネル用誘電体形成材料
US6171987B1 (en) 1997-12-29 2001-01-09 Ben-Gurion University Of The Negev Cadmium-free and lead-free glass compositions, thick film formulations containing them and uses thereof
JP2000207938A (ja) * 1999-01-13 2000-07-28 Murata Mfg Co Ltd 絶縁性ガラスペ―スト及び厚膜回路部品
AU2002354062A1 (en) * 2001-11-30 2003-06-10 Asahi Glass Company, Limited Sealing composition and sealing material
US7176152B2 (en) 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
CN108367967A (zh) * 2015-12-09 2018-08-03 日本电气硝子株式会社 封孔剂、封孔剂涂布液、耐腐蚀性包膜、高温部件以及高温部件的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL109459C (ko) * 1960-01-26
US3088835A (en) * 1961-09-15 1963-05-07 Owens Illinois Glass Co Thermally devitrifiable sealing glasses
US3959543A (en) * 1973-05-17 1976-05-25 General Electric Company Non-linear resistance surge arrester disc collar and glass composition thereof
JPS52154825A (en) * 1976-06-18 1977-12-22 Asahi Glass Co Ltd Crystalline glass of low melting point
JPS59182246A (ja) * 1983-03-29 1984-10-17 Asahi Glass Co Ltd ガラス組成物
DE3501100A1 (de) * 1985-01-15 1986-07-17 Schott Glaswerke, 6500 Mainz Optisches cdo- und tho(pfeil abwaerts)2(pfeil abwaerts)-freies glas mit brechwerten 1,73 - 1,78 und abbezahlen 30 - 34 und mit sehr guter entglasungsstabilitaet
DE3625873A1 (de) * 1986-07-31 1988-02-04 Siemens Ag Lotglas und verfahren zum herstellen einer lotverbindung zwischen substraten aus silizium
DE4005011C1 (ko) * 1990-02-19 1991-04-25 Schott Glaswerke, 6500 Mainz, De

Also Published As

Publication number Publication date
US5114885A (en) 1992-05-19
EP0509438A2 (en) 1992-10-21
KR950006199B1 (ko) 1995-06-12
EP0509438A3 (en) 1993-06-09
CA2065782A1 (en) 1992-10-17
CN1065876A (zh) 1992-11-04
TW209300B (ko) 1993-07-11
JPH05116984A (ja) 1993-05-14

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