TW202528419A - 環氧樹脂組合物、樹脂糊料、樹脂膜及半導體裝置 - Google Patents

環氧樹脂組合物、樹脂糊料、樹脂膜及半導體裝置

Info

Publication number
TW202528419A
TW202528419A TW113141694A TW113141694A TW202528419A TW 202528419 A TW202528419 A TW 202528419A TW 113141694 A TW113141694 A TW 113141694A TW 113141694 A TW113141694 A TW 113141694A TW 202528419 A TW202528419 A TW 202528419A
Authority
TW
Taiwan
Prior art keywords
group
carbon atoms
epoxy resin
substituent
resin composition
Prior art date
Application number
TW113141694A
Other languages
English (en)
Chinese (zh)
Inventor
小林尚裕
吉田真典
Original Assignee
日商旭化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW202528419A publication Critical patent/TW202528419A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
TW113141694A 2023-12-08 2024-10-30 環氧樹脂組合物、樹脂糊料、樹脂膜及半導體裝置 TW202528419A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023207573 2023-12-08
JP2023-207573 2023-12-08

Publications (1)

Publication Number Publication Date
TW202528419A true TW202528419A (zh) 2025-07-16

Family

ID=95979737

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113141694A TW202528419A (zh) 2023-12-08 2024-10-30 環氧樹脂組合物、樹脂糊料、樹脂膜及半導體裝置

Country Status (5)

Country Link
JP (1) JPWO2025121026A1 (https=)
KR (1) KR20260019633A (https=)
CN (1) CN121586738A (https=)
TW (1) TW202528419A (https=)
WO (1) WO2025121026A1 (https=)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2847441A1 (de) * 1978-11-02 1980-05-22 Basf Ag Imidazol-kupferkomplexverbindungen
JP4509247B2 (ja) 1999-04-30 2010-07-21 東レ・ダウコーニング株式会社 シリコーン含有ポリイミド樹脂、シリコーン含有ポリアミック酸およびそれらの製造方法
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP3816454B2 (ja) 2003-03-12 2006-08-30 Ｔｄｋ株式会社 エポキシ樹脂組成物およびそれから得られるシート、プリプレグ状材料、金属箔付シート、積層板、電気絶縁用材料、レジスト材料
JP4929623B2 (ja) 2004-06-21 2012-05-09 味の素株式会社 変性ポリイミド樹脂を含有する熱硬化性樹脂組成物
MY150836A (en) * 2007-09-21 2014-02-28 Nippon Soda Co Inclusion complex containing epoxy resin composition for semiconductor encapsulation
TWI476230B (zh) 2008-11-10 2015-03-11 味之素股份有限公司 Silicone-containing polyimide resin
JP5729605B2 (ja) 2011-08-15 2015-06-03 Dic株式会社 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP5936340B2 (ja) * 2011-12-13 2016-06-22 日本合成化学工業株式会社 エポキシ樹脂用硬化剤
JP6064653B2 (ja) * 2013-02-15 2017-01-25 東洋インキＳｃホールディングス株式会社 蛍光材料、蛍光性樹脂組成物および化合物
JP2016029153A (ja) * 2014-07-24 2016-03-03 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、及び硬化物
JP2016029152A (ja) 2014-07-24 2016-03-03 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、及び硬化物
JP6536281B2 (ja) 2015-08-18 2019-07-03 日立化成株式会社 半導体用接着剤、並びに、半導体装置及びその製造方法
WO2017157429A1 (en) * 2016-03-16 2017-09-21 Hp Indigo B.V. Security liquid electrostatic ink composition
JP6705262B2 (ja) * 2016-04-04 2020-06-03 三菱ケミカル株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、および硬化物
WO2018181045A1 (ja) * 2017-03-28 2018-10-04 日本曹達株式会社 潜在性エポキシ硬化触媒又は硬化剤
JP7226954B2 (ja) 2018-09-28 2023-02-21 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7235561B2 (ja) * 2019-03-28 2023-03-08 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、繊維強化複合材料および成形体
JP7103401B2 (ja) 2020-12-23 2022-07-20 昭和電工マテリアルズ株式会社 アンダーフィル材及びそれを用いた電子部品装置
CN115437215A (zh) * 2021-06-02 2022-12-06 三星显示有限公司 光敏树脂组合物、由其制备的膜和包括该膜的电子设备
CN117255839A (zh) 2021-07-13 2023-12-19 古河电气工业株式会社 导热性膜状粘接剂、半导体封装及其制造方法

Also Published As

Publication number Publication date
WO2025121026A1 (ja) 2025-06-12
KR20260019633A (ko) 2026-02-10
CN121586738A (zh) 2026-02-27
JPWO2025121026A1 (https=) 2025-06-12

Similar Documents

Publication Publication Date Title
CN106967208B (zh) 被覆粒子
JP7154732B2 (ja) 樹脂組成物
TWI822828B (zh) 樹脂組成物
TWI886199B (zh) 樹脂組成物
TW201638175A (zh) 組成物、環氧樹脂固化劑、環氧樹脂組成物、熱固化性組成物、固化物、半導體裝置以及層間絕緣材料
KR102881840B1 (ko) 수지 시트
JP7287348B2 (ja) 樹脂組成物
TW202337952A (zh) 聚合物、組成物、硬化物、成形體、積層體和電子零件
CN102741351A (zh) 热固性组合物
TW202108653A (zh) 樹脂組成物
JP2013221120A (ja) エポキシ樹脂組成物および該エポキシ樹脂組成物を硬化させてなる硬化物
KR102832305B1 (ko) 경화성 수지 조성물, 경화물 및 시트상 성형체
JP2012116146A (ja) 絶縁シート及び積層構造体
TWI736593B (zh) 樹脂組成物
JP2014080455A (ja) 液状硬化性樹脂組成物及びその用途
JP2013006972A (ja) エポキシ樹脂組成物及び該エポキシ樹脂組成物を硬化させてなる硬化物
TW202528419A (zh) 環氧樹脂組合物、樹脂糊料、樹脂膜及半導體裝置
TWI891410B (zh) 環氧樹脂組合物、樹脂糊料、膜型接著劑、印刷電路板、半導體晶片封裝及電子裝置
TWI753456B (zh) 硬化性組成物、硬化物、保護膜以及可撓性電路板及其製造方法
JP7839364B2 (ja) 組成物、エポキシ樹脂組成物、フィルム、プリント配線板、半導体チップパッケージ、及び電子装置
CN117120544A (zh) 树脂组合物
KR20220056134A (ko) 밀봉 용도의 수지 조성물
JP7156335B2 (ja) 樹脂組成物、接着フィルム、部品内蔵回路基板、半導体装置、及びシート状樹脂組成物の製造方法
WO2026042451A1 (ja) 組成物、硬化剤、密着剤、防錆剤、樹脂組成物、硬化物、樹脂ペースト、樹脂フィルム、プリント配線板、半導体パッケージ及び電子装置
JP2026052333A (ja) 樹脂組成物