JPWO2025121026A1 - - Google Patents

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Publication number
JPWO2025121026A1
JPWO2025121026A1 JP2025506049A JP2025506049A JPWO2025121026A1 JP WO2025121026 A1 JPWO2025121026 A1 JP WO2025121026A1 JP 2025506049 A JP2025506049 A JP 2025506049A JP 2025506049 A JP2025506049 A JP 2025506049A JP WO2025121026 A1 JPWO2025121026 A1 JP WO2025121026A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506049A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025121026A1 publication Critical patent/JPWO2025121026A1/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
JP2025506049A 2023-12-08 2024-10-25 Pending JPWO2025121026A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023207573 2023-12-08
PCT/JP2024/038214 WO2025121026A1 (ja) 2023-12-08 2024-10-25 エポキシ樹脂組成物、樹脂ペースト、樹脂フィルム、及び半導体装置

Publications (1)

Publication Number Publication Date
JPWO2025121026A1 true JPWO2025121026A1 (https=) 2025-06-12

Family

ID=95979737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506049A Pending JPWO2025121026A1 (https=) 2023-12-08 2024-10-25

Country Status (5)

Country Link
JP (1) JPWO2025121026A1 (https=)
KR (1) KR20260019633A (https=)
CN (1) CN121586738A (https=)
TW (1) TW202528419A (https=)
WO (1) WO2025121026A1 (https=)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339448A (en) * 1978-11-02 1982-07-13 Basf Aktiengesellschaft Imidazole-copper complex compounds and fungicides containing them
WO2009037862A1 (ja) * 2007-09-21 2009-03-26 Nippon Soda Co., Ltd. 包接錯体を含有する半導体封止用エポキシ樹脂組成物
JP2013124265A (ja) * 2011-12-13 2013-06-24 Nippon Synthetic Chem Ind Co Ltd:The エポキシ樹脂用硬化剤
JP2014156412A (ja) * 2013-02-15 2014-08-28 Toyo Ink Sc Holdings Co Ltd 蛍光材料、蛍光性樹脂組成物および化合物
JP2016029153A (ja) * 2014-07-24 2016-03-03 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、及び硬化物
JP2016029152A (ja) * 2014-07-24 2016-03-03 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、及び硬化物
WO2017157429A1 (en) * 2016-03-16 2017-09-21 Hp Indigo B.V. Security liquid electrostatic ink composition
JP2017186414A (ja) * 2016-04-04 2017-10-12 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、硬化物、および新規なイミダゾベンゾオキサジン−５−オン系化合物
WO2018181045A1 (ja) * 2017-03-28 2018-10-04 日本曹達株式会社 潜在性エポキシ硬化触媒又は硬化剤
JP2020164558A (ja) * 2019-03-28 2020-10-08 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、繊維強化複合材料および成形体
US20220403179A1 (en) * 2021-06-02 2022-12-22 Samsung Display Co., Ltd. Photosensetive resin composition, film prepared from the same, and electronic apparatus including the film

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4509247B2 (ja) 1999-04-30 2010-07-21 東レ・ダウコーニング株式会社 シリコーン含有ポリイミド樹脂、シリコーン含有ポリアミック酸およびそれらの製造方法
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP3816454B2 (ja) 2003-03-12 2006-08-30 Ｔｄｋ株式会社 エポキシ樹脂組成物およびそれから得られるシート、プリプレグ状材料、金属箔付シート、積層板、電気絶縁用材料、レジスト材料
JP4929623B2 (ja) 2004-06-21 2012-05-09 味の素株式会社 変性ポリイミド樹脂を含有する熱硬化性樹脂組成物
TWI476230B (zh) 2008-11-10 2015-03-11 味之素股份有限公司 Silicone-containing polyimide resin
JP5729605B2 (ja) 2011-08-15 2015-06-03 Dic株式会社 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP6536281B2 (ja) 2015-08-18 2019-07-03 日立化成株式会社 半導体用接着剤、並びに、半導体装置及びその製造方法
JP7226954B2 (ja) 2018-09-28 2023-02-21 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7103401B2 (ja) 2020-12-23 2022-07-20 昭和電工マテリアルズ株式会社 アンダーフィル材及びそれを用いた電子部品装置
CN117255839A (zh) 2021-07-13 2023-12-19 古河电气工业株式会社 导热性膜状粘接剂、半导体封装及其制造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339448A (en) * 1978-11-02 1982-07-13 Basf Aktiengesellschaft Imidazole-copper complex compounds and fungicides containing them
WO2009037862A1 (ja) * 2007-09-21 2009-03-26 Nippon Soda Co., Ltd. 包接錯体を含有する半導体封止用エポキシ樹脂組成物
JP2013124265A (ja) * 2011-12-13 2013-06-24 Nippon Synthetic Chem Ind Co Ltd:The エポキシ樹脂用硬化剤
JP2014156412A (ja) * 2013-02-15 2014-08-28 Toyo Ink Sc Holdings Co Ltd 蛍光材料、蛍光性樹脂組成物および化合物
JP2016029153A (ja) * 2014-07-24 2016-03-03 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、及び硬化物
JP2016029152A (ja) * 2014-07-24 2016-03-03 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、及び硬化物
WO2017157429A1 (en) * 2016-03-16 2017-09-21 Hp Indigo B.V. Security liquid electrostatic ink composition
JP2017186414A (ja) * 2016-04-04 2017-10-12 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、硬化物、および新規なイミダゾベンゾオキサジン−５−オン系化合物
WO2018181045A1 (ja) * 2017-03-28 2018-10-04 日本曹達株式会社 潜在性エポキシ硬化触媒又は硬化剤
JP2020164558A (ja) * 2019-03-28 2020-10-08 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、繊維強化複合材料および成形体
US20220403179A1 (en) * 2021-06-02 2022-12-22 Samsung Display Co., Ltd. Photosensetive resin composition, film prepared from the same, and electronic apparatus including the film

Also Published As

Publication number Publication date
WO2025121026A1 (ja) 2025-06-12
KR20260019633A (ko) 2026-02-10
CN121586738A (zh) 2026-02-27
TW202528419A (zh) 2025-07-16

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