TW202521974A - 光透射性積層體 - Google Patents

光透射性積層體 Download PDF

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Publication number
TW202521974A
TW202521974A TW114104350A TW114104350A TW202521974A TW 202521974 A TW202521974 A TW 202521974A TW 114104350 A TW114104350 A TW 114104350A TW 114104350 A TW114104350 A TW 114104350A TW 202521974 A TW202521974 A TW 202521974A
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TW
Taiwan
Prior art keywords
light
transmitting
inspection
laminate
transmitting laminate
Prior art date
Application number
TW114104350A
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English (en)
Chinese (zh)
Inventor
田中卓哉
望月政和
小西隆博
伊崎章典
Original Assignee
日商日東電工股份有限公司
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Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202521974A publication Critical patent/TW202521974A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/108—Miscellaneous
    • G01N2201/1087—Focussed scan beam, e.g. laser

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Laminated Bodies (AREA)
TW114104350A 2020-02-28 2021-02-24 光透射性積層體 TW202521974A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020032701A JP7451227B2 (ja) 2020-02-28 2020-02-28 光透過性積層体の検査方法
JP2020-032701 2020-02-28

Publications (1)

Publication Number Publication Date
TW202521974A true TW202521974A (zh) 2025-06-01

Family

ID=77491087

Family Applications (4)

Application Number Title Priority Date Filing Date
TW114104350A TW202521974A (zh) 2020-02-28 2021-02-24 光透射性積層體
TW114104352A TW202521975A (zh) 2020-02-28 2021-02-24 光透射性積層體
TW110106532A TW202141029A (zh) 2020-02-28 2021-02-24 光透射性積層體之檢查方法
TW114104353A TW202519849A (zh) 2020-02-28 2021-02-24 光透射性積層體之製造方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW114104352A TW202521975A (zh) 2020-02-28 2021-02-24 光透射性積層體
TW110106532A TW202141029A (zh) 2020-02-28 2021-02-24 光透射性積層體之檢查方法
TW114104353A TW202519849A (zh) 2020-02-28 2021-02-24 光透射性積層體之製造方法

Country Status (5)

Country Link
JP (4) JP7451227B2 (enExample)
KR (1) KR20220145816A (enExample)
CN (4) CN115135996A (enExample)
TW (4) TW202521974A (enExample)
WO (1) WO2021172089A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451227B2 (ja) * 2020-02-28 2024-03-18 日東電工株式会社 光透過性積層体の検査方法
KR20240045215A (ko) * 2021-08-17 2024-04-05 닛토덴코 가부시키가이샤 광투과성 적층체의 검사 방법
JP7723528B2 (ja) 2021-08-20 2025-08-14 株式会社シマノ 充電装置および充電システム
JP2023105601A (ja) 2022-01-19 2023-07-31 日東電工株式会社 表面保護フィルムおよび表面保護フィルム付光学部材
JP7288989B1 (ja) 2022-01-31 2023-06-08 日東電工株式会社 長尺光学フィルムの検査方法
JP7472927B2 (ja) * 2022-03-17 2024-04-23 味の素株式会社 樹脂シート及びその製造方法、並びに欠点検出方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1006378C2 (nl) * 1997-06-23 1998-12-24 Tno Werkwijze en inrichting voor het inspecteren van een voorwerp met betrekking tot verstoringen.
JP2001228091A (ja) * 2000-02-14 2001-08-24 Kobe Steel Ltd 欠陥検査方法及びその装置
JP2001264259A (ja) * 2000-03-16 2001-09-26 Konica Corp シート検査装置
JP2002303714A (ja) * 2001-04-03 2002-10-18 Toppan Printing Co Ltd カラーフィルタの製造方法
JP2003139713A (ja) * 2001-10-30 2003-05-14 Tomoegawa Paper Co Ltd シート材料
JP3974400B2 (ja) * 2002-01-07 2007-09-12 日東電工株式会社 シート状成形体の検査結果記録方法及び検査結果記録システム及びロール状成形体
JP2004054092A (ja) * 2002-07-23 2004-02-19 Elpida Memory Inc マスクおよびその製造方法
JP2005062165A (ja) 2003-07-28 2005-03-10 Nitto Denko Corp シート状製品の検査方法、検査システム、シート状製品、及び、画像表示装置
JP2005134573A (ja) * 2003-10-29 2005-05-26 Seiko Epson Corp 検査方法および検査装置
JP2009069142A (ja) * 2007-08-23 2009-04-02 Nitto Denko Corp 積層フィルムの欠陥検査方法およびその装置
WO2009025210A1 (ja) * 2007-08-23 2009-02-26 Nitto Denko Corporation 積層フィルムの欠陥検査方法およびその装置
WO2009128115A1 (ja) * 2008-04-15 2009-10-22 日東電工株式会社 光学フィルム積層体ロールならびにその製造方法および装置
JP2012002676A (ja) * 2010-06-17 2012-01-05 Toshiba Corp マスク欠陥検査装置およびマスク欠陥検査方法
JP2013231662A (ja) * 2012-04-27 2013-11-14 Mitsubishi Chemicals Corp 積層体の検査方法、積層体の製造方法、及び積層体の検査装置
US9816940B2 (en) * 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method
JP6437329B2 (ja) * 2015-02-03 2018-12-12 住友化学株式会社 光学フィルムの欠陥検査方法
JP6807637B2 (ja) * 2015-09-30 2021-01-06 日東電工株式会社 偏光子の検査方法および偏光板の製造方法
WO2017098970A1 (ja) * 2015-12-10 2017-06-15 日東電工株式会社 円偏光板およびそれを用いたフレキシブルな画像表示装置
JP2017166903A (ja) * 2016-03-15 2017-09-21 株式会社大真空 欠陥検査装置及び欠陥検査方法
CN109856049A (zh) * 2018-12-14 2019-06-07 杭州元色科技有限公司 透明板材瑕疵检测全内反射光导入装置及载片方法
JP2019215371A (ja) * 2019-08-26 2019-12-19 住友化学株式会社 光学フィルム及び積層光学フィルムの欠陥検査方法
JP7451227B2 (ja) 2020-02-28 2024-03-18 日東電工株式会社 光透過性積層体の検査方法

Also Published As

Publication number Publication date
TW202141029A (zh) 2021-11-01
JP7451227B2 (ja) 2024-03-18
JP2024083647A (ja) 2024-06-21
WO2021172089A1 (ja) 2021-09-02
TW202521975A (zh) 2025-06-01
JP7766141B2 (ja) 2025-11-07
JP2024111327A (ja) 2024-08-16
CN120761413A (zh) 2025-10-10
JP7498815B2 (ja) 2024-06-12
CN115135996A (zh) 2022-09-30
JP2023053294A (ja) 2023-04-12
CN120761411A (zh) 2025-10-10
KR20220145816A (ko) 2022-10-31
JP2021135219A (ja) 2021-09-13
CN120761412A (zh) 2025-10-10
TW202519849A (zh) 2025-05-16

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