TW202507300A - 探頭裝置及其製造方法 - Google Patents

探頭裝置及其製造方法 Download PDF

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Publication number
TW202507300A
TW202507300A TW113120841A TW113120841A TW202507300A TW 202507300 A TW202507300 A TW 202507300A TW 113120841 A TW113120841 A TW 113120841A TW 113120841 A TW113120841 A TW 113120841A TW 202507300 A TW202507300 A TW 202507300A
Authority
TW
Taiwan
Prior art keywords
probe
probe device
wiring pattern
electrode pad
opening
Prior art date
Application number
TW113120841A
Other languages
English (en)
Chinese (zh)
Inventor
齋藤雄二
塩尻和也
安生健二
杉本重人
Original Assignee
日商Ｖ科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｖ科技股份有限公司 filed Critical 日商Ｖ科技股份有限公司
Publication of TW202507300A publication Critical patent/TW202507300A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Geometry (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW113120841A 2023-07-07 2024-06-05 探頭裝置及其製造方法 TW202507300A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023-112543 2023-07-07
JP2023112543 2023-07-07
JP2023-183975 2023-10-26
JP2023183975 2023-10-26

Publications (1)

Publication Number Publication Date
TW202507300A true TW202507300A (zh) 2025-02-16

Family

ID=94215327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113120841A TW202507300A (zh) 2023-07-07 2024-06-05 探頭裝置及其製造方法

Country Status (5)

Country Link
JP (1) JPWO2025013432A1 (https=)
KR (1) KR20260035129A (https=)
CN (1) CN121511409A (https=)
TW (1) TW202507300A (https=)
WO (1) WO2025013432A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533431Y2 (ja) * 1990-10-03 1997-04-23 株式会社アドバンテスト Ｉｃウエーハ試験用プローブ
JPH05226430A (ja) * 1992-02-10 1993-09-03 Nitto Denko Corp プローブカード構造体およびその製法
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
JPH0763787A (ja) * 1993-06-16 1995-03-10 Nitto Denko Corp プローブ構造
JPH0763788A (ja) * 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法
JP3793945B2 (ja) * 2002-05-30 2006-07-05 松下電器産業株式会社 電圧プローブ、これを用いた半導体装置の検査方法、およびモニタ機能付き半導体装置

Also Published As

Publication number Publication date
WO2025013432A1 (ja) 2025-01-16
JPWO2025013432A1 (https=) 2025-01-16
KR20260035129A (ko) 2026-03-12
CN121511409A (zh) 2026-02-10

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