KR20260035129A - 프로브 장치 및 그 제조 방법 - Google Patents

프로브 장치 및 그 제조 방법

Info

Publication number
KR20260035129A
KR20260035129A KR1020257039358A KR20257039358A KR20260035129A KR 20260035129 A KR20260035129 A KR 20260035129A KR 1020257039358 A KR1020257039358 A KR 1020257039358A KR 20257039358 A KR20257039358 A KR 20257039358A KR 20260035129 A KR20260035129 A KR 20260035129A
Authority
KR
South Korea
Prior art keywords
probe
probe device
wiring pattern
electrode pad
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257039358A
Other languages
English (en)
Korean (ko)
Inventor
유지 사이토
카즈야 시오지리
켄지 안조
시게토 스기모토
Original Assignee
브이 테크놀로지 씨오. 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 브이 테크놀로지 씨오. 엘티디 filed Critical 브이 테크놀로지 씨오. 엘티디
Publication of KR20260035129A publication Critical patent/KR20260035129A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
    • G01R31/396—Acquisition or processing of data for testing or for monitoring individual cells or groups of cells within a battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Geometry (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020257039358A 2023-07-07 2024-05-22 프로브 장치 및 그 제조 방법 Pending KR20260035129A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2023-112543 2023-07-07
JP2023112543 2023-07-07
JPJP-P-2023-183975 2023-10-26
JP2023183975 2023-10-26
PCT/JP2024/018901 WO2025013432A1 (ja) 2023-07-07 2024-05-22 プローブ装置およびその製造方法

Publications (1)

Publication Number Publication Date
KR20260035129A true KR20260035129A (ko) 2026-03-12

Family

ID=94215327

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257039358A Pending KR20260035129A (ko) 2023-07-07 2024-05-22 프로브 장치 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2025013432A1 (https=)
KR (1) KR20260035129A (https=)
CN (1) CN121511409A (https=)
TW (1) TW202507300A (https=)
WO (1) WO2025013432A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533431Y2 (ja) * 1990-10-03 1997-04-23 株式会社アドバンテスト Ｉｃウエーハ試験用プローブ
JPH05226430A (ja) * 1992-02-10 1993-09-03 Nitto Denko Corp プローブカード構造体およびその製法
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
JPH0763787A (ja) * 1993-06-16 1995-03-10 Nitto Denko Corp プローブ構造
JPH0763788A (ja) * 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法
JP3793945B2 (ja) * 2002-05-30 2006-07-05 松下電器産業株式会社 電圧プローブ、これを用いた半導体装置の検査方法、およびモニタ機能付き半導体装置

Also Published As

Publication number Publication date
TW202507300A (zh) 2025-02-16
WO2025013432A1 (ja) 2025-01-16
JPWO2025013432A1 (https=) 2025-01-16
CN121511409A (zh) 2026-02-10

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Legal Events

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)