TW202406977A - 聚苯醚型雙馬來醯亞胺樹脂 - Google Patents

聚苯醚型雙馬來醯亞胺樹脂 Download PDF

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TW202406977A
TW202406977A TW111129785A TW111129785A TW202406977A TW 202406977 A TW202406977 A TW 202406977A TW 111129785 A TW111129785 A TW 111129785A TW 111129785 A TW111129785 A TW 111129785A TW 202406977 A TW202406977 A TW 202406977A
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polyphenylene ether
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bismaleimide resin
phenolic compound
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廖德超
呂雯華
陳其霖
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南亞塑膠工業股份有限公司
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Priority to CN202211056704.1A priority patent/CN117567743A/zh
Priority to US17/901,869 priority patent/US20240059836A1/en
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Abstract

本發明提供一種聚苯醚型雙馬來醯亞胺樹脂。聚苯醚型雙馬來醯亞胺樹脂是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成。經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。

Description

聚苯醚型雙馬來醯亞胺樹脂
本發明是有關於一種雙馬來醯亞胺樹脂,且特別是有關於一種聚苯醚型雙馬來醯亞胺樹脂(polyphenylene ether bismaleimide,PPE-BMI)。
聚苯醚樹脂具有良好的絕緣性、耐酸鹼性、介電常數(dielectric constant,Dk)以及介電損耗(dissipation factor,Df)等特性,因此常被應用於高頻印刷電路板等電子基板的絕緣材料。然而,目前使用的聚苯醚樹脂具有穩定性不足的問題,進而產生加工性較差的缺點。
本發明提供一種可形成具有良好的介電特性以及耐熱性的聚苯醚型雙馬來醯亞胺樹脂。
本發明的一種聚苯醚型雙馬來醯亞胺樹脂是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成。經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
在本發明的一實施例中,上述經改質的聚苯醚型雙胺的莫耳數與馬來酸酐的莫耳數的比為1:1.1至1:1.6。
在本發明的一實施例中,上述酚類化合物的莫耳數與聚苯醚的莫耳數的比為1:1至10:1。
在本發明的一實施例中,上述聚苯醚型雙馬來醯亞胺樹脂的重量平均分子量為1000至8000。
在本發明的一實施例中,上述酚類化合物包括兩個以上的酚基。
在本發明的一實施例中,上述酚類化合物包括下述式(1)至式(9)表示的化合物中的任一者: 式(1), 式(2), 式(3), 式(4), 式(5), 式(6), 式(7), 式(8), 式(9)。
本發明的一種聚苯醚型雙馬來醯亞胺樹脂具有如下述式(A)表示的結構: 式(A), 式(A)中,L表示衍生自酚類化合物的二價有機基團, m表示0至20的整數,且 n表示0至20的整數。
基於上述,本發明提供一種具有剛性結構的聚苯醚型雙馬來醯亞胺樹脂,其具有良好的介電特性及耐熱性。
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例及圖式作詳細說明如下。
以下是詳細敘述本發明內容之實施例。實施例所提出的實施細節為舉例說明之用,並非對本發明內容欲保護之範圍做限縮。任何所屬技術領域中具有通常知識者當可依據實際實施態樣的需要對該些實施細節加以修飾或變化。
在本文中,所謂「二價有機基團」為具有兩個鍵結位置的有機基團,並且「二價有機基團」可經由這兩個鍵結位置形成兩個化學鍵。
依據本實施例的一種聚苯醚型雙馬來醯亞胺樹脂,是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成,其中經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
藉此,本實施例經由酚類化合物賦予主鏈的聚苯醚具有剛性結構,使聚苯醚型雙馬來醯亞胺樹脂具有良好的介電特性及耐熱性。
接著,對上述經改質的聚苯醚型雙胺進行詳細說明。 經改質的聚苯醚型雙胺
經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。 酚類化合物
酚類化合物可包括兩個以上的酚基。酚類化合物可包括下述式(1)至式(9)表示的化合物中的任一者或其他合適的酚類化合物。在本實施例中,酚類化合物較佳為包括式(1)至式(3)表示的化合物中的任一者。酚類化合物可單獨使用一種,也可以組合多種使用。
式(1) 式(2) 式(3) 式(4) 式(5) 式(6) 式(7) 式(8) 式(9) 聚苯醚
聚苯醚的市售商品的具體例包括NORYL SA90(商品名稱;沙比克(SABIC)公司製造,重量平均分子量1600)、NORYL SA9000(商品名稱;沙比克(SABIC)公司製造,重量平均分子量2300)或其組合。
在本實施例中,酚類化合物先與聚苯醚反應,接著以具有硝基結構的化合物(例如4-鹵硝基苯)將經改質的聚苯醚末端的基團進行硝化反應及氫化反應,以形成經改質的聚苯醚型雙胺。酚類化合物的莫耳數與聚苯醚的莫耳數的比為1:1至10:1,較佳為2:1至5:1。 聚苯醚型雙馬來醯亞胺樹脂的製備方法
首先,先將酚類化合物與聚苯醚反應形成經改質的聚苯醚型雙胺。將酚類化合物與聚苯醚反應的方法沒有特別的限制,例如可採用周知的有機合成方法來合成,在此不另行贅述。接著,將經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應,以形成聚苯醚型雙馬來醯亞胺樹脂。在本實施例中,經改質的聚苯醚型雙胺的莫耳數與馬來酸酐的莫耳數的比為1:1.1至1:1.6,較佳為1:1.2至1:1.4。
聚苯醚型雙馬來醯亞胺樹脂具有如下述式(A)表示的結構。在本實施例中,聚苯醚型雙馬來醯亞胺樹脂的重量平均分子量為1000至8000,較佳為1000至4000。
式(A)
式(A)中,L表示衍生自酚類化合物的二價有機基團; m表示0至20的整數,較佳為1至10的整數;且 n表示0至20的整數,較佳為1至10的整數。
在本實施例中,L所示的二價有機基團可衍生自包括兩個以上的酚基的酚類化合物。酚類化合物可包括上述式(1)至式(9)表示的化合物中的任一者,較佳為包括上述式(1)至式(3)表示的化合物中的任一者。 聚苯醚型雙馬來醯亞胺樹脂的實施例
以下說明聚苯醚型雙馬來醯亞胺樹脂的實施例1至實施例3以及比較例1: 實施例 1
將3.5莫耳的式(1)表示的化合物、0.45莫耳的作為催化劑的三苯基磷(triphenyl phosphine,TPP)與1莫耳的聚苯醚(商品名稱NORYL SA90,沙比克公司製造)加至1.5莫耳的作為反應溶劑的甲苯中,在145℃的溫度下反應120分鐘,以形成經改質的聚苯醚。接著,加入1.3莫耳的4-氟硝基苯,在140℃的溫度下反應120分鐘,以進行硝化反應。然後,通入氫氣,在100℃的溫度下反應120分鐘,以進行氫化反應,以形成經改質的聚苯醚型雙胺。接著,加入1.38莫耳的馬來酸酐,在110℃的溫度下反應180分鐘,再加入2莫耳的作為脫水劑的甲苯磺酸,即可製得實施例1的聚苯醚型雙馬來醯亞胺樹脂。 實施例 2 至實施例 3 以及比較例 1
實施例2至實施例3以及比較例1的聚苯醚型雙馬來醯亞胺樹脂是以與實施例1相同的步驟來製備,並且其不同處在於:改變聚苯醚型雙馬來醯亞胺樹脂的酚類化合物的種類(如表1所示)。將所製得的聚苯醚型雙馬來醯亞胺樹脂以下列各評價方式進行評價,其結果如表1所示。
[表1]
項目 實施例1 實施例2 實施例3 比較例1
酚類化合物 式(1)表示的化合物 式(2)表示的化合物 式(3)表示的化合物 式(10)表示的化合物
重量平均分子量(Mw) 2,778 2,795 2,643 2,000
Tg(單位:℃) 248 241 245 203
CTE(單位:ppm/℃) 40 43 42 49
介電常數(Dk) 2.47 2.48 2.50 2.42
介電損耗(Df) 0.0020 0.0020 0.0024 0.0017
式(10) 評價方式 a. 重量平均分子量( weight-average molecular weight Mw
將所製得的聚苯醚型雙馬來醯亞胺樹脂藉由凝膠滲透色譜法(gel permeation chromatograph,GPC)測量重量平均分子量(Mw),並用四氫呋喃(tetrahydrofuran,THF)作為校正標準品。 b. 玻璃轉移溫度( glass transition temperature Tg
將所製得的聚苯醚型雙馬來醯亞胺樹脂藉由微差掃描熱分析儀(differential scaning calorimeter,DSC)測量玻璃轉移溫度(Tg)。當Tg愈高時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的抵抗相變化的能力,即良好的耐熱性。 升溫速度:10℃/min 溫度範圍:0℃~350℃(升溫、冷卻、升溫) c. 熱膨脹係數( coefficient of thermal expansion CTE
將所製得的聚苯醚型雙馬來醯亞胺樹脂藉由熱機械分析儀(型號TMA Q400,TA儀器製造)測量熱膨脹係數(CTE)。當CTE愈小時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的抵抗相變化的能力,即良好的耐熱性。 升溫速度:10℃/min 溫度範圍:0℃~300℃ d. 介電常數( dielectric constant Dk
將所製得的聚苯醚型雙馬來醯亞胺樹脂塗佈至基板上,以210℃的溫度進行烘烤60分鐘,以形成厚度為0.25毫米的片狀物。接著,藉由共振腔測量頻率為1 GHz的介電常數(Dk)。當介電常數愈小時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的介電特性。 e. 介電損耗( dissipation factor Df
將所製得的聚苯醚型雙馬來醯亞胺樹脂塗佈至基板上,以210℃的溫度進行烘烤60分鐘,以形成厚度為0.25毫米的片狀物。接著,藉由共振腔測量頻率為1 GHz的介電損耗(Df)。當介電損耗愈小時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的介電特性。 評價結果
由表1可知,當聚苯醚型雙馬來醯亞胺樹脂具有衍生自酚類化合物的剛性結構時(實施例1~3),聚苯醚型雙馬來醯亞胺樹脂同時兼具良好的耐熱性及介電特性。
此外,相較於不具有衍生自酚類化合物的剛性結構的聚苯醚型雙馬來醯亞胺樹脂(比較例1),具有衍生自酚類化合物的剛性結構的聚苯醚型雙馬來醯亞胺樹脂(實施例1~3)具有較高的玻璃轉移溫度及較小的熱膨脹係數,即較佳的耐熱性,且同時具有良好的介電特性。
綜上所述,本發明的聚苯醚型雙馬來醯亞胺樹脂具有剛性結構,故具有良好的介電特性及耐熱性,而具有良好的應用性。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
無。
無。

Claims (10)

  1. 一種聚苯醚型雙馬來醯亞胺樹脂,是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成, 其中所述經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
  2. 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述經改質的聚苯醚型雙胺的莫耳數與所述馬來酸酐的莫耳數的比為1:1.1至1:1.6。
  3. 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物的莫耳數與所述聚苯醚的莫耳數的比為1:1至10:1。
  4. 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其重量平均分子量為1000至8000。
  5. 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括兩個以上的酚基。
  6. 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括下述式(1)至式(9)表示的化合物中的任一者: 式(1), 式(2), 式(3), 式(4), 式(5), 式(6), 式(7), 式(8), 式(9)。
  7. 一種聚苯醚型雙馬來醯亞胺樹脂,具有如下述式(A)表示的結構: 式(A), 式(A)中,L表示衍生自酚類化合物的二價有機基團, m表示0至20的整數,且 n表示0至20的整數。
  8. 如請求項7所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括兩個以上的酚基。
  9. 如請求項7所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括下述式(1)至式(9)表示的化合物中的任一者: 式(1), 式(2), 式(3), 式(4), 式(5), 式(6), 式(7), 式(8), 式(9)。
  10. 如請求項7所述的聚苯醚型雙馬來醯亞胺樹脂,其重量平均分子量為1000至8000。
TW111129785A 2022-08-08 2022-08-08 聚苯醚型雙馬來醯亞胺樹脂 TWI814526B (zh)

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TWI774559B (zh) * 2021-09-13 2022-08-11 南亞塑膠工業股份有限公司 具有雙馬來醯亞胺修飾的聚苯醚樹脂、其製造方法、及電路板的基板材料

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