TW202406977A - 聚苯醚型雙馬來醯亞胺樹脂 - Google Patents
聚苯醚型雙馬來醯亞胺樹脂 Download PDFInfo
- Publication number
- TW202406977A TW202406977A TW111129785A TW111129785A TW202406977A TW 202406977 A TW202406977 A TW 202406977A TW 111129785 A TW111129785 A TW 111129785A TW 111129785 A TW111129785 A TW 111129785A TW 202406977 A TW202406977 A TW 202406977A
- Authority
- TW
- Taiwan
- Prior art keywords
- polyphenylene ether
- formula
- bismaleimide resin
- phenolic compound
- type
- Prior art date
Links
- 229920001955 polyphenylene ether Polymers 0.000 title claims abstract description 69
- 229920005989 resin Polymers 0.000 title claims abstract description 52
- 239000011347 resin Substances 0.000 title claims abstract description 52
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229920003192 poly(bis maleimide) Polymers 0.000 title claims abstract description 48
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 150000004985 diamines Chemical class 0.000 claims abstract description 9
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000012643 polycondensation polymerization Methods 0.000 claims abstract description 5
- 150000002989 phenols Chemical class 0.000 claims description 33
- -1 polyphenylene Polymers 0.000 claims description 15
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 14
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 claims description 9
- 125000000962 organic group Chemical group 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 239000004727 Noryl Substances 0.000 description 3
- 229920001207 Noryl Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- WFQDTOYDVUWQMS-UHFFFAOYSA-N 1-fluoro-4-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=C(F)C=C1 WFQDTOYDVUWQMS-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2618—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing nitrogen
- C08G65/2633—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing nitrogen the other compounds containing amide groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/128—Unsaturated polyimide precursors the unsaturated precursors containing heterocyclic moieties in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/04—Anhydrides, e.g. cyclic anhydrides
- C08F222/06—Maleic anhydride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
- C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
- C08G65/2612—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aromatic or arylaliphatic hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
- C08G65/2669—Non-metals or compounds thereof
- C08G65/2675—Phosphorus or compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
- C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
- C08G65/3324—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof cyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
- C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/04—End-capping
Abstract
本發明提供一種聚苯醚型雙馬來醯亞胺樹脂。聚苯醚型雙馬來醯亞胺樹脂是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成。經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
Description
本發明是有關於一種雙馬來醯亞胺樹脂,且特別是有關於一種聚苯醚型雙馬來醯亞胺樹脂(polyphenylene ether bismaleimide,PPE-BMI)。
聚苯醚樹脂具有良好的絕緣性、耐酸鹼性、介電常數(dielectric constant,Dk)以及介電損耗(dissipation factor,Df)等特性,因此常被應用於高頻印刷電路板等電子基板的絕緣材料。然而,目前使用的聚苯醚樹脂具有穩定性不足的問題,進而產生加工性較差的缺點。
本發明提供一種可形成具有良好的介電特性以及耐熱性的聚苯醚型雙馬來醯亞胺樹脂。
本發明的一種聚苯醚型雙馬來醯亞胺樹脂是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成。經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
在本發明的一實施例中,上述經改質的聚苯醚型雙胺的莫耳數與馬來酸酐的莫耳數的比為1:1.1至1:1.6。
在本發明的一實施例中,上述酚類化合物的莫耳數與聚苯醚的莫耳數的比為1:1至10:1。
在本發明的一實施例中,上述聚苯醚型雙馬來醯亞胺樹脂的重量平均分子量為1000至8000。
在本發明的一實施例中,上述酚類化合物包括兩個以上的酚基。
在本發明的一實施例中,上述酚類化合物包括下述式(1)至式(9)表示的化合物中的任一者:
式(1),
式(2),
式(3),
式(4),
式(5),
式(6),
式(7),
式(8),
式(9)。
本發明的一種聚苯醚型雙馬來醯亞胺樹脂具有如下述式(A)表示的結構:
式(A),
式(A)中,L表示衍生自酚類化合物的二價有機基團,
m表示0至20的整數,且
n表示0至20的整數。
基於上述,本發明提供一種具有剛性結構的聚苯醚型雙馬來醯亞胺樹脂,其具有良好的介電特性及耐熱性。
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例及圖式作詳細說明如下。
以下是詳細敘述本發明內容之實施例。實施例所提出的實施細節為舉例說明之用,並非對本發明內容欲保護之範圍做限縮。任何所屬技術領域中具有通常知識者當可依據實際實施態樣的需要對該些實施細節加以修飾或變化。
在本文中,所謂「二價有機基團」為具有兩個鍵結位置的有機基團,並且「二價有機基團」可經由這兩個鍵結位置形成兩個化學鍵。
依據本實施例的一種聚苯醚型雙馬來醯亞胺樹脂,是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成,其中經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
藉此,本實施例經由酚類化合物賦予主鏈的聚苯醚具有剛性結構,使聚苯醚型雙馬來醯亞胺樹脂具有良好的介電特性及耐熱性。
接著,對上述經改質的聚苯醚型雙胺進行詳細說明。
經改質的聚苯醚型雙胺
經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
酚類化合物
酚類化合物可包括兩個以上的酚基。酚類化合物可包括下述式(1)至式(9)表示的化合物中的任一者或其他合適的酚類化合物。在本實施例中,酚類化合物較佳為包括式(1)至式(3)表示的化合物中的任一者。酚類化合物可單獨使用一種,也可以組合多種使用。
式(1)
式(2)
式(3)
式(4)
式(5)
式(6)
式(7)
式(8)
式(9)
聚苯醚
聚苯醚的市售商品的具體例包括NORYL SA90(商品名稱;沙比克(SABIC)公司製造,重量平均分子量1600)、NORYL SA9000(商品名稱;沙比克(SABIC)公司製造,重量平均分子量2300)或其組合。
在本實施例中,酚類化合物先與聚苯醚反應,接著以具有硝基結構的化合物(例如4-鹵硝基苯)將經改質的聚苯醚末端的基團進行硝化反應及氫化反應,以形成經改質的聚苯醚型雙胺。酚類化合物的莫耳數與聚苯醚的莫耳數的比為1:1至10:1,較佳為2:1至5:1。
< 聚苯醚型雙馬來醯亞胺樹脂的製備方法 >
首先,先將酚類化合物與聚苯醚反應形成經改質的聚苯醚型雙胺。將酚類化合物與聚苯醚反應的方法沒有特別的限制,例如可採用周知的有機合成方法來合成,在此不另行贅述。接著,將經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應,以形成聚苯醚型雙馬來醯亞胺樹脂。在本實施例中,經改質的聚苯醚型雙胺的莫耳數與馬來酸酐的莫耳數的比為1:1.1至1:1.6,較佳為1:1.2至1:1.4。
聚苯醚型雙馬來醯亞胺樹脂具有如下述式(A)表示的結構。在本實施例中,聚苯醚型雙馬來醯亞胺樹脂的重量平均分子量為1000至8000,較佳為1000至4000。
式(A)
式(A)中,L表示衍生自酚類化合物的二價有機基團;
m表示0至20的整數,較佳為1至10的整數;且
n表示0至20的整數,較佳為1至10的整數。
在本實施例中,L所示的二價有機基團可衍生自包括兩個以上的酚基的酚類化合物。酚類化合物可包括上述式(1)至式(9)表示的化合物中的任一者,較佳為包括上述式(1)至式(3)表示的化合物中的任一者。
聚苯醚型雙馬來醯亞胺樹脂的實施例
以下說明聚苯醚型雙馬來醯亞胺樹脂的實施例1至實施例3以及比較例1:
實施例 1
將3.5莫耳的式(1)表示的化合物、0.45莫耳的作為催化劑的三苯基磷(triphenyl phosphine,TPP)與1莫耳的聚苯醚(商品名稱NORYL SA90,沙比克公司製造)加至1.5莫耳的作為反應溶劑的甲苯中,在145℃的溫度下反應120分鐘,以形成經改質的聚苯醚。接著,加入1.3莫耳的4-氟硝基苯,在140℃的溫度下反應120分鐘,以進行硝化反應。然後,通入氫氣,在100℃的溫度下反應120分鐘,以進行氫化反應,以形成經改質的聚苯醚型雙胺。接著,加入1.38莫耳的馬來酸酐,在110℃的溫度下反應180分鐘,再加入2莫耳的作為脫水劑的甲苯磺酸,即可製得實施例1的聚苯醚型雙馬來醯亞胺樹脂。
實施例 2 至實施例 3 以及比較例 1
實施例2至實施例3以及比較例1的聚苯醚型雙馬來醯亞胺樹脂是以與實施例1相同的步驟來製備,並且其不同處在於:改變聚苯醚型雙馬來醯亞胺樹脂的酚類化合物的種類(如表1所示)。將所製得的聚苯醚型雙馬來醯亞胺樹脂以下列各評價方式進行評價,其結果如表1所示。
[表1]
式(10)
< 評價方式 > a. 重量平均分子量( weight-average molecular weight , Mw )
項目 | 實施例1 | 實施例2 | 實施例3 | 比較例1 |
酚類化合物 | 式(1)表示的化合物 | 式(2)表示的化合物 | 式(3)表示的化合物 | 式(10)表示的化合物 |
重量平均分子量(Mw) | 2,778 | 2,795 | 2,643 | 2,000 |
Tg(單位:℃) | 248 | 241 | 245 | 203 |
CTE(單位:ppm/℃) | 40 | 43 | 42 | 49 |
介電常數(Dk) | 2.47 | 2.48 | 2.50 | 2.42 |
介電損耗(Df) | 0.0020 | 0.0020 | 0.0024 | 0.0017 |
將所製得的聚苯醚型雙馬來醯亞胺樹脂藉由凝膠滲透色譜法(gel permeation chromatograph,GPC)測量重量平均分子量(Mw),並用四氫呋喃(tetrahydrofuran,THF)作為校正標準品。
b. 玻璃轉移溫度( glass transition temperature , Tg )
將所製得的聚苯醚型雙馬來醯亞胺樹脂藉由微差掃描熱分析儀(differential scaning calorimeter,DSC)測量玻璃轉移溫度(Tg)。當Tg愈高時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的抵抗相變化的能力,即良好的耐熱性。
升溫速度:10℃/min
溫度範圍:0℃~350℃(升溫、冷卻、升溫)
c. 熱膨脹係數( coefficient of thermal expansion , CTE )
將所製得的聚苯醚型雙馬來醯亞胺樹脂藉由熱機械分析儀(型號TMA Q400,TA儀器製造)測量熱膨脹係數(CTE)。當CTE愈小時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的抵抗相變化的能力,即良好的耐熱性。
升溫速度:10℃/min
溫度範圍:0℃~300℃
d. 介電常數( dielectric constant , Dk )
將所製得的聚苯醚型雙馬來醯亞胺樹脂塗佈至基板上,以210℃的溫度進行烘烤60分鐘,以形成厚度為0.25毫米的片狀物。接著,藉由共振腔測量頻率為1 GHz的介電常數(Dk)。當介電常數愈小時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的介電特性。
e. 介電損耗( dissipation factor , Df )
將所製得的聚苯醚型雙馬來醯亞胺樹脂塗佈至基板上,以210℃的溫度進行烘烤60分鐘,以形成厚度為0.25毫米的片狀物。接著,藉由共振腔測量頻率為1 GHz的介電損耗(Df)。當介電損耗愈小時,顯示聚苯醚型雙馬來醯亞胺樹脂具有良好的介電特性。
< 評價結果 >
由表1可知,當聚苯醚型雙馬來醯亞胺樹脂具有衍生自酚類化合物的剛性結構時(實施例1~3),聚苯醚型雙馬來醯亞胺樹脂同時兼具良好的耐熱性及介電特性。
此外,相較於不具有衍生自酚類化合物的剛性結構的聚苯醚型雙馬來醯亞胺樹脂(比較例1),具有衍生自酚類化合物的剛性結構的聚苯醚型雙馬來醯亞胺樹脂(實施例1~3)具有較高的玻璃轉移溫度及較小的熱膨脹係數,即較佳的耐熱性,且同時具有良好的介電特性。
綜上所述,本發明的聚苯醚型雙馬來醯亞胺樹脂具有剛性結構,故具有良好的介電特性及耐熱性,而具有良好的應用性。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
無
無。
無。
Claims (10)
- 一種聚苯醚型雙馬來醯亞胺樹脂,是由經改質的聚苯醚型雙胺與馬來酸酐經縮合聚合反應而成, 其中所述經改質的聚苯醚型雙胺是由酚類化合物與聚苯醚反應而形成。
- 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述經改質的聚苯醚型雙胺的莫耳數與所述馬來酸酐的莫耳數的比為1:1.1至1:1.6。
- 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物的莫耳數與所述聚苯醚的莫耳數的比為1:1至10:1。
- 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其重量平均分子量為1000至8000。
- 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括兩個以上的酚基。
- 如請求項1所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括下述式(1)至式(9)表示的化合物中的任一者: 式(1), 式(2), 式(3), 式(4), 式(5), 式(6), 式(7), 式(8), 式(9)。
- 一種聚苯醚型雙馬來醯亞胺樹脂,具有如下述式(A)表示的結構: 式(A), 式(A)中,L表示衍生自酚類化合物的二價有機基團, m表示0至20的整數,且 n表示0至20的整數。
- 如請求項7所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括兩個以上的酚基。
- 如請求項7所述的聚苯醚型雙馬來醯亞胺樹脂,其中所述酚類化合物包括下述式(1)至式(9)表示的化合物中的任一者: 式(1), 式(2), 式(3), 式(4), 式(5), 式(6), 式(7), 式(8), 式(9)。
- 如請求項7所述的聚苯醚型雙馬來醯亞胺樹脂,其重量平均分子量為1000至8000。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111129785A TWI814526B (zh) | 2022-08-08 | 2022-08-08 | 聚苯醚型雙馬來醯亞胺樹脂 |
CN202211056704.1A CN117567743A (zh) | 2022-08-08 | 2022-08-30 | 聚苯醚型双马来酰亚胺树脂 |
US17/901,869 US20240059836A1 (en) | 2022-08-08 | 2022-09-02 | Polyphenylene ether bismaleimide resin |
JP2023000017A JP2024023118A (ja) | 2022-08-08 | 2023-01-04 | ポリフェニレンエーテルビスマレイミド樹脂 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111129785A TWI814526B (zh) | 2022-08-08 | 2022-08-08 | 聚苯醚型雙馬來醯亞胺樹脂 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI814526B TWI814526B (zh) | 2023-09-01 |
TW202406977A true TW202406977A (zh) | 2024-02-16 |
Family
ID=88965944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111129785A TWI814526B (zh) | 2022-08-08 | 2022-08-08 | 聚苯醚型雙馬來醯亞胺樹脂 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240059836A1 (zh) |
JP (1) | JP2024023118A (zh) |
CN (1) | CN117567743A (zh) |
TW (1) | TWI814526B (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3839287A (en) * | 1971-09-21 | 1974-10-01 | Union Carbide Corp | Polyarylimides |
US7638566B2 (en) * | 2006-10-30 | 2009-12-29 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) compositions |
US20090076307A1 (en) * | 2007-08-13 | 2009-03-19 | . | Aromatic diamine compound and aromatic dinitro compound |
ATE541879T1 (de) * | 2008-06-09 | 2012-02-15 | Mitsubishi Gas Chemical Co | Bismaleaminsäure, bismaleinimid und gehärtetes produkt davon |
CN106255713B (zh) * | 2014-04-04 | 2017-12-19 | 日立化成株式会社 | 聚苯醚衍生物、热固化性树脂组合物、树脂清漆、预浸渍体、层叠板及多层印制线路板 |
TWI774559B (zh) * | 2021-09-13 | 2022-08-11 | 南亞塑膠工業股份有限公司 | 具有雙馬來醯亞胺修飾的聚苯醚樹脂、其製造方法、及電路板的基板材料 |
-
2022
- 2022-08-08 TW TW111129785A patent/TWI814526B/zh active
- 2022-08-30 CN CN202211056704.1A patent/CN117567743A/zh active Pending
- 2022-09-02 US US17/901,869 patent/US20240059836A1/en active Pending
-
2023
- 2023-01-04 JP JP2023000017A patent/JP2024023118A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2024023118A (ja) | 2024-02-21 |
TWI814526B (zh) | 2023-09-01 |
CN117567743A (zh) | 2024-02-20 |
US20240059836A1 (en) | 2024-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4102853B2 (ja) | 熱硬化性樹脂、及びそれを含む熱硬化性組成物、並びにそれから得られる成形体 | |
KR100977927B1 (ko) | 열경화성 수지의 제조 방법, 열경화성 수지, 그것을 포함하는 열경화성 조성물, 성형체, 경화체, 및 이들을 포함하는 전자 기기 | |
JP4548855B2 (ja) | 熱硬化性ポリイミドシリコーン樹脂組成物及びその硬化皮膜 | |
TWI597278B (zh) | 聚氧代氮代苯并環己烷前驅物及其製備方法 | |
EP2634200B1 (en) | Benzoxazine-containing composition and cured product thereof, and varnish | |
TW200306295A (en) | Amino group containing phenol derivative | |
TWI814526B (zh) | 聚苯醚型雙馬來醯亞胺樹脂 | |
JP2007106800A (ja) | 熱硬化性樹脂、及びそれを含む熱硬化性組成物、並びにそれから得られる成形体 | |
TWI828404B (zh) | 經改質的二環戊二烯系樹脂及其製備方法 | |
TWI626272B (zh) | 環氧樹脂組成物及其固化物 | |
TWI756020B (zh) | 苯並噁嗪樹脂及其製法以及樹脂組合物 | |
KR101349119B1 (ko) | 폴리 에폭시이미드-아크릴레이트 변형 전자재료 소재용 접착제 조성물 및 이의 제조방법 | |
CN114957155A (zh) | 含双重交联网络的高耐热低介电苯并噁嗪预聚体、共聚树脂及其制备方法 | |
JP2021066861A (ja) | ポリイミン、ワニス、フィルム、その製造方法、積層体及びその製造方法 | |
TWI828405B (zh) | 經改質的二環戊二烯系樹脂 | |
JP5347528B2 (ja) | ポリアミド | |
TW201600540A (zh) | 聚氧代氮代苯并環己烷前驅物及其製備方法 | |
Zeng et al. | Preparation of high-performance thermosetting films from novel diallyl bisphenol A/furfurylamine type benzoxazine and oligo (phenylene oxide) | |
TWI824668B (zh) | 寡聚物與組成物 | |
TWI819365B (zh) | 聚苯醚型雙馬來醯亞胺樹脂及其製造方法以及樹脂組合物 | |
TWI758949B (zh) | 含磷之(2,6-二甲基苯醚)寡聚物及其製備方法與固化物 | |
TWI573780B (zh) | Dicoline Monomers Containing Adamantane and Their Polyimide Derivatives and Its preparation method | |
CN117986577A (zh) | 经改质的马来酰亚胺树脂 | |
TW202300558A (zh) | 活性聚酯、固化性樹脂組成物及樹脂固化物 | |
JP2024068074A (ja) | 変性ジシクロペンタジエン系樹脂 |