TW202405125A - 耐熱性黏著膜 - Google Patents

耐熱性黏著膜 Download PDF

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Publication number
TW202405125A
TW202405125A TW112113364A TW112113364A TW202405125A TW 202405125 A TW202405125 A TW 202405125A TW 112113364 A TW112113364 A TW 112113364A TW 112113364 A TW112113364 A TW 112113364A TW 202405125 A TW202405125 A TW 202405125A
Authority
TW
Taiwan
Prior art keywords
heat
adhesive film
resistant adhesive
lead frame
aforementioned
Prior art date
Application number
TW112113364A
Other languages
English (en)
Chinese (zh)
Inventor
清水隆史
黑崎海志
Original Assignee
日商富士可比安股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士可比安股份有限公司 filed Critical 日商富士可比安股份有限公司
Publication of TW202405125A publication Critical patent/TW202405125A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW112113364A 2022-04-18 2023-04-10 耐熱性黏著膜 TW202405125A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-068374 2022-04-18
JP2022068374 2022-04-18

Publications (1)

Publication Number Publication Date
TW202405125A true TW202405125A (zh) 2024-02-01

Family

ID=88419906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112113364A TW202405125A (zh) 2022-04-18 2023-04-10 耐熱性黏著膜

Country Status (5)

Country Link
JP (1) JPWO2023204091A1 (https=)
KR (1) KR20250005962A (https=)
CN (1) CN118525360A (https=)
TW (1) TW202405125A (https=)
WO (1) WO2023204091A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024117021A1 (https=) * 2022-11-29 2024-06-06

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619486B2 (ja) * 2000-06-01 2011-01-26 日東電工株式会社 リードフレーム積層物および半導体部品の製造方法
JP4357754B2 (ja) 2000-10-02 2009-11-04 日東電工株式会社 半導体装置の製造方法
JP4002736B2 (ja) * 2001-03-21 2007-11-07 株式会社巴川製紙所 半導体装置組立用マスクシートおよび半導体装置の組み立て方法
JP2012151360A (ja) 2011-01-20 2012-08-09 Nitto Denko Corp 半導体パッケージ製造工程用耐熱性粘着テープ

Also Published As

Publication number Publication date
JPWO2023204091A1 (https=) 2023-10-26
WO2023204091A1 (ja) 2023-10-26
CN118525360A (zh) 2024-08-20
KR20250005962A (ko) 2025-01-10

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